Серверная продукция Intel 2015 года. Алексей ......2014/08/26 · New configuration: Hewlett-Packard Company HP ProLiant ML350 Gen9 platform with two

Серверная продукцияIntel® 2015 года.Алексей Слепцов

Intel Channel Day | H1’15

МАТЕРИАЛЫ ПРЕДОСТАВЛЯЮТСЯ ПО ПРИНЦИПУ "КАК ЕСТЬ", БЕЗ КАКИХ-ЛИБО ЯВНЫХ ИЛИ ПОДРАЗУМЕВАЕМЫХ ГАРАНТИЙ,ВКЛЮЧАЯ, В ЧИСЛЕ ПРОЧЕГО, ГАРАНТИЙ В ОТНОШЕНИИ ИХ РЫНОЧНЫХ КАЧЕСТВ, НЕНАРУШЕНИЯ ПРАВ НАИНТЕЛЛЕКТУАЛЬНУЮ СОБСТВЕННОСТЬ ИЛИ ПРИГОДНОСТИ К ИСПОЛЬЗОВАНИЮ В ТЕХ ИЛИ ИНЫХ КОНКРЕТНЫХ ЦЕЛЯХ. НИ ПРИКАКИХ ОБСТОЯТЕЛЬСТВАХ КОРПОРАЦИЯ INTEL ИЛИ ЕЕ ПОСТАВЩИКИ НЕ НЕСУТ КАКОЙ-ЛИБО ОТВЕТСТВЕННОСТИ ЗА УЩЕРБ(ВКЛЮЧАЯ, В ЧИСЛЕ ПРОЧЕГО, УПУЩЕННУЮ ВЫГОДУ, ПОСЛЕДСТВИЯ ПРИОСТАНОВКИ ПРЕДПРИНИМАТЕЛЬСКОЙ ДЕЯТЕЛЬНОСТИИЛИ ПОТЕРЮ ДАННЫХ), ВЫТЕКАЮЩИЙ ИЗ ФАКТА ИСПОЛЬЗОВАНИЯ МАТЕРИАЛОВ, ЛИБО НЕВОЗМОЖНОСТИ ИХ ИСПОЛЬЗОВАТЬ,ЧТО РАСПРОСТРАНЯЕТСЯ И НА ТЕ СЛУЧАИ, КОГДА КОРПОРАЦИЯ INTEL БЫЛА ПРЕДУПРЕЖДЕНА О ВОЗМОЖНОСТИ НАНЕСЕНИЯТАКОГО УЩЕРБА. УЧИТЫВАЯ, ЧТО ЗАКОНОДАТЕЛЬСТВО, ДЕЙСТВУЮЩЕЕ В РЯДЕ ЮРИСДИКЦИЙ, НЕ ДОПУСКАЕТ ОГРАНИЧЕНИЯИЛИ ОТКАЗА ОТ ОТВЕТСТВЕННОСТИ ЗА ПОБОЧНЫЙ ИЛИ КОСВЕННЫЙ УЩЕРБ, ИЗЛОЖЕННОЕ ВЫШЕ ПОЛОЖЕНИЕ МОЖЕТ К ВАМНЕ ОТНОСИТЬСЯ.

Корпорация Intel и ее поставщики не гарантируют точности или полноты текстовой или графической информации, ссылок ииного содержания материалов. Корпорация Intel вправе в любое время и без предварительного уведомления вносить любыеизменения в указанные материалы, а равно и в продукцию, описанием которой они служат. Корпорация Intel не берет на себякаких-либо обязательств по обновлению материалов.

Информация о тестах производительности предназначена исключительно для специалистов в области компьютерной техники ипрограммного обеспечения, обладающих соответствующими техническими знаниями. Покупателям при приобретениикомпьютерных систем или компонентов помимо производительности следует также учитывать и иные характеристикисоответствующих систем и компонентов.

Тесты производительности и рейтинги измерены на конкретных компьютерных системах и/или компонентах и отражаютприблизительную производительность продуктов корпорации Intel в единицах данных тестов. Любое отличие в аппаратных илипрограммных компонентах или конфигурации может повлиять на результаты измерений. Дополнительную информацию потестам производительности и производительности продуктов корпорации Intel можно узнать по адресу:http://www.intel.com/performance/resources/benchmark_limitations.htm

Тесты третьих сторон: корпорация Intel не контролирует и не проверяет проведение и результаты тестов третьих сторон илипубликации результатов тестов в интернете на которые есть ссылки в этой презентации. Корпорация Intel предлагает всемзаинтересованным посетить указанные интернет-страницы и убедиться в том что данные тестов точно отражаютпроизводительность систем предлагаемых на рынке.

Отказ от ответственности.

2

http://www.intel.com/performance/resources/benchmark_limitations.htm


Процессоры Intel® Xeon® 2015-2016 годаШирокая продуктовая линейка, большой выбор и гибкость

Intel® Xeon® серии E5

Наиболее гибкие и эффективные

2-х сокетные мейнстрим решения

E5-4600v2

Ivy Bridge, 22nm

2015

4-х сокетные плотные


Максимальная надежность имасштабируемость

Максимальная производительность

E7-8800/4800/2800 Westmere, 32nm

E7-8800/4800/2800v2Ivy Bridge, 22nm


Наиболее доступныеЭкономичные односокетные решения

E3-1200v3Haswell/HR, 22nm

E3-1200v5Skylake, 14nm

E3-1200v4Broadwell, 14nm

2015

E5-2600v2Ivy Bridge,

22nm

E5-2600v3Haswell,

22nm

E5-2600v4Broadwell,

14nm

2015

2014 2016

E5-4600v3

Haswell, 22nm

E7-8800/4800/2800v3Haswell, 22nm

2014 2015

3


Процессоры Intel® Xeon® E3-1200

4


All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Click http://www.intel.com/products/processor_number for details

Q4’15Q1’15 Q2’15 Q3’15 Q1’16

SKU has Intel® Iris™ Pro Graphics

Intel® Xeon® processor E3-1200 v5 product family (Skylake LGA1151)

SKU has Intel®

HD Graphics

Intel® Xeon® processor E3-1200 v3 product family (Haswell and Haswell Refresh LGA1150)

Intel® Xeon® processor E3-1200 v4 product family (Broadwell LGA1150)

E3-1286 v3

E3-1281 v3

E3-1271 v3

E3-1241 v3

E3-1231 v3

E3-1220 v3

E3-1500 v5

(BGA)

E3-1286L v3

E3-1275L v3

E3-1240L v3

E3-1220L v3

E3-1285 v4

E3-1285L v4

E3-1265 v4

E3-1285 v4

E3-1285L v4

E3-1265 v4

E3-1270 v5

Skylake (LGA)

E3-1260L v5

Skylake (LGA)

E3-1240 v5

Skylake (LGA)

E3-1240L v5

Skylake (LGA)

E3-1235L v5

Skylake (LGA)

E3-1230 v5

Skylake (LGA)

E3-1220 v5

Skylake (LGA)

E3-1270 v5

Skylake (LGA)

E3-1260L v5

Skylake (LGA)

E3-1240 v5

Skylake (LGA)

E3-1240L v5

Skylake (LGA)

E3-1230 v5

Skylake (LGA)

E3-1220 v5

Skylake (LGA)

E3-1235L v5

Skylake (LGA)

E3-1281 v3

E3-1271 v3

E3-1241 v3

E3-1231 v3

E3-1220 v3

E3-1275L v3

E3-1240L v3

E3-1220L v3

E3-1285 v4

E3-1285L v4

E3-1265 v4

E3-1281 v3

E3-1271 v3

E3-1241 v3

E3-1231 v3

E3-1220 v3

E3-1275L v3

E3-1240L v3

E3-1220L v3

Intel® Xeon® Processor E3-1200 Product Family Roadmap

EntryOne Socket

5


Процессор Intel® Xeon® E3-1200v4

Intel® Hyper-Threading Technology

Fully Integrated Voltage Regulator technology

Intel® AVX 2.0 extensions and AES-NI instructions

improvements

Last Level Cache (LLC) shared between CPU and

Integrated Graphics*

• Processor’s Gfx GT3e• 128MB eDRAM (High

Bandwidth Cache Memory)

• Up to 51GB/s R/W• 48 EUs• VP8 Decode• Up to 16GB as video

RAM• OCL 2.0; OGL 4.4• Up to 18 Real Time

Transcode Processes

14nm Process

DDR3-1600 2CH. 2DIMM/CH., ECC UDIMMs

PCIe 3.0 1x16/2x83 controllers

Intel® Silicon View Technology (SVT)

E3-1200v4 вносит значительные улучшения в работу с графическими серверными приложениями

Intel® Turbo Boost Technology 2.0

Socket LGA 1150

2ch DDR3

Integrated GraphicsIntel® Iris™ Pro

graphics P6300

Core

Core

Core

Core Last Level Cache (L3)

System Agent

PCIe I/ODisplay Ports

DMI

IMC

PCIe 3.0

E3-1200v3 New in E3-1200v4

High BandwidthCache Memory

Display

6


7


Store/Stream, Transcode

Search, Surveillance

Gaming, Remote Apps,

Rendering

70%

25%

5%*

Video Delivery

Cloud Graphics

Visual Understanding

Широкие возможности во всех сегментах

Intel® Xeon® Processor E3-1200v4 FamilyФокус – работа с видео контентом

8


Процессоры Intel® Xeon® E5-2600

9


Intel® Xeon® E5-2600 v3 Product Family:

10

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance . Up to 3x performance claim. Source as of September 8, 2014. New configuration: Hewlett-Packard Company HP ProLiant ML350 Gen9 platform with two Intel® Xeon® Processor E5-2699 v3, Oracle Java Standard Edition 8 update 11, 190,674 SPECjbb2013-MultiJVM max-jOPS, 47,139 SPECjbb2013-MultiJVM critical-jOPS. Source. Baseline: Cisco Systems Cisco UCS C240 M3 platform with two Intel® Xeon® Processor E5-2697 v2, Oracle Java Standard Edition 7 update 45, 63,079 SPECjbb2013-MultiJVM max-jOPS , 23,797 SPECjbb2013-MultiJVM critical-jOPS. Source.Up to 1.9x increase in workload claim. Source as of August 2014 TR#3034 on Linpack*. Baseline configuration: Intel® Server Board S2600CP with two Intel® Xeon® Processor E5-2697 v2, Intel® HT Technology disabled, Intel® Turbo Boost Technology enabled, 8x8GB DDR3-1866, RHEL* 6.3, Intel® MKL 11.0.5, score: 528 GFlops. New configuration: Intel® Server System R2208WTTYS with two Intel® Xeon® Processor E5-2699 v3, Intel® HT Technology disabled, Intel® Turbo Boost Technology enabled, 8x16GB DDR4-2133, RHEL* 6.4, Intel® MKL 11.1.1, score: 1,012 GFlops. Up to 6x throughput claim. Comparisons based by Intel on publicly available specification sheet data &/or white papers

Computing that scales across the whole of the data center

Up to 3x performance improvement for efficient, high performance building blocks

Up to 1.9x increase in workload performance with Intel® Advanced Vector

Extensions (AVX) 2.0

Up to 6x throughput with latest SSD

Up to 40GbE to improve network virtualization

Enabling virtualization orchestration with Cache Monitoring

Compute

Network

Storage

http://www.intel.com/performance

http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=4AA5-4748ENW&cc=us&lc=en

http://www.spec.org/jbb2013/results/res2014q1/jbb2013-20140121-00050.html


Product Family Features

11

• Intel® Advanced Vector Extensions 2.0• DDR4 Memory Support• World’s Most Energy Efficient Processor• Virtual Machine Control Structure (VMCS) Shadowing

• Intel® SSDs• Intel® Intelligent Storage Acceleration Library (ISA-L)• Intel® AES-NI

Compute

Network

Storage

• 10/40 Gb Ethernet Controller• Network virtualization offloads• Intel® Ethernet Flow Director

• Network Functions Virtualizations• Intel® QuickAssist® Technology

• Intel® Node Manager 3.0• Cache Monitoring


Intel® Advanced Vector Extensions (AVX) 2.0

12

• Floating point Fused Multiply Add (FMA) improves high performance computing, professional imaging, feature detection

• 256-bit integer vector instructions benefits math, codec, image processing and DSP software.

Source as of August 2014 TR#3034 on Linpack*. Baseline configuration: Intel® Server Board S2600CP with two Intel® Xeon® Processor E5-2697 v2, Intel® HT Technology disabled, Intel® Turbo Boost Technology enabled, 8x8GB DDR3-1866, RHEL* 6.3, Intel® MKL 11.0.5, score: 528 GFlops. New configuration: Intel® Server System R2208WTTYS with two Intel® Xeon® Processor E5-2699 v3, Intel® HT Technology disabled, Intel® Turbo Boost Technology enabled, 8x16GB DDR4-2133, RHEL* 6.4, Intel® MKL 11.1.1, score: 1,012 GFlops Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance *Other names and brands may be claimed as the property of others.

2012 2013 2014

Pe

rfo

rma

nce

\C

ore

Intel® AVX 1.02X Flops: 256-bit wide floating point-vectors

E5-2600(32 nm Tock)

Half-float support,Random Number Generator

Intel®

AVX 2.0

E5-2600 v2(22 nm Tick)

E5-2600 v3(22 nm Tock)

Since 2001:128-bit vectors

new

90%UP TO 90% Gen-to-Gen INCREASED PERFORMANCE



13

The DDR4 Difference

• Next Evolution in memory technology with Higher speeds, Lower Voltage, improved density

• Sustain higher memory speed at greater memory capacities

Source as of August 2014 TR#3044 on STREAM (triad): Intel® Server Board S2600CP with two Intel® Xeon® Processor E5-2697 v2, 24x16GB DDR3-1866 @1066MHz DR-RDIMM, score: 58.9 GB/sec. New Configuration: Intel® Server System R2208WTTYS with two Intel® Xeon® Processor E5-2699 v3, 24x16GB DDR4-2133 @ 1600MHz DR-RDIMM, score: 85.2 GB/sec. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance. *Other names and brands may be claimed as the property of others.

1000

1400

1800

2200

128 256 384 512 768 GB

32GB LRDIMM

ON E5-2600

v3DDR4-2133

32GB LRDIMM

ON E5-2600

v2DDR3-1866

System Capacity (GB)

40%UP TO 40% INCREASED BANDWIDTHwith 3 DPC



World’s Most Energy Efficient Processor:Per Core P-States (PCPS) contributes to increased power efficiency by optimizing workload processing

14

Same processorSame performance

Less Power

PCPS OffPCPS On

Average freq/power by core

2 4 6 8 10 12Core

2 4 6 8 10 12Core

Comparison based on SPECpower*_ssj2008 results published as of August 26, 2014. Sugon I620-G20 platform with two Intel® Xeon® Processor E5-2699 v3, 10,599 overall ssj_ops/watt. Source. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance *Other names and brands may be claimed as the property of others.

24%UP TO 24%increase in Energy Efficiency

http://www.spec.org/

http://www.sugon.com/



Cache Monitoring Ensures Quality of Service

15

Problem: No visibility into resource usage by virtual machines

Solution: Consistent service delivery = no more noisy neighbor!

Prior:One application in multi-tenant

environment using too many resources(aka “the noisy neighbor problem”)

Today with Cache Monitoring:Visibility into cache resource usage by

virtual machine

VM

3

VM

4

VM

1 VM

2

Ca

che

U

tili

zati

on

VM

3

VM

4

VM

1

VM

2Ca

che

U

tili

zati

on


16

VMCS Shadowing: Increases virtualization isolation & monitoring abilities

Manage/ Protect Dev /Test Env.Support Legacy Apps

Hardware

Root VMM

Guest VMM

Current OS

VM0

Hardware

Root VMM

CurrentOS

VM0

Legacy VMM

Legacy OS

VM1

Manage VM Monitor for

malicious activities

Hardware

Root VMM

ProductionEnv.

VM0

Pre-production VMM

ProductionEnv.

VM1

Dev / TestEnv.

VM2


17

Product Family Features

• Intel® SSDs• Intel® Intelligent Storage Acceleration Library (ISA-L)• Intel® AES-NI

Compute

Network

Storage

• 10/40 Gigabit Ethernet • Network virtualization offloads• Intel® Ethernet Flow Director

• Network Functions Virtualizations• Intel® QuickAssist® Technology

• Intel® Advanced Vector Extensions 2.0• DDR4 Memory Support• World’s Most Energy Efficient Processor• Virtual Machine Control Structure (VMCS) Shadowing

• Intel® Node Manager 3.0• Cache Monitoring


18

Networking with Intel® Xeon® Processor E5 v3

By 2018, connected devices will outnumber

the global population 2:1

2x

Increase in mobile network connection

speeds by 2018

287%

Encrypted traffic increased 287% in

the last year

Increase Efficiency and Flexibility

Communication Infrastructure: Routers, Gateways, Security Appliances

Telco: Software Defined Network, Network Function Virtualization, 3G, 4G LTE

Cloud: Compute, Storage, Networking

Enterprise: Web, Mail, Secure Search, VPN, Firewalls

New Capabilities Relevant to Segment

Intel® Xeon® Processor E5-2600 v3 Product Family platform ingredients for networking

Custom CPU SKUs for networking applications

Chipsets with Intel® QuickAssist Technology

Intel® Ethernet XL710 Controller 10 / 40 Gigabit

Intel® DPDK for Software Packet Processing Optimizations


19

Customized Hardware SKUs Designed for Network Applications

Chipsets with Intel® QuickAssist Technology that provide hardware-

assisted offload for Security, Storage, and Communication applications

Acceleration

Intel® Ethernet Controller XL710 Family 10 / 40 GbE with Network Virtualization Offloads, Intel® DPDK optimized, Intel®

Ethernet Flow Director

Reliability SKU profiles optimized to support demanding infrastructure

availability needs

Robust silicon Thermal Profiles to help accommodate demanding infrastructure

thermal constraints such as NEBS (Network Equipment Building system)

Extended silicon product manufacturing to meet long-term infrastructure supply


Network Virtualization Overlay Acceleration

20

VXLAN Overlay Performance

Source Intel Arch Lab Aug 2014 1: Test Configuration SUT1 2x Xeon E5-2697 v2 (2.7GHz, 24c) 128GB, 8-ch, DDR3, 1600MHz 2x Intel X520, ixgbe 3.21.2 Ubuntu x64, kernel v3.11, SUT2: 2x Xeon E5-2699 v3 (2.3GHz, 14c) 128GB, 8-ch, DDR4, 2133MHz Intel Ethernet CNA XL710, i40e 1.0.15 Linux x64, kernel v3.15.6, Netperf 2.6 default settings running on 4 VNIs with 8 threads each Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.For more information go to http://www.intel.com/performance *Other names and brands may be claimed as the property of others.

25%Increase in

Throughput

1 x 40GbEThroughput 39Gb/s

@ 11% CPU Utilization

4 x 10GbE LAGThroughput 31Gb/s

@ 52% CPU Utilization78%Reduction in CPU

Utilization

EthernetControllerWithout

UDP RSS for VXLAN

4 x 10GbE LAGThroughput 4Gb/s

@ 5% CPU Utilization

Upto



All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Click http://www.intel.com/products/processor_number for details

Q4’15Q1’15 Q2’15 Q3’15 Q1’16

Intel® Xeon® Processor E5-2600 Product Family Roadmap

Intel® Xeon® processor E5-2600v3 product family (Haswell-EP)

* “Workstation–ONLY SKU”

Efficient Performance

Two Socket

Ad

va

nce

d

E5-2667 v3

E5-2643 v3

E5-2637 v3

E5-2687W v3*

E5-2697 v3

E5-2695 v3

E5-2690 v3

E5-2680 v3

E5-2670 v3

E5-2660 v3

Sta

nd

ard

E5-2640 v3

E5-2620 v3

Ba

sicE5-2609 v3

E5-2603 v3

Se

gm

en

t O

pti

miz

ed

E5-2699 v3

E5-2698 v3

E5-2699 v3 E5-2699 v3

E5-2698 v3

E5-2697 v3

E5-2695 v3

E5-2687W v3*

E5-2667 v3

E5-2643 v3

E5-2637 v3

E5-2683 v3 E5-2683 v3

E5-2609 v3 E5-2609 v3

E5-2603 v3 E5-2603 v3

E5-2640 v3E5-2640 v3

E5-2620 v3 E5-2620 v3

E5-2637 v3

E5-2643 v3

E5-2667 v3

E5-2698 v3

E5-2697 v3

E5-2695 v3

E5-2683 v3

E5-2687W v3*

E5-2690 v3 E5-2690 v3

E5-2680 v3 E5-2680 v3

E5-2670 v3 E5-2670 v3

E5-2660 v3 E5-2660 v3

E5-2623 v3 E5-2623 v3 E5-2623 v3

E5-2699 v3

E5-2698 v3

E5-2697 v3

E5-2695 v3

E5-2683 v3

E5-2687W v3*

E5-2667 v3

E5-2643 v3

E5-2643 v3

E5-2690 v3

E5-2680 v3

E5-2670 v3

E5-2660 v3

E5-2640 v3

E5-2623 v3

E5-2620 v3

E5-2609 v3

E5-2603 v3

E5-2600 v4

Broadwell-EP

E5-2650 v3 E5-2650L v3E5-2650 v3 E5-2650L v3 E5-2650 v3 E5-2650L v3 E5-2650 v3 E5-2650L v3

E5-2630 v3 E5-2630L v3E5-2630 v3 E5-2630L v3 E5-2630 v3 E5-2630L v3 E5-2630 v3 E5-2630L v3

Intel® Xeon® processor E5-2600v4 product family (Broadwelll-EP)

21


* Other names and brands may be claimed as the property of others

1 Results have been simulated and are provided for informational purposes only. Results were derived using simulations run on an architecture simulator or model. Any difference in system hardware or software design or configuration may affect actual performance. Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel’s current plan of record product roadmaps. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance

Процессоры Intel® Xeon® E5-2600v3 (Haswell-EP)

Intel® Hyper-Threading Technology

Intel® QuickPath Interface (x2)

Intel® AVX 2.0 / Haswell New Instruction (HNI)

~2.5 MB LLC/Core; Up to 45 MB total LLC

22nm Process Technology

40 Lanes PCI Express* 3.0

Intel® Turbo Boost Technology 2.0

Integrated Voltage Regulator (IVR)

Up to 18 Cores; QPI 9.6 GT/s; Socket 2011-R3

New HSX Feature

Existing Feature

4xDDR4 channels; up to 2133 MHz

… …

DDR4

DDR4

DDR4

DDR4

… …

Integrated PCI Express* 3.0

Up to 40 lanes per socket

4 channels of up toDDR4 2133 MHz memory

22



Процессоры Intel® Xeon® E7-8800v3

23


24

Introducing Intel® Xeon® Processor E7-8800/4800 v3 Product FamiliesThe Foundation for Better Business Intelligence

1Refer to Slide 11, 42 for Source and Configuration details2Refer to Slide 37 for Source and Configuration detailsSoftware and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance/datacenter

NEW Microarchitecture + 20% MORE cores + 20% MORE lastlevel cache delivers significant performance INCREASE1

LARGEST memory capacity for Real-time/Advanced Analytics, In-Memory Computing and other data-demanding workloads

FASTER application performance (when threads share memory) with Intel® TSX2

http://www.intel.com/performance/datacenter


25

Key Generational Performance IncreasesIntel® Xeon® Processor E7 v3 Product Family

* Up to 39% more OLTP database

transactions/time1

* Up to 6x more in-memory OLTP

transactions w/ Intel® TSX optimizations2

* Up to 70% additional analytical sessions/hour3

* Up to 39% application throughput gain for

virtualized machine (VM) infrastructure consolidation4

Business Processing Business Analytics Virtualization

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. Configurations: 4x Intel Xeon processor E7-8890 v3 compared to E7-4890 v2. See next slide. For more complete information, visithttp://www.intel.com/performance/datacenter.



SKU Stack Simplification

Bas

ic 6C

15C 15C 15C

12C 12C 12C

8S 4S/Scalable 2S/Scalable

15C 15C 15C

10C

Sta

nd

ard

Ad

van

ced

15C 15C 15C

12C

8C

E7-4890 v2

E7-4870 v2

E7-4880 v2

E7-4860 v2

E7-4850 v2

E7-4830 v2

E7-4820 v2

E7-4809 v2

E7-8890 v2

E7-8870 v2

E7-8880 v2

E7-8850 v2

E7-2890 v2

E7-2870 v2

E7-2880 v2

E7-2850 v2

18C

18C

18C

16C

8C

14C

10C

E7-8890 v3

E7-8870 v3

E7-8880 v3

E7-8860 v3

E7-4850 v3

E7-4830 v3

E7-4820 v3

E7-4809 v3

12C

Up

to

8S

Up

to

4S

Simplifying customer validation and inventory

Bas

icS

tan

dar

dA

dva

nce

d

Intel® Xeon® Processor E7 v3 General Purpose SKUs

Intel® Xeon® Processor E7 v2 General Purpose SKUs


27

Scale-Up vs. Scale-Out for Analytics

Scale-Up Solution for Real-time/Advanced Analytics and Data-demanding Workloads

Scale-UpSingle system

High Performance, Large Memory,

individual Server Scalability, Ease of Management &

High Availability

&

Advanced Analytics In-Memory DBMS

CRMOLTP

ERPData Warehousing

Virtualized ConsolidationRISC Migration

Decision SupportLarge-Scale, Virtualized Applications

Enterprise-Critical MiddlewareLarge memory, consolidation workloads

Hadoop/MapReduceData Serving (NoSQL data stores)HPCMedia StreamingWeb FrontendWeb Search


Business Intelligence using Intel® Xeon® Processor E7 v3 Family and Business Analytics* 9.4 M2

28

1

1.72

Sessions/hour

SAS* New Mixed Analytics

Workload

4S Intel® Xeon® Processor

E7-4890 v2 (15 C, 2.8 GHz)

4S Intel® Xeon® Processor

E7-8890 v3 (18 C, 2.5 GHz)

x

Faster business insight (more sessions per hour)

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. New You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. Configurations: SAS Mixed Analytics workload measuring sessions per hour using SAS Business Analytics* 9.4 M2 on Red Hat* Enterprise LINUX 7. For more information go to http://www.intel.com/performance1. Baseline 1.0: 4S Intel Xeon processor E7-4890 v2, 512 GB DDR3-1066 memory, 16x 800 GB Intel® SSD DC S3700, scoring 0.11 sessions/hour. , 2. Up to 1.72x more sessions per hour: 4S Intel Xeon processor E7-8890 v3, 512 GB DDR4-1600 memory, 4x 2.0 TB Intel® SSD DC P3700 SSDs + 8x 800 GB Intel® DC S3700 SSDs, scoring 0.19 sessions/hour.

Threads Frequency

IOPS xGbE NIC

TSX AVX2

CompilerGB

Memoryns/BW

70%Additional sessions per hour

Up to



In-Memory Computing Software Optimization

4 to 8S (native scaling) and 8S+ with 3rd party node

controllers.

18 cores/36 threads per socket

Large memory : 8 sockets, up to 12TB

Intel® instruction extensionsAdvanced processor features (TSX, AVX 2.0)

More Advanced RAS features:Intel Run Sure Technology

Data partitioningSoftware parallelization / modernization

Column Data Stores20:1 in-memory data compression

SIMD OptimizationScan Billions of symbols/second/core**

On-board disk storage/logsFlexible fail-over support

Massive Scalability

Entire Database In Memory

Highly Optimized

Mission-Critical

Accelerating Insight

Processor Architecture Database Optimization

29


Server Performance Scaling Summary – 2- to 4-Socket AlternativesIntel® Xeon® Processor E7 v3 Product Family

30

• E7 product family has best scale-up options

• 3rd Intel® QPI link

• 8-socket native connected options

• Up to 2x DIMMs/socket vs. E5

• Up to 128-sockets in single-system image today

• The Intel® Run Sure Technology gives confidence for in-memory solutions trend

• Business Processing database OLTP shows great tpmscaling on 4S Xeon® processor E7 v3 vs. 2S/4S E5

• Up to 2.3x vs. 2S E5-2699 v3

• Up to 1.9x vs. 4S E5-4657L v2

OLTP Database• Up to 2.3x over 2S E5 v31

• Up to 1.9x over 4S E5 v22

Intel Internal Estimates from as of 27 Feb 2015. Results have been estimated or simulated using internal Intel analysis or architecture simulation or modeling, and provided to you for informational purposes. Any differences in your system hardware, software or configuration may affect your actual performance. Configurations:1. Up to 2.3x claim based on Warehouse OLTP workload comparing 4S Intel Xeon processors E7-8890 v3 (18C, 2.5GHz) scoring up to 6602tpmto 2S Intel Xeon processor E5-2699 v3 (18C, 2.3GHz) scoring up to 2760 tpm2. Up to 1. 9x claim based on Warehouse OLTP workload comparing 4S Intel Xeon processors E7-8890 v3 (18C, 2.5GHz) scoring up to 6602 tpmto 4S Intel Xeon processor E5-4657L v2 (12C, 2.4GHz) scoring up to 3355 tpm

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information, visit http://www.intel.com/performance/datacenter

1 1

1.902.39

4S E7-8890 v3 vs.

4S E5-4657L v2

4S E7-8890 v3 vs.

2S E5-2699 v3

No

rma

lize

d t

o 1

.0

Warehouse OLTP

Transactions per Time



4- to 8-Socket Scaling Performance SummaryIntel® Xeon® Processor E7-8800 v3 Product Family

31

1.0

1.591.89 1.95

1.72 1.801.95

0.0

0.5

1.0

1.5

2.0

2.5

Baseline Stream Est.

SPECfp*_rate_

base2006

Est.

SPECint*_rate_

base2006

OLTP

Brokerage

OLTP

Warehouse

Linpack

Est

ima

ted

Re

lati

ve

Pe

rfo

rma

nce

Hig

he

r is

be

tte

r

4- to 8-Socket Intel® Xeon® Processor E7-8890 v3 (18C, 2.5GHz, 165W)

4-Socket Intel® Xeon®

Processor E7-8890 v3 (18C, 2.5 GHz)

UP TO

1.8xAVG PERFORMANCE

INCREASE

8-Socket Intel® Xeon® Processor E7-8890 v3 (18C, 2.5GHz)

Memory Bandwidth

Integer Throughput

Floating-Pt Throughput

Financial Transaction

Inventory Transaction

1

2 3

4 5

Floating Point Ops

6

Up to 1.8x average performance increase based on the average of six key workloads. Source: Intel internal estimates as of 21 April 2015. Results have been estimated or simulated using internal Intel analysis or architecture simulation or modeling, and provided to you for informational purposes. Any differences in your system hardware, software or configuration may affect your actual performance. Configurations: see next slide. For more information go to http://www.intel.com/performance/datacenter.

4-S

ock

et



Seventy-Nine Percent of Enterprises Require a Minimum of 99.99% Availability

32

Source: ITIC 2014, Global Server Hardware & Server OS Reliability Survey

40%

23%

10%12%

49%

30%

99.9% 99.99% >99.999%

2008

2014

% o

f su

rve

y r

esp

on

ses

8.76 hours/year 52 minutes/year 5.25 minutes/year

Percent Uptime RequiredEquivalent unplanned downtime

Increase Over >Five Years3X

Enterprise Server Reliability Requirements


Extending Intel® Run Sure TechnologyDesigned to Maximize Uptime – 4 New features with Intel® Xeon® E7 v3

331. MCA = Machine Check Architecture

Multiple Rank Sparing

DDR4 Recovery for Command & Address Parity Errors

Highest Reliability

within Intel® Xeon®Product Family

4 New RAS features

Resilient System TechnologiesEnhanced MCA1 Recovery gen 2

Resilient Memory Technologies Address Range Memory Mirroring

Intel® Run Sure Technology (Introduced with Intel® Xeon® E7 v2)

Other RAS Features


34

Five-Year Old Installed Base Refresh ROI Executive Summary

Existing

(100 Servers)

New

(11 Servers)

Existing server count reflects existing servers only and new server count reflects both existing and incremental demand – see backup for full details.

From 4-Socket Intel® Xeon® processor 7400 series:

9:1 consolidation 115% ROI

Financial Summary

Initial Investment $645,786

Net Savings (4 Year) $742,126

Return on Investment (ROI) 115%

Net Present Value $456,132

See http://estimator.intel.com/serverroi/ for more information.

http://estimator.intel.com/serverroi/


Delivering World Record Performance

General Computing Throughput (4-Processor SPECint_rate_base2006*)

Technical Computing Throughput (4-

Processor SPECfp_rate_base2006*)

Decision Support/Analytics (Overall SAP HANA* BW-EML @ 2B initial records)

Business Processing (4-Processor SAP Sales & Distribution* 2-tier on LINUX)

Decision Support/Analytics (4-Processor TPC-H* @ 10TB using Microsoft SQL Server*2014)

General Computing Speed(4-Processor SPECint_base2006* tie)

+ more…

Technical Computing Throughput (8-

Processor x86 SPECfp_rate_base2006*)

Decision Support/Analytics(Overall TPC-H* @ 3TB using Microsoft SQL Server*2014)

Business Processing(4-Processor TPC-E* using Microsoft SQL Server*2014)

+ more…

*Other names and brands may be claimed as the property of others.

20 New World Records

Business Processing(Overall SAP Sales & Distribution* 2-tier on Windows* with 8-Processors)

Infrastructure Virtualization(Overall VMmark* 2.5 Performance with 8-Processors)

+ more…

For more complete information about performance and benchmark results, visit www.intel.com/E7v3records.

http://www.intel.com/E7v3records


36

4S Intel® Xeon® Processor E7 v3 FamilyGenerational Performance Measurements

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. Configurations: 4x Intel Xeon processor E7-8890 v3 compared to E7-4890 v2. See previous pages for details. For more complete information, visit http://www.intel.com/performance.

1 1.06 1.07 1.09 1.12 1.13 1.25 1.29 1.39 1.39 1.68 1.72

6

E7

-48

90

v2

Ba

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ne

Est

.

SP

EC

int*

_b

ase

20

06

ST

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00

6

Est

. SP

EC

fp*_

rate

_

ba

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00

6

Est

. SP

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00

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Bro

ke

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LT

P

Ha

mm

erD

B

Wa

reh

ou

se O

LT

P

Se

rve

r C

on

soli

da

tio

n

Vir

tua

lize

d M

ach

ine

LIN

PA

CK

SA

S N

ew

Mix

ed

An

aly

tics

*

SA

P H

AN

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SP

S9

wit

h I

nte

l® T

SX

Re

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nce

E7-4890 v2 (15C, 2.80 GHz) "Ivy Bridge-EX 4S" E7-8890 v3 (18C, 2.50 GHz) "Haswell-EX 4S"

UP TO

1.4xAVG PERFORMANCE

INCREASE



Intel® Xeon® Processor E7 v3 Family Highlights

Up to 20% more cores

Up to 20% more cache

Up to 70% more query session per hour for better business insight1

Performance (vs. previous generation)

Intel® TSX

Intel® AVX 2.0

Cache Monitoring

Intel® VMCS

shadowing

New Features

Enhanced MCA Recovery Gen 2

Address Range Memory Mirroring

Multiple Rank Sparing

DDR4 Recovery for Command & Address Parity Errors

New Reliability Features

DDR4 and DDR3 supported to provide headroom for future growth as your workloads grow

Largest Memory Footprint

Твердотельные накопителиIntel® 2015 года.Алексей Слепцов


S3700 Series

330 Series

2009 2010 2011 2012 2013

910 Series

510 Series

520 Series

313 Series

320 Series

S3500 Series

335 Series

311 Series

313 Series

Data Center Family

Professional Family

Consumer Family

310 Series

EphraimX25-M Series

EphraimX25-E Series

PostvilleX25-M Series

PostvilleX25-V Series

2014

P3700 Series

P3600 Series

Pro 1500 Series

Pro 2500 Series

Intel® SSD Portfolio

730 Series

530 Series

2015

S3710 Series

P3510 Series

S3610 Series

S3510 Series

525 Series

710 Series

P3608 Series

535 Series

750 Series

P3500 Series

39


Форм-факторы SSD

M.2/NGFFmSATA

2.5’’

~2.3mm

~4.8mm

15mm

7mm

PCI-Express*

40


Random 4k Read Up to 85k IOPS

Random 4k Write Up to 45k IOPS

Random 4k 70/30 R/W

Up to 63k IOPS

Sequential Read Up to 550 MB/s

Sequential Write Up to 520 MB/s

Avg Active R/W Power

2.6-3.1/4-6.9 W

Idle Power 600 mW

Intel® SSD DC S3710 Series

2.5inx7mm

6Gbps

Delivering up to 25% more write performance than the Intel SSD DC S3700 Series at a lower total cost of ownership

Verticals• HPC• Financial• HealthcareWorkloads• Virtualization• Analytical & operational

databases• Boot OS

Performance Uses Features

Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Configurations: Intel Core i7-3770K CPU @ 3.50GHz, 8GB of system memory, Windows1 Server 2012, IOMeter. Random performance is collected with 4 workers each with 32 QD. Average RMS Active write power measured at max bandwidth. *Other names and brands may be claimed as the property of others.

Power loss protection

End-to-end data protectionAES 256b encryption

Consistently amazing performance

High Endurance Technology (HET) 20nm NAND – 10 DWPD

1.2TB400GB200GB

800GB

For additional information visit the PCIe Family Page on

www.intel.com/ssd

41

http://www.intel.com/content/www/us/en/solid-state-drives/intel-ssd-dc-family-for-pcie.html




Random 4k 70/30 R/W

Up to 51k IOPS




1.8-2.6/1.6-5.2W

Idle Power* 600 mW

Intel® SSD DC S3610 Series 6Gbps

The optimal balance of endurance, performance and cost for mixed workloads

Verticals• Manufacturing• RetailWorkloads• Virtualization• Analytical & operational

databases• Boot OS• Machine generated data






20nm NAND for value - read intensive performance at 3 DWPD


www.intel.com/ssd

2.5inx7mm400GB200GB

1.2TB 1.6TB800GB

1.8inx5mm

800GB480GB

200GB100GB*

*100GB available Q2’15

42





Random 4k 70/30 R/W

Up to 38k IOPS




1.9-2.7/1.9-5.6 W

Idle Power 600-700 mW

Intel® SSD DC S3510 Series

2.5inx7mm

6Gbps

Consistently high performance optimized for read-intensive applications in data centers, cloud, and intelligent systems

QS Product Availability

Now May ‘15

Verticals• Cloud• EmbeddedWorkloads• Static web content• Factory control systems






16nm NAND for value - read intensive performance at 0.3 DWPD

1.2TB 1.6TB

80GB120GB 480GB240GB

800GB

43


Intel® SSD NVM Express* (NVMe)

44


Почему NVM Express*?

SATA6Gb/s

PCI-Ex 2.0 x832Gb/s

•Невозможно достичь высоких значений IOPS,если хост-контроллер не может этого позволить

•NVMe изначально создан для решения этой проблемы

45


NVM Express*(NVMe) - новый уровень IOPs

100% random reads: >3Xbetter IOPs than SAS 12Gbps

70% random reads: >2X better IOPs than SAS 12Gbps

100% random writes: ~ 1.5X better IOPs than SAS 12Gbps

0

50000

100000

150000

200000

250000

300000

350000

400000

450000

500000

100% Read 70% Read 0% Read

IOP

S

4K Random Workloads

PCIe/NVMe SAS 12Gb/s

0

500

1000

1500

2000

2500

3000

100% Read 0% Read

MB

Ps

Sequential Workloads

PCIe/NVMe SAS 12Gb/s

100% reads: >2X better performance than SAS 12Gbps

100% writes: >2.5X better performance than SAS 12Gbps

46


SSD NVM Express* (NVMe)Перспективы проникновения на рынок

47


Intel® DC SSD NVM Express (NVMe)

48




Random 4k 70/30 R/W

Up to 265k IOPS




9-11/12-25 W

Idle Power 4 W

Intel® SSD DC P3700 SeriesDelivers excellent performance and the endurance to withstand the toughest

data center applications with the low latency and high efficiency of NVMe*

VirtualizationPrivate CloudDatabaseHPCCaching and tiering



800GB

400GB

1.6TB

2TB

x4 HHHL Add in card


www.intel.com/ssd


End-to-end data protectionUBER 10-17, 2M hours MTBF

High Endurance Technology (HET) 20nm NAND – 10 to 17 DWPDConsistently amazing performanceLow latency of NVMe*

2.5inx15mm

49





Random 4k 70/30 R/W

Up to 160k IOPS




7-10/8-25 W

Idle Power 4 W

Consistently amazing low latency performance optimized for mixed workloads. Up to 6x the performance of a SATA SSD at half the latency and CPU utilization!

VirtualizationPrivate CloudDatabaseHPCCaching and tiering




www.intel.com/ssd



High Endurance Technology20nm NAND – 3 DWPD

Consistently amazing performanceLow latency of NVMe*

2.5inx15mm

800GB400GB 1.6TB 2TB1.2TB

x4 HHHL Add in card

Intel® SSD DC P3600 Series

50





Random 4k 70/30 R/W

Up to 85k IOPS




9-10/12-25 W

Idle Power 4 W

Cost effective, high performance of NVMe* optimized for read intensive applications

Private CloudDatabaseBig Data





High Endurance Technology20nm NAND – 0,3 DWPD


2.5inx15mm

400GB 2TB1.2TB

x4 HHHL Add in card


Now Apr ‘15


51


P3700 P3600 P3500

Использование Intel® DC SSD NVMe

DatabaseVirtualization Big data

NVMe SSDs lower enterprise IT TCO by enabling increased

Virtual Machine scalability and

optimizing platform utilization

P3700 P3600 P3500 P3700 P3600 P3500 P3700 P3600 P3500 P3700 P3600 P3500

Software Defined Infrastructure or

hyper convergence is made affordable

with high performance SSDs

Consistent, low latency, high bandwidth

performance of NVMe shines in

traditional relational databases

Analytics and NoSQLdatabases fully utilize NVMe performance to provide near real

time results

NVMe keeps up with high bandwidth demands of HPC

designed to speed up workflow times

HPCPrivate Cloud

52


3D не только в кинотеатрах

53


Intel® + Micron* NAND Leadership

Disruptive 3D NAND

Breakthrough cost

2x bits per die

1 TB in 2mm

>10TB in a SSD

Intel 3D NAND2D NAND

32 Tiers

* Другие торговые марки и товарные знаки являются собственностью их законных владельцев.

«БОЙСЕ (Айдахо) и САНТА-КЛАРА (Калифорния), 26 марта 2015 г. – Micron Technology, Inc.* и Intel сегодня объявили о доступноститехнологии 3D NAND, которая позволяет создавать флеш-память с самым высоким в мире уровнем плотности размещения ячеекпамяти». Пресс-релиз. http://www.anandtech.com/show/9116/estimating-intelmicron-32layer-256gbit-3d-nand-die-size

54




Random 4k 70/30 R/W

TBD




9-10/12-25 W

Idle Power 4 W

Utilizing the trusted Intel NVMe* controller with new Intel 3D NAND technology delivering lower cost and TCO savings for read intensive applications


Q4’15 Q4’15

Private CloudDatabaseBig data






20nm NAND for mixed workload performance at 0,3 DWPD

2TB

2.5inx15mm x4 HHHL Add in card

INTEL SOLID-STATE DRIVEDC P3520 Series1.2TB1TB

*Available Q1’16

3.2TB*


55




Random 4k 70/30 R/W

TBD




TBD/25-50 W

Idle Power 8-10 W

Intel® SSD DC P3608 SeriesNew dual controller and PCIe 3.0, x8 architecture delivers increased capacity

and read performance compared to the Intel SSD DC P3600 Series


Q3’15 Q3’15

HPCDatabase






20nm HET NAND for mixed workload performance at 3 DWPD

1.6TB3.2T

B4TB

x8 HHHL Add in card

INTEL SOLID-STATE DRIVEDC P3608 Series

One drive volume with Intel RSTe software

56


Data Center Client Ultra-Mobile

Лидирующие позиции Intel® в компьютерной индустрииОбеспечение решений с SSD высочайшего качества

Стратегия Intel®

Решения на основе Intel® NVM Если устройство существует, оно должно быть с SSD Intel®

57

Intel Confidential — Do Not Forward

Спасибо.

[email protected]

58

Documents

Серверная продукция Intel 2015 года. Алексей ......2014/08/26 · New configuration: Hewlett-Packard Company HP ProLiant ML350 Gen9 platform with two