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14 July 2010, ITRS Summer Meeting, San Francisco, CA 1DRAFT WORK IN PROGRESS --- DO NOT PUBLISH
2010 International Technology Roadmap for Semiconductors
Radio Frequency and Analog/Mixed-Signal Technologies for Wireless Communications
Working Group
ITRS Summer Meeting
On behalf of the RF and AMS ITWG
Jack PekarikIBM
Essex Junction, [email protected]
14 July 2010, ITRS Summer Meeting, San Francisco, CA 2DRAFT WORK IN PROGRESS --- DO NOT PUBLISH
2010 OrganizationChair: Jack Pekarik, IBM 41 Members in 2010 / 39 Members in 2009
Co-chairs: Jan-Erik Mueller, Infineon 25 NA, 8 EU, 8 AP
Sebastian Liau, ITRI
Margaret Huang, Freescale
Editor: Herbert Bennett, NIST
• Subgroup CMOS Snezan Jenai, Infineon
• Subgroup Bipolar Pascal Chevalier, ST
• Subgroup Passives Sebastian Liau, ITRI
• Subgroup PA Peter Zampardi, Skywork
• Subgroup mm-Wave Tony Immorlica, BAE Systems
• Subgroup MEMS Dave Howard, Jazz
14 July 2010, ITRS Summer Meeting, San Francisco, CA 3DRAFT WORK IN PROGRESS --- DO NOT PUBLISH
2010 Membership
* Inactive this year
Name Affiliation Name Affiliation
Pascal Ancey STMicroelectronics Yukihiro Kiyota Sony Corporation,
Herbert S. Bennett NIST Sebastian Shyi-Ching Liau Industrial Technology Research Institute
Volker Blaschke Jazz Semiconductor Ginkou Ma Industrial Technology Research Institute
Bobby Brar Teledyne Scientific and Imaging Jan-Erik Mueller Infineon Technologies
Wayne Burger Freescale Semiconductor, Inc Takashi Nakamura Omron Corp
Pascal Chevalier STMicroelectronics Hansu OH Samsung Electronics Co., Ltd.
David Chow HRL Douglas Pattullo
Julio Costa RFMD Jack Pekarik IBM Corporation
Mattias Dahlstrom IBM Corporation Jean-Olivier Plouchart IBM Corporation
Stefaan Decoutere IMEC Ed Preisler Jazz Semiconductor
Jonathan Hammond RFMD Marco Racanelli Jazz Semiconductor
Erwin Hijzen NXP Semiconductors, Mark Rosker DARPA
Digh Hisamoto Hitachi Ltd., Bernard Sautreuil STMicroelectronics
Dave Howard Jazz Semiconductor Tony Stamper IBM Corporation
W. Margaret Huang Freescale Semiconductor, Inc Sorin Voinigescu University of Toronto
Matthias Illing Bosch Dawn Wang IBM Corporation
Anthony A. Immorlica Jr. BAE Systems, Albert Wang University of California
Jay John Freescale Semiconductor, Inc Dennis Williams WinSemi
Alex Kalnitsky TSMC Peter Zampardi Skyworks Solutions, Inc
Mattan Kamon Coventor, Inc. Herbert Zirath Chalmers University
Tom Kazior Raytheon RF Components
14 July 2010, ITRS Summer Meeting, San Francisco, CA 4DRAFT WORK IN PROGRESS --- DO NOT PUBLISH
Wireless Working Group Key Considerations
Traditional Roadmap Drivers:• Cost (scaling, die size, part count)• Power consumption• Chip functionality
Non-traditional Roadmap Drivers:• Government regulations determining system spectrum and specifications• Standards and protocols drive frequencies, power and performance• RF module form factor (size and height requirements)• Color coding “Manufacturing solutions exist” does not imply product
volume shipment per ITRS definition
Cost / Performance Drives Integration:• Multi-band & multi-mode system applications drive MtM focus
(MEMs, embedded passives, filters, switch integration)• Signal isolation and integrity lead to needs for clear FoMs & metrology• Analog shrink drives MtM design innovations but FoMs & metrology lag
14 July 2010, ITRS Summer Meeting, San Francisco, CA 5DRAFT WORK IN PROGRESS --- DO NOT PUBLISH
Wireless ITWG Background
• Scope of work remains the same; wireless transceiver IC as technology driver, with active contribution to ITRS-defined More than Moore thrust.
• Chapter subdivided into <10GHz applications and mm-wave applications.
• 5 technology subgroups cover <10GHz applications: CMOS, bipolar, passives, power amplifier and MEMs. A mm-wave subgroup focuses on higher frequency applications, considering power and low-noise using III-V and silicon-based devices.
• Some portions of the roadmap reflect prototype capability more than volume production. Production requires applications (especially emerging mm-wave connectivity and imaging) that currently lag technology capability.
14 July 2010, ITRS Summer Meeting, San Francisco, CA 6DRAFT WORK IN PROGRESS --- DO NOT PUBLISH
Scope of Wireless Chapter
14 July 2010, ITRS Summer Meeting, San Francisco, CA 7DRAFT WORK IN PROGRESS --- DO NOT PUBLISH
GSMCDMA
ISM
PDCGPSSAT
Radio
DCSPCS
DECTCDMA
WLAN802.11b/gHomeRFBluetooth
SATTV
WLAN802.11a
SAT TVWLAN
HyperlinkUWB
LMDSWLAN
AUTORADAR
ContrabandDetection
All WeatherLanding
94 GHz77 GHz28 GHz10 GHz5 GHz2 GHz0.8 GHz
GSMCDMA
ISM
PDCGPSSAT
Radio
DCSPCS
DECTCDMA
WLAN802.11b/g
Bluetooth
SATTV Tuner
WLAN802.11aWiMAX
SAT TVWLAN
HyperlinkUWB
LMDSWLAN
AUTORADAR
All WeatherLanding
0.094-1 THz77 GHz28 GHz10 GHz5 GHz2 GHz0.4 GHz
Si –RF CMOSSi –RF CMOS
SiC -MESFETSiC -MESFET
GaN -HEMTGaN -HEMT
SiGe –HBT, BiCMOSSiGe –HBT, BiCMOS
GaAs -HBT, PHEMTGaAs -HBT, PHEMT
InP –HBT, HEMT GaAs MEHMTInP –HBT, HEMT GaAs MHEMT
ZigBee
ImagingSpectroscopy
60GHzWPAN
Wireless Communication Application Spectrum
WCDMA
14 July 2010, ITRS Summer Meeting, San Francisco, CA 8DRAFT WORK IN PROGRESS --- DO NOT PUBLISH
RF & AMS for Wireless plans
• CMOS: Revise data for matching & fMAX, to better-match published data, acknowledge that more companies offer more HV & analog devices.
• BIPOLAR: Revisit HS-PNP fT, BVCEO.
• PA: No changes required.
• Passives: No changes required. Many considerations for 2011.
• MEMs: No changes required.Investigating whether to spin-off MEMs into a new chapter for 2011– Discussing with iNEMI and ITRS (Assy & Pkg, Design)
• mmWave: Consider delay of GaN & perhaps earlier retirement of some InP technologies; review timing of gate length reductions.
• General: Provide clear definitions of FOMs used and encourage publication of data using these methods.
This year’s focus: Few changes for 2010, full-chapter revision for 2011