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RoHS ComplianceRoHS Compliance

Add Add CorporateCorporate

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Updated: Jul. 25, 2011

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DefinitionDefinition

–R estriction

–o f certain

–H azardous

–S ubstances

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POLICYPOLICY

• Retention of Current Models

• Creation of New Models for RoHS Compliance

• Drop-in replacement

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WHY ??WHY ??

• Mini-Circuits is ISO-14001 Certified and is committed to a Greener environment

• Restricted Substances are potential hazards to health and the environment

• INCREASING CUSTOMER DEMAND

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StandardStandard

• Mini-Circuits will meet the requirements as stated in the European Union Directive (2002/95/EC)

• Mini-Circuits will provide compliant parts prior to the July 2006 deadline

• Policy includes ‘total’ compliance, not just Lead-free

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Restricted SubstancesRestricted Substances

• Lead (Pb) - platings, surface finishes• Mercury (Hg) - not applicable• Cadmium (Cd) - capacitors, ceramics• Hexavalent Chromium (CrVI) - chromate

conversion finish of aluminum• PBB - flame retardant • PBDE - flame retardant

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Customer InquiriesCustomer Inquiries

• Web Page devoted to RoHS/Pb-free• Includes Letter of Introduction• Policy• FAQ Sheet• List of RoHS Compliant Model Families

• ROHS@MINICIRCUITS.COM• Material Declarations, in Excel format

(see sample at end of slide)

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Product IdentificationProduct Identification

• All RoHS Compliant models will have part numbers ending in “ + “ suffix.

• “+” suffix to appear on models where marking is done.

• “ + “ Part numbers and symbol will appear on all labels and packaging.

• Implementation of JESD97 2nd level interconnect (e) labeling.

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AlternativesAlternatives

• Getting the ‘Lead Out’– SAC solders– Matte Tin over Nickel on Leadframes and

Chip Components– ENIG (electroless nickel immersion gold)

on ‘soft’ PCBs– Tin/Silver/Nickel on MMIC leadframes– Tin/Silver on pin headers

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AlternativesAlternatives (cont’d)(cont’d)

• Cadmium– Cadmium-free capacitors

– Cadmium-free ceramics

• Hexavalent Chromium– Trivalent “Alodyne”

– Phosphating

– Gold Plating

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Process/Reliability IssuesProcess/Reliability Issues

• Pb-free solders require higher Peak Reflow Temperatures.

• RoHS Compliant parts will meet J-Std-020C Reflow profile requirement.

• No change in MSL is anticipated• Testing for Joint Reliability and Tin

Whiskers

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Example of Material DeclarationExample of Material Declaration

• ADE-1+

Sample of Material DeclarationSample of Material Declaration Mini-Circuits® Prepared on: 03/11/2005

Model No. : ADE-1+ Weight : 262.2 mgDBL BAL MIX / SURF MT/T&R/ROHSRoHS Compliant : Yes

Constituent Cas No. Parts Per Million (PPM) Weight in mg %POLYPHENYLENE SULPHIDE RESIN GLASS 26125-40-6 469982 123.229 46.99FERRITE 1309-37-1 180282 47.27 18.02COPPER 7440-50-8 135927 35.64 13.59ALLOY #42 56545 14.826 5.65ALUMINA - CERAMIC 1344-28-1 53159 13.938 5.31MANGANESE TETROXIDE 1317-35-7 37300 9.78 3.72ZINC OXIDE 1314-13-2 24867 6.52 2.48EPOXY RESIN 10847 2.844 1.08PARYLENE-C 28804-46-8 6217 1.63 0.62SILICA FUSED 60676-86-0 5514 1.445 0.55TIN-100 7440-31-5 4448 1.166 0.44BISPHENOL A EPOXY 3814 1 0.38POLYAMIDE HARDENER 3814 1 0.38NICKEL 7440-02-0 2969 0.778 0.29POLYURETHANE NYLON CL180 1373 0.36 0.13PHTHALIC ANHYDRIDE 25550-51-0 1098 0.288 0.1SILICA FUMED 953 0.25 0.09SILVER 7440-22-4 267 0.07 0.02DIKETO PYRROLO-PYRROLE 191 0.05 0.01DIGLYCIDYLETHER OF BISPHENOL A 1675-54-3 183 0.048 0.01PALLADIUM 7440-05-3 159 0.041 0.01SILICON 7440-21-3 44 0.011 0CRISTOBALITE 14464-46-1 40 0.01 0PLATINUM 7440-06-4 26 0.006 0BORON OXIDE 1303-86-2 8 0.002 0GOLD 7440-57-5 6 0.001 0BISMUTH TRIOXIDE 1304-76-3 5 0.001 0AROMATIC AMINES 0 0 0

Material declaration based on information provided by suppliers.

Method of quantity/percentage determination based on w eight analysis, calculated estimates,

or similarity, and represent the materials used at the time of this report