ConfidentialNovember 2008 1

Nordiko Technical Services Limited500/550 Nest Business ParkMartin RoadHavantHampshire PO9 5TLUnited Kingdom

Corporate Member

Confidential 1

Location 50° 51’ 54.67”, 0° 58’ 15.49”

Nordiko Technical Services Limited

Nest Business Park500 m2 (5,380 ft2)70 m2 (750 ft2) cleanroom

Confidential 2

Introduction

Nordiko Limited Founded in 1972.Sputtering - magnetron and RF diode sputtering.Ion Beam technology - introduced in 1989.

First commercially available RF ion source.Ion Beam Deposition.Ion Beam Milling.

Nordiko Limited Acquired by Shimadzu Corporation 1998.Shimadzu decided to close Nordiko in 2003.

•Nordiko Technical Services Limited - May 2003.• Acquired by Anelva Corporation - June 2005.• Anelva 100% owned subsidiary of NEC.• NEC sold Anelva to Canon - October 2005.• Bought out Canon - October 2011.

Sputtering At It’s Best

A company I used to work for has 4 Nordiko Sputtering Systems and they are 10 years old at this

point and being used daily for manufacturing. Darwin King

3Confidential

Confidential 4September 2013

N2000 - Magnetron ElectrodesFeaturesUp to four

confocal.Magnet module not

immersed in water.Available for

magnetic targets.RF diode avaialble.

Confidential 5September 2013

N2000 ModuleFeaturesFour 150 mm cathodes.

Central 200 mm rotary table, 20 rpm.100 mm vertical travel.

Source to substrate separation variable from 100 to 200 mm.

OptionsRF, DC.Co-sputtering.Cooling.

Heating.Magnetic field projection.RF bias.Turbomolecular pump, 1400 l.s-1.Cryogenic pump, 1200 l.s-1.WaterPump, 20000 l.s-1 for H2O.

SPUTTERING SYSTEMS

N2000 – Up to 4- 150mm (6”) targets

N2500 – Up to 4 -250mm (10”) or 6- 150mm (6”) targets

8000 and 8500, Up to 4- 250mm (10”) targets or 6- 200

mm (8”) targets

9000 and 9500, Up to 4- 330 mm (13”) targets or 6- 250 mm

(10”) targets

Targets can be RF Diode, RF magnetron, DC magnetron or

even an Ion etch beam for substrate cleaning.

Sputtering at it’s best, Nordiko’s, 2000, 2550, 5000, 8000, 8550, 9000 and 9550

are reliable and long production machines.

6Confidential

With Magnetic Orientation

No magnetic Orientation

7

The First Magnetic Orientated Machine was shipped in 1987.

Confidential

8Confidential

Top Plate from a 9000 sputtering system. Two sputtering targets and ion source.

Confidential 9

A top Plate for a 9000 system, two Al2O3 targets and an ion source.

Confidential10

Side view of table for the an 8000 unit.

Confidential 11

Chase area for a 9000 system.

Nordiko’sCluster tool,Single wafer,

Rotating magnetronsputtering

With Loadloc

k!

12Confidential

Magnetic Orientated

No Magnetic Orientation

13Confidential

Confidential 14

Random access vacuum cassette load lock/s.Standard 25 wafer cassette.Optical sensors for slide out detection.Optical sensors for cassette mapping.700 l.s-1 turbomolecular pump.30 m3.hr-1 dry mechanical pump.Combined vacuum gauge covering he range from atmosphere to 1E-08 Torr.VAT series 02.VAT series 62 pipeline isolation valve.

Vacuum Cassette Load Lock

Confidential 15

Static cassette load lock.Static four (4) wafer cassette.

Vertical travel of the transfer arm (35 mm) is used to pick from four wafer slots within a static cassette.

Common vacuum environment to the robot transfer chamber.

No isolation valve between the load lock and the transfer chamber.700 l.s-1 turbomolecular pump.28 m3.hr-1 dry mechanical pump.

Combined vacuum gauge covering he range from atmosphere to 1E-08 Torr.VAT series 02.VAT series 62 pipeline isolation valve.

Ideal for research applications where small batches are often processed

Vacuum Load Lock - Static Cassette

Confidential 16

Transfer ChamberTransfer chamber.Six port or Eight port.

Six port; two load ports and four process ports.Eight port; two load ports and six process ports.Optical sensors for wafer tracking.700 l.s-1 turbomolecular pump.30 m3.hr-1 dry mechanical pump.

Three axis robot.SCARA style - single end effector.Rotary vacuum seal, magnet fluid feedthrough.Z-axis seal, edge welded bellows.

Aligner.Optical CCD aligner.Operates in concert with the robot.Wafer centre alignment ±0.25 mm.Angular alignment ±0.1 degree.

Control Automation SystemFeatures

System is not a PLC.• Modular computer with industrial I/O.• Intel micro-processor.• OS is Windows CE.• HMI on a separate PC.

InstallationsFourteen installations.

• Three new systems +.• Eleven field retro-fits.

• Ten in USA.• One in Japan. ⎬production tools.

Confidential 1719

Control Automation System

Confidential18

FeaturesCPU - only Ethernet & COM1 ports.

• No video, no keyboard, no mouse.

• Networked PC for user interface, HMI.

• Flash storage, no rotating hard disc.

• Low power CMOS - no fans.

• Serial, digital & analogue I/O modules.

• No back-plane - I/O modules build the bus.

• Intelligent Instrumentation.