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HelioVolt's 2011 presentation at SPIE Optoelectronics Conference. Thin Film CIGS Photovoltaic Modules: Monolithic Integration and Advanced Packaging for High Performance, High Reliability and Low Cost
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1
Thin Film CIGS Photovoltaic Modules:Monolithic Integration and Advanced Packagingfor High Performance, High Reliability and Low Cost
Louay EldadaChief Technology Officer
© 2011 HelioVolt Corporation
January 27, 2011
Next Generation High-Performance and Low-Cost Solar Technology
• Disruptive CIGS PV technology: high efficiency low cost monolithic modules
• Extensive CIGS intellectual property portfolio
• 9+ years and ~$145MM of R&D
• Unique technology commercialization partnership with NREL
• Fully equipped production line and R&D line in Austin
• Team with deep technical expertise
• NREL-confirmed ~12% (11.8±0.6%) efficiency champion production module, with 10.8% average efficiency
• Efficiency roadmap to 16%+ in 2014
• Plan for production expansion under development
© 2011 HelioVolt Corporation 2
Competitive Technology Advantage• FASST® CIGS process advantages
– Two-stage process provides maximum flexibility to optimize precursor deposition method and composition of each layer: higher efficiency
– Most rapid synthesis of CIGS from precursors of any method: reduces capital costs
– Demonstrated state of the art crystalline quality: higher efficiency
– Unique, rapid, flexible optimization of CIGS surface quality: higher efficiency
• Advanced NREL liquid precursor technology
– Reduces capital costs and COGS
• Monolithic module circuit integration
– Reduces module assembly costs compared to discrete cell assembly
• Advanced module packaging
– Unique, high performance encapsulant, edge sealant, and potting compound supports product lifetime beyond standard 25 year warranty: reduces cost of electricity (¢/kWh)
Glass In
Module Out
GlassPreparation
FASST® CIGSProcess
ModuleFormation
Final Assembly& Test
© 2011 HelioVolt Corporation 3
CIGS: Highest Thin Film Efficiency
Source: Greentech Media, Prometheus Institute and Wall Street research.
2010 Module Efficiency Record Cell Efficiency
0% 5% 10% 15% 20% 25%
a-Si 1-j
a-Si/Micro
CdTe
CIGS
Multi-Crystalline Si
Mono-Crystalline Si
© 2011 HelioVolt Corporation 4
CIGS Contenders Approach
Company Process
Technology Substrate Cell or Module
Co-evaporation Glass Module
Co-evaporation Glass Tubular “Module”
Selenization Glass Module
Sputtering Steel Foil Cell
Nanoparticle
Sintering Metal Foil Cell
Electroplating Steel Foil Cell
HelioVolt FASST®
Currently Glass
Module
© 2011 HelioVolt Corporation 5
Company CIGS Deposition
Uniformity COGS CapEx
Typical Module Efficiency
High High High 10-12%
Moderate High High 9%
Moderate Moderate High 10-12%
Low Moderate High 10%
Low Moderate Moderate 9%
Low Moderate Moderate 9%
High
Low
Low
10-12%
CIGS Contenders Results
© 2011 HelioVolt Corporation 6
Total: $0.27/Wp
HelioVolt Process
Glass In
GlassPreparation
FASST® CIGSProcess
ModuleFormation
Final Assembly& Test
Competitors’ CIGS Cell-Based Processes
Monolithic Integration is Key to Cost Leadership and Product Reliability
$0.06
Module Out
$0.07
$0.01
$0.13
Note: Input materials cost / Wp in cents.
SubstratePreparation
CIGSProcess
Contact & GridFormation
Cell Cut & Sort
$0.06
$0.15
$0.01
?
Cell Stringing
Final Assembly& Test
Total: $0.51+/Wp
$0.12
$0.17
Glass In
Module Out
Additional Costs
Stainless steel foil
Higher non-material inputs (e.g. labor)
Higher yield loss
Stringing material
Two encapsulant layers and outer frame
$0.08
?
?
$0.12
$0.04
Add’l: $0.24+/Wp
© 2011 HelioVolt Corporation 7
HelioVolt PV Module Production Line
Moly Deposition Exit Precursor Deposition Load FASST® Processor Load
FASST® Processor Unload Buffer Load
PVIC Lamination Junction Box Attach Final Eff. Test
Final PVIC Pattern Step
© 2011 HelioVolt Corporation 8
FASST® Reactive Transfer ProcessNon-Contact Transfer (NCT™) Synthesis
Source Plate
SubstrateCIGS Layer
Heat
Source Plate with Transfer Film
Pressure
Substrate
Cu, In,
Ga, Se
Process Step
• Independent deposition of distinct compound precursor layers on substrate and source plate
• Rapid non-contact reaction– Turns stack into CIGS with high efficiency structure– Combines benefits of sequential selenization with
Close-Spaced Vapor Transport (CSVT) for junction optimization
• CIGS adheres to the substrate and the source plate is reused
Rapid manufacturing process reduces capital amortization cost
© 2011 HelioVolt Corporation 9
CIGS Material Fundamentals
B.J. Stanbery, Critical Reviews in Solid State and Materials Sciences, 27(2):73-117 (2002)
T–X section of the phase diagram along the
Cu2Se-In2Se3 pseudobinary section of the
Cu–In–Se chemical system.
: CuInSe2 chalcopyrite phase
: In-rich/Cu-poor (Cu2In4Se7 & CuIn3Se5)
ordered defect compound (ODC) phase
CuInSe2 chalcopyrite crystal structure:
(a) conventional unit cell of height c, with a
square base of width a
(b) cation-centered first coordination shell
(c) anion-centered first coordination shell
showing bond lengths dCu–Se and dIn–Se.
© 2011 HelioVolt Corporation 10
Role of Micro and Nanostructuringin CIGS PV Device Operation
Observations on Device-Quality ( >15%) CIGS:
Large columnar grains
Copper deficiency compared to -CuInSe2
Compositions lie in the equilibrium 2-phase domain:domains, Cu-rich with p-type conductivity anddomains, Cu-poor with n-type conductivity,
form nanoscale p-n junction networks*;n-type networks act as preferential electron pathways,p-type networks act as preferential hole pathways,positive and negative charges travel to the contacts inphysically separated paths, reducing recombination
*Intra-Absorber Junction (IAJ) model, APL 87, 121904 (2005)
© 2011 HelioVolt Corporation 11
Composition Fluctuations and Carrier Transport in CIGS PV Absorbers
Experimental results* HAADF-TEM & Nanoscale EDS
– 5-10 nm characteristic domain size
– Chemical composition fluctuations found across the domains
p1: Cu:In:Ga:Se=31:14:7:48
p2: Cu:In:Ga:Se=27:15:9:49
p3: Cu:In:Ga:Se=30:15:6:49
– Dark domains are relatively Cu rich, bright domains are relatively Cu poor
*Applied Physics Letters, 87, 2005, 121904
HAADF-TEM: High-Angle Annular Dark-Field Transmission Electron Microscopy
EDS: Energy-Dispersive X-ray Spectroscopy
© 2011 HelioVolt Corporation 12
Reactive Transfer Processing Compound Precursor Deposition• Two methods have been developed for deposition of
compound precursors
• Low-temperature Co-evaporation
– Equipment requirements similar to conventional single-stage co-evaporation but lower temperatures lead to higher throughput and reduced thermal budget
• Liquid Metal-Organic molecular solutions
– Proprietary inks developed under NREL CRADA (Cooperative Research And Development Agreement)
– Decomposition of inks leads to formation of inorganic compound precursor films nearly indistinguishable from co-evaporated films (for some compounds)
© 2011 HelioVolt Corporation 13
Recrystallization of Nanoscale Vacuum Precursor Films Forming Large Grain CIGS
Precursor Film FASST® CIGS cross-section
© 2011 HelioVolt Corporation 14
HelioVolt-NREL CRADA Technology Advantages• Atmospheric (non-vacuum) processes
– Low capital equipment cost, 10-20x reduction vs. vacuum equipment
– Low thermal budget, low energy consumption
– Small footprint, 5-10x reduction vs. vacuum equipment
– High uptime
– High throughput
• Inks– Good compositional control by chemical synthesis
– A variety of materials can be synthesized; we have proprietary Cu-, In-and Ga-containing inks that densify to multinary selenide precursors
• Efficient use of materials– >95% material utilization vs. 80% for sputtering, 60% for evaporation
© 2011 HelioVolt Corporation 15
Printed Electronics Equipment & ProcessesLeveraged in PV
– Slow or static circuits
– Low integration density
– Large areas
– Rigid or flexible substrates
– Simple fabrication
– Low fabrication cost
– Fast switching circuits
– High integration density
– Small areas
– Rigid substrates
– Complex fabrication
– High fabrication cost
Complex Circuitry
High Cost
Simple Circuitry
Low Cost
Printed Electronics Conventional Electronics
© 2011 HelioVolt Corporation 16
Metal-Organic Decomposition (MOD) Precursor Film Deposition• Inorganic compound reaction CIGS synthesis provides
pathway for evolutionary adoption of MOD precursors
• Key drivers– Low capital equipment cost
– Low thermal budget
– High throughput
• Flexibility– Good compositional control by chemical synthesis
– Variety of Cu-, In- and Ga-containing inks can be synthesized and densified to form multinary sulfo-selenide precursors
• Efficient use of materials
© 2011 HelioVolt Corporation 17
Deposition of PV InksPreferred methods for printing CIGS precursor ink thin films
Ultrasonic Atomization Spraying
Slot Die Extrusion Coating
© 2011 HelioVolt Corporation 18
PVD vs. Ink Precursor Deposition
Cross Section Cross Section
PVD DepositedCIGS Precursor Film
Spray DepositedCIGS Precursor Film
Top View Top View
© 2011 HelioVolt Corporation 19
NREL CRADA – Hybrid CIGS by FASST®
SEM
• Exceptionally large grains• Columnar structure
XRD
• Chalcopyrite CIGS (& Mo)• (220/204) preferred orientation, helps
junction formation and improves solar cell performance
Hybrid CIGS efficiency reached parity with PVD-based CIGS
© 2011 HelioVolt Corporation 20
Device Quality CIGS in 30 Seconds:First Ultra-Fast Heating Results with Rapid Optical Processor (ROP)
© 2011 HelioVolt Corporation 21
SEMLarge, columnar grains
FASST® Yields High-Quality CIGS
QE curveGood carrier collection
© 2011 HelioVolt Corporation 22
Cd-Free Buffer for a Cd-Free Product
Uniform conformal Cd-free buffer on CIGS
CdS bufferCd-free buffer
Quantum Efficiency (QE) of CIGS with Cd-free buffer shows improvement over CdS, especially in the 400-500 nm wavelength range
© 2011 HelioVolt Corporation 23
Uniform High-Quality CIGS Polycrystalline Films Deliver 14% Cell Efficiency
Voc = 631 mV
Jsc = 31 mA/cm2
FF = 72%
Eff = 14%
Voltage (V)
Cu
rren
t D
en
sit
y (
A/c
m2)
© 2011 HelioVolt Corporation 24
Module Fab Process Flow
Glass In Module Out
= 2.5 hrs
PVIC
Sputtered Back Contact (Mo)
Cu-In-Ga-Se Precursor Films
CIGS by FASST Reactive Transfer
Buffer Layers
Sputtered Front Contact (TCO)
Bus Bars and Tabs
PVIC Test
Edge Sealant Application
Encapsulant Application
Pattern 1 (Laser Scribe)
Pattern 2 (Mech. Scribe)
Pattern 3 (Mech. Scribe)
Lamination
Final Test
Quality Control
© 2011 HelioVolt Corporation 25
Photovoltaic Integrated Circuit (PVIC)
CIGS Absorber
Substrate
Back Contact P1
BufferTCO Window
P2P3
–
– – – –
–
–
–
W.N. Shafarman et al., „Cu(InGa)Se2 Solar Cells‟ in Handbook of Photovoltaic Science and Engineering (2003)
Typical manufacturing steps of monolithic
interconnection for CIGS PV modules
Segment Isolation & Interconnection Scribesand Charge Transport
ScribeZone
CellLength
Cell
Wid
th
+ -
Bus Bar
© 2011 HelioVolt Corporation 26
Modeling for Device/Module Design
• HelioVolt CIGS device/module design further improved by various modeling methods, e.g. 2-D circuit design, device physics modeling, and thermodynamics modeling
Circuit model
Module
Sub-cell
Segment/Cell Sub-cell network
TCO network
Mo network
63.5
64
64.5
65
65.5
66
75
76
77
78
79
80
8 10 12 14 16 18 20 22
Mo
du
le F
F (%
)
Mo
du
le P
ow
er O
utp
ut
(W)
TCO Sheet Resistance (Ω/)
Power
FF (%)
© 2011 HelioVolt Corporation 27
Product Scaling and Performance Experience
Prototype Module30cmx30cm
Scalability Proof
Production Module1.2mx0.6m
Commercial Production Size
Cell0.66cm2
14%
3%
3 Months
5%
12%
2 Months
2%
8%12%
10 Months
Cell
Prototype
Module Progress
1364x scale-up
8x scale-up
Effi
cie
ncy
Effi
cie
ncy
Effi
cie
ncy
4 Months
© 2011 HelioVolt Corporation 28
FASST® CIGS Production Modules
Faceted CIGS crystals absorb light efficiently from all directions from dawn to dusk, giving HelioVolt CIGS its characteristic black color
Large grainswith no horizontal grain boundaries
support high efficiency
Cross-sectional
SEM view
Top view with SEM
120x60 cm2 Module
© 2011 HelioVolt Corporation 29
0
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50
57
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85
92
99
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Eff
icie
ncy
(%
)
G2 Modules – Feb 2010-present
Production Module Results in Last Year
G2 Modules – Feb ’10-present
EquipmentUpgraded
Average EfficiencyContinuously
Increasing
Effi
cie
ncy
(%
)
© 2011 HelioVolt Corporation 30
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
120%
0%
1%
2%
3%
4%
5%
6%
7%
8%
9%
10%
11%
12%
MAY JUN JUL AUG SEP OCT NOV
Co
eff
icie
nt
of
Var
iati
on
(C
V)
Ave
rage
Eff
icie
ncy
2010
G2 Module Efficiency ProgressMax
Equipment
Capability Upgrade
and
Characterization
CV
Std Dev
AverageCV =
Efficiency: continuous improvement in efficiency average, maximum, and distribution
© 2011 HelioVolt Corporation 31
12% HelioVolt G2 Module Efficiency– NREL Measurement –
12% module independently verified by NREL (11.8±0.6%)
© 2011 HelioVolt Corporation 32
Best-In-Class Proprietary Packaging
• Edge Sealing: HVC has unique edge sealant solution that guarantees 25 year lifetime in high humidity environments
• Lamination: HVC has unique encapsulant sheet with high optical transparency, light trapping capability, good chemical compatibility with thin films, and outstanding ability to keep moisture out and withstand UV exposure
• Junction box: HVC has a J-box that is proven in the field; includes bypass diode to protect string from partial shading losses
• Front glass: HVC uses high-transparency low-iron tempered superstrate glass for highest optical performance and reliability
© 2011 HelioVolt Corporation 33
HelioVolt CIGS Module Product Spec
• Construction: Glass-glass laminate• Certification: IEC 61646, IEC 61730,
UL 1703, UL 790 Class A fire rating, CEC listing, CE mark in process
• Warranty: 25 years
© 2011 HelioVolt Corporation 34
Electrical Performance * HVC-170X
Maximum Power – Pmax 68.0 Watts
Open Circuit Voltage – Voc 74.5 Volts
Short Circuit Current – Isc 1.5 Amps
Operating Voltage – Vmp 55.0 Volts
Current at Operating Voltage – Imp 1.24 Amps
Maximum System Voltage – UL 600 Volts
Maximum System Voltage – IEC 1000 Volts*Standard Test Conditions (STC). Ratings are +/-10%.
HVC-170X
Physical & Mechanical Specifications HVC-170X
Length 1210 mm
Width 601 mm
Thickness 6.7 mm
Area 0.73 m2
Weight 12.3 kg
Positive Leadwire Length 660 mm
Negative Leadwire Length 660 mm
Connectors MC-4
Bypass Diode Yes
Cell Type CIGS
Frame None
Cover Type Tempered Glass
Encapsulation Edge Seal/Thermoplastic
Certification Testing
TestDescription
(per UL/IEC requirements)
Performance +/- 10% of specified electrical parameters
Outdoor Exposure 60 kWh/m2, maintain performance
Thermal Cycling • -40 to +90°C
Damp Heat • 85°C / 85%RH
Humidity Freeze • -40 to +90°C w/ condensation
Mechanical Robustness
• Shading hot spot • Connectors/J-box pull test• Mech loading: 400 lbs, 30 minutes• Impact: 2” 1.18 lb steel ball, 51” drop
Shock Hazard • No leakage current afterenvironmental exposure
UL: Underwriters Laboratories, IEC: International Electrotechnical Commission
UL 1703: Flat-Plate Photovoltaic Modules and PanelsIEC 61646: Thin-film Terrestrial Photovoltaic (PV) Modules
– Design Qualification and Type ApprovalIEC 61730: PV Module – Safety Qualification
Impact Testing
Temperature & RH Environmental Testing
Mechanical Load Testing
© 2011 HelioVolt Corporation 35
107.1%98.2%
0%
20%
40%
60%
80%
100%
120%
HF Exposure Only DH + HF Exposure
% o
f In
itia
l P
max
% of Initial Pmax, Light Soak StabilizedHF Test and DH+HF Test
99.9%89.9% 87.5%
0%
20%
40%
60%
80%
100%
120%
HelioVolt Competitor A Competitor B
% o
f In
itia
l P
max
Module Manufacturer
% of Initial Pmax, Light Soak StabilizedDH Test• Completed Damp Heat (DH) and
Humidity Freeze (HF) testing for pre-certification reliability screening
• DH Test:
– Followed IEC protocol 1000 hrs 85°C, 85% RH (Relative Humidity)
– Passed with virtually no degradation
• HF Test:
– All modules followed IEC protocol, which includes 50 cycles of thermal cycling (TC*) pre-conditioning, followed by 10 cycles of HF**
– Half of the modules had additionally gone through 1000 hrs of IEC DH test
– Passed with no degradation:No loss of Power, Voc, Isc
HF
Double torture not required in certificationtesting
DH
* TC cycle: -40°C to 85°C, 10min dwell at extremes** HF cycle: -40°C to 85°C/85%RH, 30min dwell at -40°C, 20hr dwell at 85°C/85%RH DH+HF
Completed Reliability Screening Tests
© 2011 HelioVolt Corporation 36
HelioVolt Module Rooftop Test Array
Factory Rooftop HelioVolt module test array. Array tracks performance of HelioVolt, as well as other thin-film and silicon modules, and inverters
© 2011 HelioVolt Corporation 37
HV Rooftop Test Facility STATUS
• Phase 1 installation complete
• ProSolar, Schletter, and CoolPly racking
• Xantrex, SMA, Fronius Inverters
• Competitor and HelioVolt modules
• 10kW initial capacity
• Thorough monitoring of energy harvest and weather conditions
CAPABILITIES
• Irradiance
– Plane of Array (POA)
– Global Total (GT)
• Weather
– Temperature
– Relative Humidity
• Electrical
– DC Voltage
– DC Current
– AC Voltage
– AC Current
– Inverter Efficiency
© 2011 HelioVolt Corporation 38
HelioVolt Modules(20° tilt, ballasted, Schletter racking)
• 32 HelioVolt modules in 4 strings on Schletter racking
• Full light soak effect achieved on first day
39© 2011 HelioVolt Corporation
Rooftop Performance –Comparison of All Arrays
• HelioVolt modules have highest yield, followed by Tier 1 mc-Si modules; CdTe & other CIGS lag behind
HelioVolt CIGSTier 1 mc-SiTier 1 CdTe2nd Glass Laminate CIGSTubular CIGS
One Day Comparison, All Arrays
© 2011 HelioVolt Corporation 40
• Development work based on HelioVolt patents and trade secrets will drive module efficiency from 10% to 16%
• Applied Research – HelioVolt’s partnership with NREL will drive module efficiency from 16% to 21%
6%
12%
18%
0%
2010 2011 2012 2013
Baseline Process
Active
Quenching,
Advanced
Composition
Grading Control
Ultrafast Heating,
Predictive Design
Advanced TCO,
Enhanced
Transmission,
Light Trapping
Roadmap to 16% Module Efficiency
© 2011 HelioVolt Corporation 41
Product Portfolio Built on Standard Component Platform
Commercial Rooftop Systems
BIPV – SpandrelsBIPV – Sunshades
Parking Structures
Utility Scale
• Front view
• 5‟x5‟ Element
• Framing provided by curtain wall manufacturer
• Standard or custom element
1‟X1‟300mm CIGS PVIC
2‟X4‟
5‟X5‟
© 2011 HelioVolt Corporation 42
Product Portfolio Evolution
2013 2014
Standard modules for commercial rooftops and utility applications.
Standard modules offered with system level solutions for commercial rooftops (including mounting, power management).New standard component introduced to reduce balance of systems costs.
Standard modules adapted for BIPV applications (facades, sunshades, roof tiles) including BIPV components with integrated power management.
11% 12% 14% 16%
2011 2012
Efficiency
© 2011 HelioVolt Corporation 43
Acknowledgments• Dr. Keith Emery and his team for the module efficiency
verification testingNational Renewable Energy Laboratory
• Prof. James Sites and his team for the help with cell characterizationColorado State University
• Dr. David S. Ginley and his team for the CRADA work on ink developmentNational Renewable Energy Laboratory
• The entire HelioVolt team for their role in the successful scale up of the CIGS reactive transfer technologyHelioVolt Corporation
© 2011 HelioVolt Corporation 44
© 2011 HelioVolt Corporation 45
Thank You!Louay Eldada
(512) 767-6060
© 2011 HelioVolt Corporation