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17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
VCI 2010
M.Friedl, T.Bergauer, I.Gfall, C.Irmler, M.Valentan (HEPHY Vienna)
2Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
IntroductionBelle II: The FutureSuperSVD ComponentsAPV25 & Time ResolutionReadout SystemSummary
Contents
3Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
Linac
Belle
KEKB
KEKB and Belle @ KEK• Asymmetric machine:
8 GeV e- on 3.5 GeV e+
• Center of mass energy: Y(4S) (10.58 GeV)
• High intensity beams (1.6 A & 1.3 A)
• Integrated luminosity 1 ab-1 recorded by end of 2009
~1 km in diameter
Mt. Tsukuba
KEKBBelle
Linac
About 60km northeast of Tokyo
4Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
„…the two particle detectors BaBar at Stanford, USA and
Belle at Tsukuba, Japan, both detected broken symmetries…“
(Press Release of the Swedish Academy)
2008 Nobel Prize in Physics
T. MaskawaM. Kobayashi
5Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
µ / KL detection 14/15 lyr. RPC+Fe
CsI(Tl) 16 X0
Si vertex detector 4 lyr. DSSD
SC solenoid 1.5 T
8 GeV e-
3.5 GeV e+
Aerogel Cherenkov counter n=1.015~1.030
Central Drift Chamber small cell +He/C2H5
TOF counter
Belle Detector (1999–2010)
6Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
The Present: SVD2 – Overview
• 4 layers (6/12/18/18 ladders), r = 2.0…8.8 cm • 17°…150° polar angle coverage• 246 double sided silicon detectors (DSSDs), 0.5 m2 overall active
area• VA1TA readout chip (Viking variant; 800ns shaping time) • 110592 channels in total
7Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
IntroductionBelle II: The FutureSuperSVD ComponentsAPV25 & Time ResolutionReadout SystemSummary
8Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
KEKB/Belle upgrade (2010–2013)
• Aim: super-high luminosity ~81035 cm-2s-1 11010 BB / year• LoI published in 2004; TDR is presently being written• Refurbishment of accelerator and detector required
http://belle2.kek.jp
9Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
Belle II SVD Upgrade (2010–2013)
• Present SVD limitations are– occupancy (currently ~10% in
innermost layer) need faster shaping
– dead time (currently ~3%) need faster readout and pipeline
• Needs Silicon Vertex Detector with– high background tolerance– pipelined readout– robust tracking– low material budget in active
volume (low energy machine)
Current SVD is not suitable for Belle II
• Ultimately 40-fold increase in luminosity (~81035 cm-2s-1)
10Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
Present SVD2 Layout
• 4 straight layers of 4" double-sided silicon detectors (DSSDs)• Outer radius of r~8.8 cm • Up to 3 sensors are ganged
and read out by one hybridlocated outside of acceptance
0
0
10
12
34
[cm]
layers
[cm]
20
-10-20-30 10 20 30 40
11Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
0
0
10
1+23
45
6[cm] layers
[cm]
20
-10-20-30 10 20 30 40
SuperSVD Layout
• Geometry optimization is underway• New central pixel double-layer using
DEPFET• Strip layers extend to r~14 cm• Every sensor is read out individually
(no ganging) to maintain good S/N chip-on-sensor concept
Double-layer of DEPFET pixels
4 layers of double-sided strip sensors
12Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
IntroductionBelle II: The FutureSuperSVD ComponentsAPV25 & Time ResolutionReadout SystemSummary
13Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
Double-sided Silicon Strip Detectors
• Only 3 different sensor designs for SuperSVD (2 x , 1 x )• 6” prototypes ordered from Hamamatsu (rectangular) and Micron
(trapezoidal)• Currently in production, expected in April and summer
Atoll p-stop designTrapezoidal sensor with test structures
14Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
APV25 Readout Chip
• Developed for CMS (LHC) by IC London and RAL (70k chips installed)• 0.25 µm CMOS process (>100 MRad tolerant)• 40 MHz clock (adjustable), 128 channels• 192 cell analog pipeline no dead time • 50 ns shaping time low occupancy • Low noise: 250 e + 36 e/pF must minimize capacitive load!!!• Multi-peak mode (read out several samples along shaping curve)• Thinning to 100µm successful
Schematics of one channel
15Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
Origami – Chip-on-Sensor Concept
• Chip-on-sensor concept for double-sided readout• Flex fan-out pieces wrapped to opposite side (hence “Origami“)• All chips aligned on one side single cooling pipe
Prototype for 4” DSSD(later with 6” sensors)
Side View (below)
zylon rib
APV25 cooling pipe
3-layer kapton hybrid
integrated fanoutDSSD
double-layer flex wrapped to p-side
APV25(th inned to 100µm )
zylon ribcooling pipe
DSSDRohacellKapton
16Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
16
4th Open Meeting of the Belle II Collaboration
First Origami Module
• Top and bottom side Origami concept (4” sensor)• Prototype completed in August 2009• Successfully evaluated in lab and beam tests
17Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
Sketch of the Outermost Ladder (Layer 6)
• Composed of 5 x 6” double-sided sensors• Center sensors have Origami structure• Border sensors are conventionally read out from sides
Connector (Nanonics)
Structural element (CF)
Cooling pipe
Flex circuits
Electronics for border sensor
Electronics for border sensor
ca. 60cm
18Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
3D Rendering (preliminary)
• Carried by ribs made of carbon fiber and Rohacell
• Averaged material budget: 0.58% X0
• Cooling options under study
19Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
IntroductionBelle II: The FutureSuperSVD ComponentsAPV25 & Time ResolutionReadout SystemSummary
20Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
APV25 – Hit Time Reconstruction
• Possibility of recording multiple samples (x) along shaped waveform (feature of APV25)
• Reconstruction of peak time (and amplitude)by waveform fit
• Will be used toremove off-timebackground hits
0 50 100 150 200 250 300
0
5000
10000
15000
20000
25000
30000
S peak
tpeak
Measurement
21Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
Measured Hit Time Precision
• Results achieved in beam tests with several different types of Belle DSSD prototype modules (covering a broad range of SNR)
• 2...3 ns RMSaccuracy at typical cluster SNR(15...25)
• Working onimplementationin FPGA (using lookup tables) – simulationsuccessful
Time Resolution vs. Cluster SNR
0
1
2
3
4
5
6
7
5 10 15 20 25 30
Cluster SNR [1]
trm
s [n
s]
Previous beam tests
SPS 09 beam test
Log-Log Fit
(TDC error subtracted)
Origami Module
22Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
Aim: Occupancy Reduction
Threshold
Threshold
Tim e over threshold ~ 2000ns (m easured)
Tim e over threshold ~ 160ns (measured)
Sensitive tim e window ~ 20ns
VA1TATp~800ns
APV25Tp~50ns
Pulse shapeprocessingRM S(tm ax)~3ns
Gain ~12.5
Gain ~8
Total gain ~100
With hit time reconstruction, we can cope with 40-fold increase in luminosity
23Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
IntroductionBelle II: The FutureSuperSVD ComponentsAPV25 & Time ResolutionReadout SystemSummary
24Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
Readout System• Prototype readout system exists• Verified in several beam tests• Basis for future SVD system shown below
1902APV25chips
Front-end hybrids Rad-hardvoltage
regulators
Analog level translation, data sparsification andhit time reconstruction
Unified Belle IIDAQ system
~2mcoppercable
J unctionbox
~10mcoppercable
FADC+PROC
CO
PP
ER
Unified opticaldata link (>20m)
Finesse Transmitter Board (FTB)
25Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
Prototype Readout System
Repeater BoxLevel translation, buffering
FADC+PROC (9U VME)Digitization, zero-suppression,
hit time reconstruction
26Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
Beam Tests
KEK (Apr 2005)
PSI (Aug 2005, Aug 2006)
KEK (Nov 2007, Nov 2008)
CERN (June 2008,September 2009)
27Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
IntroductionBelle II: The FutureSuperSVD ComponentsAPV25 & Time ResolutionReadout SystemSummary
28Markus Friedl (HEPHY Vienna)17 February 2010
The Silicon Vertex Detector of the Belle II Experiment
Summary
• KEKB is the highest luminosity machine in the world• Belle experiment acknowledged by Physics Nobel Prize 2008• Upgrade of KEKB and Belle (2010-2013)
– 40-fold increase in luminosity– Needs upgrades of all subdetectors
• New, enlarged Silicon Vertex Detector– DEPFET pixel double-layer– Plus 4 strip layers
• Strip Detector R&D– Origami chip-on-sensor concept for low-mass DSSD readout– Readout with hit time reconstruction for improved background
tolerance (up to 100x occupancy reduction w.r.t. now)– Implementation in FPGA hardware (using lookup tables)
SVD