11

STARSTARSTAR Upgrade Plans and R&DSTAR Upgrade Plans and R&D

Open Meeting on RHIC Planning, December 4, 2003 R. Majka for STAR

22

Physics QuestionsPhysics Questions

1.1. What are the gross properties of the partonic matter?What are the gross properties of the partonic matter?• Is it equilibrated? Is it equilibrated? • Does it behave collectively? Does it behave collectively? • What are its early temperature and pressure? What are its early temperature and pressure? • What is its gluon density? What is its gluon density?

2.2. Are symmetries restored/broken in the partonic Are symmetries restored/broken in the partonic matter?matter?• Spontaneous CP violation Spontaneous CP violation • Chiral symmetry and UChiral symmetry and UAA(1) restoration(1) restoration

3.3. What are the properties of the hadronic medium after What are the properties of the hadronic medium after hadronization hadronization

4.4. What are the gluon densities in normal nuclear matter What are the gluon densities in normal nuclear matter

6.6. What are the contributions to the nucleon spin?What are the contributions to the nucleon spin?

33

Upgrade GoalsUpgrade GoalsKeep (expand) STAR’s large coverageKeep (expand) STAR’s large coverage

1.1. Enhanced (higher momentum) PID – barrel TOFEnhanced (higher momentum) PID – barrel TOF

2.2. Micro vertex detector and inner tracking for enhanced Micro vertex detector and inner tracking for enhanced heavy quark IDheavy quark ID

3.3. Improved momentum resolution for forward (1<|Improved momentum resolution for forward (1<||<2) |<2) region - inner and end cap tracking,region - inner and end cap tracking,

4.4. High rate readout and DAQ – present large samples to High rate readout and DAQ – present large samples to high level trigger, also record very large sampleshigh level trigger, also record very large samples

5.5. Enhanced Forward instrumentation - |Enhanced Forward instrumentation - ||>2 (Hadron |>2 (Hadron calorimetry)calorimetry)

6.6. High rate tracking capability High rate tracking capability

7.7. High Luminosity, Large pp polarization – RHIC High Luminosity, Large pp polarization – RHIC development and upgradesdevelopment and upgrades

44

Physics BulletsPhysics Bullets

• Determine degree of thermalization and Determine degree of thermalization and collectivity in partonic matter formed in collectivity in partonic matter formed in RHIC collisionsRHIC collisions

• Test QCD (for variety of parton types) and Test QCD (for variety of parton types) and determine the fate of its fundamental determine the fate of its fundamental symmetries in bulk partonic mattersymmetries in bulk partonic matter

• Map the contributions of gluons and sea Map the contributions of gluons and sea antiquarks of different flavor to the spin of antiquarks of different flavor to the spin of the protonthe proton

• Probe the large gluon densities at low Probe the large gluon densities at low momentum fraction in heavy nucleimomentum fraction in heavy nuclei

}}RHIC-RHIC-IIII

TOF BarrelTOF Barrel

Pixel Pixel VertexVertex

DAQ/FEE DAQ/FEE upgradeupgrade

}}Inner/ Inner/ endcap endcap trackingtracking Forward Forward

hadron hadron calorimetercalorimeter

UpgradeUpgrade

55

TOF: Correlations, Fluctuations, Partonic Collectivity, Open Charn, Vector meson (->e+e-), lepton, di-lepton spectra, away-side jet fragmentation, exotica searches, helicity correlations,

Microvertex: Heavy quark production with identification via slightly displaced vertices; D yields & flow to test degree of thermalization & partonic collectivity; c- and b-quark energy loss in partonic matter.

DAQ/FEE: Acquisition of very large data samples for precision and rare process studies: e.g., b-quark jet quenching; CP violation search via spin correlations opposite a high-pT hadron; HBT.

Inner/Forward Tracking Upgrade: W± production and charge sign discrimination in polarized pp collisions, especially in endcap region, for kinematically clean distinction of flavor-dependence of sea antiquark vs. valence quark polarizations in proton.

Forward Hadron Calorimeter: Jet reconstruction at high pseudorapidity: CGC monojet search in d(p) + A; isolation of fragmentation effects in large single-spin transverse asymmetries in pp 0 production.

Robust Tracking in High Luminosity RHIC II era: High luminosity studies of - and heavy-quark tagged jets; HBT.

66

STAR DetectorSTAR Detector

77

Ongoing Improvements of STAR CapabilityOngoing Improvements of STAR Capability

Detector / Detector / InterestInterest StatusStatus CompletionCompletion

Barrel Electromagnetic CalorimeterBarrel Electromagnetic Calorimeter (high pt, photons, (high pt, photons, °, jets °, jets TRiGGER!TRiGGER!))

90 modules of 120 90 modules of 120 installedinstalled

20042004

Endcap Electromagnetic Calorimeter Endcap Electromagnetic Calorimeter (reach in x(reach in xBJBJ, high pt, photons, , high pt, photons, °, jets, °, jets,

TRIGGERTRIGGER))

mech structure installed; mech structure installed; 40% instr.40% instr.

20042004

Silicon Strip DetectorSilicon Strip Detector(x 1.5 efficiency for hyperon reconstr.)(x 1.5 efficiency for hyperon reconstr.)

11 ladders installed11 ladders installed 20042004

Photon Multiplicity DetectorPhoton Multiplicity Detector <N<N > ( > (°) fluctuations, Chiral Condensate°) fluctuations, Chiral Condensate

InstalledInstalled 20032003

One Tray of MRPC TOFOne Tray of MRPC TOF(< 100 ps TOF PID with MRPC Modules)(< 100 ps TOF PID with MRPC Modules)

New prototype TrayNew prototype Tray 20032003

DAQ 100 DAQ 100 ( ( Event Rates Event Rates 100 Hz) 100 Hz)

CompletedCompleted 20032003

Forward Pi Zero Detector Forward Pi Zero Detector ( A( ANN for leading for leading °, G(x) in d + Au)°, G(x) in d + Au)

CompleteComplete 20032003

New Triggers and increased capabilityNew Triggers and increased capability(Rare Trigger Selection e.g. J/(Rare Trigger Selection e.g. J/, Upsilon), Upsilon)

Ongoing Dev.Ongoing Dev.

88

STAR Barrel TOFSTAR Barrel TOF

MRPC modules to cover outer barrel of STAR TPCMRPC modules to cover outer barrel of STAR TPC• < 100 ps< 100 ps

• Large coverage –Large coverage –<<<<, -1<, -1<<1, R<1, R≈≈2.1 m2.1 m

• More than double momentum range of PID (95% of More than double momentum range of PID (95% of charged particles in acceptance)charged particles in acceptance)

• 3800 modules with 23,000 readout channels3800 modules with 23,000 readout channels

• Fast detector – maintains (improves) trigger Fast detector – maintains (improves) trigger capability of existing CTB scintilators.capability of existing CTB scintilators.

99

Read out pad sizeRead out pad size ：：3.15cm×6.3cm3.15cm×6.3cm

gapgap ：： 6×0.22mm6×0.22mm

95% C95% C22HH22FF44

5% Iso-butane5% Iso-butane

Multigap Resistive Plate Chamber Multigap Resistive Plate Chamber MRPCMRPC Technology developed at CERN Technology developed at CERN

3800 modules, 23,000 readout chan. to cover TPC barrel3800 modules, 23,000 readout chan. to cover TPC barrel

1010

Examples of Benefit of TOFExamples of Benefit of TOF

Open Charm and Resonances Open Charm and Resonances in central Au-Au collisionsin central Au-Au collisions

ppTT

(GeV/c)(GeV/c)FOMFOM

DDoo All 4.6

DDoo 2-4 2.6

DDoo 4-6 2.0

DDoo >6 1.0

K*K*oo 0-10-1 2.02.0

K*K*oo 1-21-2 1.851.85

K*K*oo 2-32-3 1.741.74

K*K*oo 3-53-5 1.391.39

(1020)(1020) 0-20-2 5.05.0

(1020)(1020) 2-52-5 3.43.4

(1520)(1520) 0-1.60-1.6 11.411.4

FOM (figure of merit) = reduction FOM (figure of merit) = reduction in required data set by using TOF in required data set by using TOF PIDPID

TOF PID also reduces systematic TOF PID also reduces systematic errors from correlated back-errors from correlated back-ground due to misidentified ground due to misidentified particlesparticles

Certain measurements are Certain measurements are impossibleimpossible without TOF – unlike particle without TOF – unlike particle correlations (correlations (scale dependent scale dependent correlation studies (velocity vs correlation studies (velocity vs momentum correlations), exotic momentum correlations), exotic searches… searches…

1111

TOF R&D TOF R&D Accomplished in FY03Accomplished in FY03

For RHIC run 3, one full tray For RHIC run 3, one full tray installed in STARinstalled in STAR

•28 MRPC modules28 MRPC modules

•72 chan. of readout using 72 chan. of readout using final FEE components on final FEE components on prototype boards connected prototype boards connected to CAMAC digitizersto CAMAC digitizers

•Signals split to form TOF Signals split to form TOF triggertrigger

1212

TOF R&D Accomplished in FY03TOF R&D Accomplished in FY03•SFSF66 is NOT required is NOT required in the gas mix in the gas mix

•HV was on for the entire runHV was on for the entire run – no failures – no failures

•Noise rate ~200HzNoise rate ~200Hz from OR of 72 chan. from OR of 72 chan.

•TPC TPC track matchingtrack matching done ( done (software developedsoftware developed) )

•CalibrationsCalibrations (t-zero, slewing, TDC nonlinearity, …) are (t-zero, slewing, TDC nonlinearity, …) are all performed (all performed (software developedsoftware developed))

•85 ps MRPC timing resolution85 ps MRPC timing resolution demonstrated for a demonstrated for a small system in the RHIC/STAR environmentsmall system in the RHIC/STAR environment

•95%95% MRPC efficiencyMRPC efficiency demonstrated in the RHIC/STAR demonstrated in the RHIC/STAR environmentenvironment

•PID capabilityPID capability demonstrated ( demonstrated (software developedsoftware developed))

•Electron taggingElectron tagging demonstrated demonstrated

•Physics publicationPhysics publication submitted submitted

1313/K separation p=1.6GeV/c, p/(K+) p=3GeV/c

From TOF Triggered Data in d-Au CollisionsFrom TOF Triggered Data in d-Au Collisions

1414

Electron tag from combining TPC dE/dx and TOFElectron tag from combining TPC dE/dx and TOF

TPC dE/dx for all tracks

TPC dE/dx for tracks with TOF ~ 1

1515

TOF + TPC electron Tag TOF + TPC electron Tag

•Works well at low energy – complements calorimeterWorks well at low energy – complements calorimeter

•Gives access to vector meson (Gives access to vector meson (JJ e e++ee- - decays decays

•In medium modification, ‘onia studiesIn medium modification, ‘onia studies

•Thermal dileptonsThermal dileptons

•Single electron spectrumSingle electron spectrum

•D meson yield, flowD meson yield, flow

Simulations show inner Simulations show inner vertex tracker can suppress vertex tracker can suppress conversions conversionsDDoo decay electrons follow D decay electrons follow Doo flow!flow!

1616

Nucl-ex/0309012, Sept. 2003

Submitted to PRL

MRPC TOF has run successfully in STAR and MRPC TOF has run successfully in STAR and produced publishable physics results.produced publishable physics results.

1717

TOF R&D in 2004TOF R&D in 2004

For the upcoming run (Run 4):For the upcoming run (Run 4):

•TOF Tray rebuilt with prototypes of “final” FEE boardsTOF Tray rebuilt with prototypes of “final” FEE boards

•A few channels of HPTDC digitizersA few channels of HPTDC digitizers

Address integration volume issues (space, cooling)Address integration volume issues (space, cooling)

Gain experience with final FEE configuration (24 channel Gain experience with final FEE configuration (24 channel boards, sealing top of trays boards, sealing top of trays

Gain experience with HPTDCGain experience with HPTDC

Gain running experience with Au-Au collisionsGain running experience with Au-Au collisions

Continue software development and physics analysisContinue software development and physics analysis

1818

TOF R&D in 2004 (TOF R&D in 2004 (cont.)cont.)

For Run 5:For Run 5:

•Build a significant amount of full electronics chain (up to Build a significant amount of full electronics chain (up to four trays)four trays)

•Build significant number of MRPC modules (up to 4 Build significant number of MRPC modules (up to 4 trays)trays)

Operational experience with full electronics chainOperational experience with full electronics chain

Check electronics design for productionCheck electronics design for production

Experience with module production linesExperience with module production lines

Finalize module production and QA procedureFinalize module production and QA procedure

Extended physics capabilityExtended physics capability

1919

Proposal for construction is submitted:Proposal for construction is submitted:

Construction funding in FY05Construction funding in FY05

Construction FY05 – FY07Construction FY05 – FY07

30 Trays (25% coverage) in FY0630 Trays (25% coverage) in FY06

Partial (and increasing) coverage (and Partial (and increasing) coverage (and physics capability) available during physics capability) available during construction phase.construction phase.

2020

Micro-Vertex DetectorMicro-Vertex DetectorHighHigh resolution inner vertex detector, better than 10 resolution inner vertex detector, better than 10 m m

resolution, with better than 20 resolution, with better than 20 m point-back accuracy m point-back accuracy at the primary vertex.at the primary vertex.

CMOS Active Pixel Sensor (APS) technology – can be CMOS Active Pixel Sensor (APS) technology – can be very thin, allows some readout to be on same chip as very thin, allows some readout to be on same chip as detector.detector.

Develop high speed APS technology for second Develop high speed APS technology for second generation silicon replacement (LEPSI/IReS, and generation silicon replacement (LEPSI/IReS, and LBNL+UC Irvine)LBNL+UC Irvine)

Required Areas of development:Required Areas of development: APS detector technologyAPS detector technology Mechanical support and cabling for thinned siliconMechanical support and cabling for thinned silicon Thin beam pipe developmentThin beam pipe development Calibration and position determinationCalibration and position determination Data stream interfacingData stream interfacing

2121

Features of First Generation Design:Features of First Generation Design:• 2 layers2 layers

• Inner radius ~1.8 cmInner radius ~1.8 cm

• Active length 20 cmActive length 20 cm

• Readout speed 20 ms (generation 1)Readout speed 20 ms (generation 1)

• Number of pixels 130 MNumber of pixels 130 M

Goals and Milestones: • Choose MIMOSTAR fabrication process, End 03• Thinned MIMOSA-5 chips to LEPSI/IReS, Feb. 04• Design of LEPSI/IReS MIMOSTAR chip, May 04• Tested MIMOSA-5 to LBNL, June 04• Submit fabrication MIMOSTAR, 2 proto, Sept 04• First ladder prototype, start Oct. 04• Tests of 2 MIMOSTAR prototypes, Jan 05• Final MIMOSTAR prototype design, Mar 05• Submit fab final MIMOSTAR prototype, Apr 05• Production tests of final MIMOSTAR proto type on wafer, July 05• Send MIMOSTAR for thinning, Aug 05• Test thinned and diced MIMOSTAR prototype chips, Sept 05• Mount MIMOSTAR chips on final ladder prototype• Proposal in 2004

2222

carbon composite (75 m)Young’s modulus 3-4 times steel

aluminum kapton cable(100 m)

silicon chips(50 m)

21.6 mm

254 mm

Thin stiff ladder conceptThin stiff ladder conceptMechanical and Mechanical and integration issues are integration issues are being addressed:being addressed:

Existing SiliconExisting Silicon

Two Two Layers of Layers of APSAPS

Integration volume and rapid Integration volume and rapid insertion/removal being studied insertion/removal being studied using modern 3-D modeling using modern 3-D modeling tools.tools.

2323

GOAL: GOAL: increase STAR’s rate capability to equivalent of 1 kHz min-bias increase STAR’s rate capability to equivalent of 1 kHz min-bias Au+Au Au+Au ~820 MB/s instantaneous (~300 MB/s time-averaged?) ~820 MB/s instantaneous (~300 MB/s time-averaged?)

IMPLEMENTATION: IMPLEMENTATION: (1) replace TPC FEE with version based on ALICE (1) replace TPC FEE with version based on ALICE ALTRO chip; (2) replace TPC DAQ system with one based on storage of ALTRO chip; (2) replace TPC DAQ system with one based on storage of only cluster information extracted in fast hardware; (3) upgrade EMC only cluster information extracted in fast hardware; (3) upgrade EMC Level 2 Receiver Boards and use for other new subsystems as well.Level 2 Receiver Boards and use for other new subsystems as well.

MILESTONESMILESTONES: :

FY04 Run: deploy Fast Cluster Finder algorithm (FY04 Run: deploy Fast Cluster Finder algorithm ( DAQ100) and DAQ100) and cluster storage only in software as proof-of-principle; handle clustered cluster storage only in software as proof-of-principle; handle clustered event building with 4 Linux-based EVB work stationsevent building with 4 Linux-based EVB work stations

FY04 R&D: implement a Row Computing Slice (RCS) incorporating FY04 R&D: implement a Row Computing Slice (RCS) incorporating FCF in hardware (FPGA, DSP, …); design generic new DAQ Receiver FCF in hardware (FPGA, DSP, …); design generic new DAQ Receiver Board; prototype ALTRO-based FEEBoard; prototype ALTRO-based FEE

FY05 Run: implement new Receiver Board for BEMC/EEMC Level 2 FY05 Run: implement new Receiver Board for BEMC/EEMC Level 2 triggeringtriggering

FY05 R&D: design ALTRO FY05 R&D: design ALTRO DAQ interconnect; prototype DAQ fiber DAQ interconnect; prototype DAQ fiber interconnect & network systeminterconnect & network system

STAR DAQ upgrade – STAR DAQ upgrade – DAQ1000DAQ1000

2424

Primary Vertex position, Z, cm

Pt, GeV/c, simulated

Improved Tracking for Improved Tracking for >1>1

GEM in front of TPC

+ 3-layer Si strip barrel + GEM plane in front of EEMC

18%, wrong sign

TPC hits only > 7 hits/track “Fast”

Detector hits only

All hits

Pt, GeV/c, reconstructed

Inner (Si strip) + forward (GEM) tracking detector concept should eliminate incorrect sign reconstructions for W daughters in endcap region!

Simulated events illuminate endcap region ~ uniformly, assume modest fast detector spatial resolutions of 100 m (GEM) and 50 m (Si)

2525

==GasGas Electron MultiplierElectron Multiplier

A micropattern structure produced A micropattern structure produced in 50in 50m thick copper clad kapton m thick copper clad kapton using lithographic techniques. using lithographic techniques. 5555m holes on ~140m holes on ~140m centers m centers Gain up to ~10Gain up to ~1033 for single foil for single foil

3M Foil (J. Collar) Photo – Bo Yu, BNL3M Foil (J. Collar) Photo – Bo Yu, BNL CERN Foil (F. Sauli) Photo – G. JesseCERN Foil (F. Sauli) Photo – G. Jesse

2626

November 7-8, Meeting at MIT to begin to address issues related November 7-8, Meeting at MIT to begin to address issues related to integrating requirements and design for tracking upgradesto integrating requirements and design for tracking upgrades

New working group formed to:New working group formed to:

Decide on optimal sequence/staging/integration of upgrades Decide on optimal sequence/staging/integration of upgrades and replacement of existing STAR subsystems, navigating highly and replacement of existing STAR subsystems, navigating highly coupled issues:coupled issues:• APS needs fast inner tracker consistent with FEE/DAQ upgrade. APS needs fast inner tracker consistent with FEE/DAQ upgrade. • W± sign discrimination in endcap region requires inner tracker W± sign discrimination in endcap region requires inner tracker coverage beyond coverage beyond = 1 = 1• Endcap tracker needs space freed by TPC FEE upgradeEndcap tracker needs space freed by TPC FEE upgrade• Present SVT + FTPC introduce intricate mechanical problems Present SVT + FTPC introduce intricate mechanical problems for APS insertion/removalfor APS insertion/removal •Mapping onto physics priorities, funding, RHIC run planMapping onto physics priorities, funding, RHIC run plan

Produce an integrated design addressing these issuesProduce an integrated design addressing these issues

Inner Tracking + Forward TrackingInner Tracking + Forward Tracking

2727

Forward Physics

Forward Hadron Calorimetry (~2.4<<4.0, 0<<2)

Simulations and Design

Forward jets – probing gluon saturation, mono-jets

Is the asymmetry for pions produced in transversely polarized proton scattering due to spin dependent fragmentation?

Roman Pots (~6.5)

Access to a variety of diffractive phenomena in p-p scattering

beam

detectors

beam pipe

2828

Goals for FY04Goals for FY04

TOF: Proposal submittedTOF: Proposal submitted construct 4 prototype MRPC TOF construct 4 prototype MRPC TOF trays with ~ final on-board time digitization electronics for trays with ~ final on-board time digitization electronics for installation in STAR for RHIC run 5; design Level 2 Receiver installation in STAR for RHIC run 5; design Level 2 Receiver Board for TOF + other sub-systems.Board for TOF + other sub-systems.

Vertex: Vertex: design and begin fabrication of prototype design and begin fabrication of prototype MIMOSTAR chips; advance mechanical design and begin MIMOSTAR chips; advance mechanical design and begin fabrication of first prototype APS ladder. Develop proposalfabrication of first prototype APS ladder. Develop proposal

FEE/DAQ FEE/DAQ build/test several prototype FEE boards utilizing build/test several prototype FEE boards utilizing ALTRO chip. ALTRO chip. Implement Fast TPC Cluster Finder algorithm in Implement Fast TPC Cluster Finder algorithm in hardware; contribute to design of new Receiver Board.hardware; contribute to design of new Receiver Board.

GEM: GEM: (Joint R&D with PHENIX) (Joint R&D with PHENIX) prepare prototype GEM pad prepare prototype GEM pad detector and readout electronics for installation within STAR detector and readout electronics for installation within STAR for RHIC run 5, to test operation and backgrounds in RHIC for RHIC run 5, to test operation and backgrounds in RHIC collision environment. Build prototype compact TPC modulecollision environment. Build prototype compact TPC module

Inner + Endcap tracking: Inner + Endcap tracking: Develop integrated design.Develop integrated design.

2929

STAR Future Physics and Planned UpgradesSystem R&D Constr/Cost Benefit to STAR

Barrel MRPC ‘ 04 Barrel MRPC ‘ 04 ‘05 ‘ 05 ‘05 ‘ 05 ‘06 PID information for ~ 95% ‘06 PID information for ~ 95% TOF $260k $4.3M of kaons and protons in acc;TOF $260k $4.3M of kaons and protons in acc; + $2.5M in- kind extended p+ $2.5M in- kind extended pTT for resonances; for resonances; vv22; D’s; ebe correlations;; D’s; ebe correlations; anti-nuclei; inclusiveanti-nuclei; inclusive electronselectrons

Inner Inner vtx ‘04 vtx ‘04 ‘06 ‘06 ‘ 06 ‘ 06 ‘07 D’s , flavor- tagged jets ‘07 D’s , flavor- tagged jets (Forward Tracker)(Forward Tracker) $ 965K $4M $ 965K $4M (TBD) (Charge sign for W(TBD) (Charge sign for W± ± ))

DAQ Upgrade ‘04 DAQ Upgrade ‘04 ‘06 ‘ 06 ‘06 ‘ 06 ‘08 1 kz ‘08 1 kz L3; D’s; L3; D’s; & D, & D, $1.77M $5M v$1.77M $5M v22, cp, D thermalization, cp, D thermalization FEE Upgrade ‘04 FEE Upgrade ‘04 ‘05 ‘ 05 ‘05 ‘ 05 ‘06 1 kz ‘06 1 kz L3; D’s; L3; D’s; , D,, D, $250k $2.5M v$250k $2.5M v22, cp, D thermalization , cp, D thermalization

Forward Hadron before next d-Au forward jets, mono-jets,Forward Hadron before next d-Au forward jets, mono-jets, Calorimeter TBD collins fragmentationCalorimeter TBD collins fragmentation

GEM DeV ‘ 04 GEM DeV ‘ 04 ‘06 ‘08 - ‘10 Compact, fast TPC;robust ‘06 ‘08 - ‘10 Compact, fast TPC;robust $900k ? tracking for high Q$900k ? tracking for high Q2 2 physics physics at 40 x L GEM pad chambers forat 40 x L GEM pad chambers for forward/inner trackingforward/inner tracking