1 Ott IBM eServer. Total Storage, On Demand · 2008-02-29 · Processors Power Density (W/CM2) Chip Voltage (VDC) IO PCI PCI X 4x IB Cables/Switches 12x IB & IB Modules 10 Gb Enet

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IBM eServerTM

10/7/2005 © 2005 IBM Corporation

IBM eServer™ Total Storage, On Demand

Bill Ott, Vice President, eServer xSeries & IntelliStation DevelopmentSystems and Technology Group

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IBM eServerTM

© 2005 IBM Corporation2 10/7/2005

IBM 2Q 2005 Business Status

Key Accomplishments– Operational Performance– PC Sale– Restructuring Actions– Microsoft Settlement

2Q Performance Highlights– Services Signings– Power5-based Servers and Storage– Key Middleware– Growth Initiative– Cash and Balance Sheet

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IBM eServerTM


IBM 2Q05 Financial Summary

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IBM Revenue 1Q05 and 2Q05

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IBM Geographic Revenue

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Global Services

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Systems & Technology

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Software

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IBM Systems & Technology GroupWho Are We– #1 Systems Vendor

• $19B in 2004– Fastest growing vendor in

storage, UNIX servers and Intel-based servers

– Top blade-server vendor– 10,000 development

employees worldwide– 21 development sites World

Wide

What We Do– IBM eServer

• zSeries mainframe• iSeries midmarket• pSeries UNIX • xSeries Intel-based• BladeCenter• Systems Control Software

– IBM TotalStorage• Tape• Disk• Storage software

– Key Competitors:• HP, Sun, EMC

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IBM eServerTM


IBM Technology Leadership

Server & StorageVirtualization

Partitioning

Core on demand Technologies

Linux open standards

Grid Computing

Autonomic Computing

Capacity on Demand

Systems Consolidation

POWER™

Architecture

Mainframe Servers

Core Products

Blade ServersDisk Storage

StorageNetworking

Tape and Optical Systems

Intel processor-based Servers

AMD processor-based Servers

Midrange Servers

Unix Servers

ClustersStorageSoftware

TotalStorage

IBM eServer

CoreTechnologies

Operating Systems

Processors VirtualizationEngine

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IBM eServerTM


Momentum in High Growth Segments

IBM is – First in worldwide server revenue for the ninth consecutive

quarter– First in UNIX-based server revenue– First in blade server revenue.

IBM overtook the top position in UNIX-based server revenue, growing nearly seven points year-to-year

AND IBM led Blade server revenue for the eight consecutitvequarter ending 2Q05 with 40 percent of the revenue share

Source: IDC Worldwide Quarterly Server Tracker, 2Q05, issued on August 25, 2005

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IBM xSeries

Power, Packaging and Cooling Challenges

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The System Technology Challenge/Drivers

More Speed!

Higher Density!

More Data Capacity!

More Bandwidth!

Lower Cost!

Smaller!

More Portable!

More Open!

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Trends That Affect Power, Packaging, and Cooling 2000 2001 2002 2003 2004 2005 2006 2007

Technology DriversProcessors

Power Density (W/CM2)Chip Voltage (VDC)

IOPCI

PCI X 4x IB Cables/Switches 12x IB & IB Modules

10 Gb Enet

2 1

CoolingCooling Ability

W/CM2

U

Heat PipesChilled Air / Water1

15Technology Enables

2 17

3.3V, 5V, 12V 5V, 12V Hybrid

12V Distributed 12V Distributed

PowerPower Density (W/in3) 3

20

Market DriversIntel CPU / Rack (42U) 20

168 cores*

ServerPackaging

Tower Rack / Tower

Rack OptimizedModular Scalar Systems

Server Blade - High PowerServer Blade - Low Power

Media (HDD, CD, FDD)36 GB

600 GB

3.5" 2.5" SFF, SCSIHDD

244 cores*

PCI Express 40 Gb Enet

300 GB

2.5" SAS

Vapor Chamber

15 22

Chilled Air Rack

Multicore 2

FBD Memory

Multicore 8

3.5" SATA/ SAS

(single core)(dual core)

488 cores*(quad core)

( * blade servers)

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Challenges:Server designs have reached several limits:– Power supply density: cooling a bottleneck, continued push higher– Thermal: ability to move enough air to cool at server, rack and building levels– Accoustics: increased airfow = more noise

Ability to provide primary power, building and rack: over 30kW per rack– Higher power driving higher input currents

• Running out of AC ampacity with primary connector, C13/C14 must use C19/C20 and further as input connectors– Racks require more capacity than 60A 3-phase service

Energy Efficient Designs– "80 plus" desktop initiative gaining interest in Server market

Other technology drivers– Number of planar voltages is increasing.

• To conserve planar area, VRMs & SIPs need to be more common / smaller– Lower load voltages, 1.8V, 1.5V, 1.2V, etc., coupled with high dynamic loads continues to drive "point-of-load"

VRs.– Power Management

• Growing need to monitor currents and power• Dynamic voltage adjustments

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Thermal - Power Requirements Watts / U

1U Max Power

Blade Max Power

Dashed lines are projected

**When 20% of Racks are at 31.8kW (6 BladeCenters), Then high density data center limits are reached.80% of racks must be at 5KW or below.

2003 2004 2005 20060

200

400

600

800

1000

Range of cooling capability in typical data centersRaised and Non-Raised Floor

High Density**Data Center

5,000 W per Rack

10,000 W per Rack

15,000 W per Rack

31,800 W per Rack

34000 W per Rack

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IBM eServerTM


Power Supply Roadmap

GENERAL– N+N bulk power required for redundancy– 12V distribution within the chassis drives VRM / VRD input, DASD, PCI, FANS– High efficiency converter technologies– Design for future power increases (mech. package, connectors)– Focus on quality and reliability– Voltage and current monitoring circuitry

LOW END– Density pressure will continue driving lower number of output voltages

• Facilitates denser power supply packaging trend• Improved power supply efficiency• Requires more use of VRDs and VRMs CBBs

ISSUES– Power supply densities limited at system level by cooling– Connector ratings / dc power distribution– AC Power distribution

• need more power than 60A 3-phase can provide

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Technical Challenges and SolutionsWhat We Need– Higher Reliability - MTBF– Higher Power Density– Higher Transient Response - di/dt– Higher Efficiency– Lower Voltage - Higher Current– Voltage/Current Distribution – Increased Number Of Voltage

Domains– Ability to Hot Swap– Lower Cost– Shorter Development Cycles– Best Industry Quality– Error and Status Reporting– Power measurement capabilities

How We Get There– More Integration– Higher Switching Frequencies– Lower Switching and Conduction

Losses – Topology Influences

• RES/ZVS/ZCS– Better EMI Design– Innovative Design – Lower Output Impedance– Thermal Management– Component Improvements

• Integrated• Battery Technology• Power Semiconductors• Capacitors• Interconnect

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Backup

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xSeries MetricsDate Updated:08/27/04

History

PS Density W / ci. in.

PS Cost $ /W

2002 2003 2004 2005 2006 2007Year

$0.00

$0.02

$0.04

$0.06

$0.08

$0.10

$0.12

Cos

t

cost

Cost

2007200620052004200320022001Year

0

5

10

15

20

25

W/c

u in

Density

Density

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Server Load Power Proportions

32.6%

8.6%

11.3%17.7%

29.8%

Rack Optimized

22.1%

4.6%

7.3%

10.5%

55.5%

BladeCenter

PowerCooling

I/ O Subsystem Memory Processors

BladeCenter vs Rack Opt imized

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AC Power Distribution Challenge

xSeries customers are almost at the same AC input requirements as the Mainframes (60A 3-phase required for many applications)

mainframe timeline

20061995 x-i-p series timeline 2002

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Momentum in High Growth Segments

Source: IDC and Systems and Technology Group Market Intelligence

0%

10%

20%

30%

40%

50%

60%

70%

Q201 Q401 Q202 Q402 Q203 Q403IBM HP Dell

8-way+ Revenue Marketshare Blade Revenue Marketshare

0%

10%

20%

30%

40%

50%

60%

Q202 Q302 Q402 Q103 Q203 Q303 Q403

IBM HP Dell

31%

24%

67%

44%

Documents

1 Ott IBM eServer. Total Storage, On Demand · 2008-02-29 · Processors Power Density (W/CM2) Chip Voltage (VDC) IO PCI PCI X 4x IB Cables/Switches 12x IB & IB Modules 10 Gb Enet