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R&D Total Personnel
PhD
MS
BS
Tech
Centro de Tecnologia da Informação Renato Archer
Figures: – Total area = 320.000 m2 – Built area= 14.000 m2 – Personnel = 600
2010 Budget: – OGU: R$ 12M – Projects: R$ 22M – Total: R$ 34M
Microelectronics Software Applications
R&D Areas
HW and IC Design
Microsystems
Packaging
Qualification of Electronic Products
Surface Interaction and Displays
Software Quality and Process Improvement
Information System Security
Software Development
Robotics and Computer Vision
Decision Support Systems
3D Technologies
MISSION: Create, apply and disseminate knowledge in Information Technology, in
articulation with other social and economic agents, promoting innovations according to
society demands.
Final Commercial Product
Digital, Analog and RF 0,18 µm Technology
1st batch from Foundry Engineering Phase
Test on Protoboard
Backend & Final Tests
Geometrical Description
Functional blocs
Symbolic language description Simulation
Design House
Main Tools: Mask Fabrication Wet bench Mask aligner MJB3 Magnetron sputtering Balzers BAS 450 Optical profilemeter Zygo Pattern Generator Heidelberg DWL66 Clean rooms: 400 m2, Class 1000 & 100 w. tunnel class 10
Microfabrication and Microsystems Infrastructure
Optical
Microscope
SEM w. EDX/WDS
Teradyne MicroFlex tester
Wafer prober – Micromanipulator 6400
Logic analyzer-HP16500B
FIB/SEM dual beam (@UNICAMP)
Characterization and Failure Analysis
Focused-Ion-Beam Scanning Electron Microscope
Burn-in
Climatic chamber – Vötsch 7033
Sample preparation
Thermal cycling chamber Vötsch 7012
Reliability and Certification Lab
IC Packaging Group
Prototypes; Components 01005; Printer, Pick&Place, Reflow;
Project
Failure Analysis
Multi Chip Modules (MCM)
SMT Asembly
PCB, Hybrid Circuits, Multi-Chip-Modules;
Chip-on-board (COB); Wire Bonding of Au or Al; Custom Capsules;
X-Ray & Ersascope; BGA & µBGA reballing; Wire-bonding;
Alumina or Silicon substrates; 3 Metal Levels; Embedded Components: Resistors, Capacitors e Inductors;
Available IC Packaging Technologies
Technologies Bump Deposition Stud Bump Wire Bonding Flip Chip Wafer Thinning Stacked Dies IR Sensors
RFID MEMS &
BioMEMS Memories
Aplications
Customized Capsules and Connectors
Technologies
Hermetic Sealing Metal/Ceramic Joint
IR Sensors RFID MEMS & BioMEMS Memories
Aplications
Organic Electronics
Flexible Solar Cells
Bulk-heterojuction Solar Cells PET ITO PEDOT P3MET/
CdSe QD Al/Ag
Nanomaterials
Nanostructures Fabricated by Sputtering
Applications: Electrodes; Sensors; Memories; Surface Functionalization
[1] R. R. Tummala, MOORE'S LAW MEETS ITS MATCH, IEEE Spectrum, p. 44, June 2006.
IC Packaging: More-than-Moore
14
DSL CO Linecards
1996 1st Gen Single Channel
1998 2nd Gen Dual Ch
1999 3rd Gen Dual Ch
2000 4th Gen Quad Ch
2001 5th Gen Octal Ch
2002 6th Gen Octal Ch
IC Packaging: SOC – Saving Space
15
AR5
BOM
Manufacturing Process Technology
2000 5 chips 740 discretes
u CMOS u Analog u Flash u SDRAM
2005 – AR5 3 chips 415 discretes
u CMOS u Analog u Flash u SDRAM
1 chip <50 discretes
u CMOS u Analog u Flash u SDRAM
Memory
Comms Processor
Digital PHY
Analog Codec
Line Driver
Line Receiver
740 Discretes
Memory
Comms Processor
Digital PHY
415 Discretes
AFE
Memory
<50 Discretes
Single-Chip DSL Modem
IC Packaging: SOC Integration
16
IC Packaging: 3D SoP
[1] R. R. Tummala, MOORE'S LAW MEETS ITS MATCH, IEEE Spectrum, p. 44, June 2006.
17
IC Packaging: Mobile Requirements
18
• Decreasing Thickness
• Decreasing Weight
• Increasing Functionality
• Increasing Complexity
• Increasing I/O ports
1971 – First Microprocessor 4004
2.3x103 transistors, 108Khz, 10μm, pMOS, 12V, 0.3W, 4 Bits, 16DIP
2006 – Dual-Core Intel Itanium “Montecito”
1.7x109 transistors, 2GHz, 65nm, CMOS, 1.2V, 130W, 64 Bits, 775 Flipchip MCM
IC Packaging: MCM Evolution
19
IC Packaging: 3D Packaging
• Achieves Packaging Efficiency greater than 1.0
20 J.U. Knickerbocker et al., ECTC2012, pg.1068 (2012)
5 years Goal: Chip Embedding
Technologies Multi Chip Module (MCM) Flip Chip Through Silicon Vias (TSV)
Conclusions
• Packaging integration – RFID IC – Antenna – Energy Harvesting – Battery – Sensors
• Flexible substrate – Organic Electronics
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