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SERVICE MANUAL LEVEL 2 Link DISASSEMBLY SERVICE NOTE SPECIFICATIONS SCHEMATIC DIAGRAMS FRAME SCHEMATIC DIAGRAM BLOCK DIAGRAMS REPAIR PARTS LIST PRINTED WIRING BOARDS Link Revision History Revision History How to use Acrobat Reader How to use Acrobat Reader Sony EMCS Co. DSC-T20/T25_L2 Internal memory ON BOARD Internal memory ON BOARD Ver 1.0 2007.03 DIGITAL STILL CAMERA 2007C0800-1 © 2007.03 Published by Kohda TEC 9-852-195-31 US Model Canadian Model AEP Model UK Model E Model Australian Model Hong Kong Model Chinese Model Korea Model Argentine Model Brazillian Model Japanese Model Tourist Model The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part num- ber specified. Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié. Precaution on Replacing the SY-170 Board DSC-T20/T25 Photo: Silver

0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

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Page 1: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

SERVICE MANUAL LEVEL 2

Link

DISASSEMBLY

SERVICE NOTE

SPECIFICATIONS

SCHEMATIC DIAGRAMS

FRAME SCHEMATIC DIAGRAM

BLOCK DIAGRAMS

REPAIR PARTS LIST

PRINTED WIRING BOARDS

Link

Revision HistoryRevision History

How to useAcrobat Reader

How to useAcrobat Reader

Sony EMCS Co.DSC-T20/T25_L2

Internal memoryON BOARD

Internal memoryON BOARD

Ver 1.0 2007.03

DIGITAL STILL CAMERA

2007C0800-1 © 2007.03

Published by Kohda TEC9-852-195-31

US ModelCanadian Model

AEP ModelUK Model

E ModelAustralian Model

Hong Kong ModelChinese Model

Korea ModelArgentine ModelBrazillian ModelJapanese Model

Tourist Model

The components identified bymark 0 or dotted line withmark 0 are critical for safety.Replace only with part num-ber specified.

Les composants identifiés par unemarque 0 sont critiques pour lasécurité.Ne les remplacer que par une pièceportant le numéro spécifié.

• Precaution on Replacing the SY-170 Board

DSC-T20/T25

Photo: Silver

Page 2: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

— 2 —DSC-T20/T25_L2

SPECIFICATIONS

Camera

[System]Image device: 7.18 mm (1/2.5 type) color CCD,

Primary color filterTotal pixel number of camera:

Approx. 8286 000 pixelsEffective pixel number of camera:

Approx. 8083 000 pixels

6.33 – 19.0 mm (38 – 144 mm when converted to a 35 mm still camera) F3.5 – 4.3

Exposure control: Automatic exposure, Scene Selection (9 modes)

White balance: Automatic, Daylight, Cloudy, Fluorescent 1, Fluorescent 2, Fluorescent 3,Incandescent, Flash

File format (DCF compliant): Still images: Exif Ver. 2.21 JPEG compliant,

DPOF compatibleMovies: MPEG1 compliant (Monaural)

Recording media: Internal Memory (approx. 31 MB), “Memory Stick Duo”

Flash: Flash range (ISO (Recommended Exposure

approx. 0.25 to 2.5 m (9 7/8 inches to 8feet 2 1/2 inches) (T)

[Input and Output connectors]Multi connectorVideo outputAudio output (mono)USB communication: Hi-Speed USB (USB 2.0

compliant)

[LCD screen]LCD panel: 6.2 cm (2.5 type) TFT drive

[Power, general]Power: Rechargeable battery pack NP-BG1, 3.6 V

AC-LS5K AC Adaptor (not supplied), 4.2 VPower consumption (during shooting): 1.0 WOperating temperature: 0 to 40°C (32 to 104°F)Storage temperature: –20 to +60°C (–4 to +140°F)

protrusions)Mass: Approx. 159 g (5.6 oz) (including NP-BG1

battery pack and wrist strap, etc.)Microphone: MonauralSpeaker: MonauralExif Print: CompatiblePRINT Image Matching III: CompatiblePictBridge: Compatible

BC-CSG/BC-CSGB/BC-CSGCbattery chargerPower requirements: AC 100 to 240 V, 50/60 Hz,

2 W (BC-CSG/BC-CSGC)/2.6 W (BC-CSGB)Output voltage: DC 4.2 V, 0.25 AOperating temperature: 0 to 40°C (32 to 104°F)Storage temperature: –20 to +60°C (–4 to +140°F)

Mass: Approx. 75 g (2.7 oz)

Rechargeable battery pack NP-BG1Used battery: Lithium-ion batteryMaximum voltage: DC 4.2 VNominal voltage: DC 3.6 VCapacity: 3.4 Wh (960 mAh)

Design and specifications are subject to change without notice.

Lens: Carl Zeiss Vario-Tessar 3× zoom lens f = Total number of dots: 230 400 (960×240) dots

Dimensions: 89.7×55.7×22.8 mm (3 5/8× 2 1/4×29/32 inches) (W/H/D, excluding

Dimensions: Approx. 62×24×91 mm (2 1/2× 31/32×3 5/8 inches) (W/H/D)

Index) set to Auto): approx. 0.1 to 3.0 m (4 inches to 9 feet 10 1/8 inches) (W)/

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— 3 —DSC-T20/T25_L2

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITHMARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTSLIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESECOMPONENTS WITH SONY PARTS WHOSE PART NUMBERSAPPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTSPUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORTÀ LA SÉCURITÉ!

LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LESDIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONTCRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NEREMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONYDONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OUDANS LES SUPPÉMENTS PUBLIÉS PAR SONY.

1. Check the area of your repair for unsoldered or poorly-solderedconnections. Check the entire board surface for solder splashesand bridges.

2. Check the interboard wiring to ensure that no wires are"pinched" or contact high-wattage resistors.

3. Look for unauthorized replacement parts, particularlytransistors, that were installed during a previous repair. Pointthem out to the customer and recommend their replacement.

4. Look for parts which, through functioning, show obvious signsof deterioration. Point them out to the customer andrecommend their replacement.

5. Check the B+ voltage to see it is at the values specified.6. FLEXIBLE Circuit Board Repairing

• Keep the temperature of the soldering iron around 270°Cduring repairing.

• Do not touch the soldering iron on the same conductor of thecircuit board (within 3 times).

• Be careful not to apply force on the conductor when solderingor unsoldering.

Unleaded solderBoards requiring use of unleaded solder are printed with the lead-free mark (LF) indicating the solder contains no lead.(Caution: Some printed circuit boards may not come printed withthe lead free mark due to their particular size.)

: LEAD FREE MARKUnleaded solder has the following characteristics.• Unleaded solder melts at a temperature about 40°C higher than

ordinary solder.Ordinary soldering irons can be used but the iron tip has to beapplied to the solder joint for a slightly longer time.Soldering irons using a temperature regulator should be set toabout 350°C.Caution: The printed pattern (copper foil) may peel away if theheated tip is applied for too long, so be careful!

• Strong viscosityUnleaded solder is more viscous (sticky, less prone to flow) thanordinary solder so use caution not to let solder bridges occur suchas on IC pins, etc.

• Usable with ordinary solderIt is best to use only unleaded solder but unleaded solder mayalso be added to ordinary solder.

SAFETY CHECK-OUT

After correcting the original service problem, perform the following

safety checks before releasing the set to the customer.

CAUTIONDanger of explosion if battery is incorrectly replaced.Replace only with the same or equivalent type.

Model

Destination

DSC-T20

US, CND, AEP, UK, E, AUS,HK, CH, KR, AR, BR, J, JE

DSC-T25

AEP, E, AUS, HK

• AbbreviationAR : Argentine modelAUS: Australian modelBR : Brazilian modelCH : Chinese modelCND: Canadian modelEE : East European modelHK : Hong Kong modelJ : Japanese modelJE : Tourist modelKR : Korea modelNE : North European modelTW : Taiwan model

Model information table

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— 4 —DSC-T20/T25_L2

TABLE OF CONTENTS

1. SERVICE NOTE1-1. Precaution on Replacing the SY-170 Board ···················· 1-11-2. Self-Diagnosis Function ·················································· 1-11-3. Process After Fixing Flash Error ····································· 1-21-4. Method for Copying or Erasing the Data in Internal

Memory ··········································································· 1-31-5. How to Write Data to Internal Memory ·························· 1-4

2. DISASSEMBLY2-1. Disassembly ····································································· 2-2

3. BLOCK DIAGRAMS3-1. Overall Block Diagram (1/2) ··········································· 3-13-2. Overall Block Diagram (2/2) ··········································· 3-23-3. Power Block Diagram ····················································· 3-33-4. Power Block Diagram ····················································· 3-4

4. PRINTED WIRING BOARDS ANDSCHEMATIC DIAGRAMS

4-1. Frame Schematic Diagram ·············································· 4-14-2. Schematic Diagrams ························································ 4-24-3. Printed Wiring Boards ··················································· 4-16

5. REPAIR PARTS LIST5-1. Exploded Views ······························································· 5-25-2. Electrical Parts List ························································· 5-5

Section Title Page

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1-1

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DSC-T20/T25_L2

1. SERVICE NOTE

1-2. SELF-DIAGNOSIS FUNCTION

1-2-1. Self-diagnosis FunctionWhen problems occur while the unit is operating, the self-diagnosisfunction starts working, and displays on the LCD screen what todo.Details of the self-diagnosis functions are provided in the Instructionmanual.

1-2-2. Self-diagnosis DisplayWhen problems occur while the unit is operating, the LCD screenshows a 4-digit display consisting of an alphabet and numbers, whichblinks at 3.2 Hz. This 5-character display indicates the “repairedby:”, “block” in which the problem occurred, and “detailed code”of the problem.

0 03 2C

Repaired by:

Refer to “1-2-3. Self-diagnosis Code Table”.Indicates the appropriatestep to be taken.E.g.13 ....Format the “Memory Stick Duo”.32 ....Turn on power again.

Block Detailed Code

Blinks at 3.2 Hz

C : Corrected by customerE : Corrected by service

engineer

LCD screen

1-1. PRECAUTION ON REPLACING THE SY-170 BOARD

DESTINATION DATAWhen you replace to the repairing board, the written destination data of repairing board also might be changed to original setting.Refer to Service Manual ADJ, and perform “DESTINATION DATA WRITE”.

USB SERIAL No.The set is shipped with a unique ID (USB Serial No.) written in it.This ID has not been written in a new board for service, and therefore it must be entered after the board replacement.Refer to Service Manual ADJ, and perform “USB SERIAL No. INPUT”.

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1-2

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DSC-T20/T25_L2

1-3. PROCESS AFTER FIXING FLASH ERROR

When “FLASH error” (Self-diagnosis Code E : 91 : 01) occurs, to prevent any abnormal situation caused by high voltage, setting of the flashis changed automatically to disabling charge and flash setting.After fixing, this setting needs to be deactivated. Flash error code can be initialized by the operations on the HOME screen.

Method for Initializing the Flash Error Code

1-2-3. Self-diagnosis Code Table

C

C

E

E

E

E

E

E

E

E

E

BlockFunction

1 3

3 2

6 1

6 1

6 2

6 2

6 2

6 2

6 2

9 1

9 2

DetailedCode

0 1

0 1

0 0

1 0

0 2

1 0

1 1

1 2

2 0

0 1

0 0

Symptom/State

The internal memory has experienced aformat error.

“Memory Stick Duo” is unformatted.

“Memory Stick Duo” is broken.

“Memory Stick Duo” type error

The camera cannot read or write dataon the “Memory Stick Duo”.

Trouble with hardware

Difficult to adjust focus(Cannot initialize focus)

Zoom operations fault(Cannot initialize zoom lens.)

Abnormality of IC for steadyshot.

Lens initializing failure.

Lens overheating (PITCH).

Lens overheating (YAW).

Abnormality of thermistor.

Abnormality when flash is being charged.

Non-standard battery is used.

Self-diagnosis Code

Rep

aire

d by

:

Correction

Format the internal memory.

Format the “Memory Stick Duo”.

Insert a new “Memory Stick Duo”.

Insert a supported “Memory Stick Duo”.

Turn the power off and on again, or taking out and inserting the“Memory Stick Duo” several times.

Turn the power off and on again.

Retry turn the power on by the power switch. If it does notrecover, check the focus reset sensor of lens block (pin ea ofCN401 on the SY-170 board). If it is OK, check the focus motordrive IC (IC401 on the SY-170 board).

Retry turn the power on by the power switch. Check the zoomreset sensor of lens block (pin wk of CN401 on the SY-170board), if zooming is performed when the zoom button isoperated. If it is OK, check the zoom motor drive IC (IC401 onthe SY-170 board).

Check or replacement of the IC for steadyshot (IC503 on the SY-170 board).

Check or replacement of the IC for steadyshot (IC503 on the SY-170 board).

Check the HALL element (PITCH) of optical image stabilizer(pin 1, 2 of CN401 on the SY-170 board). If it is OK, checkPITCH angular velocity sensor (SE502 on the SY-170 board)peripheral circuits.

Check the HALL element (YAW) of optical image stabilizer (pin6, 7 of CN401 on the SY-170 board). If it is OK, check YAWangular velocity sensor (SE501 on the SY-170 board) peripheralcircuits.

Check the OIS temp sensor of optical image stabilizer (pin 5 ofCN401 on the SY-170 board).

Checking of flash unit or replacement of flash unit. (Note)

Use the compatible battery only.

Note: After repair, be sure to perform “1-3. PROCESS AFTER FIXING FLASH ERROR”.

Initializes the setting to the default setting. Even if you execute this function, the images stored in the internal memory are retained.

1 Select [Initialize] with v/V/b/B, then press z.The message “Initialize all settings” appears.

2 Select [OK] with v, then press z.The settings are reset to the default setting.

To cancel the resettingSelect [Cancel] in step 2, then press z.

• Make sure that the power is not disconnected during resetting.

Initialize

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1-3

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DSC-T20/T25_L2

1-4. METHOD FOR COPYING OR ERASING THE DATA IN INTERNAL MEMORY

The data can be copied/erased by the operations on the HOME screen. (When erasing the data, execute formatting the internal memory.)

Note 1: When replacing the SY-170 board, erase the data in internal memory of the board before replacement.Note 2: When replacing the SY-170 board, execute formatting and initialize the internal memory after replacement.

Method for Copying the Data in Internal Memory

Method for Formatting the Internal Memory

This item does not appear when a “Memory Stick Duo” is inserted in the camera.

Formats the internal memory.• Note that formatting irrevocably erases all data in the internal memory, including even protected images.

1 Select [Format] with v/V/b/B on the control button, then press z.The message “All data in internal memory will be erased” appears.

2 Select [OK] with v, then press z.The format is completed.

To cancel the formattingSelect [Cancel] in step 2, then press z.

Format

Copies all images in the internal memory to a “Memory Stick Duo”.

1 Insert a “Memory Stick Duo” having 32 MB or larger capacity.

2 Select [Copy] with v/V/b/B on the control button, then press z.The message “All data in internal memory will be copied” appears.

3 Select [OK] with v, then press z.Copying starts.

To cancel the copyingSelect [Cancel] in step 3, then press z.

• Use a fully charged battery pack. If you attempt to copy image files using a battery pack with little remaining charge, the battery pack may run out, causing copying to fail or possibly corrupting the data.

• You cannot copy individual images.• The original images in the internal memory are retained even after copying. To delete the contents of the

internal memory, remove the “Memory Stick Duo” after copying, then execute the [Format] command in [ Internal Memory Tool] .

• When you copy the data in the internal memory to the “Memory Stick Duo”, all the data will be copied. You cannot choose a specific folder on the “Memory Stick Duo” as the destination for the data to be copied.

• Even if you copy data, a DPOF (Print order) mark is not copied.

Copy

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1-4

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DSC-T20/T25_L2

1-5. HOW TO WRITE DATA TO INTERNAL MEMORY

Usually, the camera has been set so as to disable the data writing from the PC to the internal memory of the camera.This setting must be changed temporarily when the data is to be written to the internal memory such as a case after the board replacement.To change the setting, use the write enable tool “WriteEnableTool.exe”.

Data writing method1) Connect the PC to the camera (USB mode: Mass Storage), and switch the driver to the “Sony Seus USB Driver”.2) Start the Write Enable Tool and the SeusEX.3) Click the [Activate Write Enable Mode] button of the Write Enable Tool.

4) Upon completion of the setting change, the following message will be displayed.

5) Return the driver to the original one, and connect the PC to the camera (USB mode: Mass Storage).6) Write the data read out into the PC to the internal memory of the camera.7) Disconnect the PC from the camera, and turn off the camera.

Note: By turning off the camera, the write enable setting is reset.

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1. SERVICE NOTE

1-1. SY-170基板交換時の注意

仕向けデータ補修用基板と交換する時,補修用基板に書かれている仕向けデータは元の設定と違っている場合があります。ADJ編を参照して,「DESTINATION DATA WRITE」を行ってください。

USBシリアルNo.セットは,1台毎に異なる固有のID(USB Serial No.)を書き込んだ後,出荷されています。新品の補修用基板には,このIDが書き込まれていないので,基板交換後にIDを入力する必要があります。ADJ編を参照して,「USB SERIAL No. INPUT」を行ってください。

1-2. 自己診断機能1-2-1. 自己診断機能について本機の動作に不具合が生じたとき,自己診断機能が働き,L C D 画面に,どう処置したらよいか判断できる表示を行います。自己診断機能については取扱説明書にも掲載されています。

1-2-2. 自己診断表示本機の動作に不具合が生じたとき,LCD画面にアルファベットと4桁の数字が表示され,3.2Hzで点滅します。この5文字の表示によって対応者分類および不具合の生じたブロックの分類,不具合の詳細コードを示します。

0 03 2C

対応者分類

「1-2 -3 . 自己診断コード表」 を参照

対応方法の違いにより分類 例 13 ・・ ・“メモリースティック

32 ・・ ・電源を入れ直す

ブロック分類 詳細コード

3.2Hz点滅

C :お客さま自身で対応 E :サービスエンジニア

で対応 デュオ”をフォーマッ トする

LCD画面

C : 3 2 : 00

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1-2-3. 自己診断コード表

C

C

E

E

E

E

E

E

E

E

E

ブロック機能

1 3

3 2

6 1

6 1

6 2

6 2

6 2

6 2

6 2

9 1

9 2

詳細コード

0 1

0 1

0 0

1 0

0 2

1 0

1 1

1 2

2 0

0 1

0 0

症状/状態

内蔵メモリにフォーマットエラーがあった。

フォーマットしていない“メモリースティック デュオ”を入れた。

“メモリースティック デュオ”が壊れている。

“メモリースティック デュオ”のタイプエラーを検出した。

“メモリースティック デュオ”が読み/書きできない。

ハードウェアトラブルを検出した。

フォーカスが合いにくい。(フォーカスの初期化ができない)

ズーム動作の異常。(ズームレンズの初期化ができない)

手振れ補正用ICの異常。

手振れ補正用ICの異常。(レンズ初期化異常)

レンズオーバーヒート(PITCH)

レンズオーバーヒート(YAW)

サーミスタの異常。

フラッシュの充電異常。

規定外の充電池が使用された。

自己診断コード

対応/方法

内蔵メモリをフォーマットする。

“メモリースティック デュオ”をフォーマットする。

新しい“メモリースティック デュオ”に交換する。

規格内の“メモリースティック デュオ”を挿入する。

電源の入れ直し,または“メモリースティック デュオ”の挿し/外しを数回試す。

電源を入れ直す。

操作スイッチの電源を入れ直す。復帰しない場合はレンズブロックのフォーカスリセットセンサ(SY-170基板CN401 eaピン)を点検する。異常なければフォーカスモータ駆動IC(SY-170基板IC401)を点検する。

操作スイッチの電源を入れ直す。ズームボタンを操作したときにズーム動作をすればレンズブロックのズームリセットセンサ(SY-170基板CN401 wkピン)を点検する。異常なければズームモータ駆動IC(SY-170基板IC401)を点検する。

手振れ補正用IC(SY-170基板IC503)を点検または交換する。

手振れ補正用IC(SY-170基板IC503)を点検または交換する。

光学手振れ補正ブロックのホール素子(PITCH)(SY-170基板CN401 1,2ピン)を点検する。異常なければPITCH角速度センサ(SY-170基板SE502)周辺の回路を点検する。

光学手振れ補正ブロックのホール素子(YAW)(SY-170基板CN401 6,7ピン)を点検する。異常なければYAW角速度センサ(SY-170基板SE501)周辺の回路を点検する。

光学手振れ補正ブロックのサーミスタ(SY-170基板CN4015ピン)を点検する。

フラッシュユニットを点検または交換する。(Note)

規定の充電池を使用する。

対応者

Note:交換後は,必ず「1-3. フラッシュ異常修理後の処置」を行って下さい。

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1-3. フラッシュエラー発生時の対処法本機はフラッシュエラー(自己診断コードE:91:01)が発生した場合,高電圧による異常を防止するために自動的にフラッシュ充電および発光禁止の設定になります。フラッシュエラー発生後はエラーの解除を行う必要があります。エラーの解除はホーム画面から初期化操作を実行することにより行います。

1-4. 内蔵メモリのデータコピーおよび消去方法内蔵メモリのデータコピーまたは消去はホーム画面の操作から実行可能です。(消去する場合は内蔵メモリの初期化を行います。)

Note1:SY-170基板交換の際は,基板交換前に内蔵メモリのデータを消去して下さい。Note2:SY-170基板交換の際は,基板交換後に内蔵メモリのフォーマットおよび初期化を実行して下さい。

内蔵メモリのコピー方法

内蔵メモリのフォーマット方法

設 定 リ セ ッ ト

お 買 い 上 げ 時 の 設 定 に 戻 し ま す 。 [ 設 定 リ セ ッ ト ] を 実 行 し て も 、 内 蔵 メ モ リ ー に 記 録 さ れ て い る 画 像 は 削 除 さ れ ま せ ん 。

コ ン ト ロ ー ル ボ タ ン の / / / で [ 設 定 リ セ ッ ト ] を 選 び 、 中 央 の を 押 す 。 「 全 て の 設 定 内 容 を リ セ ッ ト し ま す 」 と い う メ ッ セ ー ジ が 表 示 さ れ る 。

で [ 実 行 ] を 選 び 、 中 央 の を 押 す 。 設 定 リ セ ッ ト が 実 行 さ れ る 。

設 定 リ セ ッ ト を 中 止 す る に は

手 順 で 、 [ キ ャ ン セ ル ] を 選 び 、 中 央 の を 押 す 。

設 定 リ セ ッ ト 中 は 電 源 が 切 れ な い よ う に ご 注 意 く だ さ い 。

1

2

2

“メ モ リ ー ス テ ィ ッ ク デ ュ オ”が 本 機 に 入 っ て い る 場 合 は 表 示 さ れ ま せ ん 。

フ ォ ー マ ッ ト

内 蔵 メ モ リ ー の 管 理 領 域 を フ ォ ー マ ッ ト ( 初 期 化 ) し ま す 。

フ ォ ー マ ッ ト す る と 、 プ ロ テ ク ト し て あ る 画 像 も 含 め て 、 す べ て の デ ー タ が 消 去 さ れ 、 元 に 戻 せ ま せ ん 。

コ ン ト ロ ー ル ボ タ ン の / / / で [ フ ォ ー マ ッ ト ] を 選 び 、 中 央 の を 押 す 。 「 内 蔵 メ モ リ ー の デ ー タ が す べ て 消 去 さ れ ま す 」 と い う メ ッ セ ー ジ が 表 示 さ れ る 。

で [ 実 行 ] を 選 び 、 中 央 の を 押 す 。 フ ォ ー マ ッ ト が 実 行 さ れ る 。

フ ォ ー マ ッ ト を 中 止 す る に は

手 順 で 、 [ キ ャ ン セ ル ] を 選 び 、 中 央 の を 押 す 。

1

2

2

コ ピ ー

内蔵メモリーに記録した画像を、“メモリースティックデュオ”に一括コピーします。

32MB以上の容量のある“メモリースティックデュオ”を本体に入れる。コントロールボタンの / / / で[コピー]を選び、中央の を押す。「内蔵メモリーのデータがすべてコピーされます」というメッセージが表示される。で[実行]を選び、中央の を押す。コピーが実行される。

コピーを中止するには手順 で、[キャンセル]を選び、中央の を押す。

充分に充電したバッテリーをご使用ください。残量の少ないバッテリーを使用して画像ファイルをコピーすると、バッテリー切れのため、データを転送できなかったり、データを破損するおそれがあります。画像ごとのコピーはできません。データをコピーしても、内蔵メモリー内のデータは削除されません。内蔵メモリーの内容を消去するには、コピー後に“メモリースティックデュオ”を本体から取りはずし、[ 内蔵メモリーツール]の[フォーマット]を行ってください。データのコピーをすると、“メモリースティックデュオ”内に新しいフォルダが作成されます。コピー先のフォルダを指定することはできません。データのコピーを行っても、DPOF(プリント予約)マークの設定はコピーされません。

Page 12: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

1-8E

ENGLISH JAPANESEENGLISH JAPANESE

DSC-T20/T25_L2

1-5. 内蔵メモリへデータを書き戻す方法通常は,PCからカメラの内蔵メモリへデータを書き込むことはできない設定になっています。基板交換後などに,内蔵メモリへデータを書き戻す場合には,この設定を一時的に変更する必要があります。設定の変更には,書き込み許可ツール(WriteEnableTool.exe)を使用します。

書き戻し方法1) カメラとPCをマスストレージ接続し,ドライバを"Sony Seus USB Driver"に切り替える。2) 書き込み許可ツールとSeusEXを起動する。3) 書き込み許可ツールの[Activate Write Enable Mode]ボタンをクリックする。

4) 設定の変更が終了すると,次のメッセージが表示されます。

5) ドライバを元に戻して、カメラとPCをマスストレージ接続する。6) PCに読み出しておいたデータをカメラの内蔵メモリに書き込む。7) カメラとPCの接続を解除し,カメラの電源をOFFにする。

注意: カメラの電源をOFFにすることにより,書き込み許可の設定が解除されます。

Page 13: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

2-1

2. DISASSEMBLY

DSC-T20/T25_L2

NOTE FOR REPAIR

• Make sure that the flat cable and flexible board are not cracked of bent at the terminal.Do not insert the cable insufficiently nor crookedly.

• When remove a connector, don’t pull at wire of connector. It is possible that a wire is snapped.

• When installing a connector, don’t press down at wire of connector.It is possible that a wire is snapped.

• Do not apply excessive load to the gilded flexible board.

Cut and remove the part of gilt which comes off at the point.(Be careful or some pieces of gilt may be left inside)

DISCHARGING OF THE ST-163 BOARD’S CHARGING CAPACITOR (C901)

The charging capacitor (C901) of the ST-163 board is chargedup to the maximum 300 V potential.There is a danger of electric shock by this high voltage when thecapacitor is handled by hand. The electric shock is caused bythe charged voltage which is kept without discharging when themain power of the unit is simply turned off. Therefore, theremaining voltage must be discharged as described below.

Preparing the Short JigAs the discharging location is in depths, the short jig may touchto the opening of frame.Expose the tip of resistor of 1kΩ /1 W (1-215-869-11) by 1mmand insulate the rest of it with insulation tape.

1 kΩ/1 W

Wrap insulating tape.

to about 1mm to about 1mmNote: High-voltage cautions

Discharging the CapacitorShort-circuit between the two points with the short jig about 10 seconds.To avoid the spark with the metal plate,wrap the short jig with the insulation tape.

R:1 kΩ/1 W (Part code: 1-215-869-11)

ChargingCapacitor

Page 14: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

2-2DSC-T20/T25_L2

HELPHELP

EXPLODED VIEW HARDWARE LIST2-1. DISASSEMBLY

2-1-1. OVERALL SECTIONFollow the disassembly in the numerical order given.1Cabinet (Front) Assy (1-1 to 1-3)2 Lens Block (2-1 to 2-2)3Cabinet (Rear) Assy (3-1 to 3-6)

1Cabinet (Front) Assy

3Cabinet (Rear) Assy

1-1 (#18/#29)

1-2 (#18/#29)

1-3 (#18/#29)

2Lens Block

2-1

2-2

3-1 (#72)

3-2 (#72)

3-3 (claw)

3-4 (claw)

3-5 (claw)

3-6

HELPNote: High-voltage cautions

Discharging the CapacitorShort-circuit between the two points with the short jig about 10 seconds.To avoid the spark with the metal plate,wrap the short jig with the insulation tape.

R:1 kΩ/1 W (Part code: 1-215-869-11)

ChargingCapacitor

Note: Speaker cable cautions

As the wire of speaker is fragile, disconnect theconnector carefully to prevent damage it.

Page 15: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

2-3DSC-T20/T25_L2

EXPLODED VIEW HARDWARE LIST2-1-2. SY-170 BOARD SECTIONFollow the disassembly in the numerical order given.1 SY-170 Board (1-1 to 1-6)2 Flash Block (2-1 to 2-4)

1SY-170 Board

2-1 (hook)

2-2 (claw)

2-3 (claw)

2-4

2Flash Block

53

SY-170

ST-161ST-163

1-1

1-2

1-3

1-5 (claw)

1-6 (hook)

1-4 (#72)

Page 16: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

2-4EDSC-T20/T25_L2

EXPLODED VIEW2-1-3. FRAME SECTIONFollow the disassembly in the numerical order given.1 LCD Block (1-1 to 1-2)2Battery Holder Assy (2-1 to 2-4)3BT-034 Flexible Board (3-1 to 3-2)

1LCD Block

2-1 (claw)

2-2 (claw)

2-4

2-3 (claw)

2Battery Holder Assy

3BT-034 Flexible Board

3-1 (fook)

3-2 (fook)

1-1 (claw)

1-2 (claw)

Page 17: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

HELPDSC-T20/T25_L2

HELPSheet attachment positions and procedures of processing the flexible boards/harnesses are shown.

PLATE (CCD), FIXED

SHEET (CCD), ADHESIVE

PLATE (CCD), FIXED

CCD BLOCK ASSY

SHEET (CCD), ADHESIVE

Page 18: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L2

LinkLink

3. BLOCK DIAGRAMS

OVERALL BLOCK DIAGRAM (2/2)

OVERALL BLOCK DIAGRAM (1/2) POWER BLOCK DIAGRAM (1/2)

POWER BLOCK DIAGRAM (2/2)

Page 19: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L23-1

3. BLOCK DIAGRAMS

3-1. OVERALL BLOCK DIAGRAM (1/2) ( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.

: VIDEO SIGNAL

SY-170 BOARD (1/2)

IC203_3_SO

VSUB_CONT_PRE, VSUB_CONT_POST

C25

D19XIC203_3_SCK

AF22CA_FD

CA_FD

AE23CA_HD

CA_AD00 - CA_AD13

LENS

CCDIMAGER

IC001

CD-695 FLEXIBLE BOARD

18 141

10 L7J8

LENS BLOCK

CN301

ZOOMMOTOR

M

FOCUSMOTOR

M

FOCUSSENSOR

ZOOMSENSOR

YAWMOTOR M

HALLELEMENT

21, 2

4 - 28

, 32 -

375

- 7

D1, D

2, H1

,H2

, K1,

K2

16

LENS TEMPSENSOR

IC002

HIGH SPEEDBUFFER AMP

27

28, 2

9, 3

0

9 L2

38

3 - 1

4

CCD_OUTPOWER_SAVEPOWER_SAVE

H1, H2, H3H1, H2, H3

V1, V2, V3A, V3B, V4, V5A, V5B, V6 - V10V1, V2, V3A, V3B, V4, V5A, V5B, V6 - V10

LH1

201125

Q301

CCD SIGNALPROCESS,

TIMINGGENERATOR

(5/8)

IC304

1 G7

F11

SUBSUB_CONT

Q302

L10

K10

XLENS_DRIVER_PS H11D4

E10

D11

R7, A

F25

AE3

Y10AD26

IRIS(METER)

IRISMOTOR

M

IC401

36 -

3918

- 21

22 -

25

FOCUSMOTORDRIVER

IRIS_DIR_A, IRIS_BRK_A, IRIS_DIR_B, IRIS_BRK_B

FC_DIR_A, FC_DIR_B, FC_BRK_A

ZM_DIR_A, ZM_DIR_B, ZM_BRK_AZOOMMOTORDRIVER

IRIS MOTORDRIVER

FOCUS_A, A, B, B

FC_SENSZM_SENS

LENS_TEMP

FC_SENSZM_SENS_1ST

LENS_TEMP

IRIS_A, A, B, B IRIS_A, IRIS_A, IRIS_B, IRIS_B

CN401

F2, E

2, D

2, B

1D6

, E6,

B7,

C6

B4, B

5, B

3, A

3

LENS DRIVE(6/8)

27

3128

M8FC_SENS_GND XFC_RST_LED

33J8

ZM_SENS_GND XZM_RST_LED30

TZ HALL TEMPSENSOR AF3

AB18

TZ_HALL_TEMPTZ_HALL_TEMP5

08

XDD_SYS_RST

XDD_SYS_RST

XDD_SYS_RST

2OVERALL (2/2)

(PAGE 3-2)

CAMERA DSP,LENS CONTROL,MODE CONTROL,FRONT CONTROL

(3/8, 4/8)

IC203(1/2)

OVERALL (2/2)(PAGE 3-2)

3

LCD_CK, LCD_HD, LCD_VD

LCD_D0 - LCD_D7

U19 XCS_ PANEL

IC203_0_SI, IC203_0_SO, XIC203_0_SCK

IC203_2_SO, XIC203_2_SCK

IC203_2_SO, XIC203_2_SCK

C4, D

9, F7

, F9,

D10,

E5, F

5, F6

, J9

, E9,

G5, G

9

22, 2

3, 2

9 - 3

1

15, 1

6, 3

1 - 3

3

VHLD1, VHLD2, LV, VST1, VST2

LH1

20 3 L4RGRG

24 12 CSUBCSUBSUB

SUB_CONT

VHLD1, VHLD2, LV, VST1, VST2

C8, E

7, E

6,

B5, C

5

A3 -

A8, B

4, B6

- B1

0,C6

, C7

AE18

- AE

21, A

F19 -

AF21

,AC

18 -

AC21

, AB1

9 - AB

21

F5, E

5, D

3, F

1D5

, A6,

B6,

C5

A2, C

3, C

4, A

1

B23,

E18

B18,

D18,

B17

W16

, Y18

, AD2

5, Y1

7

A17,

D16,

A18,

E16,

A19,

E17,

B19,

D17

W18

, AB2

6, W

17AB

23, A

C26,

AA23

FOCUS_A, FOCUS_A, FOCUS_B, FOCUS_B

ZOOM_A, ZOOM_A, ZOOM_B, ZOOM_B

13, 1

73,

4, 6

, 7

PITCHMOTOR M

HALLELEMENT

OPTICAL IMAGESTABILIZER

YAW±

YAW_HALLBIAS±,YAW_HALL±

9 - 1

215

, 16,

1, 2

PITCH±

PITCH_HALLBIAS±,PITCH_HALL±

ZOOM_A, A, B, B

SE501

SE502

PITCH_AD

YAW_ADIC506

PITCH/YAWSENSOR

AMP(7/8)

IC503

OPTICALIMAGE

STABILIZATIONDRIVE(7/8)

2118

J5

G5

D5

13

10

24CPU_PIO_0

D6 25CPU_PIO_1

CLK_IC503XCS_IC503

A3A7C9

A5XIC503_IC203_RSTA6

W13U8H10

YAWSENSOR

PITCHSENSOR

B10,

D10

G6, J

8,J9

, J7

J3, J

2,H2

, J4

B1, D

1

B4, A

4, B

5

D901BACKLIGHT

3 - 1

0

CN706

2.5 inchCOLOR

LCDMONITOR

LCD901

BL_HBL_L

OVERALL (2/2)(PAGE 3-2)

1

16

17

BL_H 38BL_L 39

11, 1

2, 1

314

, 15

RESET

DCK, HD, VD

XCS

D0 - D7

SI, SCK

E11

51

16

GEN_TG_CLK

GEAR_ON

AF18

Y13

J5

X20136MHz IC202

LOW POWERCLOCK GEN

(4/8)

1

BATT_SIG

3GEN_SYS_CLK Y12

IC203_1_SI G18IC203_1_SO B24

5

2

IC201

DSCCONTROL

(3/8)

D5C5

XIC203_1_SCK H18B5XCS_IC201 W20B1

E4

XDD_SYS_RSTXDD_SYS_RST B24OVERALL (2/2)

(PAGE 3-2)

Page 20: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L23-2

3-2. OVERALL BLOCK DIAGRAM (2/2) ( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.

DIRECT_PB

MS_IN

SY-170 BOARD (2/2)

V_LINE_OUTAU_LINE_OUT

USB_VBUS

AUDIO, VIDEO AMP(8/8)

IC602

A6E2F1

SP+, SP-

V_LINE_OUTAU_LINE_OUT

B6

F3D6

IC203_2_SO, XIC203_2_SCK

D5, E

6

A1, C

1

MEMORYSTICKDUO

2 - 5

, 7, 8

6

CN704

XMS_IN

XACV_DETD003

D002

AF_SW

Q704, Q707

MAX_5.0V

ACV_UNREG

BATT_UNREG

XPWR_ON

VL_3V

BL_HBL_L

V_OUTA_OUT_L

XAV_JACK_IN

USB_VBUS

CN705

24

18, 2

0

22

28

16

USB_DP, USB_DM

10, 1

2

6

2016

26

MC-177 FLEXIBLEBOARD

BATT_XEXT

HD_PR

10

8, 9

12

UART_Tx, UART_Rx

15, 9

ACV_UNREG

23, 2

5

CHARGE_V

17, 2

1

19

2

XPOWER_ON7 7

HD_PB14 4

HD_Y26 24

CN001MULTI

CONNECTOR

34 -

3929

- 33

08

ST-161 BOARD ST-163 FLEXIBLE BOARD

ST_UNREG

Q001FLASHDRIVE

FLASHUNIT

FLASHCONTROL,CHARGE

CONTROL64

9

7

IC001

XE_H

TRIGGERTRIGGER_GND

XE_L

+

C901CHARGINGCAPACITOR

D001

3

4 1

2

15

T001

10

CN701

5

12

87

6

1, 2

: VIDEO SIGNAL : AUDIO SIGNAL : VIDEO/AUDIO SIGNAL

STRB_CHGXSTRB_FULL

STB_CHG_CONTSTRB_ON STRB_ON1

XAF_LEDAF_ANODE

D002SELF-TIMER/

AF ILLUMINATOR

E2

A1B9XPWR_OFF

XCS_FR

XIC203_RST_REQ

IC203_1_UO, IC203_1_UIIC203_1_UO, IC203_1_UI

IC203_AUOUT

USB_DP, USB_DMUSB_DP, USB_DM

AE8AF8 IC203_AUIN

V8 XCS_AUDIO

IC203_AUOUTIC203_AUINXCS_AUDIO

XHD_EN

AB13IC203_CVOUT IC203_YOUT

IC203_CVOUT

MSX_BS, MSX_D0 - MSX_D3, MSX_CLKMSX_BS, MSX_D0 - MSX_D3, MSX_CLK

Y1, A

A1G1

9, D2

6A1

4, A1

3, B1

4,B1

3, A1

5, B1

5

AF12VOUT_1 IC203_PBOUT

AC12VOUT_2 IC203_PROUT

Q202, Q203, Q204

MUTE

A_3.0V

Q201

V7

Y16

H9V2H15

STRB_CHGXSTRB_FULL

STB_CHG_CONTSTRB_ON1

G15 AF_LED_CONT

AF_LED_CONT

G9 XVA_JACK_IN XVA_JACK_IN

Y9 XPWR_LED

R19 X_SHUT_SW

N19 XAE_LOCK_SW

AC8 KEY_AD_1

AF6 KEY_AD_2

H8

A23 XCS_FR

W12G8 XPWR_OFF

K8 XACV_IN

XIC203_RST_REQ

CAMERA DSP,LENS CONTROL,MODE CONTROL,FRONT CONTROL

(3/8, 4/8)

IC203(2/2)

D706MS ACCESS

LED

MEMORY STICKDETECT

Q101

BACKUP POWERREG(2/8)

IC103

POWER/ENABLE SIGCONTROLLER

(2/8)

IC101

TI_5.0VA1B4

EVER_3VA2

J4

C6XUSB_JACK

XMS_INUSB_VBUSD8

DISW1P8_EN1.8V/3.0V

DISCHARGE

1.8VSELECT SW

Q007C2

DISW2P9_EN C1XRSTXD7 B2

LCD POWER REG(1/8)

IC006PANEL_EN B11

DC/DC CONVERTER(1/8)

IC002EVER_PSB J98

1.8V REG(1/8)

IC003LDO_1P8_EN H21

B7

XPWR_ONB8

XDD_SYS_RSTBATT_SIG

XDD_SYS_RST

B4

A8

J5

X10232.768KHz

LENS COVERDETECT

S101

DDCPV_ENSW

Q014

C9

BL_EN2SW

Q006

F8

SW_1P8_ENQ010, Q012

J1

5V LOAD SW DDC5PSW_ENQ003

F7

CAMDD_EN, DDC1P2_EN, DDC1P8_EN, DDC2P9_EN, BL_EN1, VSU_EN

B2, D

9, E

8,E9

, F8,

J8

DC/DCCONVERTER

(1/8)

IC001

D_1.8VD_3.0VA_3.0VD_1.2VCAM_-7.5V

MAX_5V

CAM_12V

AVC/BATT UNREG

85

1621

30

3437

43, 4

4

1, 3

, 10,

15,

22, 3

6, 4

6

SP901SPEAKER

BATT_UNREG

BATT_SIG

VL_3V

CN702

+

BH001BATTERY

TERMINAL

BATT_UNREG

VL_3V

BATT_GNDS

BATT_SIG

BT-034 FLEXIBLEBOARD

2 BT001LITHIUMBATTERY

9 - 1

23

- 7

8

XPWR_ON

CN707 CN002

CONTROL SWITCH BLOCK(RL-073)

CONTROL SWITCH BLOCK(SW-495)

4

XPWR_LED5

XSHUTTER_SW10

XAE_LOCK_SW11

DIRECT_PB12

KEY_AD_113

KEY_AD_215

SP+, SP-

7, 8

1, 2

CN001

6

POWERS001

S002

D001(POWER)

(SHUTTER)

S001

4

2

S003W

(ZOOM)

S008

(REVIEW)

S005MENU

S007

(SET)

S004

(FLASH) (MACRO) (SELF-TIMER)

S002T

(ZOOM)

S010S006 S009HOME

OVERALL (1/2)(PAGE 3-1)

1

OVERALL (1/2)(PAGE 3-1)

4

OVERALL (1/2)(PAGE 3-1)

2

OVERALL (1/2)(PAGE 3-1)

3

IC203_0_SI, IC203_0_SO, XIC203_0_SCK

H17,

A24,

G17

D1, D

2, E

1

Q004,Q013

Page 21: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L23-3

3-3. POWER BLOCK DIAGRAM (1/2) ( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.

CCD_12V

CCD_-7.5V

CAM_12V

CAM_-7.5V

1

39

CN301

CCDIMAGER

IC001

HIGH SPEEDBUFFER AMP

IC002

CD-695 FLEXIBLE BOARD

45 BATT

47 LXSU9 PVAFE35 PVLED29 PVBST28 GD13 PVSD

36 ONLED

VSEN

LXM 5

LXAFED_1.8V

MAX_5.0V MAX_5.0V

8

DISW1P8_ENDISW2P9_EN

DC/DCCONVERTER

(1/8)

IC001

L002

L005

L006

LXSDD_1.2V

EVER_3.0V1.2V_INT

1.2V_INT

16L009

L702

SWBSTCAM_12V

30L004

LXINVCAM_-7.5V

21

20PVINV4PVM

MAX_5.0V

44PVSU43SU

D012

D010

D007

SWLEDBL_H

34

FBLLEDBL_L

BL_H

BL_L37

L003 D006

IC004

VOLTAGEDETECTOR

(1/8)

D_1.8V

D_3.0V

3VIN 4

VOUT 1

VinLDO_1P8_EN

DDR_1.8VIC003

1.8V REG(1/8)

4CE1

Vout 3

EN

EVER_PSB

IC002

DC/DCCONVERTER

(1/8)

1SW9

LBI7VBAT6

PS8

VOUT 2

33LXLED

Q006

Q003

Q014

D008

Q0071.8V/3.0VDISCHAGE

MAX_5.0VQ707

AF SW

SW_1P8_ENQ010, Q012

1.8VSELECT SW

Vin

PANEL_EN

DDC5PSW_EN

PANEL_6.4V

AF_ANODE

IC006

LCDPOWER

REG(1/8)6

Vcont1Vout 4

D_1.8V

CAM_-7.5V

CAM_12V

D_1.2V

EVER_3.0V

D_3.0V

A_3.0V

D_3.0V

L001 A_3.0V

DDCPV_EN

TI_5

.0V

A_3.

0V

D_1.

8V

D_3.

0V

DDR_

1.8V

TI_5.0V TI_5.0V

L007

ST_UNREG

ACV_

UNRE

G

ACV_UNREG

ACV_UNREG ACV_UNREG

TI_5.0VTI_5.0V

ST-161 BOARDST-163 FLEXIBLEBOARD

SY-170 BOARD (1/2)

CN701D001

T001

L001

FLASH CONTROL,CHARGE CONTROL

IC001

9

3, 4

2

D002SELF-TIMER/

AF ILLUMINATOR

FLASHUNIT

C901CHARGINGCAPACITOR

+

VCCI

D901BACKLIGHT

BL_H

CN706

3938

33

VCC (3.0V)35

VCC2 (6V)34

BL_LBL_HBL_L

2.5 inchCOLOR

LCDMONITOR

LCD901

FL701

B8XPOWER_ON0

H7DDC2P9_AD

XPOWER_ON1

32KHZ_IN

32KHZ_OUT

POWER/ENABLE SIGCONTROLLER

(2/8)

IC101

A8

BL_EN1 F8

BL_EN2 F9

DDC1P8_ADD_1.8V

1.2V_INT

J7

LDO1P8_EN H2EVER_PSB J9SW1P8_EN J1PANEL_EN B1DDCPV_EN C9

DDC5PSW_EN F7DISW1P8_EN C2DISW2P9_EN C1

LENS COVER DETECT

S101

J4

J5

X10232.768KHz

D_3.0V

D_1.8V

D_3.0V

C8DDC1P2_RESET

CAM_12V_1

TI_5.0V

DDR_1.8V

MC-177 FLEXIBLEBOARD

Q004, Q013

28

1019

26

CN705

CHARGE_V BATT_UNREG

BATT_XEXT XACV_DET

ACV_UNREG ACV_UNREG ST_UNREG

XAV_JACK_IN

D002

D003CN001MULTI

CONNECTOR

77XPOWER_ON

23, 2

517

, 21

34 -

3929

- 33

XPWR_ON

BATT_UNREG

BT-034FLEXIBLEBOARD

CN702

+

BH001BATTERY

TERMINAL

BATT_UNREG

VL_3V VL_3VXAV_JACK_IN

XACV_IN

BATT_SIG

BATT_GNDS

BATT_SIG

2BT001LITHIUMBATTERY

9 - 1

23

- 7

8

F002

F001

APOWER (2/2)(PAGE 3-4)

BPOWER (2/2)(PAGE 3-4)

08

L302

L303

D009

Page 22: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L23-4E

CN704

SY-170 BOARD (2/2)

Q706

IC203

CAMERA DSP,LENS

CONTROL,MODE

CONTROL,FRONT

CONTROL,(3/8, 4/8)

L203

FB217

L204

A_3.0VA_3.0V

AVCC_3.0V

DDR_VDD

XHD_EN

D_3.0V

D_3.0V BATT_SIG

VL_3V

D_1.8VD_1.8V

D_1.8V

D_1.2VDDR_1.8V

D_1.2V

08

DDR_1.8V

CAM_3.5VCAM_3.5V

AU_AVCC

9MEMORY

STICKDUO

TXRX

IC201

DSCCONTROL

(3/8)

E4VDDAVREF

D_3.0VD_3.0VD_3.0V

D2, B

4, A

5, E

1

D101VCH

VIN

VRO

TI_5.0VTI_5.0V

EVER_3.0VBACKUPPOWER

REG(2/8)

IC103

XAV_JACK_IN

XACV_IN

A1

A2A4

AE10 VRP

XAV_JACK_IN G9 GPE_06

XACV_IN K8 GPE_05 MS_PWR_ON

MS_

PWR_

ON

T7GPE_15

GPE_04

GPE_03

GPS_11V7

VBUSAA5

Q201Q202, Q203, Q204Y/PB/PR

MUTE

L201

VBUS

USB_IDY5

MAX_5.0V MAX_5.0VD_3.0V

D_1.8V D_1.8V

A_3.0V

CAM

_3.5

V

2.8V REG(7/8)

IC501

B2VOUT

VINB1

VCONTA2

1.5V REG(7/8)

IC502B2 VOUTVIN B1

IC503

OPTICALIMAGE

STABILIZATIONDRIVE(7/8) SE501

SE502

IC506

PITCH/YAWSENSOR AMP

(7/8)

YAWSENSOR

PITCHSENSOR

D_3.0V D_3.0VCAM_3.5V

TI_5.0V TI_5.0VXDD_SYS_RST

XDD_SYS_RSTCAM_3.5V

EVER_3.0VEVER_3.0V

3.5V REG(5/8)

IC307

CCD SIGNALPROCESS,

TIMINGGENERATOR

(5/8)

IC304

A2VOUT

STBY

A2 STBY

B1VINB2

D_3.0V HVDD1, HVDD22.3V REG

(5/8)

IC308B2 VOUTVIN B1

Q304

3.5VDISCHAGE

D_3.0V D_1.8V

D_3.0V

1.8V REG(5/8)

IC3066 VOUTVIN 4

CAM_12V

CAM_12V_1

CAM_12V_113.0V REG

(5/8)

IC303

1Vout

Vcont4

Vin5

FB302

CAM_-7.5V

CAM_12V

CAM_-7.5V CAM_-7.5VFB301

D_1.8VCLIVDD

FB305

DVDDFB306

A_3.0V

D_3.0V

MAX_5.0V

L602

IC602

AUDIO/VIDEOAMP(8/8)

D_3.0V

IC401

LENS DRIVER(6/8)

D_3.0VCN401

ZM_SENS_VCC29

FC_SENS_VCC

ZM_SENS_GNDXZM_RST_LED 30

FC_SENS_GNDXFC_RST_LED 3332 FOCUS

SENSOR

ZOOMSENSOR

LENS BLOCK

M8

J8

APOWER (1/2)(PAGE 3-3)

BPOWER (1/2)(PAGE 3-3)

RSTB

RGVDD

E11

L3

1 Vcont

A2 Vcont

L5

A10

DRVDDFB303

A2

FB216

FB215

3-4. POWER BLOCK DIAGRAM (2/2) ( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.

Page 23: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L24-1

4-1. FRAME SCHEMATIC DIAGRAM

4. PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

FRAME

BT001LITHIUM RECHARGEBLE

BATTERY

BH001BATTERY TERMINAL

SP901SPEAKER

LCD901

2.5 inchCOLOR

LCD MONITOR

CONTROL SWITCH BLOCK(RL-073)

CONTROL SWITCHBLOCK

(SW-495)

LENS BLOCK

LEVEL3

LEVEL3

C901CHARGING CAPACITOR

FLASH UNIT

D002

D002AF illuminator/self-timer lamp( )

2

1

38

39

2

1

38

39

112

1314

112

1314

2

1

38 39

21

3839

21

1617

1 10

1211

226

2728

125

CN401

CN301

IC001(Not supplied)

IC002(Not supplied)

CN70

1CN

702

CN70

5

CN70

6CN

707

CN704MEMORY STICK

CONNECTRO( )

CN001(MULTI CONNECTOR)

MC-177 FLEXIBLEBOARD

ST-163FLEXIBLE BOARD

ST-161 BOARD

SY-170 BOARD (SIDE B)

BT-034 FLEXIBLEBOARD

CD-695 FLEXIBLE BOARD

SY-170 BOARD (SIDE A)

1 13

1

14

39 1

1

39

IC203(Not supplied)

Page 24: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L2

ST-163 FLEXIBLE BOARD (AF ILLMINATOR)

CD-695 FLEXIBLE BOARD (CCD IMAGER)

ST-161 BOARD (FLASH DRIVE)

MC-177 FLEXIBLE BOARD(MULTI CONNECTOR)BT-034 FLEXIBLE BOARD (BATTERY IN, MODE SWITCH)CONTROL SWITCH BLOCK (RL-073, SW-495)

LinkLink

4-2. SCHEMATIC DIAGRAMS

COMMON NOTE FOR SCHEMATIC DIAGRAMS

Page 25: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

4-2DSC-T20/T25_L2

4-2. SCHEMATIC DIAGRAMS4-2. SCHEMATIC DIAGRAMS

4-2. SCHEMATIC DIAGRAMS

1. Connection

2. Adjust the distance so that the output waveform ofFig. a and the Fig. b can be obtain.

When indicating parts by reference number, pleaseinclude the board name.

(For schematic diagrams)• All capacitors are in µF unless otherwise noted. pF : µ

µF. 50 V or less are not indicated except for electrolyticsand tantalums.

• Chip resistors are 1/10 W unless otherwise noted.kΩ=1000 Ω, MΩ=1000 kΩ.

• Caution when replacing chip parts.New parts must be attached after removal of chip.Be careful not to heat the minus side of tantalumcapacitor, Because it is damaged by the heat.

• Some chip part will be indicated as follows.Example C541 L452

22U 10UHTA A 2520

• Constants of resistors, capacitors, ICs and etc with XXindicate that they are not used.In such cases, the unused circuits may be indicated.

• Parts with differ according to the model/destination.Refer to the mount table for each function.

• All variable and adjustable resistors have characteristiccurve B, unless otherwise noted.

• Signal nameXEDIT → EDIT PB/XREC → PB/REC

• 2: non flammable resistor• 5: fusible resistor• C: panel designation• A: B+ Line• B: B– Line• J : IN/OUT direction of (+,–) B LINE.• C: adjustment for repair.• A: not use circuit(Measuring conditions voltage and waveform)• Voltages and waveforms are measured between the

measurement points and ground when camera shootscolor bar chart of pattern box. They are reference valuesand reference waveforms.(VOM of DC 10 MΩ input impedance is used)

• Voltage values change depending upon inputimpedance of VOM used.)

Kinds of capacitorCase size

External dimensions (mm)

Yello

w

A AB BA=B

Fig. a (Video output terminal output waveform)

HC

yan

Gre

en

Whi

teM

agen

ta

Red

Blu

e

Fig.b (Picture on monitor TV)

CRT picture frame

Electronic beamscanning frame

THIS NOTE IS COMMON FOR SCHEMATIC DIAGRAMS(In addition to this, the necessary note is printed in each block)

Pattern box

Pattern box PTB-450J-6082-200-A orSmall pattern boxPTB-1450J-6082-557-A

Color bar chart

For PTB-450:J-6020-250-A

For PTB-1450:J-6082-559-A

Pattern box Front of the lens

L = 24 cm (PTB-450)L = 11 cm (PTB-1450)

L Camera

Precautions for Replacement of Imager• If the imager has been replaced, carry out all the adjustments

for the camera section.• As the imager may be damaged by static electricity from

its structure, handle it carefully like for the MOS IC.In addition, ensure that the receiver is not covered withdusts nor exposed to strong light.

The components identified by mark 0 or dotted line withmark 0 are critical for safety.Replace only with part number specified.

Les composants identifiés par une marque 0 sontcritiques pour la sécurité.Ne les remplacer que par une pièce portant le numérospécifie.

Page 26: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L24-3 CD-695

R10.2/P0

NO MARK:REC/PB MODE R:REC MODE P :PB MODE

Note: CD-695 f lex ib le complete board, IC001 and IC002 are not suppl ied,but they are inc luded in CCD block assy.

Note : Vol tage of IC001 can not be measured, because th is is mounted by the s ide of the lens.

0

R12.0/P0

0

A

1

V5B

V4

V1

V3A

VHLD1

VST1

VST2

V8

V6

V5A

V3B

V2

VHLD2

LV

V8

V7

V6

V5B

V5A V

4

V3B

V3A

V2

V1

VHLD2

VHLD1

LVV7

V9

V10

V9

V10

VS

T2

VS

T1

R0060

C0030.22u

LND035

LND034

LND033

LND032

LND031

LND030

LND029

LND028

LND027

LND026

LND025

LND024

LND023

LND022

LND021

LND020

LND019

LND018

LND016

LND015

LND014

LND013

LND012

LND011

LND010

LND008

LND007

LND006

LND005

LND003

LND002

LND001

C0060.1u

C0070.01u

LND009

LND037

LND036

LND038

LND017

C0050.1u

C0010.01u

C0090.01u

LND039

C0080.01u

IC002CXA3741UR-T9

1

SFC

NT

2

IDR

V0

3

IDR

V1

4

GN

D

5VCC

6ISF0

7ISF1

8NC

9

GN

D

10

IN

11

GN

D

12

NC

13 NC

14 OUT

15 GND

16 DRVCNT

17 GND

LND004

R010120k

R007 120k

R009330k

R008 220k IC001ICX636EQZ-13

5

V3A

6

V3B

7

V4

8

V5A

9

V5B

10

V6

13 V9

14 V10

15 VST2

16 VST1

17 NC

18 VOUT

24

CS

UB

25

SU

B_C

ON

T

26

DG

ND

22

VS

S

23

GN

D

30H3

1SUB

2VL

3V1

11

V7

27

LH1

19 VDD

4V2

12

V8

20 RG

21 AGND

28

H1

29

H2

31LV

32VHLD1

33VHLD2

34NC

V7

H3

CAM_12V

LH1

H1

CCD_OUT

CAM_-7.5V

REG_GND

REG_GND

REG_GND

SUB

VST1

V8

VHLD1

REG_GND

V10

V5A

V3A

LV

VHLD2

V1

CCD_GND

CSUB

V6

V3B

REG_GND

SUB_CONT

power_save

V4

VST2

REG_GND

V2

V9

V5B

RG

REG_GND

REG_GND

H2

REG_GND

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

7

08

H

9

C

D

8

B

3

G

F

124

E

105 6 112

XX MARK:NO MOUNT

B U F F E R A M P

(5/8)

PAGE 4-8of LEVEL 3

CN301

CCD IMAGER

SY-170

C C D I M A G E RH I G H S P E E D

CD-695 FLEXIBLE BOARD

IC002 IC001

Page 27: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L2

Schematic diagrams of the SY-170 board are not shown.Pages from 4-4 to 4-11 are not shown.

Page 28: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L24-12 ST-161, ST163

• Refer to page 4-2 for mark 0.

C006XX

C005XX

0

4.1

4.1

5

0

0 0

0

3.2

A

1

C00122u

C0021u

C0040.047u

250V

D001MA2YF8000LS0

IC001TPS65552RGTR

1 SW

2 SW

3 VCC

4 F_ON

5

N.C

6

I_P

EAK

7

G_I

GB

T

8

N.C

XFULL 9

CHG 10

PGND 11

PGND 12

N.C

13

N.C

14

VB

ATT

15

N.C

16

HG

ND

17

L0012.2uH

LND020

XE_K(L)

LND019

XE_A(H)

LND009 STRB_CHG_CONT

LND018

TRIG_GND

LND008 STRB_ON

LND007 STRB_CHG

LND006 XSTRB_FULL

LND010 TI_5.0V

LND004 REG_GND

LND003 REG_GND

LND002 ST_UNREG

LND001 ST_UNREG

LND005 REG_GND

LND017

TRIGGER

Q001RJP4003ASA-00-Q0

1

8

5

2

3

4

6

7

R003100

R0021M

R0041M

T001

1

2 3

4

C007220p

D00

2R

B52

0S-4

0TE6

1

R0064700

C90149u

315V

LND019REG_GND

LND001 XAF_LED

LND007 REG_GND

LND011 STRB_CHG_CONT

LND006 REG_GND

LND002 AF_ANODE

LND023STRB_CHG

LND017ST_UNREG

LND016C-

LND004 ST_UNREG

LND022XSTRB_FULL

LND024STRB_ON

LND027 C+

LND005 REG_GND

LND028 C-

LND009 STRB_CHG

D002DOR5352

AF i l lminator /se l f - t imer lamp( )

1

2

34

5

6

LND012 TI_5.0V

LND015C+

LND021REG_GND

LND018ST_UNREG

LND025STRB_CHG_CONT

LND008 XSTRB_FULL

LND010 STRB_ON

LND003 ST_UNREG

LND026TI_5.0V

LND020REG_GND

1

2

10

9

8

7

6

5

4

3

7

08

G

9

C

D

8

B

3

F

124

E

105 6 112

C H A R G E C O N T R O L

F L A S H D R I V E

FLASH DRIVE

AF ILLMINATOR

FLASHUNIT

CAPACITORCHARGING

PAGE 4-6

1

6

7

2

4

(3/8)SY-170

3

CN701

11

10

8

9

of LEVEL 3

5

12

13 14 15

F L A S H C O N T R O L ,

ST-161 BOARD

BOARDFLEXIBLEST-163

IC001

Note: ST-161 complete board is inc luded in ST-163 f lex ib le complete board.

Note : ST-163 f lex ib le complete board inc lude ST-161 complete board.

Page 29: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L24-13 MC-177

Note: CN001 (MULTI CONNECTOR) is not suppl ied, but th is is inc luded in MC-177 f lex ib le complete board.

A

1

CN001(MULTI CONNECTOR)

2 HD_Pr

4 HD_Pb

6 USB_VBUS

8 USB_GND

10 USB_DP

12 USB_DM

14 USB_GND

16 A_OUT_L

18 A_GND

20 V_OUT

22 V_GND

24 HD_Y

26 XAV_JACK_IN

1ACV_GND

3ACV_GND

5ACV_GND

7XPOWER_ON

9UART_Tx

15UART_Rx

17CHARGE_V

19BATT_XEXT

21CHARGE_V

23ACV_UNREG

25ACV_UNREG

27

28

LND024

LND015

LND016

LND026

LND013

LND004

LND002

LND028

LND029

LND007

LND009

LND040

LND019

LND021

LND032

LND030

LND020

LND006

LND023

LND033

LND027

LND031

LND001

LND003

LND008

LND010

LND018

LND011

LND025

LND012

LND022

LND017

LND005

LND014

LND038

LND036

LND037

LND035

LND034

LND039

STATIC_GND

ACV_GND

A_GND

USB_GND

HD_Pb

XAV_JACK_IN

HD_Pr

ACV_UNREG

ACV_UNREG

BATT/XEXT

USB_DM

USB_GND

ACV_GND

USB_DP

USB_VBUS

AU_LINE_OUT

ACV_UNREG

XPOWER_ON

V_GND

ACV_GND

ACV_UNREG

ACV_GND

HD_Y

ACV_GND

CHARGE_V

CHARGE_V

N.C.

ACV_UNREG

CHARGE_V

CHARGE_V

CHARGE_V

V_LINE_OUT

UART_Rx

UART_Tx

REG_GND

REG_GND

REG_GND

REG_GND

ACV_UNREG

ACV_GND

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

7

08

F

C

D

8

B

3 4

E

5 62

(8/8)

PAGE 4-11of LEVEL 3

CN705

MULT I CONNECTOR

SY-170

MC-177 FLEXIBLE BOARD

Page 30: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L24-14

A

1

LND015

LND011

LND003

LND007

LND002

LND004

LND005

LND001

LND013

LND008

LND009

LND010

LND006

LND012

LND014

LND017

LND016

BATT_UNREG

VL_3V

BATT_GND

REG_GND

BATT_GND

BATT_UNREG

BATT_SIG

BATT_GND

BATT_UNREG

BATT_GND

BATT_UNREG

BATT_GND

BATT_SIG

BATT_UNREG

REG_GND

VL_3V

BATT_GND

1

2

3

4

5

6

7

8

9

10

11

12

08

C

B

3 4 5 62

(3/8)

PAGE 4-6of LEVEL 3

CN702

BATTERY IN , MODE SWITCH

SY-170

s BH001BATTERY

TERMINAL

LITHIUMBATTERY

BT001

BT-034 FLEXIBLE BOARD

• Refer to page 4-2 for mark 0.

BT-034

Page 31: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L24-15 RL-073, SW-495

CONTROL SWITCH BLOCK (RL-073) is rep laced asblock, so that PRINTED WIRING BOARD is omit ted.( )

N O

A

1

D002MAZW068H0LS0

3 2

1

LND005

LND006

LND007

LND008

LND009

LND010

LND013

LND017

LND012

LND003

LND015

LND011

LND016

LND002

LND001

LND004

LND014S002

13

42

CL001

CL002

D001SML-412MWT86

CN001 6P

1

2

3

4

5

6

CN002 2P

1 SP+

2 SP-

LND022

LND023

S001

S005

LND001

S009

R006

S002 S004

R00110k

S001

R008

R005

R004

LND002

LND006

S003

R00210k

LND004

S008

R007R003

LND005

S006

R009

S010

LND003

S007

SP-

MIC_SIG

XPWR_ON

MIC_GND

REG_GND

SP+

XSHUTTER_SW

XAE_LOCK_SW

POWER

REG_GND

KEY_AD1

REG_GND

DPB

KEY_AD2

REG_GND

KEY_AD1

DPB

STATIC_GND

KEY_AD2

D_3.0V

XPWR_LED

STATIC_GND

A_3.0V

A_3.0V

N.C.

1

2

3

4

5

6

7

8

9

10

11

12

13

14

16

17

15

N.C.

7

08

H

9

C

D

8

B

3

G

F

124

E

105 6 112

(8/8)

PAGE 4-11of LEVEL 3

CN707

S P 9 0 1S P E A K E RSY-170

(POWER)

(SHUTTER)

22503 2250

1

(SET)

(FLASH)

MENU(ZOOM)

4KEY_AD_1

5

2250

DPB

1900

(SELF-TIMER)

A_3.0V

NC

6

(MACRO)

(REVIEW)

REG_GND

W

KEY_AD_2

(ZOOM)

3300

T

2250

2

HOME

1900

CONTROL SWITCH

CONTROL SWITCH BLOCK

BLOCK(RL-073)

(SW-495) CONTROL SWITCH BLOCK (SW-495) is rep laced asblock, so that PRINTED WIRING BOARD is omit ted.( )

Page 32: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L2

LinkLink

4-3. PRINTED WIRING BOARDS

ST-163 FLEXIBLE BOARD

ST-161 BOARD

CD-695 FLEXIBLE BOARD

BT-034 FLEXIBLE BOARD

MC-177 FLEXIBLE BOARD

COMMON NOTE FOR PRINTED WIRING BOARDS

Page 33: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

4-16DSC-T20/T25_L2

4-3. PRINTED WIRING BOARDS4-3. PRINTED WIRING BOARDS

4-3. PRINTED WIRING BOARDS

• : Uses unleaded solder.• : Circuit board

: Flexible boardPattern from the side which enables seeing.

: pattern of the rear side(The other layers’ patterns are not indicated)

• Through hole is omitted.• Circled numbers refer to waveforms.• There are a few cases that the part printed on diagram

isn’t mounted in this model.• C: panel designation

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS

2 1

3

2 1

3

2 1

3

345

21

123

654

EB

C

31

5

2

46

123

654

31

5

2

46

123

54

4 3

1 2

31 2

45

53 4

12

14

23

46

2

5

31

12

43

14

23

• Chip parts.Transistor Diode

Page 34: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L24-17 CD-695

CD-695 (3 layers)

: Uses unleaded solder.

Note: CD-695 flexible complete board, IC001 and IC002 are not supplied,but they are included in CCD block assy.

1

5

91

2

13

16

8

4

17

29

5

22

12

21

13

1

34

30

4

C001

C003

C005

C006

C007

C008

C009

IC00

2

1-873-583-

08

CD-695 FLEXIBLE BOARD

R006

R007

R008

R009 R0

10

IC001

11

LND0

01LN

D002

LND0

03LN

D004

LND0

05LN

D006

LND0

07LN

D008

LND0

09LN

D010

LND0

11LN

D012

LND0

13LN

D014

LND0

15LN

D016

LND0

17LN

D018

LND0

19LN

D020

LND0

21LN

D022

LND0

23LN

D024

LND0

25LN

D026

LND0

27LN

D028

LND0

29LN

D030

LND0

31LN

D032

LND0

33LN

D034

LND0

35LN

D036

LND0

37LN

D038

LND0

39

Page 35: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L2

Printed wiring boards of the SY-170 board are not shown.Pages 4-18 and 4-19 are not shown.

Page 36: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L24-20

ST-161 (4 layers), ST-163 (2 layers)

: Uses unleaded solder.

ST-161, ST-163

Note: ST-161 complete board is included in ST-163 flexible complete board.

Note: ST-163 flexible complete board include ST-161 complete board.

FLASH UNIT

C901CHARGING CAPACITOR

D002

LND0

01LN

D002

LND0

03LN

D004

LND0

05LN

D006

LND0

07

LND0

08

LND0

09LN

D010

LND0

11LN

D012

LND015 LND016LND017LND018

LND019LND020 LND021

LND022

LND023

LND024

LND025

LND026

LND027

LND028

D002

AF illuminator/self-timer lamp( )

ST-161 BOARD

1-873-590- 11

08

ST-163 FLEXIBLE BOARD

1-873-588- 11

08

LND001LND002

LND003

LND004

LND005

LND006

LND007

LND

008

LND009

LND010

LND

015

LND

016

5 16

8 13

14

129

17

145

8

C005

C006

D001

D00

2

IC00

1

T001

LND017 LND018

LND019 LND020

Q00

1

L001

R00

2

C001

C002

C004

C007

R00

3

R00

4

R006

Page 37: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

DSC-T20/T25_L24-21

BT-034 (2 layers), MC-177 (2 layers)

: Uses unleaded solder.

BT-034, MC-177

Note: CN001 (MULTI CONNECTOR) is not supplied, but this is included in MC-177 flexible complete board.

CN

001 CN001

(MULTI CONNECTOR)

LND001LND002LND003LND004LND005LND006LND007

LND008LND009

LND010LND011

LND012LND013

LND014LND015

LND016LND017

LND018LND019

LND020LND021

LND022LND023

LND024LND025

LND026LND027

LND028LND029LND030LND031LND032LND033LND034LND035LND036LND037LND038LND039

LND040

1-873-585-

08

MC-177 FLEXIBLE BOARD

11

22

6

27

28

12

5

+

LND0

01LN

D002

LND0

03LN

D004

LND0

05LN

D006

LND0

07LN

D008

LND0

09LN

D010

LND0

11LN

D012

LND0

13

BH001BATTERY TERMINAL

LND0

14

LND0

15

LND016

LND017

1-873-584-08

BT-034 FLEXIBLE BOARD

11

S

BT001LITHIUM RECHARGEBLE

BATTERY

CAUTIONDanger of explosion if battery is incorrectly replaced.

Replace only with the same or equivalent type.

Page 38: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

4-22DSC-T20/T25_L2

Mounted parts location of the SY-170 board is not shown.Page 4-22 to 4-23 are not shown.

Page 39: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

NOTENOTE

DSC-T20/T25_L2

LinkLink

5. REPAIR PARTS LIST

LinkLink ELECTRICAL PARTS LISTELECTRICAL PARTS LIST

EXPLODED VIEWSEXPLODED VIEWS

ACCESSORIESACCESSORIES

NOTE: Characters A to Z of the electrical parts list indicate location of exploded views in which the desired part is shown.

A B C

OVERALL SECTION FRAME SECTIONSY-170 BOARD SECTION

CD-695 FLEXIBLE BOARD

BT-034 FLEXIBLE BOARD MC-177 FLEXIBLE BOARD

ST-161 BOARD

ST-163 FLEXIBLE BOARD

A

C B

B

B

Page 40: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

5. REPAIR PARTS LIST

5-1

5. REPAIR PARTS LIST5. REPAIR PARTS LIST

DSC-T20/T25_L2

The components identified by mark 0 ordotted line with mark 0 are critical for safety.Replace only with part number specified.

Les composants identifiés par une marque0 sont critiques pour la sécurité.Ne les remplacer que par une pièce portantle numéro spécifié.

NOTE:• -XX, -X mean standardized parts, so they may have some differences from

the original one.• Items marked “*” are not stocked since they are seldom required for routine

service. Some delay should be anticipated when ordering these items.• The mechanical parts with no reference number in the exploded views are not

supplied.• Due to standardization, replacements in the parts list may be different from

the parts specified in the diagrams or the components used on the set.• CAPACITORS:

uF: µF• COILS

uH: µH• RESISTORS

All resistors are in ohms.METAL: metal-film resistorMETAL OXIDE: Metal Oxide-film resistorF: nonflammable

• SEMICONDUCTORSIn each case, u: µ, for example:uA...: µA... , uPA... , µPA... ,uPB... , µPB... , µPC... , µPC... ,uPD..., µPD...

• AbbreviationAR : Argentine modelAUS : Australian modelBR : Brazilian modelCH : Chinese modelCND : Canadian modelEE : East European modelHK : Hong Kong modelJ : Japanese modelJE : Tourist modelKR : Korea modelNE : North European modelTW : Taiwan model

When indicating parts by reference number,please include the board name.

• Color Indication of Appearance PartsExample:(SILVER) : Cabinet’s Color(Silver) : Parts Color

Page 41: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

5-2

5. REPAIR PARTS LIST5. REPAIR PARTS LIST

DSC-T20/T25_L2

5-1-1. OVERALL SECTION

Ref. No. Part No. Description Ref. No. Part No. Description

1 X-2176-593-1 CABINET (FRONT) ASSY (SILVER) (T20)1 X-2177-179-1 CABINET (FRONT) ASSY (BLACK)1 X-2177-183-1 CABINET (FRONT) ASSY (WHITE) (T20)1 X-2177-187-1 CABINET (FRONT) ASSY (PINK) (T20)2 A-1234-374-A BLOCK, CABINET (UPPER)

* 3 3-094-165-01 PLATE (CCD), FIXED4 1-873-587-11 SW-495 SWITCH BLOCK, CONTROL

* 5 3-094-129-01 SHEET (CCD), ADHESIVE* 6 3-094-130-01 BUTTON (PLAYBACK) (SILVER, WHITE, PINK)

(T20)* 6 3-094-130-11 BUTTON (PLAYBACK) (BLACK)

7 X-2176-600-1 WINDOW ASSY, LCD8 X-2176-596-1 CABINET (REAR) ASSY (SILVER) (T20)

8 X-2177-181-1 CABINET (REAR) ASSY (BLACK) (T20)8 X-2177-185-1 CABINET (REAR) ASSY (WHITE) (T20)8 X-2177-189-1 CABINET (REAR) ASSY (PINK) (T20)

8 X-2177-191-1 CABINET (REAR) ASSY (BLACK) (T25)9 3-094-164-01 SCREW, TRIPOD10 A-1167-020-B LSV-1110A (SERVICE USE)11 A-1239-748-A CCD BLOCK ASSY (Note1, 2)

SP901 1-826-403-41 LOUDSPEAKER (1.0CM)

#18 2-635-591-21 SCREW (M1.4), NEW TRUSTAR P2 (Silver)#29 2-662-396-01 SCREW (M1.4), NEW, TRUSTAR, P2 (Black)#30 3-086-156-11 SCREW B1.2 (White)#72 4-663-621-41 SCREW (M1.4), HEAD PRECISION (Silver)

5-1. EXPLODED VIEWS

ns: not supplied

DISASSEMBLY HARDWARE LIST

Note 2: Be sure to read “Precuations for Replacement ofImager” on page 4-2 when changing the imager.

Note 1: CCD block assembly is including CD-695 flexible completed board,IC001 (CCD imager) and IC002.

46

7

10

#18 (SIL

SP901

#29 (BLACK)VER)

#18 (SIL#29 (BLACK)

VER)

#18 (SIL#29 (BLACK)

VER)

#18 (SIL#29 (BLACK)

VER)

#30 (WHITE)

#72 (SILVER)

#72 (SILVER)

8

9

11(Note1, 2)

5

SY-170 board section(See page 5-3.)

1

3

2ns

Page 42: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

5-3

5. REPAIR PARTS LIST5. REPAIR PARTS LIST

DSC-T20/T25_L2

5-1-2. SY-170 BOARD SECTION

Ref. No. Part No. Description Ref. No. Part No. Description

* 51 3-094-166-01 PLATE (MULTI), FIXED52 A-1251-311-A MC-177 FLEXIBLE BOARD, COMPLETE53 A-1271-290-A SY-170 BOARD, COMPLETE (SERVICE)

054 1-480-014-21 FLASH UNIT* 55 3-094-157-01 HOLDER (MAIN CONVERTER)

ns: not supplied

• Refer to page 5-1 for mark 0.

DISASSEMBLY HARDWARE LIST

51

52

53

54

55

57

SY-170

ST-161ST-163

Frame section(See page 5-4.)

ns

(Note 2)

(Note 1)

ns

C901

#72 (SILVER)

57 A-1251-310-A ST-163 FLEXIBLE BOARD, COMPLETE (Note1, 2)

0C901 1-114-387-11 CAP, ELECT 49MF

#72 4-663-621-41 SCREW (M1.4), HEAD PRECISION (Silver)

Note 1: ST-161 complete board is included in ST-163flexible complete board.

Note 2: ST-163 flexible complete board include inST-161 complete board.

Page 43: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

5-4

5. REPAIR PARTS LIST5. REPAIR PARTS LIST

DSC-T20/T25_L2

Ref. No. Part No. Description Ref. No. Part No. Description

101 A-1251-312-A BT-034 FLEXIBLE BOARD, COMPLETE102 X-2176-598-1 HOLDER ASSY, BATTERY (SILVER) (T20)102 X-2177-193-1 HOLDER ASSY, BATTERY (BLACK)102 X-2177-194-1 HOLDER ASSY, BATTERY (WHITE) (T20)102 X-2177-195-1 HOLDER ASSY, BATTERY (PINK) (T20)

5-1-3. FRAME SECTION

103 X-2176-599-1 FRAME ASSY, LCD104 1-480-022-11 BLOCK, LIGHT GUIDE PLATE (2.5)

LCD901 8-753-271-82 ACX554AK-10BH001 1-780-456-11 TERMINAL BOARD, BATTERY0BT001 1-756-710-11 LITHIUM RECHARGEABLE BATTERY

ns: not supplied

• Refer to page 5-1 for mark 0.

DISASSEMBLY

CAUTIONDanger of explosion if battery is incorrectly replaced.Replace only with the same or equivalent type.

ns

BT001

BH001

101

102

103

104

LCD901

! BT001 (BATTERY, LITHIUM SECONDARY)Board on the mount position (See page 4-21).

!

Page 44: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

5-5

Ref. No. Part No. Description Ref. No. Part No. Description5-2. ELECTRICAL PARTS LIST

DSC-T20/T25_L2

CAUTIONDanger of explosion if battery is incorrectly replaced.Replace only with the same or equivalent type.

BT-034 CD-695 MC-177 ST-161 ST-163

A-1251-312-A BT-034 FLEXIBLE BOARD, COMPLETE******************************

< BATTERY TERMINAL BOARD >

0BH001 1-780-456-11 TERMINAL BOARD, BATTERY

< LITHIUM RECHARGEABLE BATTERY >

0BT001 1-756-710-11 LITHIUM RECHARGEABLE BATTERY************************************************************

A-1239-748-A CCD BLOCK ASSY (Note)(Not supplied) CD-695 FLEXIBLE BOARD

********************(CD-695 flexible complete board, IC001 and IC002 are not supplied,but they

are included in CCD block assy.)

< CAPACITOR >

C001 1-164-943-11 CERAMIC CHIP 0.01uF 10% 16VC003 1-127-715-11 CERAMIC CHIP 0.22uF 10% 16VC005 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10VC006 1-100-505-11 CERAMIC CHIP 0.1 uF 10% 16VC007 1-164-943-11 CERAMIC CHIP 0.01uF 10% 16V

C008 1-164-943-11 CERAMIC CHIP 0.01uF 10% 16VC009 1-164-943-11 CERAMIC CHIP 0.01uF 10% 16V

< IC >

IC001 (Not supplied) ICX636EQZ-13IC002 (Not supplied) IC CXA3741UR-T9

< RESISTOR >

R006 1-218-990-11 SHORT CHIP 0R007 1-218-978-11 RES-CHIP 120K 5% 1/16WR008 1-218-981-11 RES, CHIP 220KR009 1-218-983-11 RES-CHIP 330K 5% 1/16WR010 1-218-978-11 RES-CHIP 120K 5% 1/16W

************************************************************

A-1251-311-A MC-177 FLEXIBLE BOARD, COMPLETE*******************************

(CN001 (multi connector) is not supplied, but this is included in MC-177flexible complete board.)

< CONNECTOR >

CN001 (Not supplied) CONNECTOR, MULTIPLE (SOCKET)(MULTI CONNECTOR)

************************************************************

ST-161 BOARD************

(ST-161 complete board is included in ST-163 flexible complete board.)

< CAPACITOR >

C001 1-100-611-91 CERAMIC CHIP 22 uF 20% 6.3VC002 1-165-908-11 CAP, CERAMIC 1000000PF B 1608C004 1-100-758-11 CERAMIC CHIP 0.047uF 10% 250VC007 1-164-933-11 CERAMIC CHIP 220PF 10% 50V

< DIODE >

*0D001 6-501-433-01 DIODE MA2YF8000LS0D002 6-500-619-01 DIODE RB520S-40TE61

< IC >

IC001 6-707-555-01 IC TPS65552RGTR

< COIL >

* L001 1-400-820-11 INDUCTOR 2.2uH

< TRANSISTOR >

*0Q001 6-551-702-01 TRANSISTOR RJP4003ASA-00-Q0

< RESISTOR >

R002 1-240-729-91 RES-CHIP 1M 5% 1/20WR003 1-218-941-81 RES-CHIP 100 5% 1/16WR004 1-216-121-00 RES-CHIP 1M 5% 1/10WR006 1-218-961-11 RES-CHIP 4.7k 5% 1/16W

< TRANSFORMER >

0T001 1-445-108-21 TRANSFORMER, D.C-D.C CONVERTER************************************************************

A-1251-310-A ST-163 FLEXIBLE BOARD, COMPLETE******************************

(ST-163 flexible complete board include ST-161 complete board.)

0 1-480-014-21 FLASH UNIT

< CAPACITOR >

0C901 1-114-387-11 CAP, ELECT 49MF

< DIODE >

* D002 6-501-364-01 DIODE DOR5352(AF illuminator/self-timer lamp)

************************************************************

Note: Be sure to read “Precautions for Replacement ofImager” on page 4-2 when changing the imager.

• Refer to page 5-1 for mark 0.

Electrical parts list of the SY-170 board isnot shown.Pages 5-6 to 5-9 are not shown.

Page 45: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

5-11EDSC-T20/T25_L2

• Refer to the page 5-1 for mark 0.

Checking supplied accessories.

Note 1: This item is supplied with the unit as an accessory, but isnot prepared as a service part.

USB,A/V cable for multi-use terminal1-829-866-71

Wrist strap2-050-981-01 (SILVER, WHITE, PINK)2-050-981-11 (BLACK)

Battery charger(BC-CSG/BC-CSGB/BC-CSGC)0 1-479-791-12 (J)0 1-479-791-22 (US, CND)0 1-479-791-32 (EXCEPT US, CND, AR, BR, J)0 1-480-175-31 (AR)

Rechargeable battery pack (NP-BG1)(Note 1)

Instruction Manual

Battery case(Note 1)

HD Output Adaptor Cable (DSC-T25 only)1-833-859-21

Power cord (mains lead) (except US, CND, BR and J)0 1-555-074-91 (AUS)0 1-782-476-71 (CH)0 1-827-826-41 (AEP, E)0 1-828-050-31 (JE)0 1-823-947-71 (KR)0 1-832-106-31 (AR)0 1-832-169-31 (UK, HK)

CD-ROM(Cyber-shot application software/"Cyber-shot Handbook"/"Cyber-shot Step-up Guide") 3-100-778-01 (EXCEPT US, J) 3-100-779-01 (US) 3-209-352-01 (J)

3-100-780-01 (JAPANESE) 3-100-780-11 (ENGLISH) 3-100-780-21 (FRENCH) 3-100-780-31 (ITALIAN) 3-100-780-41 (SPANISH) 3-100-780-51 (PORTUGUESE) 3-100-780-61 (GERMAN) 3-100-780-71 (DUTCH) 3-100-780-81 (TRADITIONAL CHINESE) 3-100-780-91 (SIMPLIFIED CHINESE) 3-100-781-11 (RUSSIAN) 3-100-781-21 (ARABIC) 3-100-781-31 (PERSIAN)

3-100-786-01 (JAPANESE) (J)3-100-786-11 (ENGLISH)

(CND, UK, HK, AUS, JE, AEP, E)3-100-786-21 (FRENCH, ITALIAN) (CND, AEP)3-100-786-31 (SPANISH, PORTUGUESE) (JE, AEP, E, AR)3-100-786-41 (GERMAN, DUTCH) (AEP)3-100-786-51 (TRADITIONAL CHINESE,

SIMPLIFIED CHINESE) (HK, CH, JE, E)3-100-786-61 (RUSSIAN) (AEP)3-100-786-71 (ARABIC, PERSIAN) (E)3-100-786-81 (KOREAN) (KR, JE)3-100-786-91 (POLISH, CZECH) (AEP)3-100-787-11 (HUNGARIAN, SLOVAK) (AEP)3-100-787-21 (SWEDISH, FINNISH) (AEP)3-100-787-31 (NORWEGIAN, DANISH) (AEP)3-100-787-41 (THAI, MALAY) (E)3-100-787-51 (TURKISH, GREEK) (AEP)3-100-787-61 (ENGLISH, SPANISH) (US)

3-100-781-41 (KOREAN) 3-100-781-51 (POLISH) 3-100-781-61 (CZECH) 3-100-781-71 (HUNGARIAN) 3-100-781-81 (SLOVAK) 3-100-781-91 (SWEDISH) 3-100-782-11 (FINNISH) 3-100-782-21 (NORWEGIAN) 3-100-782-31 (DANISH) 3-100-782-41 (THAI) 3-100-782-51 (MALAY) 3-100-782-61 (TURKISH) 3-100-782-71 (GREEK)

Cyber-shot Handbook(PDF)

The CD-ROM supplied contains all of language version ofthe Instruction Manual in pdf (Cyber-shot Handbook.pdf) for printing.

Note: The printed matter is not supplied. If required, please order it with the part number below.

Page 46: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

#1: M1.7 X 2.5 (Black)2-635-562-11

2.5

1.7

#10: M1.7 X 4.0 (Silver)2-599-475-31

1.6

1.7

#6: M1.4 X 1.7 (Silver)2-598-474-01

1.7

1.4

#7: M1.7 X 1.6 (Black)7-627-552-18

#3: M1.7 X 2.5 (Red)2-660-401-01

2.5

1.7

#2: M1.7 X 4.0 (Black)2-635-562-31

4.0

1.7

4.0

1.7

#5: M1.7 X 3.5 (Tapping)(Black)3-080-204-01

3.5

1.7

#4: M1.4 X 2.5 (Tapping)(Dark Silver)3-348-998-81

2.5

1.4

#12: M1.7 X 5.0 (Tapping)(Black)3-080-204-21

1.7

#9: M1.7 X 5.0 (Tapping)(Silver)3-078-890-21

5.0

1.7

#14: M1.7 X 2.5 (Silver)2-599-475-11

#13: M1.7 X 2.5 (Tapping)(Silver)3-085-397-01

2.5

1.7

#11: M1.7 X 4.0 (Tapping)(Silver)3-078-890-11

#8: M1.7 X 3.5 (Tapping)(Silver)3-078-890-01

3.5

1.7

4.0

1.7

5.0

2.5

#17: M1.7 X 1.5 (Silver)2-586-389-01

2.5

1.7

#15: M1.4 X 1.5 (Silver)3-062-214-01

1.5

1.4 1.4

#16: M1.4 X 2.5 (Silver)2-586-337-01

1.5

3.5

1.7 2.2

#18: M1.4 X 2.5 (Silver)2-635-591-21

2.5

1.4

#19: M1.2 X 4.0 (Tapping)(Red)3-086-156-21

4.0

1.2

#20: M1.4 X 3.0 (Silver)2-635-591-31

3.0

1.4

HARDWARE LIST (1/4)

Page 47: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

HARDWARE LIST (2/4)

#21: M1.4 X 3.0 (Black)2-662-396-21

3.0

1.4

#22: M1.7 X 5.0 (Tapping)(Silver)3-083-261-01

1.7

5.0

1.7

5.5

#23: M1.7 X 4.0 (Tapping)(Black)3-080-204-11

4.0

1.7

#24: B1.7 X 5.5 (Tapping)(Black)4-679-805-11

#25: M1.7 X 3.0 (Black)2-635-562-21

3.0

1.7

#26: M1.4 X 2.0 (Silver)2-635-591-11

2.0

1.4

#27: M1.4 X 2.0 (Black)2-662-396-11

2.0

1.4

#28: M1.4 X 4.0 (Tapping)(Dark Silver)3-348-998-61

1.4

4.0

#29: M1.4 X 2.5 (Black)2-662-396-01

#31: M3.0 X 4.0(Silver)2-102-434-01

2.5

1.4

#30: M1.2 X 4.0 (Tapping)(White)3-086-156-11

3.5

1.2

#32: M2.0 X 4.5 (Tapping)(Silver)2-102-498-01

#33: M3.0 X 6.0 (Silver)3-077-331-21

#35: M4.0 X 6.0 (Tapping)(Silver)3-975-291-02

#34: M3.0 X 8.0 (Black)3-077-331-41

#36: M3.0 X 6.0 (Silver)4-886-821-11

#37: M2.0 X 6.0 (Tapping)(Black)3-080-206-31

#38: M3.0 X 20.0 (Tapping)(Silver)7-685-651-79

#40: M2.0 X 4.0 (Tapping)(Silver)7-685-851-04

#39: M2.6 X 5.0 (Tapping)(Black)7-685-791-09

4.0

3.0

4.5

2.0

6.0

3.0

8.0

3.0 4.0

6.0 6.0

3.0

6.0

2.0

20.0

3.0

4.0

2.0

5.0

2.6

Page 48: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

HARDWARE LIST (3/4)

#41: M3.0 X 8.0 (Tapping)(Silver)3-065-748-01

8.0

3.0

#42: M2.0 X 4.0 (Tapping)(Silver)7-628-253-00

2.0

4.0

#43: M1.7 X 4.0 (Red)2-660-401-31

4.0

1.7

#46: M1.7 X 3.0 (Red)2-660-401-11

#45: M1.4 X 2.5 (Silver)2-587-151-01

#47: M1.4 X 3.0 (Tapping)(Silver)2-665-774-01

3.0

1.4

#44: M1.7 X 3.0 (Tapping)(Silver)3-078-890-61

3.0

1.7

3.0

1.7

2.5

1.4

#48: M1.7 X 2.5(Silver)3-973-497-91

2.5

1.7

#49: M2.0 X 4.0(Black)2-630-005-31

#50: M2.0 X 3.0(Red)2-891-494-11

#51: M2.0 X 2.5 (Silver)3-073-686-01

#54: M1.75 X 6.0 (Tapping)(Black)3-318-203-11

#53: M2.0 X 5.0 (Tapping)(Black)3-080-206-21

#55: M2.0 X 4.0(Silver)2-655-582-11

#52: M2.0 X 4.0 (Tapping)(Black)3-080-206-11

#56: M2.0 X 3.5(Silver)3-067-187-11

4.0

2.0

3.0

2.0

2.5

2.0

5.0

2.0

4.0

2.0

6.0

1.75

4.0

2.0

3.5

2.0

#57: M1.7 X 4.0(Black)7-627-852-18

4.0

1.7

#58: M2.0 X 6.0 (Tapping)(Silver)3-719-408-11

6.0

2.0

#59: M2.0 X 5.0 (Tapping)(Silver)3-080-205-21

#60: M2.6 X 5.0(Black)3-061-062-11

5.0

2.0

5.0

2.6

Page 49: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

HARDWARE LIST (4/4)

#61: M3.0 X 10.0(Black)7-682-549-09

10.0

3.0

#62: M2.0 X 3.0(Silver)3-080-202-21

3.0

2.0

#63: M5.0 X 12.5(Black)3-060-811-21

12.5

5.0

#64: M1.7 X 5.0 (Tapping)(Silver)2-666-551-21

5.0

1.7

#65: M1.4 X 3.5 (Silver)2-635-591-01

3.5

1.4

#66: M1.4 X 1.4 (Silver)2-635-591-41

1.4

1.4

#71: M1.4 X 2.0 (Red)3-208-537-01

2.0

1.4

#67: M1.4 X 2.0 (Silver)3-389-523-16

2.0

1.4

#68: M1.7 X 4.0 (Silver)2-655-581-01

4.0

1.7

#72: M1.7 X 2.0 (Silver)4-663-621-41

2.0

1.7

#69: M1.7 X 3.0 (Silver)2-599-475-21

3.0

1.7

#70: M1.7 X 5.0 (Silver)2-599-475-41

5.0

1.7

Page 50: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

[Description of main button functions on toolbar of the Adobe Acrobat Reader Ver5.0 (for Windows)]

Printing a text1. Click the Print button .2. Specify a printer, print range, number of copies, and other op-

tions, and then click [OK].

Application of printing:To set a range to be printed within a page, select the graphic

selection tool and drag on the page to enclose a range tobe printed, and then click the Print button.

Finding a text1. Click the Find button .2. Enter a character string to be found into a text box, and click

the [Find]. (Specify the find options as necessary)

Application to the Service Manual:To execute “find” from current page toward the previous pages,select the check box “Find Backward” and then click the“Find”.

3. Open the find dialog box again, and click the [Find Again] andyou can find the matched character strings displayed next.(Character strings entered previously are displayed as they arein the text box.)

Application to the Service Manual:The parts on the drawing pages (block diagrams, circuit dia-grams, printed circuit boards) and parts list pages in a textcan be found using this find function. For example, find aRef. No. of IC on the block diagram, and click the [Find Again]continuously, so that you can move to the Ref. No. of IC onthe circuit diagram or printed circuit board diagram succes-sively.Note: The find function may not be applied to the Service

Manual depending on the date of issue.

Switching a page• To move to the first page, click the .

• To move to the last page, click the .

• To move to the previous page, click the .

• To move to the next page, click the .

Reversing the screens displayed once• To reverse the previous screens (operation) one by one, click

the .

• To advance the reversed screens (operation) one by one, click

the .

Application to the Service Manual:This function allows you to go and back between circuit dia-gram and printed circuit board diagram, and accordingly itwill be convenient for the voltage check.

Moving with link

1. Select either palm tool , zoom tool , text selection tool

, or graphic selection tool .2. Place the pointer in the position in a text where the link exists

(such as a button on cover and the table of contents page, orblue characters on the removal flowchart page or drawingpage), and the pointer will change to the forefinger form .

3. Then, click the link. (You will go to the link destination.)

Moving with bookmark:Click an item (text) on the bookmark pallet, and you can moveto the link destination. Also, clicking can display thehidden items.(To go back to original state, click )

Zooming or rotating the screen display“Zoom in/out”• Click the triangle button in the zoom control box to select the

display magnification. Or, you may click or for zoom-

ing in or out.

“Rotate”• Click rotate tool , and the page then rotates 90 degrees each.

Application to the Service Manual:The printed circuit board diagram you see now can be changedto the same direction as the set.

Toolbar

Page 51: 0 01-04 DSCT20 311. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard

Revision History

Reverse

DSC-T20/T25_L2

Ver.

1.0

Date

2007.03

History

Official Release

Contents

S.M. Rev.issued

985219531.pdf