Designing Internet Of Things

© 2015 Atmel Corporation1

Designing IoTHiPEAC CSW

Jo Uthus - Sr Director, Applications Atmel CorporationMay 2015

05/02/2023

2 © 2015 Atmel Corporation 05/02/2023HiPEAC

3 © 2015 Atmel Corporation

1,000,000,000+ per year

30per second


Our customers build this…

5 © 2015 Atmel Corporation 05/02/2023

Electrification of The World Around Us, Accelerating IoT

of World Wide Households will have Wi-Fi by 2016

- Strategy Analytics

42%

# of smart phone Subscriptions by 2018

- Ericsson Mobility Report, 6/2015

4.5B

Connected devices by 2020- ABI Research, 6/2015

>30B

of IoT Solutions will be provided by startups which are less than 3 years old by 2019 - Gartner

50%

Expected # of connected devices per household

- Atmel Estimate

~100

HiPEAC


Acceleration Of IoT, Impacting Many End Segments

05/02/2023HiPEAC


Internet Of Things Topology

or

MCUsMPUs Energy

Sensing Connectivity

Security

BAN/ PAN/ LAN /HAN

Short RangeConnectivity

EdgeSensing Nodes

Hierarchical IoT Gateways

WANLong RangeConnectivity

Cloud

Data Analytics

Application/ Action


Internet of ThingsLet’s take a look at the real world...


Philips Hue, RGBW Color MixATmega2564RFR2 + BitCloud 3.0

Lighting and home automation

05/02/2023HiPEAC



AT86RF233 + ZigBee Green PowerBatteryless/Energy Harvester

05/02/2023HiPEAC



Lutron Wireless RemoteATmega2564RFR2Coincell powered

HiPEAC

12 © 2015 Atmel Corporation 05/02/2023HiPEAC

Consumer, Wearables

Agent SmartwatchAtmel low-power SAM4L + BLE


Wearables, Health Monitoring

Amulyte PendantLow-power SAM4L, GPS, WiFi

05/02/2023HiPEAC


Agriculture

Libelium SensorsAtmel MCU + RF6LowPan (IPv6 over 802.15.4)

Precision Agriculture Leaf wetness, fruit diameter

Irrigation Systems Soil moisture, leaf wetness

Greenhouses Weather Stations Anemometer, wind vane, pluviometer

05/02/2023HiPEAC


Edge Node Challenge: Technology IntegrationFitness Band Smart Watch ThermostatSmart Detector

eMPU

Charging IC

ZigBee SoC

Nand Flash

Wi-Fi Module

DRAM

BT Module MCU BT Transceiver Chip Antenna

3-Axis Accelerator

MCU

MCU

BLE SoC

Accelerometer

Charger IC

MCU

ZigBee SoC

Sensor Hub MCU

Wi-Fi Module


05/02/2023

Key Embedded Design Challenges in all edge

node designs..

HiPEAC

MCUsMPUs Energy


Security


Broad Portfolio MCUs & MPUs NeededScalable Family of Atmel | SMART and AVR

180 DMIPS512KB to 2MB Flash

SAM 4C/D/E/G/LCortex-M4

+ FPU

850 DMIPS

SAMA5Cortex-A5

NEON

20 MIPS512B to 384KB Flash

tinyAVRmegaAVR

600 DMIPS512KB to 2MB Flash

SAM E7/S7

Cortex-M7+FPU

45 DMIPS8KB to 256KB Flash

SAM D/L/C/V

Cortex-M0+

One Size Does Not Fit All:MCUsMPUs Energy


Security

05/02/2023HiPEAC


Broad Portfolio Of Wireless ConnectivityScalable Family of Atmel | SmartConnect

SAM W

Wi-Fi MCUSolutions

SAM B

BLE MCUSolutions

SAM R

Wireless MCUSolutions

Bluetooth Low Energy

1Mb/sUp to 10m range

Bluetooth Dual Mode


NarrowbandFSK

2.4GHz & Sub GHz

~ 2-5Kb/sUp to 2Km range

802.15.4ZigBee

6LoWPAN

250kb/sUp to 300m range

Wi-Fi802.11a/b/g/n


One Size Does Not Fit All:MCUsMPUs Energy


Security


Offering best in Class Security for IoT Edge NodesSmartConnect IoT Layered Security Solutions

Layer 1: Physical

Layer 2: Link

Layer 3: Network

Layer 4: Transport

Layer 5: Session

Layer 6: Presentation

Layer 7: Application

802.11b/g/n

TLS/SSLTCP/UDP

IP, ARP, DHCP

APPLICATION

HOMEKIT, OIC, HTTP, FTP, SMTP, SNMP,

Wi-Fi Security LevelCryptoAuthentication

-> Storage of Keys / Certificates

On-Chip (WINC1500)TLS 1.0 (SSL)

-> Ensures Data Encryption“Coming out” of the LAN, also Known as Internet Security

On-Chip (WINC1500)WEP, WPS,WPA2 PersonalWPA2 Enterprise

-> Ensures Data Encryptionwithin the LAN to avoid intrusion

05/02/2023HiPEAC



Layer 1: Physical

Layer 2: Data Link

Layer 3: Network

Layer 4: Transport

Layer 5: Session



802.14.5 (Thread)ContikiMAC

IP 6LoWPAN

APPLICATION

CoAP, MQTT, Etc,..

6LoWPAN / Thread Security Level

UDP + DTLSTCP + TLS (not in Thread)

On-Chip, HW, mandatoryAES-128-> Basic Frame encryption

On-Chip, HW/SW, mandatory (in Thread)DTLS 1.2 (EC-JPAKE)

-> Authentication and key provisioning,Security outside of WPAN

CryptoAuthentication

-> Authentication used forAnti-cloning, Ecosystem Management, Storage of Keys/Certificates

05/02/2023HiPEAC



Layer 1: Physical

Layer 2: Data Link

Layer 3: Network

Layer 4: Transport

Layer 5: Session



802.14.5

ZigBee PRO

APPLICATION

ZCL

ZigBee Security Level

On-Chip, HW, optionalAES-128

On-Chip, HW, mandatoryAES-128

CryptoAuthenticationATECC508A bundled

-> Authentication Key Storage

05/02/2023HiPEAC



Layer 1: Physical

Layer 2: Data Link

Layer 3: NetworkLayer 4: TransportLayer 5: SessionLayer 6: Presentation


Bluetooth SMART Security Level

Baseband + Radio

L2CAP

Link Layer

GATT

HCI

ATTGAP

SMP

Application

Link Layer securityBLE 4.X

-> Ensures Data Encryptionwithin the Link to avoid intrusion-> Association mode: Just works, Passkey entry, Out of Band

Advanced Comm. SecurityBLE4.2-> Enables Secure Connections-> Authentication with Key exchange.-> Association mode: Numeric Comparison

CryptoAuthenticationATECC508A bundled

-> Authentication Key Storage

05/02/2023HiPEAC


Solving today’s IoT System Integration ChallengeSilicon Integration is solved…

MCU /eMPU

No Supplier has a System level solution- Decentralized Development environment

- Increases risks of system security holes.

- Multiple SW stack suppliers & Silicon Vendors

- RF antenna and coexistence issues

- Low BOM efficiency: Cost, Space

- Power Consumption

SMARTCONNECT System Solution- MCU / Wireless SoC Chipsets

- Ready to MP Certified Modules

- Layered Security

- MP ready integrated SW stacks

- System-In-Package Integration

- Lowest Power Consumption

- Shortest Time to Market

FCC, ETSI, IC Certified

Wireless Transceiver

Customer SW

WiFi APIZigBee MWBLE Profiles

MCU /eMPU Wireless SoC,

SIP, Module

Customer SW

WiFi APIZigBee MWBLE Profiles

Customer has to develop bothTo make the solution work

Customer only needs to focus on the MCU

Black Box

Laye

red

Secu

rity


Embedded Designer Value Creation Pyramid

Security

Application

IoT Comm. Stacks + 3rd Party Cloud APIs

Ultra Low PowerHardware Integration

Atmel SmartConnect

Customer Application

Atmel Software Solutions

Creating a System Solution for Easy Adoption

Wireless(Comms)

MCU(Application)

Security(Crypto

Authentication)

Atmel Security Solutions

15mm

33mm

HiPEAC


Key Challenge in the next phase of edge-node design

is not Silicon….

05/02/2023

HiPEAC


UBM 2014 Tech Embedded Market Study The importance of the eco-system is growing

2010 2011 2012 2013 2014

43% 46%

61%

48%

65%

45% 43%

30%

40%

27%

What is most important whenchoosing an MPU/MCU?

Device Eco Sys Device Itself

05/02/2023HiPEAC


Embedded Software Complexity explodes

Microcontroller Hardware

Customer IoT Application

Incr

easi

ng V

alue

05/02/2023HiPEAC


Prototyping hardware

Integrated Development Environment

Embedded Software Framework

Solve Integration with Design Tools

Common Design and Integration Flow

• Integration• Configuration • Customization

• Application Focused• Design and Debug

• Evalutate Features• Prototype Solutions

HiPEAC


Embedded Software

Industry Partners

Online Communities

Xplained boards& HW Tools

DevelopmentTools

05/02/2023

Atmel solves IoT integrationOpen Development Platform

ReferenceSolutions Gallery

Fastest Time toPrototype


The Winner of IoT is defined by ability to integrate technologies…

..and the solution is found in toolchains, software and common design flows…

05/02/2023HiPEAC

© 2015 Atmel Corporation31

© 2015 Atmel Corporation.

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Designing Internet Of Things