WELCOME TO THE LIGHT AGES ™ Considerations For The Constructions Of Foundational Standards In...

WELCOME TO THE LIGHT AGES™

Considerations For The Constructions Of Foundational Standards In Solid State Lighting

Fred MaxikFounder and CTO, Lighting Science

August, 2012Copyright 2012. Strictly Confidential. Not for redistribution or copy.

Technology Pitfalls: When Good Lights Go Bad

Copyright 2012. Strictly Confidential. Not for redistribution or copy.

LEDs:Wafer,

Encapsulate, Photo Conversion

Materials, Chip/Die Mounting

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012. Strictly Confidential. N

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r copy.

LEDs:Wafer,

Encapsulate, Photo Conversion

Materials, Chip/Die Mounting

LEDs:Wafer,

Encapsulate, Photo Conversion

Materials, Chip/Die Mounting

PSU:Active/Passive Parts

Bulk PartsWaste HeatWave FormRF Inference

Copyrig

ht 2

012. Strictly Confidential. N

ot fo

r redistrib

utio

n o

r copy.

LEDs:Wafer,

Encapsulate, Photo Conversion

Materials, Chip/Die Mounting

PSU:Active/Passive Parts

Bulk PartsWaste HeatWave FormRF Inference

ThermalStructure:Alloy, Shape /Fin Sizing, Expansion, TIM, Adhesion and Conduction

Copyrig

ht 2

012. Strictly Confidential. N

ot fo

r redistrib

utio

n o

r copy.

Wafer, Encapsulate,

Photo Conversion Materials,

Chip/Die Mounting

LEDs

Active/Passive PartsBulk Parts

Waste HeatWave FormRF Inference

PSU

Alloy, Shape /Fin Sizing, Expansion, TIM, Adhesion and Conduction

Thermal Structure

Base, Solder, Wire,

Circuit Board, Screws, Snap Fittings

Interconnect

Copyrig

ht 2

012. Strictly Confidential. N

ot fo

r redistrib

utio

n o

r copy.

Wafer, Encapsulate,

Photo Conversion Materials,

Chip/Die Mounting

LEDs

Active/Passive PartsBulk Parts

Waste HeatWave FormRF Inference

PSU

Alloy, Shape /Fin Sizing, Expansion, TIM, Adhesion and Conduction

Thermal Structure

Base, Solder, Wire,

Circuit Board, Screws, Snap Fittings

Interconnect

Base/SocketInsulatorHeat SinkGaskets, OpticPotting Material

Mechanical Structure

Copyrig

ht 2

012. Strictly Confidential. N

ot fo

r redistrib

utio

n o

r copy.

Wafer, Encapsulate,

Photo Conversion Materials,

Chip/Die Mounting

LEDs

Active/Passive PartsBulk Parts

Waste HeatWave FormRF Inference

PSU

Alloy, Shape /Fin Sizing, Expansion, TIM, Adhesion and Conduction

Thermal Structure

Base, Solder, Wire,

Circuit Board, Screws, Snap Fittings

Interconnect

Base/SocketInsulatorHeat SinkGaskets, OpticPotting Material

Mechanical Structure

MaterialsPhoto Conv

UV DegradationDirt DegradationEnvironmental

Hazards

Optics

Copyrig

ht 2

012. Strictly Confidential. N

ot fo

r redistrib

utio

n o

r copy.

WELCOME TO THE LIGHT AGES™

Fred MaxikFounder and CTO, Lighting Science

August, 2012Copyright 2012. Strictly Confidential. Not for redistribution or copy.