04 Omron A5 Cover & Spine . Eu - Industrijska automatizacija · D2D 650 - 657 D3D 658 - 661 DIP SWITCHES 662 ... which prevents faulty ignition from ... Storage The temperature range

ComponentsCatalogue

2

Contents

Continued on next page

AUTOMOTIVE RELAYS 274 - 313

Selection Guide 274 - 277

G8N-1 278 - 282

G8ND-2 283 - 287

G8NW 288 - 292

G8QN 293 - 294

G8SN 295 - 296

G8SE 297 - 298

G8HN-J 299 - 304

G8HL 305 - 309

G8JN 310 - 311

G8JR 312 - 313

SOLID STATE RELAYS 314 - 347

Technical Information 314 - 318


G3R/G3RD 324 - 327

G3M 328 - 331

G3MB 332 - 334

G3MC 335 - 339

G3S/G3SD 340 - 343

G3DZ 344 - 347

MOSFET RELAYS 348 - 433



G3VM-61A1/D 358 - 359

G3VM-2(F)L 360 - 361

G3VM-351A/D 362 - 363

G3VM-353A/D 364 - 365

G3VM-401A/D 366 - 367

G3VM-61G1 368 - 369

G3VM-81G1 370 - 371

G3VM-201G 372 - 373

G3VM-351G 374 - 375

G3VM-353G 376 - 377

G3VM-401G 378 - 379

G3VM-61B1/E1 380 - 381

G3VM-XN(F) 382 - 384

G3VM-351B/E 385 - 386

Welcome 7 - 8

POWER RELAYS 9 - 156

Technical Information – Power & Signal Relays 9 - 28


G5B 41 - 44

G5NB-E 45 - 48

G5SB 49 - 52

G6M 53 - 56

G6D 57 - 60

G6B 61 - 67

G2RG 68 - 71

G5Q-EU 72 - 75

G6RN 76 - 79

G5LE 80 - 84

G5LC-EU 85 - 88

G5C(E) 89 - 92

G6C 93 -101

G2R 102 - 122

G2RL 123 - 127

G4W 128 - 132

G8P 133 - 138

G4A 139 - 142

G9EA-1 143 - 149

G9EC-1 150 - 156

SIGNAL RELAYS 157 -273


G5V-1 166 - 168

G2E 169 - 172

G6E 173 - 177

G6L 178 - 186

G6H 187 - 192

G6J 193 - 202

G6K 203 - 212

G6S 213 - 221

G5A 222 - 225

G5V-2 226 - 230

G6A 231 - 239

G6Y 240 - 245

G6K(U)-RF 246 - 249

G6Z 250 - 265

G6W 266 - 273

1

Contents

4

Contents

SS-P 576 - 581

SSG 582 - 589

D2F 590 - 595

D2MQ 596 - 600

D3C 601 - 604

D2X 605 - 608

D3K 609 - 612

D3M 613 - 618

D2SW 619 - 624

D2VW 625 - 630

D2JW 631 - 635

D2HW 636 - 644

D2MC 645 - 649

D2D 650 - 657

D3D 658 - 661

DIP SWITCHES 662 - 690



A6H 669 - 670

A6T/A6S 671 - 673

A6D/A6DR 674 - 676

A6E/A6ER 677 - 679

A6A 680 - 683

A6C/A6CV 684 - 686

A6R/A6RV 687 - 690

TACTILE SWITCHES 691 - 731

Techinical Information 691 - 693


B3F 699 - 707

B3W 708 - 711

B3FS 712 - 714

B3SN 715 - 716

B3S 717 - 718

B3WN 719 - 720

B3J 721 - 723

B3DA 724 - 725

B3D 726 - 729

B32 730 - 731

P

Continued on next page

3

Contents

G3VM-3(F)L 387 - 388

G3VM-353B/E 389 - 390

G3VM-401B/E 391 - 392

G3VM-4N(F) 393 - 395

G3VM-401BY/EY 396 - 397

G3VM-601BY/EY 398 - 399

G3VM-61H1 400 - 401

G3VM-201H1 402 - 403

G3VM-351H 404 - 405

G3VM-353H 406 - 407

G3VM-401H 408 - 409

G3VM-62C1/F1 410 - 411

G3VM-352C/F 412 - 413

G3VM-W(F)L 414 - 415

G3VM-354C/F 416 - 417

G3VM-355C/F 418 - 419

G3VM-402C/F 420 - 421

G3VM-62J1 422 - 423

G3VM-202J1 424 - 425

G3VM-352J 426 - 427

G3VM-354J 428 - 429

G3VM-355J 430 - 431

G3VM-402J 432 - 433

GENERAL PURPOSE RELAYS 434 - 508



MY 443 - 455

LY 456 - 468

G2RS 469 - 478

G7L 479 - 493

G7J 494 - 502

G7SA 503 - 508

MICROSWITCHES 509 - 659



D3V 531 - 544

V 545 - 560

VX 561 - 567

SS 568 - 575

x

Contents

EE-SA104 862 - 864

EE-SA107-P2 865 - 867

EE-SA407-P2 868 - 870

EE-SY124 871 - 873

EE-SY125 874 - 876

EE-SY193 877 - 881

EE-SY171 882 - 884

EE-SY169B 885 - 887

EE-SY113 888 - 890

EE-SY313/413 891 - 894

EE-SF5-B 895 - 897

EE-SY110 898 - 900

EE-SY310/410 901 - 904

Z4D-B01 905 - 908

EY3A-312 909 - 911

EY3A-112 912 - 914

LEDs 915 - 921

2MDR 915 - 921

SPECIAL SENSORS 922 - 935

D6B 922 - 923

D6A-N 924 - 926

D8M-A1 927 - 928

D8M-D82 929 - 930

D6F 931 - 933

D7E 934 - 935

CONNECTORS 936 - 968

XF2E 936 - 937

XF2H 938 - 939

XF2J 940 - 941

XF2L 942 - 943

XG4M-U 944 - 946

XG4 947 - 954

XM4 955 - 957

XH2 958 - 964

XM7 965 - 968

PART NUMBER INDEX 969 - 971

x

Contents

PHOTOMICROSENSORS 732 - 914



EE-SX1107 739 - 743

EE-SX1018 744 - 746

EE-SX1108 747 - 751

EE-SX1131 752 - 756

EE-SX1139 757 - 759

EE-SX4139 760 - 762

EE-SX493 763 - 765

EE-SX1055 766 - 768

EE-SX1046 769 - 771

EE-SX1082 772 - 774

EE-SX1106 775 - 777

EE-SX1109 778 - 782

EE-SX199 783 - 785

EE-SX398/498 786 - 788

EE-SV3 789 - 791

EE-SX1071 792 - 794

EE-SX1088 795 - 797

EE-SH3 798 - 800

EE-SJ3 801 - 803

EE-SX3088/4088 804 - 806

EE-SG3 807 - 809

EE-SX1128 810 - 812

EE-SX1041 813 - 815

EE-SX1042 816 - 818

EE-SX1081 819 - 821

EE-SX1235A-P2 822 - 824

EE-SX4009-P1 825 - 827

EE-SX4019-P2 828 - 830

EE-SX3081/4081 831 - 833

EE-SX4009-P10 834 - 836

EE-SX4235A-P2 837 - 839

EE-SX1070 840 - 842

EE-SX3070/4070 843 - 845

EE-SPX415-P2 846 - 848

EE-SX461-P11 849 - 852

EE-SX414-P1 853 - 855

EE-SA102 856 - 858

EE-SA103 859 - 861

8

HeadingHeading

Omron Components is a world-class business

delivering a wide range of high quality, high

performance components utilising latest technologies

and backed by full technical, applications and

logistical support.

We offer the widest range of relays for power, signal

and automotive applications as well as solid-state

and MOSFET relays. Our G3VM MOSFETS combine

the advantages of mechanical and solid-state technologies allowing design

flexibility with either AC or DC load able to be connected in either direction.

We are also developing our range of microsensors, and currently offer

photomicrosensors and a new range of D8M-D8 micro pressure-sensors which

meet stringent safety standards such as working reliably with low pressure,

metal casing and flange fitting. Our broad range of switches includes micro, DIP,

and tactile options, and you will find a wide selection of connectors to meet

industry-standard data interconnect, power

transmission and signalling. Omron Double

Reflection LEDs feature built-in optical light

guide technology that more than doubles

effective light output compared with

conventional bullet-type LEDs.

Environmental research and experience enabled us to

formulate a policy to remove recognised hazardous

substances from our products well within the timescales of

European Directives. We have identified suitable alternative

materials and agreed the changes we need to make to our

production processes in order to maintain quality levels.

All of our manufacturing sites have achieved ISO14001

certification for the management of environmental protection

in our organisation.

Using our website alongside this catalogue,

you can be kept fully up-to-date with our

range of products, technical capabilities and

environmental policy.

www.eu.omron.com/ocb

Welcome to the Omron Components Catalogue

Omron Electronic Components Europe B.V. reserves the right tomake any changes to the specifications, technical informationand data of the components described in this catalogue at its solediscretion without prior notice

Although we do strive for perfection, Omron ElectronicComponents Europe B.V. does not warrant or make anyrepresentations regarding the correctness or accuracy of thespecifications, technical information and data of the componentsas described in this catalogue.

7

Glossary

314

Technical Information – Solid-State Relays

Terms Meaning

Circuit functions Photocoupler Transfers the input signal and insulates inputs and outputs as well.Photoctriac coupler

Zero cross circuit A circuit which starts operation with the AC load voltage at close to zero-phase.

Trigger circuit A circuit for controlling the triac trigger signal, which turns the load current ON and OFF.

Snubber circuit A circuit consisting of a resistor R and capacitor C, which prevents faulty ignition fromoccurring in the SSR triac by suppressing a sudden rise in the voltage applied to the triac.

Input Input impedance The impedance of the input circuit and the resistance of current-limiting resistors used.Impedance varies with the input signal voltage in case of the constant current input method.

Operating voltage Minimum input voltage when the output status changes from OFF to ON.

Reset voltage Maximum input voltage when the output status changes from ON to OFF.

Operating voltage The permissible voltage range within which the voltage of an input signal voltage mayfluctuate.

Rated voltage The voltage that serves as the standard value of an input signal voltage.

Input current The current value when the rated voltage is applied.

Output Leakage current The effective value of the current that can flow into the output terminals when a specifiedload voltage is applied to the SSR with the output turned OFF.

Load voltage The effective supply voltage at which the SSR can be continuously energized with the output terminals connected to a load and power supply in series.

Maximum load The effective value of the maximum current that can continuously flow into the outputcurrent terminals under specified cooling conditions (i.e., the size, materials, thickness of the

heat sink, and an ambient temperature radiating condition).

Minimum load The minimum load current at which the SSR can operate normally.current

Output ON The effective value of the AC voltage that appears across the output terminals when thevoltage drop maximum load current flows through the SSR under specified cooling conditions (such

as the size, material, and thickness of heat sink, ambient temperature radiation conditions, etc.)

Characteristics Dielectric strength The effective AC voltage that the SSR can withstand when it is applied betweenthe input terminals and output terminals or I/O terminals and metal housing (heat sink)for more than 1 minute.

Insulation The resistance between the input and output terminals or I/O terminals and metalresistance housing (heat sink) when DC voltage is imposed.

Operating time A time lag between the moment a specified signal voltage is imposed to the input terminals and the output is turned ON

Release time A time lag between the moment the imposed signal input is turned OFF and the output is turned OFF.

Ambient The ranges of temperature and humidity in which the SSR can operate normally undertemperature and specified cooling, input/output voltage, and current conditions.humidity (operating)

Storage The temperature range in which the SSR can be stored without voltage imposition.temperature

Others Inrush current A current which can be applied for short periods of time to the electrical element.resistance

Counter- Extremely steep voltage rise which occurs when the load is turned ON or OFF.electromotive force

Recommended The recommended load capacity which takes into account the safety factors of ambientapplicable load temperature and inrush current.

Bleeder resistance The resistance connected in parallel to the load in order to increase apparently smallload currents, so that the ON/OFF of minute currents functions normally.

87

86 85

30

14.5

11.0

25.0

28.0

17.9

10.35

8.35

16.887

86

85

30

COIL TERMINALS6.3 X 0.8

LOAD TERMINALS9.5 X 1.2

28.0

87

86

85

30

87

86

85

30

35.0

OPTIONAL COVER WITHMOLDED BRACKET

18.0

Made in Canada

CIRCUIT DIAGRAM

313

Automotive High Current Relay – G8JR

Application Examples• Engine cooling fan(s)• Starter motor• Glow plug

Dimensions(All dimensions in mm.)

ALL DIMENSIONS SHOWN ARE IN MILLIMETERS.To convert millimeters into inches, multiply by 0.03937. To convert grams into ounces, multiply by 0.03527.

316


INPUT CONDITIONS

1. Input Voltage RipplesWhen there is a ripple in the input voltage, set so that the peakvoltage is lower than the maximum operating voltage and the rootvoltage is above the minimum operating voltage.

OPERATION AND STORAGE ENVIRONMENT PRECAUTIONS

Operation and Storage LocationsDo not operate or store the Relay in locations subject to directsunlight or ultraviolet rays. Otherwise the resin to deteriorate,thereby causing cracks and other damage to the case. Do notoperate or store the Relay in locations subject to exposure towater or chemicals. Otherwise rust, corrosion, and deteriorationof the resin will occur.Extended Storage of the SSRIf the SSR is stored for an extended period of time, the terminalwill be exposed to the air, reducing its solderability due to sucheffects as oxidation. Therefore, when installing a Relay onto aboard after a long time in storage, check the state of the solderbefore use. Also, take preventive measures so that the terminalswill not be exposed to water, oil, or solvents while they are stored. Vibration and ShockDo not subject the SSR to excessive vibration or shock.Otherwise the SSR will malfunction and may cause damage to theinternal components. To prevent the SSR from abnormalvibration, do not install the Unit in locations or by means that willsubject it to the vibrations from other devices, such as motors.SolventsDo not allow the SSR to come in contact with solvents such asthinners or gasoline. Doing so will dissolve the markings on theSSR.OilDo not allow the SSR terminal cover to come in contact with oil.Doing so will cause the cover to crack and become cloudy.PCB SSR Soldering1. SSRs must be soldered at 260°C within five seconds. For

models, however, that conform to separate conditions, performsoldering according to the specified requirements.

2. Use a rosin-based non-corrosive flux that is compatible withthe material of the SSR.

Ultrasonic CleaningDo not perform ultrasonic cleaning. Performing ultrasoniccleaning after the SSR base has been installed will causeultrasonic waves to resonate throughout the SSR internalstructure, thereby damaging the internal components.

FAIL-SAFE CONCEPT

Overcurrent ProtectionA short-circuit current or an overcurrent flowing through the loadof the SSR will damage the output element of the SSR. Connecta quick-break fuse in series with the load as an overcurrentprotection measure.Design a circuit so that the protection coordination conditions forthe quick-break fuse satisfy the relationship between the SSRsurge resistance (IS), quick-break fuse current-limiting feature (IF),and the load inrush current (IL), shown in the following chart.

SSR Life ExpectancyThe SSR is not subject to mechanical wear. Therefore, the lifeexpectancy of the SSR depends on the rate of internalcomponent malfunction. See Omron for further details.The effects of heat on the solder also need to be considered inestimating the total life expectancy of the SSR. The solderdeteriorates due to heat-stress from a number of causes. OMRONestimates that the SSR begins to malfunction due to solderdeterioration approximately 10 years after it is first installed.

Time (unit: s)

IF

IL

IS

IS>IF >IL

Pea

k cu

rren

t (A

)

315


LIFE EXPECTANCY (MTTF)

The mean time to failure (MTTF) of SSRs is 100,000 hours, whichvaries with the operating conditions. To ensure long life and stableoperation, take proper countermeasures against extremely high orlow operating temperature, heavy fluctuations of ambienttemperature, and/or long-time, continuous energization.

WARNING

Do not touch the SSR terminal section (charged section)when the power supply is ON. Touching the charged section maycause electric shock.Do not touch the SSR LOAD terminal immediately after the poweris turned OFF.• Do not apply excessive voltage or current to the SSR input or

output circuits. Otherwise SSR malfunction or fire damage mayresult.

• Do not obstruct the air flow to the SSR. Otherwise, heatgenerated from an SSR error may cause the output element toshort, or cause fire damage.

• Be sure to conduct wiring with the power supply turned OFF.Otherwise electric shock may result.

• Follow the Correct Use section when conducting wiring andsoldering. If the product is used before wiring or soldering arecomplete, heat generated from a power supply error may causefire damage.

Correct UseBefore Using the SSR1. Unexpected events may occur before the SSR is used. For this

reason it is important to test the SSR in all possibleenvironments. For example, the features of the SSR will varyaccording to the product being used.

2. All rated performance values listed in this catalog, unlessotherwise stated, are all under the JIS C5442 standard testenvironment (15° to 30°C, 25% to 85% relative humidity, and86 to 106 kPa atmosphere). When checking these values on theactual devices, it is important to ensure that not only the loadconditions, but also the operating environmental conditions areadhered to.

INPUT CIRCUIT

Input NoiseSSRs need only a small amount of power to operate. This is whythe input terminals must shut out electrical noise as much aspossible. Noise applied to the input terminals may result inmalfunction. The following describe measures to be taken againstpulse noise and inductive noise.1. Pulse NoiseA combination of capacitor and resistor can absorb pulse noiseeffectively. The following is an example of a noise absorptioncircuit with capacitor C and resistor R connected to an SSRincorporating a photocoupler.

The value of R and C must be decided carefully. The value of Rmust not be too large or the supply voltage (E) will not be able tosatisfy the required input voltage value. The larger the value of Cis, the longer the release time will be, due to the time required forC to discharge electricity.

Note: For low-voltage models, sufficient voltage may not beapplied to the SSR because of the relationship between C,R, and the internal impedance. When deciding on a valuefor R, check the input impedance for the SSR.

2. Inductive NoiseDo not wire power lines alongside the input lines. Inductive noisemay cause the SSR to malfunction. If inductive noise is imposedon the input terminals of the SSR, use the following cablesaccording to the type of inductive noise, and reduce the noiselevel to less than the reset voltage of the SSR.Twisted-pair wire: For electromagnetic noiseShielded cable: For static noiseA filter consisting of a combination of capacitor and resistor willeffectively reduce noise generated from high-frequencyequipment.

Note: R: 20 to 100 ΩC: 0.01 to 1 µF

Precautions

Pul

se w

idth

(µs)

Pulse Voltage (v)

318


Mounting SSR to PCBRead the precautions for each model and fully familiarize yourselfwith the following when mounting the SSR to the PCB.

1. Do not bend the terminals to make theSSR self-standing, otherwise the fullperformance of the SSR may not bepossible.

2. Process the PCB properly in accordancewith the mounting dimensions.

1. The flux applied must be non-corrosive rosinflux, which is suitable to the materialof theSSR. Apply alcohol solvent to dissolve theflux.

2. Make sure that all parts of the SSR otherthan the terminals are free of the flux. Theinsulation resistance of the SSR may bedegraded if the flux is on the bottom of theSSR.

1. Be sure to preheat the SSR to allow bettersoldering.

2. Preheat the SSR under the followingconditions.

3. Do not use the SSR if it is left at hightemperature over a long time. This maychange the characteristics of the SSR.

Automatic Soldering1. Reflow soldering is recommended for

maintaining a uniform soldering quality.• Solder: JIS Z3282 or H63A• Soldering lead temperature:

Approx. 210°C max 10 secs• Soldering time: Approx. 5 s max. (Approx.

2 s for first time and approx. 3 s for secondtime for DWS)

• Perform solder level adjustments so thatthe solder will not overflow on the PCB.

Manual Soldering – see recommendedTemperature Profile1. After smoothing the tip of the soldering iron,

solder the SSR under the followingconditions.• Solder: JIS Z3282, 1160A, or H63A with

rosin-flux-cored solder• Soldering iron: 30 to 60 W• Soldering temperature: 260°C max.• Soldering time: Approx. 5 s max.

1. After soldering the SSR, be sure to cooldown the SSR so that the soldering heat willnot deteriorate the SSR or any othercomponent.

2. Do not dip the SSR into cold liquid, such asa detergent, immediately after soldering theSSR.

1. Refer to the following table for the selectionof the cleaning method and detergent.

Detergent

Boiling cleaning or dip cleaning is availableto the SSR. Do not cut the terminals,otherwise the internal parts of the SSR maybe damaged. Make sure that thetemperature of the detergent is within thepermissible ambient operating temperatureof the SSR.

2. Availability of Detergents

Note: 1. Contact your OMRON representativesbefore using any other detergent. Donot apply Freon TMC, paint thinner, orgasoline to any SSR.2. The space between the SSR andPCB may be not be adequatelycleaned with a hydrocarbon or alcoholdetergent.

Actions are being taken worldwide to stopthe use of CFC-113 (chlorofluorocarbon) and1.1.1 trichloroethane. Your understandingand cooperation are highly appreciated.

1. Do not fix the whole SSR with resin,otherwise the characteristics of the SSRmay change.

2. The temperature of the coating materialmust be within the permissible ambientoperating temperature range.

Detergent Availability

Chlorine Perochine OKdetergent Chlorosolder

Trichloroethylene

Aqueous Indusco OKdetergent Holys

Pure water(pure hot water)

Alcohol IPA OKEthanol

Others Paint thinner NGGasoline

Detergent Availability

Epoxy OK

Urethane OK

Silicone OK

Temperature 150° C max.

Time 60-90 secs.

317


HANDLING THE SSR

Do Not DropThe SSR is a high-precision component. Do not drop the SSR or subject it to excessive vibration or shock regardless of whether the SSRis mounted or not.The maximum vibration and shock that an SSR can withstand varies with the model. Refer to the relevant datasheet.The SSR cannot maintain its full performance capability if the SSR is dropped or subjected to excessive vibration or shock resulting inpossible damage to its internal components.The impact of shock given to the SSR that is dropped varies upon the case, and depends on the floor material, the angle of collision withthe floor, and the dropping height. For example, if a single SSR is dropped on a plastic tile from a height of 10 cm, the SSR may receivea shock of 1,000 m/s2 or more.Handle the SSR models in in-line packages with the same care and keep them free from excessive vibration or shock.

PCB-MOUNTING SSR

Suitable PCB1. PCB Material

PCBs are classified into epoxy PCBs and phenol PCBs. The following table lists the characteristics of these PCBs. Select onetaking into account the application and cost. Epoxy PCBs are recommended for SSR mounting in order to prevent the solder fromcracking.

2. PCB ThicknessThe PCB may warp due to the size, mounting method, or ambientoperating temperature of the PCB or the weight of parts mountedto the PCB. Should warping occur, the internal mechanism of theSSR on the PCB will be deformed and the SSR may not provideits full capability. Determine the thickness of the PCB by takingthe material of the PCB into consideration.3. Terminal Hole and Land DiametersRefer to the following table to select the terminal hole and landdiameters based on the SSR mounting dimensions. The landdiameter may be smaller if the land is processed with through-hole plating.

MOUNTING SPACE

The ambient temperature around the sections where the SSR ismounted must be within the permissible ambient operatingtemperature. If two or more SSRs are mounted closely together,the SSRs may radiate excessive heat. Therefore, make sure thatthe SSRs are separated from one another at the specifieddistance provided in the datasheet. If there is no such provision,maintain a space that is as wide as a single SSR. Provide adequate ventilation to the SSRs as shown in thefollowing

Hole Dia. (mm) Minimum land dia. (mm)

Nominal Tolerancevalue

0.6 ±0.1 1.5

0.8 1.8

1.0 2.0

1.2 2.5

1.3 2.5

1.5 3.0

1.6 3.0

2.0 3.0

Item Epoxy Phenol

Glass epoxy Paper epoxy Paper phenol

Electricalcharacteristics

Mechanicalcharacteristics

Economical Expensive Rather expensive Inexpensiveefficiency

Application

High insulation resistance.Highly resistive to moistureabsorption.

The dimensions are not easilyaffected by temperature or humidity.Ideal for through-hole or multi-layerPCBs.

Applications that require highreliability.

Applications that may require lessreliability than those for glass epoxyPCBs but require more reliabilitythan those of paper phenol PCBs.

Applications in comparativelygood environments withlong-density wiring.

Inferior to glass epoxy butsuperior to paper phenol PCBs.

The dimensions are easily affectedby temperature or humidity.Not suitable for through-holePCBs.

Inferior to glass epoxy butsuperior to paper phenol PCBs.

New PCBs are highly insulation-resistive but easily affected bymoisture absorption and cannotmaintain good insulationperformance over a long time.

320

Selection Guide – Solid-State RelaysClassification Socket Mounting Type

Model G3R I/O

G3R- G3R- G3R- G3R- G3R- G3R- G3R-IAZR1SN IDZR1SN IDZR1SN-1 OA202SZN OA202SLN ODX02SN OD201SN

Appearance & Dimensions I/O SSR Input Module I/O SSR Output Module(W x H x D) (mm)

29 x 13 max.

Features • Compatible with OMRON’s G2R• For mounting G70A-AOC16 Relay Terminal Socket.• For mounting G730-R or G730-Z Remote I/O Terminal.

Output Insulation Photocoupler Phototriac Photocoupler

Load voltage 4 to 32 VDC 75 to 264 VAC 4 to 40 to60 VDC 200 VDC

Maximum switching 100 mA 2 A 2 A 1 Acurrent

Leakage current 5 µA max. at 32 VDC 1.5 mA max. at 200 VAC 1 mA max. 1 mA max.at 50 VDC at 200 VAC

VDRM, VCEO (V) 80 V (reference value) 600 V (reference value) 80 V 400 V(reference (referencevalue) value)

di/dt (A/µs) – 30 –

dv/dt (V/µs) – 300 –

I2t (A2s) – 10.4 –

Tj (°C) max. 150 125 150

Rated input voltage 100 to 5, 12, 24 VDC 5 to 24 VDC240 VAC

Dielectric strength (between input 4,000 VAC, 50/60 Hz for 1 minand output terminals)

Ambient temperature (operating) -30° to 80°C (with no icing or condensation)

Function Zero cross No Yes No

Operation indicator Yes Yes Yes

Built-in varistor No

Plug-in Yes Yes Yes

Screw No

Tab No

PCB No

Mounting method Socket mounting

Magnet relay with compatible G2R-1-Sterminals

Approved standards UL, CSA, TÜV (with -UTU version)

Socket P2RF-05, P2RF-05-E, P2R-05P, P2RF-05, P2R-05P, P2R-05A, P2R-057P, P2RF-05-EP2R-05A, P2R-057P

Weight Approx. Approx.18 g

Page 324

Note: 1. VCEO: Collector-emitter voltage2. The above values are engineering data (reference values) for each output semiconductor incorporated by the respective

SSRs.

Terminaltype

319

Selection Guide – Solid-State RelaysClassification PCB Mounting Type

Model G3R/G3RD

G3R-102PN G3R-102PLN G3R-202PN G3R-202PLN G3RD-101PN G3RDX02PN

Appearance & Dimensions(W x H x D) (mm)

29 x 13 max.

Features • Compatible with OMRON’s G2R

Output Insulation Phototriac Photocoupler

Load voltage 75 to 132 VAC 75 to 264 VAC 3 to 125 VDC 3 to 52.8 VDC

Maximum switching 2 A 1.5 A 2 Acurrent

Leakage current 2 mA max. at 100 VAC 2 mA max. at 100 VAC 0.1 mA max. 0.1 mA max.5 mA max. at 200 VAC at 125 VDC at 50 VDC

VDRM, VCEO (V) 400 600 180 80

di/dt (A/µs) 30 –

dv/dt (V/µs) 300 –

I2t (A2s) 10.4 –

Tj (°C) max. 125 150

Rated input voltage 5, 12, 24 VDC



Function Zero cross Yes No Yes No

Operation indicator Yes


Plug-in No

Screw No

Tab No

PCB Yes

Mounting method PCB mounting

Magnet relay with compatible G2Rterminals

Approved standards UL, CSA

Socket –

Weight Approx. Approx.18 g

Page 324


SSRs.

Terminaltype

322


Model G3MC

G3MC-101P G3MC-101PL G3MC-201P G3MC-201PL G3MC-202P G3MC-202PL


24.5 x 4.5 max. 24.5 x 4.5 max.

Features • Miniature, low-cost SSR

Output Insulation Phototriac

Load voltage 75 to 132 VAC 75 to 264 VAC 75 to 264 VAC

Maximum switching 1 A 2 Acurrent

Leakage current 1 mA max. at 100 VAC 1.5 mA max. at 200 VAC 1.5 mA max. at 200 VAC

VDRM, VCEO (V) 400 600 600

di/dt (A/µs) 50 40

dv/dt (V/µs) 300 100

I2t (A2s) 4 4

Tj (°C) max. 125




Function Zero cross Yes No Yes No Yes No

Operation indicator No


Plug-in No

Screw No

Tab No

PCB Yes

Mounting method PCB mounting

Magnet relay with compatible –terminals

Approved standards UL, CSA, TÜV

Socket –

Weight Approx. Approx. 2.5 g Approx. 5 g

Page 335


SSRs.

Terminaltype

321

Selection Guide – Solid-State RelaysClassification PCB Mounting Type PCB Mounting Type

Model G3M G3MB

G3M- G3M- G3M- G3M- G3M- G3M- G3M- G3MB- G3MB- G3MB-102PL 202PL 202P 203P 203PL 205P 205PL 102PL 202PL 202P


40 x 9 max. 40 x 7.6 24.5 x 5.5 max.

Features • Miniature, low-cost SSR • Miniature, low-cost SSR

Output Insulation Phototriac Phototriac

Load voltage 75 to 75 to 264 VAC 75 to 75 to 264 VAC132 132VAC VAC

Maximum switching 2 A 3 A 5 A 2 A (at 25°C)current

Leakage current 2 mA 2 mA max. at 1.5 mA at 200 VAC 1 mA 1.5 mA max. atmax. at 100 VAC max. at 200 VAC100 5 mAmax. at 100VAC 200 VAC VAC

VDRM, VCEO (V) 400 600 400 600

di/dt (A/µs) 30 – 40

dv/dt (V/µs) 300 – 100

I2t (A2s) 10.4 – 4

Tj (°C) max. 125 – 125

Rated input voltage 5, 12, 24 VDC 5, 12, 24 VDC

Dielectric strength (between input 2,000 VAC, 50/60 Hz 2,500 VAC, 50/60 Hz 2,500 VAC, 50/60 Hzand output terminals) for 1 min for 1 min for 1 min

Ambient temperature (operating) -30° to 80°C (with no icing or condensation) -30° to 80°C (with no icingor condensation)

Function Zero cross No Yes No Yes No No Yes

Operation indicator No No No

Built-in varistor No No No

Plug-in No No No

Screw No No No

Tab No No No

PCB Yes Yes

Mounting method PCB mounting PCB mounting

Magnet relay with compatible – –terminals

Approved standards UL, CSA, TÜV UL, CSA UL, CSA, TÜVEN, IEC, VDE:approval pendingfor UTU models

Socket – –

Weight Approx. Approx. 15 g Approx. 25 g Approx. 5 g

Page 328 332

Terminaltype

324

Solid-State Relay – G3R/G3RD

323


Model G3S/G3SD G3DZ

G3S-201PL G3S-201PL-PD G3SD-Z01P G3SD-Z01P-PD G3DZ-2R6PL


20 x 10 max.

Features • Compatible with OMRON’s G6B • AC/DC SSR• 10-µA leakage

current max.• Same shape

as G6D• Input resistor

and varistorincorporated

Output Insulation Phototriac Photocoupler Photodiode array

Load voltage 75 to 264 VAC 3 to 26 VDC 3 to 264 VAC,3 to 125 VDC

Maximum switching 1 A 1.2 A 1 A 1.1 A 0.6 Acurrent

Leakage current 2 mA max. at 200 VAC 0.1 mA max. at 26 VDC 10 µA max. at125 VDC

VDRM, VCEO (V) 600 32 VDSS 600

di/dt (A/µs) 30 –

dv/dt (V/µs) 300 –

I2t (A2s) 10.4 –

Tj (°C) max. 125 150



Ambient temperature (operating) -30° to 80°C (with no icing or condensation) -30° to 80°C (with no icing orcondensation)

Function Zero cross No

Operation indicator No

Built-in varistor Yes

Plug-in No

Screw No

Tab No

PCB Yes

Mounting method Socket mounting Socket mounting/PCB mounting

Magnet relay with compatible G6B G6Dterminals

Approved standards UL, CSA –

Socket P6BF-4BND (with operating indicator, with counterelectromotive voltage P6D-04Pabsorption diode), P6B-04P

Weight Approx. Approx. 13 g Approx. 3.1 g

Page 340 344


SSRs.

Terminaltype

PD types eachseparated by heat sink

326


325


328

Solid-State Relay – G3M

Zero Cross Models Added toCompact, Low-cost G3M Series This design for high-density PCB applications.

DC input-AC output for up to 5-A load.

Approved by UL and CSA.

327



330


329


332

Solid-State Relay – G3MB

331



334



333


336

Solid-State Relay – G3MC

335


338


337


340

Solid-State Relay – G3S/G3SD

339



342


341


344

Solid-State Relay – G3DZ

343



346


345


348

Technical Information – MOSFET Relays

IntroductionNew models and a wider range provide an array of solutions,meeting the needs of today’s high performance applications.Our new range of MOSFET relays, Type G3VM, set the benchmarkin Solid State Relays (SSRs). Products are manufactured usingthe latest advances in automated production and include a varietyof improved construction technologies within the areas of theinput LED, PDA (Photo Diode Array used as a photocoupler) andMOSFET chips used in the load switching circuit. As a result,further reductions in package size and power requirements havebeen achieved.Combining the advantages of mechanical and solid statetechnology, the new G3VM range gives you unprecedentedcapability to design. All models featured include a doubleMOSFET load circuit, enabling the designer complete versatilitysince it makes no difference whether an AC or DC load in eitherdirection is connected (Connection A). Thus, the MOSFET relay isa fully functional alternative to an electromechanical relay withminimal additional drive circuitry.

The built-in Current Limit Function (CLR models) has many uses.Traditionally used to clamp excessive over current fault conditionsin telecom equipment, this feature can also be used to good effectto resist transient and short circuit conditions.MOSFET relays are the ideal data and telecommunication solutionfor line seizing, line switching, hook switching, Data AccessArrangement (DAA) function, line transformer circuit control andother feature phone functions. Central office applications requirehigh reliability and long life. Here G3VM is ideal for use in theareas of Subscriber Line Interfaces (SLICs) Multiplexers andRouters. In addition, Local Area Networks (LANs) and NetworkTermination Units (NTUs) including Set-Top Boxes (STBs) andRemote Metering Systems (RMS) can take advantage of theG3VMs’ small size and low ON resistance.Advances in performance and cost reduction enable MOSFETrelays to be considered as good alternatives to Reed Relays inapplication areas such as security motion detectors (standard andanti-mask PIRs), other surveillance alarm equipment andassociated systems.

Glossary

Term Symbol Description

Rated current that can flow continuously in the forward direction of the LED

Rated current that can flow momentarily in the forward direction of the LED

Rated change of forward current flowing through the LED relative to ambienttemperature above 25 °C

Rated reverse voltage that can be applied between the anode and the cathode

Rated temperature that can be allowed in the junction of the LED, Photodetectoror MOSFET(s)

Rated voltage that can be applied between the MOSFET's output terminalsin the OFF state

Rated current that can flow between the MOSFET's output terminals in the ON state

Rated change of load current flowing between MOSFET(s) output terminals relativeto ambient temperature above 25 °C

Isolation voltage between input and output terminals for a specified time

Ambient temperature range in which the relay may be operated without impairment

Ambient temperature range in which the relay may be stored while not operating

Voltage drop between the LED's anode and cathode at a certain forward current

Leakage current flowing in the LED's reverse direction (between cathode and anode)

Electrostatic capacitance between the anode and the cathode terminals of the LED

Minimum value of input current necessary to put the output MOSFET(s)in to the ON state

Resistance between the MOSFET's output terminals specified with reference to ONstate current

Leakage current flowing between the MOSFET's output terminals in the OFF state

Electrostatic capacitance between the input and output terminals of the relay

Resistance between the input and output terminals at the specified voltage value

Time required for the output waveform to change from 0(100%) to 90(10%) after inputgoes from OFF to ON state

Time required for the output waveform to change from 0(100%) to 90(10%) after inputgoes from ON to OFF state

Rated load voltage that can be applied between the MOSFET's output terminals

LED forward current

Repetitive peak LED forwardcurrent

LED forward current reductionrate

LED reverse voltage

Connection temperature

Output dielectric strength

Continuous load current

ON current reduction rate

Dielectric strength betweeninput and output

Operating temperature

Storage temperature

LED forward voltage

LED reverse current

Capacity between LED terminals

Trigger LED forward current

Maximum resistance with outputON

Current leakage when the relayis open

Capacity between I/O terminals

Insulation resistance

Turn-ON time

Turn-OFF time

Output dielectric strength

IF

IFP

<ION/°C

VR

TJ

VOFF

IO

<ION/°C

VI-O

Ta

Tstg

VF

IR

CT

IFT

RON

ILEAK

CI-O

RI-O

tON

tOFF

VDD

347



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