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Production of THGEM at ELTOS Production of THGEM at ELTOS S.p.A.S.p.A.

Company profile

Production procedures

Small size THGEM prototypes

Large area THGEM photon detector

The production of the first set of 600 x 600 mm2 THGEM prototypes

Fulvio Tessarotto

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Company profile (seen from a Company profile (seen from a client)client)

For the production of THGEMs by industry Rui de Oliveira suggested

us to contact an Italian pcb producer: the company ELTOS S.p.A.

Founded in 1980 by Dr. Riccardo Pinamonti, in Arezzo (Tuscany),

a place with centuries long tradition in gold handcraft

almost 100 workers; turnover > 12 M€ / year; page: www.eltos.it

producing of all kinds of pcb’s, mainly for foreign customers

many labs and research institutes among clients (CERN LHCb award)

typically working on special products and small orders

treating more than 30 different codes / day

using many high-tech machines and newly developed techniques

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Production of small size THGEM Production of small size THGEM prototypesprototypes

At the beginning of 2008 we ordered to the ELTOS Company 13 groups of THGEM

prototypes with 30 x 30 mm2 of active area.

POSALUX ULTRASPEED 6000LZ6-spindle-roboter

180,000 turns/min, Ø down to 0.15 mmNominal CNC drilling tolerance: +- 10 μm

common prototype parameters:thickness: 0.4 mm,Cu thickness: 35 μm, holes diameter: 0.4 mm,pitch: 0.8 mm;material: R-1566 Panasonic (halogen free, anti CAF)

10 samples per type

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13 series (different rim or 13 series (different rim or production)production)

NameDrilling 0.4

mm Rim 1 (μm) Rim 2 (μm) rim production material

M1 Y 0 0 NO Panasonic

M2 Y 25 0 Drilling Panasonic

M3 Y 50 0 Drilling Panasonic

M4 Y 100 0 Drilling Panasonic

M5 Y 50 50 Two Sides Drilling Panasonic

R NO NO NO NO Panasonic

RI NO NO NO NO Isola

C1 Y 10 10 Etching Panasonic

C2 Y 25 25 Etching Panasonic

C3 Y 50 50 Etching Panasonic

C3I Y 50 50 Etching Isola

C4 Y 100 100 Etching Panasonic

C5 Y 10 10 Laser + Etching Panasonic

C6 Y 50 50 Laser + Etching Panasonic

C7 Y 10 10 Global Etching Panasonic

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Documentation and packagingDocumentation and packagingFASE DI LAVORAZIONE

QUADROTTO ELTOS = 0.38 35/35 320 X 375MATERIALE PANASONIC R-1566 HF

STABILIZZARE INNER 140° 4 ORE

PRIMA FORATURA ( SOLO FORI DI SERVIZIO)AGGIUNGERE LA SCRITTA C3 SUL BORDO

STAMPA ESTERNI INCISIONE INDIRETTAAGGIUNGERE LA SCRITTA C3 SUI CS

SECONDA GALVANICA ( SOLO STAGNO )STRIPPAGGIO RISTON

INCISIONE AMONIACALE RAME 35µ

NON STRIPPARE STAGNO

FORATURA PASSANTE ( DIAMETRO 0.4 )

INCISIONE AMONIACALE RAME 35µINCIDERE USANDO LA VELOCITA ADEGUATA IN MODO DA CREARE UN ISOLAMENTO DI 50µ

INTORNO ALLA CORONA DEL FORO

STRIPPARE STAGNO

SCONTORNATURA

LAVAGGIO CIRCUITI AD ULTRASUONI IN ACQUA DEMINERALIZZATA

IMBALLO E SPEDIZIONE

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Raw material

Image transfer and etching

Drilling

Stripping

Resist covering

Original “Weizmann” THGEM production process

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Raw material

Drilling

Sn stripping

“10 μm” rim

Galvanic Sn

ELTOS “small rim” production process similar to CERN one, presented by Rui de Oliveira (CERN RD51 Worshop, Sep. 10-11, 2007)

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example of “small rim” (25μm) production

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Raw material

Photo-resist

“100 μm” etching

Image transfer

Drilling

ELTOS “large rim” production process

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example of “large rim” etching production

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Raw material

Drilling

Global etching (no protection)

ELTOS “global etching” production process

proposed by Dr. Riccardo Pinamonti and used for some of the prototypes

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example of 10 μm “global etching” production

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pure drilling production process

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double drilling production process

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Vmax (= discharge limit in pure N2)For the characterization of the small prototypes, listen to Elena Rocco and Jaroslav Polak talks tomorrow

different production techniques different behaviors

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The second series of small size The second series of small size piecespieces

NAME RIM (mm) THICKNESS (mm) Ø (mm) PITCH (mm)

M2.1 0.4 0.3 0.8

M2.2   0.4 0.2 0.8

M2.3   0.4 0.3 1.2

M2.4   0.6 0.4 0.8

M2.5   0.6 0.3 0.8

M2.6   0.6 0.4 1

M2.7   0.6 0.3 1

M2.10   0.8 0.4 0.8

M2.11   0.8 0.3 0.8

M2.12   0.8 0.4 1

M2.13   0.8 0.3 1

C2.1 0.002 0.6 0.3 1

C2.2 0.005 0.6 0.3 1

C2.3 0.010 0.6 0.3 1

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th. 0.8, diam. 0.4, no rimth. 0.8, diam. 0.4, no rim

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th. 0.6, diam. 0.3, “5 th. 0.6, diam. 0.3, “5 μμm global etching m global etching rim”rim”

The Cu layer thickness is reduced from 35 μm to 30 μm

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The prototypes from this second set are presently being characterized, and a third set will probably be ordered.

Several tests have been performed with prototype detectors having double and triple THGEM layers.

UV photon detection by CsI coated THGEMS is also currently being studied.

These items will be covered in the talks by E. Rocco and J. Polak.

All pieces were providing readable signals.

None has ever beeen damaged, despite large discharges.

We wish to investigate the problems related to large area detector construction, in particular the production of larger area THGEMs

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CERN produced 100 x 100 mm2 THGEM

thickness: 0.2 mm diameter: 0.2 mm pitch: 0.5 mm rim: ~ 10 μm

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0.2 mm

0.5 mm

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Toward larger Toward larger areas:areas:

Prototipes:Prototipes:

Small, active area 30 x 30 mm2

Medium, active area 100 x 100 mm2

Large, active area 576 x 576 mm2

Next step: many engineering problems

to be faced build a first tentative

prototype box for addressing one by one

the problems; start with a large THGEM

with “standard” parameters 0.6, 0.4, 0.8

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600 mm

600 mm

THGEMsStesalite frames

Al frame

Anode pads

Structure of Structure of the large the large

areaareaprototype prototype detectordetector

Al frame

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The aluminium frames and the stesalite frames have been produced to allow assembling one prototype detector.

The anode consists in a multi-layer pcb of 3.6 mm thickness, 600 x 600 mm2, segmented in 2304 pads of 1.2 x 1.2 cm2 in the internal side, and 288 connectors for direct mounting of electronic boards on the external side.

Two such pcb’s have been produced for us by ELTOS S.p.A.

The uniformity of the pad surface is guaranteed by using a

recently developed technology: “Cu viafill” used for filling

blind microvias

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Cu viafill technology

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anode pcbanode pcb

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anode pcb padsanode pcb pads

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We ordered 3 large THGEMs with 576 x 576 mm2 active area.

The geometrical parameters are: thickness = 0.6 mm, hole diameter = 0.4 mm, pitch = 0.8 mm, rim = 5 μm.

They have been produced by ELTOS S.p.A. using single spindle machine, and single piece drilling (for small size prototypes stacking of two pcb’s during drilling was used).

There are about 600,000 holes per piece. The drilling took about 30 h / piece, but pieces were produced in parallel. Tools are replaced after 2000 holes.

The reference price for drilling is 1€ for 1000 holes. The other production operations (~5μm rim, Ni-Au, …) add a similar amount to the final price.

Production of 600 x 600 mmProduction of 600 x 600 mm22 THGEMSTHGEMS

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Pluritec Multistation Evolution at ELTOS

180,000 turns/min

20,000 holes/hour

Storage: 840 tools

Controlled diam.,

depth and run-out

Working area:

630 x 765 mm2

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600 x 600 mm2 THGEM protoypes

~600,000 holes/piece

(very large gerber file)

Ø: 0.4, p.: 0.8, th.: 0.6 mm

rim: 5 μm (micro-etching)

Ni-Au coating

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THGEM

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600 x 600 mm2

THGEMs

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ConclusionsConclusionsThe ELTOS S.p.A. Company in Italy has recently gained significant experience in the production of THGEM prototypes of many different types.

In order to optimize the procedures for THGEM production it is very important to know the production details and to correlate them to the performances of the prototypes.

This work has started with a large set of 30 x 30 mm2 THGEMS which have been delivered and tested.

The first set of 600 x 600 mm2 THGEMs has been produced and delivered last week.

Industrial production of THGEMs may be close to become real.