1 © 2004 Xanoptix, Inc Telecosm 2004 John Trezza

© 2004 Xanoptix, Inc 1

Telecosm 2004

John Trezza

Telecosm 2004

John Trezza


Xanoptix PurposeXanoptix Purpose

Xanoptix exists to permit the concept of a “Chip”

to transcend materials, technologies and distances.

Xanoptix will enable a world free of hardware bottlenecks by allowing

unimpeded communication between integrated circuits

Many data paths,

Unrestricted speed, and

Vast reach (microns to kilometers).

By doing so, we will

Radically improve the price/performance electronics,

Merge ‘chips’ and ‘the network’, and

Move the IC industry from a ‘mainframe-like’ model to a ‘PC-like’ model.


More Complex Chips with More I/OMore Complex Chips with More I/O

1.E+001.E+011.E+021.E+031.E+041.E+051.E+061.E+071.E+081.E+091.E+101.E+111.E+121.E+131.E+141.E+15

1970 1980 1990 2000 2010

Year

Bit

Rat

e (M

egab

its/

seco

nd)

\

Off Chip Data

Data ON Chip

(Desired Data)

Stacked IC 10,000 x


Industry ProblemsIndustry Problems

ICs: Poor Communication & Performance•IN SYSTEM: Can send 0.01% of Desired CHIP Data

•BY USING 10% to 50% of CHIP POWER AND AREA

•IN NETWORK: 0.0001%

ICs:complex to design & Limited In Roadmap & Expensive•Material Choices Like the Model-T Colors •IP sharing hard•$1million & Months of Design for Each Attempt•No Upgradability•Large chips = “wafers-per-chip” Yields•Million costs when 90% of chip needs Inexpensive •Chips not expected to grow in next 10 years!


What we do – What we do – 3D Integrated Circuits3D Integrated CircuitsMaterial-Neutral, Chip-level, direct Material-Neutral, Chip-level, direct die-to-die interconnectiondie-to-die interconnection

3DWafer

Daughter WafersMother Wafer (e.g. CMOS)

Electronic

Si GaAs, InP

Silicon CMOS, Bi-CMOS, GaAs IC, etc.Ceramic

Passive

ElectronicConnections(um sized)

Optical

Si

GaAs

Stack

SiSi Si

THE XANOPTIX DIFFERENCE

MILLIONS of Connections per cm2

ANY Material / Process / Fab

Semiconductor Economies of Scale.

Multi-Vertical-Stack

1000s Optical Connections(Chips kilometers Apart Act as 1 Chip)

Integrate


Daughter IC

Mother Wafer

I/O Pad Openings

4 to 14um

7 to 50um

<5um

ProcessProcess

Multi-StackingChips w/ vias

Base ProcessElectrical, Mechanical,Thermal Connection


What we are working to achieveWhat we are working to achieve

Repeat the IC Revolution

Transform Boards of Chips & Modules

Into Individual Stacked Chips

USB/Audio/HDD

WLAN

GRAPHICS

PROCSSOR OPTICAL

DRAM

WLAN USB/Audio/HDD

WLAN

GRAPHICS

PROCSSOR OPTICAL

DRAM

WLAN USB/AudioHDD

WLAN

GRAPHICS

PROCSSOR

DRAM

WLAN



Move the IC Industry from a ‘mainframe-like’ to

a ‘PC-like’ model

Transform Large, Complex Chips

Into Modular Stacked Chips

Processor CoreProcessor Core

L2 Cache Bus

Logic

L3 Cache

L3 CacheL3

CacheL3 Cache

Processor CoreProcessor Core

BusLogic

L2 Cache Processor

CoreProcessor Core

BusLogic

L3 CacheL3 CacheL3 CacheL2

Cache

Mainframe-Like PC-Like



Remove I/O Bottlenecks over Any Distance.

Transform Many ICs & the network

IntoOne Big ‘Chip’

Silicon CMOS IC(e.g. Microprocessor)

SRAM Mixed Signal IC RF Chip

Optical I/ODRAM



Optical I/ODRAM

Kilometers

MicronsTransceiver


3D Stacked 3D Stacked ICs:ICs:

ICs are Dramatically Improved in Performance

•ALL Data Available over ANY distance (The chip =network)•90% Less I/O Power•99% Less I/O Space

ICs are Unlimited in Flexibility & Decreased in Cost•Mix & Match Processes & Material From Best Suppliers •The chip IS the board•Days of Design for new version of a chip •Customize & Upgrade your chip just a PC.•Several Smaller chips each with very high yield •Cost is on function-by Function basis

•‘Unlimited’ chip size


Key CapabilitiesKey Capabilities

Optical Device Design

& Fabrication Mixed Signal

IC Design

Optical Packaging Design3-D Folded

Packaging Design

ELECTRONICS OPTICS3D Stacked IC


Xanoptix Has Advanced 3D CapabilitiesXanoptix Has Advanced 3D Capabilities

1st Optical

ProductElectrical Chips

Demonstrated Chips for Products

Capability

# contacts/chi

p~ 600 10,000 Million Million+

Contact Size 14 um 7 um 4 um 2 umContact Density 40,000/cm2 160,000 / cm2 1,000,000/cm2 1,000,000+/ cm2

# Optical devices 216 N/A ~ 300,000 > 300,000

Contact yields 99.9995%


Single Chip Optoelectronic Transceiver 250 Gb/s

(equivalent to 1,250 Ethernet Cards)

Combines active optics and electronics into single chips

First Commercial ApplicationFirst Commercial Application


Para-Optix Product LinePara-Optix Product Line

Chip Heat SinkOptical

Connector Electrical Connector

P R O G R A M M I N G

XTM-12 XTM-16 XTM-24 XTM-32 XTM-48 XTM-72

Xanoptix IC

Xanoptix Component

•15x number of optical devices•3:1 Laser redundancy•Programmable

Xanoptix3-D

Packaging

1cmOptical Output

5Gb/s 400Gb/s


PARA-OPTIX VS. LC SFFPARA-OPTIX VS. LC SFF

IP Routers

Core Switching

CATV/Metro Switching

Storage/Data Switching

Computing & Server


Next Generation: Next Generation: Fiber CablesFiber Cables

NEXT GENERATION PASSIVE NEXT GENERATION PASSIVE OPTICAL CABLING OPTICAL CABLING

““100,000 points of light100,000 points of light” ”

3mm

100,000 fibers

1000s Optical I/O

100,000s of fibers


Future Development RoadmapsFuture Development Roadmaps

Tx / RxTransceiverBackup/redundancy Power monitoringPre-EmphasisEqualization SERDESClock RecoveryMicroprocessorFPGAGraphicsNetwork Processors SRAM &DRAMBIOS ChipsetsMemory controllersDrive controllersData aggregatorsMicroprocessorsGbE / FibCh codecSONET scramblingCrossbar SwitchingDrop/AddECC & CRCRegenerators FramingHeader DecodingDigital CrossconnectWDM CrossconnecctClocking distributionBus Controller

850nm VCSEL

1310nm DFB

Single Mode devices

CWDM (2-16 )

1550nm DFB

DWDM(16-256+ )

600nm VCSEL

1310nm VCSEL

640 Mb/s/ch

1 Gb/s/ch

1.25 Gb/s/ch

2.5 Gb/s/ch

3.125 Gb/s/ch

5.5 Gb/s/ch

6.25 Gb/s/ch

10 Gb/s/ch

12.5 Gb/s/ch

40 Gb/s/ch

Intelligence Speed/I/O Wavelength(s)1248

12162432487296

128144256288576

921636864

589824

# optical I/O


Microprocessor, Router,DWDM System

• 1000s of Optical I/O channels• Hundreds of wavelengths

Expensive Monolithic

Routers, Servers,DWDM systems

CommoditySystems

BECOME

Example: Communication SystemsExample: Communication Systems

$1 Million ; 6ft System. $1,000 ; 1in System.




Optical I/ODRAM



Optical I/ODRAM

Kilometers

MicronsTransceiver


Computing, Storage, Office, and Computing, Storage, Office, and Consumer OpportunitiesConsumer Opportunities

Other Consumer Electronics•Single Chip DVD Recorder (read the disk in one rotation)•Memory Stacks•Single chip “Xbox in a wristwatch”•Printer/Scanner/Copier Chip

Highly Parallel Communication For storage systems

Single Chip Digital Cameras(Sensor, Logic, Memory, display, and Network in one)


Next Generation:Next Generation:Telecom & Communications ProductsTelecom & Communications Products

LNB devices/Modules for Satellite TV

Single Chip Fiber to The Home ‘box’

WLAN on a Chip

Cell Phone / Base Station “on a Chip”

Single-Chip, Ultra Redundant Undersea Repeaters

Modular ASICs


Next Generation:Next Generation:Consumer, Industrial, Military, and CommercialConsumer, Industrial, Military, and Commercial

Avionics & Space

The Connector/Cable *IS* the Electronics/Optics/network

In-Flight Networking & Entertainment Chips

Single Chip High-Temp Industrial Control Sytems

Active printed circuit boards, Cables & IC sockets


Active Auto Fiber Harness(embedded Electronics and/or optics in cables/connectors)Drive by Wire; In Car network.

Next Generation:Next Generation:Automotive ProductsAutomotive Products

Sensor Modules / Engine Control Modules

On Board Computer Networks

Silicon

GaAs / InP

GaN

RF

OpticsMEMS


•A Chip combines the best of all technologies.

•Merge ‘chips’ and the ‘network’

•Increased Communication Bandwidth & Functionality (millions / cm2)

•Extended communication distance (1um kms)

•Lower communication power

•Upgradability: Treat ICs like PCs

•Eliminate the need for entire classes of other components

•1st Commerical Chips: 245 Gb/s in 1 square centimeter --more bandwidth than 1000 Ethernet cards

•Huge opportunities throughout the industry.

Summary:Summary:Performance, Functionality, Yield, Cost


The VisionThe Vision

Integrated Circuits

Developed (1961)(TI & Fairchild)

Event Significance First Product Market Result

RevolutionizedElectronics

Hearing Aid $100s Billions

Electronics industry

now

3D andOPTICALLY

ENABLEDIntegrated

CircuitsDeveloped (2001)

(Xanoptix)

RevolutionizesElectronics & The Network

Intelligent Transceiver $

Documents

1 © 2004 Xanoptix, Inc Telecosm 2004 John Trezza