10
Our reference: SNB 16940 P-authorquery-v9 AUTHOR QUERY FORM Journal: SNB Please e-mail or fax your responses and any corrections to: E-mail: [email protected] Article Number: 16940 Fax: +353 6170 9272 Dear Author, Please check your proof carefully and mark all corrections at the appropriate place in the proof (e.g., by using on-screen annotation in the PDF file) or compile them in a separate list. Note: if you opt to annotate the file with software other than Adobe Reader then please also highlight the appropriate place in the PDF file. To ensure fast publication of your paper please return your corrections within 48 hours. For correction or revision of any artwork, please consult http://www.elsevier.com/artworkinstructions. Any queries or remarks that have arisen during the processing of your manuscript are listed below and highlighted by flags in the proof. Click on the ‘Q’ link to go to the location in the proof. Location in Query / Remark: click on the Q link to go article Please insert your reply or correction at the corresponding line in the proof Q1 Please confirm that given names and surnames have been identified correctly. Q2 Please ensure that the corresponding authors’ information are complete and accurate. Q3 One or more sponsor names and the sponsor country identifier may have been edited to a standard format that enables better searching and identification of your article. Please check and correct if necessary. Q4 Please provide the grant numbers for “Royal Society of Edinburgh”, “Carnegie Trust Funding”, “Scottish Sensor System Centre (SSSC)”, “EPSRC”, “European Commission” and “Ministerio de Econom´ ıa y Competitividad del Gobierno de Espa˜ na” if any. Q5 Please check the abbreviated journal titles in Refs. [1,45]. Q6 Please provide complete bibliographic details in Ref. [24]. Q7 Please provide the volume number for the bibliography in Refs. [28,29,43]. Q8 Please provide the abbreviated journal titles for Refs. [30–32]. Q9 Please define figure parts for Fig. 12 if necessary. Q10 Please specify the significance of footnote “*” cited in the table, as a corresponding footnote text has not been provided. Please check this box or indicate your approval if you have no corrections to make to the PDF file Thank you for your assistance.

Characterisation of aluminium nitride films and surface acoustic wave devices for microfluidic applications

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Our reference: SNB 16940 P-authorquery-v9

AUTHOR QUERY FORM

Journal: SNB Please e-mail or fax your responses and any corrections to:

E-mail: [email protected]

Article Number: 16940 Fax: +353 6170 9272

Dear Author,

Please check your proof carefully and mark all corrections at the appropriate place in the proof (e.g., by using on-screenannotation in the PDF file) or compile them in a separate list. Note: if you opt to annotate the file with software other thanAdobe Reader then please also highlight the appropriate place in the PDF file. To ensure fast publication of your paper pleasereturn your corrections within 48 hours.

For correction or revision of any artwork, please consult http://www.elsevier.com/artworkinstructions.

Any queries or remarks that have arisen during the processing of your manuscript are listed below and highlighted by flags inthe proof. Click on the ‘Q’ link to go to the location in the proof.

Location in Query / Remark: click on the Q link to goarticle Please insert your reply or correction at the corresponding line in the proof

Q1 Please confirm that given names and surnames have been identified correctly.Q2 Please ensure that the corresponding authors’ information are complete and accurate.Q3 One or more sponsor names and the sponsor country identifier may have been edited to a standard format

that enables better searching and identification of your article. Please check and correct if necessary.Q4 Please provide the grant numbers for “Royal Society of Edinburgh”, “Carnegie Trust Funding”, “Scottish

Sensor System Centre (SSSC)”, “EPSRC”, “European Commission” and “Ministerio de Economıa yCompetitividad del Gobierno de Espana” if any.

Q5 Please check the abbreviated journal titles in Refs. [1,45].Q6 Please provide complete bibliographic details in Ref. [24].Q7 Please provide the volume number for the bibliography in Refs. [28,29,43].Q8 Please provide the abbreviated journal titles for Refs. [30–32].Q9 Please define figure parts for Fig. 12 if necessary.Q10 Please specify the significance of footnote “*” cited in the table, as a corresponding footnote text has

not been provided.

Please check this box or indicate your approval ifyou have no corrections to make to the PDF file

Thank you for your assistance.

Please cite this article in press as: J. Zhou, et al., Characterisation of aluminium nitride films and surface acoustic wave devices formicrofluidic applications, Sens. Actuators B: Chem. (2014), http://dx.doi.org/10.1016/j.snb.2014.05.066

ARTICLE IN PRESSG ModelSNB 16940 1–9

Sensors and Actuators B xxx (2014) xxx–xxx

Contents lists available at ScienceDirect

Sensors and Actuators B: Chemical

journa l homepage: www.e lsev ier .com/ locate /snb

Characterisation of aluminium nitride films and surface acoustic wavedevices for microfluidic applications

1

2

J. Zhoua,b,c, M. DeMiguel-Ramosd, L. Garcia-Gancedoe, E. Iborrad, J. Olivaresd, H. Jina,∗,Q1

J.K. Luoa, A.S. Elhadyb, S.R. Donga, D.M. Wanga, Y.Q. Fub,∗3

4

a Department of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China5b Thin Film Centre, Scottish Universities Physics Alliance (SUPA), University of the West of Scotland, Paisley PA1 2BE, UK6c School of Engineering, The University of Edinburgh, Edinburgh EH9 3JF, UK7d GMME-CEMDATIC, ETSIT, Universidad Politécnica de Madrid, Madrid 28040, Spain8e Electrical Engineering Division, Department of Engineering, University of Cambridge, Cambridge CB3 0FA, UK9

10

a r t i c l e i n f o11

12

Article history:13

Received 7 March 201414

Received in revised form 22 April 201415

Accepted 14 May 201416

Available online xxx17

18

Keywords:19

AlN film20

Surface acoustic wave21

Microfluidic22

Microstructure23

Thickness24

a b s t r a c t

Aluminium nitride (AlN) films with different thicknesses (from 2.3 to 4.7 �m) were deposited ontohigh resistivity silicon substrates using magnetron sputtering. Crystalline and bonding structures of thedeposited AlN films were characterised. The AlN films showed a highly c-axis texture. AlN film based sur-face acoustic wave (SAW) devices were fabricated and characterised. The SAW devices showed Rayleighwave transmission band with a large side-lobe suppression of ∼15 dB. With the increase in film thickness,both the central band frequency and electromechanical coupling coefficient were increased, and valuesof temperature coefficient of frequency was increased linearly from −21.3 to −27.4 ppm/K. Microfluidicmanipulations including streaming, pumping and jetting have been realised using AlN SAW devices. Theapplied RF power boundary between streaming and pumping and that between the pumping and jettingdecreased with the increase of film thickness. The measured streaming and pumping velocities as wellas device surface temperatures increased with the film thickness.

© 2014 Elsevier B.V. All rights reserved.

25

1. Introduction26

Surface acoustic wave (SAW) resonators have been a major27

building block of electronic devices with wide applications for fil-28

ters, frequency duplexers, RF-tags (RFIDs), etc. in electronics and29

communications [1]. Recently, SAW devices have found tremen-30

dous applications in biochemical sensing, drug development, life31

science and medical research [2–5], and precise microfluidic con-32

trol with various functions such as acoustic streaming, mixing,33

pumping, jetting and nebulisation have been realised [6–12].34

Microfluidic devices based on the SAW devices provide an efficient,35

reliable and controllable method to deliver microfluidic functions36

as well as manipulate, trap, sort and pattern cells and nano-particles37

[13–17].38

∗ Corresponding authors at: University of the West of Scotland, Thin Film Centre,B229, Richardson Building, University of the West of Scotland, Paisley PA1 2BE, UK.Tel.: +44 0141 848 3563.Q2

E-mail addresses: [email protected] (H. Jin), [email protected],[email protected] (Y.Q. Fu).

SAW devices are normally fabricated on either bulk piezoelectric 39

substrates such as quartz, LiNbO3 or LiTaO3, or on piezoelectric thin 40

films such as zinc oxide (ZnO) or aluminium nitride (AlN), which 41

can be deposited on conventional substrates such as glass or sil- 42

icon [18–20]. Thin film SAW devices present several advantages 43

over the bulk counterparts in terms of device design flexibility, 44

production cost, and the most important aspect, the possibility of 45

integration in complex MEMS systems or CMOS electronics [11]. In 46

the past decade, many studies on microfluidic applications using 47

ZnO based SAW devices have been reported [21,22]. However, ZnO 48

films present potential issues for biomedical and microfluidic appli- 49

cations (unstable in liquid solutions [23]), making them less ideal 50

materials for microfluidic applications than other thin film piezo- 51

electric materials such as AlN. ZnO is also prone to form oxygen 52

vacancies, which act as donor-like impurities, thus making the 53

material conductive and destroying its piezoelectric activity [24]. 54

Conversely, AlN films have better chemical and thermal stability 55

than ZnO films [25,26]. Although generally the coupling coefficient, 56

k2, values of the ZnO/Si SAW devices are slightly higher than those 57

of the AlN/Si SAW devices [21,27], AlN films have a reasonable 58

good piezoelectric activity to obtain SAW actuators with a good 59

enough k2. The SAW propagation velocity is considerably larger in 60

http://dx.doi.org/10.1016/j.snb.2014.05.0660925-4005/© 2014 Elsevier B.V. All rights reserved.

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Please cite this article in press as: J. Zhou, et al., Characterisation of aluminium nitride films and surface acoustic wave devices formicrofluidic applications, Sens. Actuators B: Chem. (2014), http://dx.doi.org/10.1016/j.snb.2014.05.066

ARTICLE IN PRESSG ModelSNB 16940 1–9

2 J. Zhou et al. / Sensors and Actuators B xxx (2014) xxx–xxx

the AlN devices than those in the ZnO ones, and the propagation61

losses are lower due to their much larger elastic constants [28]. For62

fabricating SAW devices, it is critical to deposit AlN films with c-63

axis orientation, low stress, less transition layer between substrate64

and AlN films and good adhesion to substrates, as well as a piezo-65

electric response as good as those from the theoretical analysis of66

the single crystal of the AlN [29–32]. Currently, AlN film acoustic67

wave devices have been demonstrated to be promising for high fre-68

quency sensing applications, especially for film bulk acoustic wave69

devices with a high sensitivity [28,33]. However, there are few stud-70

ies available on the optimisation and characterisation of the effects71

of film microstructure and thickness (up to a few microns) in order72

to improve microfluidic performance of the AlN SAW based devices.73

In this study, AlN films with various thicknesses were deposited74

onto Si substrate, and their crystalline structure, film stress, SAW75

response, and sensing/microfluidic performance of the AlN SAW76

devices as a function of the film thickness were characterised.77

2. Experimental78

AlN films with thicknesses (h) ranging from 2.3 to 4.7 �m were79

deposited onto 4-inch in diameter (1 0 0)-oriented high resisti-80

vity Si substrates using a pulsed-DC reactive magnetron sputtering81

process in an ultra-high vacuum system. The diameter of the82

high-purity (99.999%) Al metallic target was 150 mm. Before AlN83

deposition, the substrates were heated to 400 ◦C with a base84

pressure of 1 × 10−8 Torr. The surface of the substrate was then85

plasma-cleaned by means of a short bombardment (60 s) with Ar+86

ions from a bias RF glow discharge. The AlN films were then sput-87

tered onto Si substrate using a gas mixture of Ar:N2 (4:6), a total88

pressure of 1.9 mTorr, a pulsed-DC target power of 1.2 kW and a89

platen temperature of 400 ◦C. AlN films develop a non-constant in-90

plane stress as they grew. The initial film stress is large compressive,91

but becomes less compressive and even tensile as the film thick-92

ness increases [34]. To reduce the stress gradient in a thick AlN93

film and improve its adherence to the substrate, an RF bias power94

of 80 W, which leads to a DC polarisation of −60 V, was applied to95

the substrates during the first 30 min of the deposition. In the sec-96

ond 30-min deposition, the RF bias applied to the substrate was97

increased to 90 W (−65 V DC bias) to compensate the film stress.98

After 1 h deposition, the RF bias was increased to 100 W (−70 V DC99

bias). The average deposition rate was estimated to be ∼60 nm/min.100

Crystalline structure of the AlN films was analyzed using X-ray101

diffraction (XRD, D5000, Siemens) with Cu-k� radiation. This radi-102

ation is composed by two terms k�1 with wavelength of 1.5406 A103

and k�2 with 1.5444 A. The intensity of k�1 is double of k�2. The104

XRD diffraction results obtained from the films were fitted with105

Voigt functions (i.e., mixed Lorentzian and Gaussian functions) for106

each k� term [35]. The overall in-plane residual stress was evalu-107

ated by measuring the radius of curvature of the sample before and108

after the deposition of the AlN film using a Veeco Dektak-150 pro-109

filometer. The residual stress was then calculated using the Stoney’s110

equation [36]. Cross-sectional morphology of the films was ana-111

lysed using a scanning electron microscope (SEM, Hitachi S-4800).112

Raman spectra of the AlN films were recorded at room temperature113

using a Raman microscope (Thermo Scientific DXR) with an exci-114

tation laser wavelength � = 532 nm and a resolution of 1 cm−1. The115

microscale (1 × 1 �m2) surface roughness of the films was charac-116

terised using an atomic force microscope (AFM, Agilent 5100), in117

contact mode using a Si3N4 cantilever. Macroscale surface rough-118

ness of the films were characterised using a surface profilometer119

(Dektak3 ST) with a scan distance of 2 mm, scan velocity of 0.5 �m/s120

and a loading force of 30 mg.121

SAW delay lines were fabricated on the AlN layer by pattern-122

ing Cr/Au inter-digitised transducers (IDTs) using a conventional123

photolithography process. The IDTs have a spatial periodicity of 124

64 �m (a line-width of 16 �m and a space of 16 �m), 30 pairs of fin- 125

gers, and an aperture of 4.9 mm. The distance between the centres 126

of both transducers was 10 mm and this is where the microfluidic 127

experiments were done. The transmission properties of the devices 128

were assessed by measuring the scattering parameters using an RF 129

vector network analyser (Agilent Technologies, E5061B). The tem- 130

perature dependence of the transmission properties of the SAW 131

devices with different thicknesses was measured in an environ- 132

mental controlled chamber (WKL 34, WEISS TECHNIC), capable of 133

controlling the temperature with an accuracy of 0.1 ◦C. 134

For microfluidic tests, the AlN SAW devices were surface- 135

coated with a ∼200 nm thick layer of CYTOPTM (Asahi Glass 136

Co. Ltd.) in order to enhance their surface hydrophobicity. The 137

SAW devices were connected to a signal generator (Agilent Tech- 138

nologies, N9310A), which was amplified by a broadband power 139

amplifier (Amplifier Research, 75A250). The system was care- 140

fully impedance-matched to avoid internal reflection of the RF 141

signals. The microfluidic behaviour of de-ionised water droplets 142

were recorded using a high speed video camera (Vision Research, 143

phantom V7.3) working at a frame rate of 4000 frames/s. Internal 144

streaming velocities were estimated from the particle move- 145

ment inside the droplet from the high speed video. Droplet 146

pumping/jetting speeds were also estimated based on the recorded 147

movies. The devices were mounted onto a bulk aluminium alloy 148

test-holder during testing in order to minimise the possible heat- 149

ing effect. The device surface temperature after applying the RF 150

power was measured using an infrared video camera (Therma- 151

CAMTM SC640) with and without water droplets on the device 152

surface. 153

3. Results and discussions 154

3.1. Film characterisation 155

Fig. 1 shows XRD patterns of the AlN films with thicknesses of 156

2.3, 3.4 and 4.7 �m, respectively. The dominant (0 0 0 2) peak of the 157

wurtzite AlN structure was verified for all the AlN films, indicating 158

a preferential growth orientation along c-axis, which is indepen- 159

dent of the film thickness. The peaks appearing around ∼32.5◦ are 160

the vestiges of the diffraction of the partially filtered k� radiation. 161

Only the XRD pattern of the thinner film (2.3 �m thick) show other 162

small peaks, which are not due to the AlN film. Probably they are 163

Fig. 1. XRD patterns of AlN films with different thicknesses. (Intensity axis is inlogarithmic scale and the patterns have been shifted vertically for comparison.)

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comparison).Figure 2(0002) diffraction

Please cite this article in press as: J. Zhou, et al., Characterisation of aluminium nitride films and surface acoustic wave devices formicrofluidic applications, Sens. Actuators B: Chem. (2014), http://dx.doi.org/10.1016/j.snb.2014.05.066

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Fig. 2. (0 0 0 2) Diffraction peak of the 4.7 �m thick AlN film fitted with three pairsof Voigt functions (corresponding each to k�1 and k�2 reflections of each stepdeposited layer).

Table 1Curve fitting results of (0 0 0 2) XRD peak of the films of different thicknesses. Onlyk�1 data are presented. .Q10

2.3 �m 3.2 �m 4.7 �m

2�-1 35.9020 35.8336 35.8340Int. 1 23,310 29,400 49,000FWHM-1 0.3136 0.1900 0.23652�-2 36.0130 36.0270 35.9847Int. 2 5860 181,000 245,200FWHM-2 0.1027 0.1444 0.10952�-3 * * 36.0760Int. 3 * * 130,000FWHM-3 * * 0.1209

reflections of radiation from impurities in the X-ray tube on silicon,164

which cannot be observed in the thicker AlN films. This ensures that165

all the AlN films have pure (0 0 0 2) orientation, and therefore, are166

good candidates for having a good piezoelectric response [37].167

In Fig. 2, a detailed XRD pattern of the 4.7 �m film is presented168

together with the decomposition in pairs of k�1 and k�2 of three169

families of planes corresponding to three families of microcrystals.170

In Table 1, the result of the fittings for the three types of AlN films171

studied in this work are listed. The origin of these different grain172

populations lies on the changes in the substrate bias polarisation173

during the film deposition. This can be also seen in Fig. 3(a), which174

represents SEM cross-section image of the 4.7 �m thick AlN films.175

All the AlN films have columnar microcrystalline grains perpen-176

dicular to the substrate with a clear evolution in its morphology177

in the direction of growth. With increase of the film thickness, the178

columnar structures are more neatly arranged and compact, indi- 179

cating forming a better crystalline structure, which is consistent 180

with the XRD results. 181

Various values of the diffraction angles of these grain popula- 182

tions are due to different strain values. The bottom-most layer near 183

the substrate has a compressive stress indicated by the (0 0 0 2) 184

peak shifting to lower angles. The upper layers have more ten- 185

sile stress components compensating the former one. The resulting 186

stress of the final layer is under 200 MPa in all the cases, and the 187

film stress increases with film thickness. The AlN (0 0 0 2) peak 188

becomes stronger and shaper, with a lower value of full width at half 189

maximum (FWHM), with gradually increasing film thickness. This 190

indicates that the grain size of the AlN films becomes larger as the 191

thickness of the film increases. Because this grain size is larger than 192

100 nm, the estimation using the Debye–Scherrer formula [38] can- 193

not be done although the FWHM of the k�1 term of the diffracted 194

X-ray radiation can be used as a measurement of the crystal quality. 195

This parameter becomes larger when the grain size is smaller but 196

also when the stress gradient in the c-axis direction increases. 197

Typical microscale surface roughness of the 4.7 �m thick AlN 198

films obtained from AFM analysis is shown in Fig. 3(b). With the 199

increase in AlN film thickness, grain sizes of the films increase 200

slightly and the values of the Roughness Measurement of the Sur- 201

face (RMS) are 5.96 and 7.01 nm for the AlN films with thicknesses 202

of 2.3 and 4.7 �m, respectively. The average macroscale surface 203

roughness values (Ra) obtained from the surface profilometer are 204

31.6, 33.4 and 36.7 nm for the AlN films with thicknesses of 2.3, 205

3.4 and 4.7 �m, respectively. In brief, the surface roughness does 206

not appear change dramatically, thus will not have any significant 207

effect on the microfluidic performance. 208

Fig. 4 shows the Raman spectra of the AlN films. The sharp peak 209

around 522 cm−1 and the broad peak at about 979 cm−1 corre- 210

spond to the single-phonon vibration mode and two TO-phonon 211

overtones scattering of the silicon substrate, respectively [39]. The 212

peaks around 250 cm−1 and 302 cm−1 are assigned to E2(low) 213

vibration modes [40,41]. The E2(high) mode (∼655.5 cm−1) and 214

A1(LO) mode of the wurtzite AlN film (∼890 cm−1) were detected, 215

which are sensitive to the strain inside the AlN film [41,42]. The 216

E2(high) mode peak of all films seems to be left-shifted compared 217

to the 655.5 cm−1 of standard unstrained AlN [41], confirming the 218

existence of compressive stresses in the AlN film on Si substrate. 219

However, a careful analysis of the second derivative of the Raman 220

spectra around 655 cm−1 shows that the peak is actually composed 221

by two or three bands which are associated to the two or three 222

AlN layers. Unfortunately, an accurate fitting of these bands has 223

not been possible because the low signal to noise ratio of the mea- 224

surements and, thus, quantitative information about the stress of 225

these layers cannot be obtained from the Raman analysis. The no- 226

appearance of the E1(LO) and the A1(TO) modes, around 912 cm−1227

Fig. 3. Characterisation of the 4.7 �m thick AlN films: (a) SEM image of cross-section morphology, (b) AFM image of surface morphology.

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Figure 3Characterization

Please cite this article in press as: J. Zhou, et al., Characterisation of aluminium nitride films and surface acoustic wave devices formicrofluidic applications, Sens. Actuators B: Chem. (2014), http://dx.doi.org/10.1016/j.snb.2014.05.066

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Fig. 4. Raman spectra of the AlN films with different thicknesses: (a) 2.3 �m, (b)3.4 �m and (c) 4.7 �m (the different spectra are presented on top of each other forclarity).

Fig. 5. Transmission (S21) signals of the AlN SAW devices with different thicknesses.

and 620 cm−1, respectively, indicates that the films are purely c-axis228

oriented. All these results are coherent with the XRD data discussed229

above.230

3.2. SAW device characterisation231

Fig. 5 shows typical transmission signals (S21) of the devices with232

different AlN film thicknesses. The devices exhibit clear transmis-233

sion bands, which are centred at 79.8, 80.1, and 80.3 MHz for the234

samples with AlN film thicknesses of 2.3, 3.4 and 4.7 �m, respec-235

tively. All the bands have an out-of-band rejection of ∼13 to ∼15 dB,236

and are assigned to the Rayleigh mode waves. The phase velocity237

(vp) of the SAW devices were determined by vp = �·f0 (in which � is238

wavelength of the SAW device, 64 �m, and f0 is the measured cen-239

tral band frequency). The corresponding velocities of the Rayleigh240

peaks were found to be 5107.2, 5126.4 and 5139.2 m/s, respectively,241

for the AlN film thicknesses of 2.3, 3.4 and 4.7 �m, indicating that242

the velocity increases as the ratio of the thickness to wavelength243

(h/�) increases. For a layered structure, the phase velocity of the244

SAW device is influenced by the properties of both the piezoelec-245

tric layer and substrate. As the wavelength is much longer than246

the thickness of the AlN layer, acoustic waves will penetrate much247

deeper into the substrate. The phase velocity for the Rayleigh wave248

in an ideal (0 0 0 2) AlN layer is ∼5607 m/s [43], which is higher249

than that of Si (4680 m/s) [44]. As the thickness of the AlN thin film250

increases, a higher proportion of the acoustic waves travel in the251

piezoelectric AlN film, leading to a higher acoustic velocity.252

The electromechanical coupling coefficient of the Rayleigh 253

modes was calculated using the following formula based on the 254

corresponding Smith-Charts [45]: 255

k2 = �

4N

(G

B

)f =f0

(1) 256

where N is the number of finger pairs; G and B are the radia- 257

tion conductance and susceptance at the band central frequency, 258

respectively. The average values of k2 for the Rayleigh modes of 259

the AlN SAW devices were found to be 0.1%, 0.19% and 0.24%, for 260

the AlN thickness of 2.3, 3.4 and 4.7 �m, respectively. It is notable 261

that the value of k2 increases with the increase of thickness of AlN 262

films. This is mainly due to the dispersion of k2 with the ratio h/�, 263

which, like the frequency, occurs in layered SAW structures. How- 264

ever, it is not discarded the possibility of an improvement of the 265

AlN properties as the thickness increases. 266

It is well known that SAW devices are extremely useful in the 267

development of various types of sensors owing to their high sen- 268

sitivity and wireless capability [4]. One of the major drawbacks of 269

these devices for sensing applications is their sensibility to tem- 270

perature variations. In order to evaluate this influence, the central 271

band frequencies of the Rayleigh waves of AlN based SAW devices 272

with different film thicknesses have been obtained as a function of 273

temperature, and the results are shown in Fig. 6(a). The frequencies 274

measured for all the devices decrease linearly with increase of tem- 275

perature. The central band frequency at a temperature T (in Celsius 276

degrees) (fT) can be expressed as: 277

fT = f0 × (1 + ˛ × T) (2) 278

where ˛ is the temperature coefficient of the centre frequency (TCF) 279

defined as �f/(f0�T), and f0 is the frequency at 20 ◦C. The obtained 280

values of ˛ are −21.3 ppm/◦C, −23.7 ppm/◦C, and −27.4 ppm/◦C for 281

the devices with AlN thicknesses of 2.3, 3.4 and 4.7 �m, respectively 282

(with f0 of 79.8, 80.1, and 80.3 MHz). The results are comparable to 283

those in the literature [46]. The magnitude of the TCF increases 284

linearly with film thickness as shown in Fig. 6(b), because the TCF 285

values of the AlN films are larger than that of Si, thus the more 286

proportion of the wave travels in the AlN film when its thickness is 287

larger. 288

3.3. Microfluidic performance 289

When a liquid droplet is located on the propagation path of a 290

surface acoustic wave, the SAW interacts with the liquid and the 291

acoustic energy couples into the liquid, inducing a typical butterfly 292

acoustic streaming pattern [47]. These patterns can be observed if 293

starch nano-particles are dispersed into the liquid. When a droplet 294

containing starch nano-particles was positioned off the central line 295

of the wave path, the induced flow circulation into the droplet 296

due to asymmetric acoustic streaming rapidly establishes vortex 297

patterns. Fig. 7 shows the acoustic streaming and particle concen- 298

tration phenomena of the droplets with a volume of 3 �L positioned 299

at the edge and in the centre of the acoustic path between the IDTs. 300

The concentration flow patterns of the starch particles inside the 301

liquid are actuated by the shear streaming forces, which induce 302

particle migration due to the gradient in the azimuthal streaming 303

velocity in the droplet [48]. When an applied RF power is about 304

2.1 W (at the Rayleigh central band frequency), the streaming tra- 305

jectory of the 3 �L droplets shows a typical butterfly pattern with a 306

double vortex when the droplet is located in the centre of the acous- 307

tic path of the SAW devices. As the film thickness increases from 308

2.3 to 4.7 �m, the streaming velocity increases from 1.8 to 3.1 cm/s 309

at the same RF power of 2.1 W. Whereas, particle concentration is 310

observed at the same time when the droplet is positioned at the 311

edge of the wave path, and the durations for the particle concen- 312

tration decreases from 7 to 5 s when the droplet were actuated by 313

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m.
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Figure 5Transmission (S
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c-axis
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Device
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(S21
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p
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λ·f0 (in which λ
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0
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(h/λ)
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(0002)
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oWhere
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2
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2
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h/λ,
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(a).
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⋅(1+α⋅T)Where α
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Δf/(f0ΔT), and f0
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α are -21.3
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-27.4
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0
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(

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Fig. 6. (a) Central band frequency as a function of temperature for the AlN based devices of different thicknesses: 4.7 �m, 3.4 �m and 2.3 �m; (b) the TCF as a function ofAlN thickness showing the linear relationship.

Fig. 7. Droplets of 3 �L show acoustic streaming induced by the AlN SAW devices. A double vortex streaming pattern is produced in the centre of the wave path while asingle vortex is formed in droplet in the edge of the wave path, for different AlN thicknesses: (a) 2.3 �m, (b) 3.4 �m and (c) 4.7 �m, with RF power of 2.1 W.

the SAW devices with film thickness increasing from 2.3 to 4.7 �m.314

These phenomena are attributed to the increased wave amplitude315

with the increasing AlN film thickness, which is closely related to316

the increase in value of k2. Additionally, the flow speed increases317

and the dispersed particles concentration time (vortex formation)318

decreases with the applied RF powers.319

For the same water droplet size, there are power boundaries320

for various microfluidic phenomena, including internal flow-321

ing/mixing, pumping and ejection. Fig. 8 shows the estimated322

power boundaries of the microfluidic phenomena for the films with323

different thicknesses. Internal streaming occurs at a low RF power324

of a few mW. Higher power will result in efficient droplet pumping325

and jetting. As shown in Fig. 8, when the thickness of AlN films326

increases from 2.3 to 3.4 �m, and then to 4.7 �m, the power bound-327

ary between steaming and pumping decreases from 35 to 27.5 W,328

and then to 14 W. With the highest power applied (∼70 W), there329

was no jetting observed for the AlN SAW device with the film thick-330

ness of 2.3 �m. As shown in Fig. 8, the power boundary between331

pumping and jetting decreases to 62 W, and then to 35 W, with the332

film thicknesses increased from 3.4 to 4.7 �m.333

With an RF input power of 62 W, for the SAW devices made334

with AlN film thicknesses of 2.3 and 3.4 �m, the droplet can be only335

observed to move on the device surface as shown in Fig. 9(a) and (b).336

The droplets are strongly deformed following the Rayleigh angle337

direction, and then pushed forward through sliding and rolling. As338

the thickness of AlN film increases from 2.3 to 3.4 �m, the pumping339

velocity increases from 11.2 to 16 mm/s at an RF power of 62 W. 340

Whereas for the AlN film thickness of 4.7 �m, significant jetting 341

of the droplet in a much shorter duration is observed as shown in 342

Fig. 9(c) under the same RF input power. At 0.3 ms after the applica- 343

tion of the RF power to the IDT, the droplet was ejected from surface 344

into a coherent cylindrical liquid jetting beam, with a tilted angle 345

Fig. 8. The estimated boundaries of the microfluidic phenomena for the AlN filmswith different thicknesses: (a) 4.7 �m, (b) 3.4 �m and (c) 2.3 �m with the fixeddroplet size of 3 �L.

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Thickness
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Fig. 9. The pumping and jetting images of the droplets of 3 �L during the different time under the RF input power of 62 W, with different AlN thicknesses: (a) 2.3 �m, (b)3.4 �m and (c) 4.7 �m.

Fig. 10. Surface temperatures on the SAW devices for the different AlN thicknesses: (a) 2.3 �m, (b) 3.4 �m and (c) 4.7 �m with the RF power of 68 W, at the time of 1.2 s, (d)influence of PF input power and AlN thickness on the surface temperatures on the SAW devices.

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Influence

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of ∼73◦. This is because the Rayleigh wave coupled into the droplet346

follows the Snell law of diffraction, in which the wave is refracted347

from the surface into the liquid at the Rayleigh angle, described by348

[2]:349

�R = sin−1(

Vwater

VSURF

)(3)350

where Vwater is 1495 m/s and VSURF (Rayleigh mode) is 5139.2 m/s,351

as measured from the central frequency of the S21 pass band [43,49].352

The Rayleigh angle is estimated to be 16.8◦. It is reasonable that the353

jetting angle is varied around 73◦ at different durations due to the354

dissipation of the acoustic wave in the liquid beam. A curved end355

of the liquid beam was observed after 11.8 ms when the acoustic356

pressure gradient rapidly changes. This demonstrates that the SAW357

device with a thicker AlN film has a better microfluidic performance358

because of the higher value of k2.359

With such a high RF power applied to the AlN SAW device, it360

would expect that significant acoustic heating effect could occur.361

Acoustic heating is a common phenomenon in SAW based devices,362

and will affect the performance of acoustic streaming and pumping363

significantly [2,12] due to the change of the central band frequency364

of a SAW device. Fig. 10(a) shows the measured surface tempera-365

tures of the SAW devices without adding any water droplet, which366

increases with the applied RF powers. Although the wave displace-367

ment on the AlN SAW surface is only a few or sub-nanometres in368

amplitudes, the high frequency vibration causes heat generation,369

especially when there are defects, such as porosity, columnar and370

grain boundaries, as well as increased surface roughness on the371

deposited AlN films [2]. The maximum temperature recorded in this372

study was ∼68.5 ◦C at an RF power of ∼70 W after a few minutes.373

AlN has a high thermal conductivity and the bulk aluminium holder374

was used beneath the AlN/Si SAW devices in this study, which acted375

as a large thermal sink.376

In order to identify temperature distribution on the device377

surface after applying the large RF power, we measured the tem-378

perature increases at two positions for each sample, i.e., one dot379

near the IDTs and another father away from the IDTs as marked in380

Fig. 10(a), at a fixed time of 1.2 s and an RF power of 62 W. Results381

show that the temperatures further away from the IDTs are lower382

than those near the IDTs, which is attributed to the acoustic energy383

loss during the acoustic wave transmission. As shown in Fig. 10(a),384

with the increase in AlN thickness, the temperature readings for385

the SAW devices increase, which is mainly attributed to a higher386

value of k2 for the thicker AlN film, thus more electrical energy has387

been converted into acoustic energy then into heat.388

To further study the temperature effect induced by the AlN/Si389

SAW devices, we increased the measurement durations up to390

1 min. The measured results of temperature evolution are shown391

in Fig. 10(b). It is evident that with the increase of RF power, more392

electrical energy changes into mechanical vibration, thus resulting393

in more heat generation. The temperature changes of the 4.7 �m394

AlN film is much significant that those of the other films. This can be395

explained mainly by a higher value of k2, and more defects formed396

inside the thicker AlN films, thus leading to more acoustic scatter-397

ing and acoustic energy conversion into heat. A slight increase in398

surface roughness with increase in film thickness might also con-399

tribute this increased heating effect. It should be mentioned that for400

jetting, the duration of RF power is only sub-milli-seconds. Within401

such a short time, the temperature increase is not significant, thus402

SAW acoustic heating should not have a significant effect in the403

jetting process.404

The surface temperatures of a droplet of 3 �L positioned on the405

surface of the AlN SAW device were recorded, and the results are406

shown in Fig. 11. The maximum temperature recorded is within407

the liquid droplet. This is understood as the acoustic energy of408

the leaky wave has been mainly dissipated into the liquid droplet.409

Fig. 11. Surface temperature comparison on the same point between with 3 �Ldroplet of deionised water and without water.

Fig. 11 shows the measured temperature readings as a function of 410

durations up to 1 min, with water droplet locating on the AlN/Si 411

SAW device. The temperatures inside the water droplets generally 412

inceased signficantly at the initial period, but gradually reached a 413

steady state. After the droplet was pumped away, the temperature 414

distribution is similar to those without any water droplets on the 415

SAW device. The maximum temperature recorded is less than 48 ◦C. 416

The drolet size effect for the temperature increase was also investi- 417

gated, and the results are shown in Fig. 12. Clearly the droplet size 418

has no significant effect on the temperature increase and the tem- 419

perature increases are from ∼27 to ∼39 ◦C for the different droplet 420

sizes. 421

Fig. 12. Droplet size effect on the temperature increase during the pumping processwith RF power of 62 W. Q9

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deionized
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oC
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8 J. Zhou et al. / Sensors and Actuators B xxx (2014) xxx–xxx

4. Conclusions422

AlN films with different thicknesses were deposited on the sil-423

icon substrate using magnetron sputtering. XRD, SEM and Raman424

show that all the films show a highly c-axis texture and columnar425

structure perpendicular to the substrate. With the increase of AlN426

film, the crystal quality of the films increases. All the AlN based427

SAW devices present good SAW responses with a large side-lobe428

suppression of ∼13 to 15 dB. As the thickness increases, both the429

SAW velocity and electro-mechanical coupling coefficient increase.430

With the increase of AlN thickness, the TCF increases linearly from431

−21.3 to −27.4 ppm/K. Micro-fluidic manipulation has been suc-432

cessfully demonstrated for all the devices. The streaming velocity433

increases from 1.8 cm/s to 3.1 cm/s when the RF power of 2.1 W434

applied to the IDT transducers of different film thicknesses. Jet-435

ting was observed in the 4.7 �m film device with an RF power of436

62 W, whereas only pumping was observed for the thinner AlN SAW437

device, which demonstrates that a thicker AlN film leads to a better438

fluidic performance. The heating effect is more significant for the439

thicker AlN film, attributed to the increase in the electromechani-440

cal coupling coefficient, film defects and surface roughness. The use441

of AlN thin films instead of ZnO has several advantages: (1) AlN is442

chemical inert; (2) AlN has better mechanical properties (hardness443

and modulus), which are beneficial for SAW propagation; (3) the444

propagating velocity for both AlN SAW and Lamb waves are higher445

allowing to design devices with higher dimensionality (finger elec-446

trode width) for the same working frequency; (4) AlN SAW has a447

smaller value of TCFs. A slightly lower coupling coefficient of AlN448

respect ZnO, which implies the use of higher power levels for the449

same effects, is the only disadvantage although it is not critical.450

Acknowledgements451

This work was supported by Royal Society of Edinburgh,Q3452

Carnegie Trust Funding, the Royal Society-Research, Grant453

(RG090609), and Scottish Sensor System Centre (SSSC), EPSRCQ4454

(Engineering and Physical Sciences Research Council, UK) Engi-455

neering Instrument Pool for providing the high speed video system456

(Vision Research, phantom V7.3) and the Infrared camera (Therma-457

CAMTM SC640), National Natural Science Foundation of China (No.458

61171038, 61204124 and 61274037), Zhejiang Province Natural459

Science Fund Key Project (No. J20110271), Fundamental Research460

Funds for the Central Universities (No. 2014QNA5002), and Zhe-461

jiang Provincial Natural Science Foundation of China (Z11101168).462

The authors acknowledge the Cyrus Tang Centre for Sensor Materi-463

als and Applications. Part of this work was funded by the European464

Commission through the 7th Framework Programme by the Rap-465

taDiag project (http://www.raptadiag.eu/), the COST action IC1208466

and by the Ministerio de Economía y Competitividad del Gobierno467

de Espana through project MAT2010-18933.468

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Biographies602

Jian Zhou received his B.S. from Hunan University, China, in 2010. He then pursued603

his Ph.D. in Information Science and Electronic Engineering, Zhejiang University.604

From Oct. 2013 to April 2014, he did research work as an academic visitor in Uni-605

versity of West of Scotland/University of Edinburgh. His research interests include606

flexible MEMS devices, sensors and microfluidics.607

Mario DeMiguel-Ramos received his M.Sci. in Telecommunications Engineering608

from the Universidad Politécnica de Madrid, Spain, in 2012. He also holds a Master609

in Liberal Arts from the Universidad Francisco de Vitoria achieved in 2012. He joined610

the Group of Microsystems and Electronic Materials (GMME-CEMDATIC) in 2011,611

where he currently works towards his Ph.D. He worked in the Centre for Advanced612

Photonics and Electronics (CAPE) in the University of Cambridge in 2013 as a visitor613

researcher, developing ZnO thin films with a tilted c-axis for in-liquid sensing. His614

current research interests focus on thin film deposition and design and fabrication615

of AlN bulk acoustic wave (BAW) resonators for biosensing applications.616

Luis García-Gancedo received a M.Sc. in Physics from the University of Oviedo,617

(Spain) in 2003 and a Ph.D. in Electrical Engineering from the University of Brighton618

(UK) in 2007. He then worked as a Research Fellow at the University of Birming-619

ham (UK) in a multidisciplinary project fabricating ultrasonic transducers and arrays620

for ultrahigh resolution real time biomedical imaging. He joined the University of621

Cambridge (UK) in Jan. 2009, where he is at present a Research Associate at the Elec-622

trical Engineering Division, working on the development of low-cost biosensors for623

diagnostic applications. Since October 2010 Luis has been a Lecturer in Engineering624

at Newnham College, University of Cambridge.625

Enrique Iborra received M.Sc. degree in Physics from the Universidad Complutense626

de Madrid, Madrid, Spain, in 1982. He received the Ph.D. degree (with distinction)627

in Physics from the same university in 1986. In 1987, he joined the Department of628

Electronic Technology at the Universidad Politécnica de Madrid (UPM), Spain, as629

associate professor. Now, he is full professor in the same department. Since 1995 he

has been the head of the Group of Microsystems and Electronic Materials (GMME) in 630

the research centre on Advanced Materials and Devices for the Information and Com- 631

munication Technologies (CEMDATIC) at the UPM. He has been working in thin film 632

electronic materials and sensor devices since 1982. His current research interests 633

are the applications of piezoelectric AlN thin films to electroacoustic sensors. 634

Jimena Olivares received the BSc degree and the M.Sc. degree in physics from 635

the Universidad Autonoma de Madrid, Spain, in 1995 and 1997, respectively. She 636

received the Ph.D. degree in physics from the Universidad Politécnica de Madrid, 637

Spain, in 2001 for a research work on polycrystalline SiGe thin films. She spent 2 638

years in a Spanish company, where she worked in the field of technology transfer 639

and in the management of European research projects. In 2003, she joined the Group 640

of Microsystems and Electronic Materials of the Department of Electronic Technol- 641

ogy of the Universidad Politecnica de Madrid. Now, she is associate professor in 642

the same department. Her current research interests are piezoelectric-based MEMS 643

applications and biological sensors. 644

Hao Jin received his B.S. and Ph.D. degrees in electronic science and technology 645

from Zhejiang University, PR China, in 2001 and 2006, respectively. After gradua- 646

tion, he worked as an RF engineer at Semiconductor Manufacturing International 647

Corporation, PR China. From 2007, he was a post-doctoral fellowship and then 648

worked as a faculty in the Department of Information Science & Electronic Engi- 649

neering at Zhejiang University, China. He became an associate professor in MEMS 650

in 2012. His research interests include vacuum science and technology, magnetron 651

sputtering processes, micro/nano piezoelectric devices, RF MEMS, and flexible elec- 652

tronics. Dr. Jin is the Associate Editor of the Chinese Journal of Vacuum Science and 653

Technology. 654

Jack Luo received his Ph.D. from the University of Hokkaido, Japan in 1989. He 655

worked in Cardiff University as a research fellow, in Newport Wafer Fab. Ltd., Philips 656

Semiconductor Co. and Cavendish Kinetics Ltd. as an engineer, senior engineer and 657

manager, and then in Cambridge University as a senior researcher from 2004. From 658

January 2007, he became a Professor in MEMS at the Centre for Material Research 659

and Innovation (CMRI), University of Bolton. His current research interests focus on 660

flexible electronics, microsystems, sensors and lab-on-a-chip for biotechnology and 661

healthcare applications, and third generation thin film solar cells using novel low 662

cost materials. 663

Ahmed Elhady received B.Sc. in Physics from the American University in Cairo, Egypt 664

in 2005, and M.Sc. in Sensor Design from the University of West of Scotland in Paisley, 665

UK in 2012. He is currently a PhD student at the Thin Film Center, the University of 666

West of Scotland, UK. His Research interests includes sensors and instrumentation, 667

microfluidics, and surface acoustic wave devices. 668

Shurong Dong received his B.S. and M.D. degrees in Materials Science and Engi- 669

neering, from Zhejiang University, PR China, in 1994 and 1998, respectively. After 670

graduation, he worked as a faculty at Zhejiang University, PR China. In 2003, he 671

received the Ph.D. degree in electronic science and technology from Zhejiang Uni- 672

versity, and then became an associate professor of microelectronics in 2004. In 2013, 673

he became a professor of MEMS and ESD. Currently, His research interests include 674

vacuum science and technology, micro/nano piezoelectric devices, RF MEMS, ESD, 675

RF IC, and flexible electronics. 676

Demiao Wang received his bachelor degree from Zhejiang University, Department 677

of radio and vacuum, China, in 1970. Since then he became a lecture of Zhejiang 678

University. In 1998, he became a professor of Zhejiang University. Now his research 679

topics are MEMS devices, film based devices and functional film material. 680

Richard Yongqing Fu is a Reader in Thin Film Centre and Physics Department in 681

University of West of Scotland, UK, and was a lecturer in Micro and Bio-Engineering 682

in Heriot-Watt University, UK before 2011. He obtained his Ph.D. degree from 683

Nanyang Technological University, Singapore, and then worked as a Research Fellow 684

in Singapore-Massachusetts Institute of Technology Alliance, and a Research Asso- 685

ciate in University of Cambridge. His recent work is focused on shape memory and 686

piezoelectric thin films for microactuators, microsensors and microfluidic devices, 687

as well as nanocomposites, and thin films and coatings. He published over 230 SCI 688

journal papers, two books, and 15 book chapters. 689

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