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1
AVPM Annual Meeting
October 6, 2009
Peter Garvin
RPET Blisters and the impact on
Heatseal Technology
2
Technical Review-Heat Seals
Components
• Blister types
• Adhesive Technologies
• Current Status
3
Technical Review-Heat Seals
Blister Type
• Traditional PVC – Vast Majority of Market
• PET & RPET Blisters -Expanding
4
Technical Review-Heat Seals
Blister Type – other impacts
• Blister Flange – need a minimal size to ensure heatsealing operation adherence of the blister to the ink/board stock
• Mold Release & denesting lubricants – need minimal amounts to preclude disruption of adhesion
5
Technical Review-Heat Seals
Heat Seal Coating
Printing Ink
Clay Coating
Clay Coating
Chemical Sizing
Chemical Sizing
Paperboard
Clay Coating
Plastic Blister
Blister Flange
Blister Flange
BASE SHEET
FINISHEDSHEET
Visual Carded PackagingComponents & Assembly
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Technical Review-Heat Seals
Adhesive Technology
• The adhesive itself is applied over wax-free inks on the blister board
• The heatsealing operation allows the molten adhesive to wet out the blister and the ink/board
7
Technical Review-Heat Seals
Adhesive Technology• The adhesive does not “dive in” to the board
as originally thought. (Determined by AVPM technicalcommittee analysis)
• Thus – the blister itself is vital to a proper and secure structure
• A proper seal is the result of the bond between blisterand ink/board, being strong enough so that the board ruptures in the base sheet (not clay split!!)
8
Technical Review-Heat Seals
Adhesive Technology (Solvent Base)• Applied off-line in second step on roll-coater over
dry inks (may require spray powder)• Able to adhere to a wide variety and “quality” of
blisters – most forgiving technology – better wetsout the flange.
• EVA and Vinyl Technologies• Solvent recovery or incineration required
9
Technical Review-Heat Seals
Adhesive Technology (Water – Base)
• Applied in-line over wet ink on a litho press equipped with an in-line coating unit
• Lower cost than off-line coating - 1 step process
• PUR and Acrylic Technologies
10
Technical Review-Heat Seals
Current Status• “Green” concerns drive the blister package to
more environmentally friendly components• Board stock is repulpable (Beloit Study)• Heatseal Adhesive – Currently water-base,
devoid oforganic solvents / and in-line which eliminates asecond operation which reduces energy and cost
11
Technical Review-Heat Seals
Current Status – Blisters• PVC Blisters – Issue with environment
(Chlorine)Being greatly reduced and eliminated in EU andnow in North America
• Recyclability provides for “better score” on Walmart score card as well as with the consumer/customer – Hence RPET!!!!
12
Technical Review-Heat Seals
Current Status – Blisters – RPET
• RPET Blisters vary in amount of “recycled” components
• This may vary the surface energy and corresponding effect on the ability of the adhesive to wet the substrate and adhere the blister to the ink/board
13
Technical Review-Heat Seals
Current Status – Blisters – RPET• Thus to overcome the variation – solvent base
systemsprovide the safest solution (traditional system with the ability to wet out the film when sealed)
• Solvent base (EVA) in effect “covers the sins” of the variation inherent in typical RPET blister stock
14
Technical Review-Heat Seals
Current Status – Blisters – RPET• Water base systems (PUR) - are being developed
to allow for their benefits (one-pass / no organic solvents)
• This will take the Blister Package to the “greenest” option
• Best bet is to test the combination of board /ink / heatseal coating / blister in the laboratory prior to approval
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Technical Review-Heat Seals
Current Status – Blisters - RPET
• When completed make sure to specify each component!!!
• With the same board – ink – heatseal / and specified RPET!!! This structure should provide the optimal desired and properly sealed package!!!
16
Technical Review-Heat Seals
Questions??
Thank you!!!
Peter GarvinHenkel
[email protected](513) 417 - 3980