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Table of Contents

1. REVISION HISTORY2

2. MODULE CLASSIFICATION INFORMATION... 4

3. PHYSICAL DATA . 5

4. OUTLINE DIMENSIONS 6

5. BLOCK DIAGRAM .. 7

6. ABSOLUTE MAXIMUM RATINGS 7

7. ELECTRICAL CHARACTERISTICS.. 8

8. ELECTRO-OPTICAL CHARACTERISTICS 8

9. INTERFACE PIN CONNECTIONS.... 11

10. SPECIFICATION OF QUALITY ASSURANCE. 12

11. INSPECTION SPECIFICATION 13

12. RELIABILITY ..... 16

13. SUGGESTIONS FOR USING LCD MODULES.......... ... 17

14. PACKING .. ...... ... 18

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3. PHYSICAL DATA

Item Contents Unit

LCD type TFT 262K Negative Transmissive ---

Viewing direction 12:00 Oclock

Module size (WHT) 34.0 46.7 2.4 mm

Active area (WH) 28.032 35.040 mm

Number of dots 128(RGB) 160 ---

Dot pitch (WH) 0.219 0.219 mm

Operation temperature -20 ~70

Storage temperature -30 ~80

Driver IC NT39102 ---

Interface mode 8080 System 8/16 bit bus ---

Back light type/Color LED back light / White color ---

Remark:1. Display color support 262K/65K, In detail please see also the NT39102 specification

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4. OUTLINE DIMENSIONS

QTCOMPANYLIMITED

7.GEN

ERALTOLERANCE:0.2

CUSTOMER'SMODELNO.:

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5.BLOCK DIAGRAM

6. ABSOLUTE MAXIMUM RATINGS

Item Symbol Min Max Unit Remark

VDD, VCC -0.3 4.6 V ---

VGH -0.3 18.5 V ---

VGL -18.5 0.3 V ---

Power Voltage

VGH-VGL -0.3 33.0 V ---

Input Signal voltage VIN -0.3 VDD+0.3 V ---

Logic Output Voltage VOUT -0.3 VDD+0.3 V ---

Remark:

If the absolute maximum rating of even is one of the above parameters is exceeded even

momentarily, the quality of the product may be degraded. Absolute maximum ratings, therefore,

specify the values exceeding which the product may be physically damaged. Be sure to use the

product within the range of the absolute maximum ratings.

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7. ELECTRICAL CHARACTERISTICS

7-1. DC Characteristics(Ta=-40 ~ 85)

RatingItem Symbol

Min Typ. MaxUnit Remark

VCC 2.6 2.78 3.0 V 2

VDD 1.6 1.8/2.78 3.0 V 2

VGH 10.0 ---- 16.0 VPower Voltage

VGL -16.0 --- -9.0 V3

Low level input voltage VIL 0.0 ---- 0.3*VDD V

High level input voltage VIH 0.7*VDD --- VDD V1,2,3

Analog operating current IVDD --- --- T.B.D mA ---

Remark:

1. VDDI=1.6 to 3.0V, VDD=2.6 to 3.0V, AGND=DGND=0V, Ta=-30 to 70(to +85no

damage)

2. Please supply digital VDDI voltage equal or less than analog VDD voltage. (VDDI < VDD)

3.CSX, RDX, WRX, D[23:0], D/CX, RESX, TE, PCLK, VS, HS, DE, SDA, SCL, GM1, GM0, LCM,

RCM1, RCM0, P68, IM2, IM1, IM0, SRGB, REV, SMX, SMY, RL, TB, IDM, SHUT, PREG, GS and

Test pins

7-2.AC Characteristics

Please Refer to the SPEC of HX8310-A.

8. ELECTRO-OPTICAL CHARACTERISTICS

8-1. Backlight Unit

Remark:

1. Average Luminous Intensity of P1 ~ P5Using a luminance meter BM-7

2. Luminous Intensity Ratio = (max-min)/max * 100%

Measured Method (X*Y: Light Area).

8-2. LCD panel

Item Symbol Min Typ. Max Unit Remark

Input voltage VBL 3.0 3.2 3.4 V -

Current IBL - 15 - mA/chip -

X 0.26 - 0.30 -ICE

Y 0.26 -- 0.31 -X>Y

Brightness - 2500 cd/m

Luminous Intensity Ratio 20 %

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Item Symbol Condition Min. Typ. Max.Unit Remark

Tr --- 20 35Response time

Tf --- 15 30ms

Contrast Ratio CR 150 300 --- ---Transmittance (with

POL)T% --- 6.3 --- %

Wx 0.26 0.30 0.34white

Wy 0.27 0.31 0.35

Rx 0.56 0.60 0.64Red

Ry 0.28 0.32 0.36

Gx 0.27 0.31 0.35Green

Gy 0.52 0.56 0.60

Bx 0.11 0.15 0.19

Color

chromaticity

BlueBy

Viewing normalangle

x= y=0

0.04 0.08 0.12

x+ 40 60 ---Hor.

x- 10 20 ---

y+ 25 35 ---Viewing angle

Ver.y-

Center

CR 10

25 35 ---

Deg

ReferenceOnly

Note (1) Definition of Viewing Angle x and y:

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9. INTERFACE PIN CONNECTIONS

NO. Symbol Function

1 LED-A Backlight power supply

2 LED-K Backlight ground

3 IM0 Interface select4 VGL Negative voltage of the Booster circuit

5 VGH Positive voltage of the Booster circuit

6 /RESETThis signal low. Will reset the device and must be applied to properly initialize the

chi .

7 DB15

8 DB14

9 DB13

10 DB12

11 DB1112 DB10

13 DB9

14 DB8

15 DB7

16 DB6

17 DB5

18 DB4

19 DB3

20 DB2

21 DB1

22 DB0

Data bus

23 /RD Read pin

24 /WR Write pin

25 RS Display data / Command selection pin

26 CS Chip select input pin (Low enable).

27 VCC Power supply

28 VCI Power supply

29 GND Ground

Remark:

IM0 Interface DB pins

0 8080 system 8 bit bus DB7-0

1 8080 system 16 bit bus DB15-0

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10. SPECIFICATION OF QUALITY ASSURANCE

10-1. Summary

The customer should check and accept the products of QTwithin one month after reception. This standard for

Quality Assurance should affirm the quality of LCD products to supply to purchaser by QT. Entire process is

controlled according to QS9000.

10-2. Standard for quality test

1. Inspection Before delivering, the supplier should take the following tests, and affirm the quality of product.

2. Electro-Optical Characteristics

According to the individual specification to test the product.

3. Test of Appearance Characteristics:

According to the individual specification to test the product.

4. Test of Reliability Characteristics

According to the definition of reliability on specification for test product.

5. Delivery Test

Before delivering, the supplier should take the delivery test

6. Test Method: According to the MIL-STD-105E General Inspection level II take a single time.

7. The defects classify of AQL as following

Major defect: AQL=0.1 (E) AQL=0.25(C)

Minor defect:: AQL= 0.65Total defects: AQL = 0.65

10-3. Nonconforming Analysis & Deal with Manners

Nonconforming Analysis

1. Purchaser should supply the detail data of nonconforming sample and the non-suitable state.

2. After accepting the detail data from purchaser, the analysis of nonconforming should be finished in two weeks.

3. If supplier can not finish analysis on time, must announce purchaser before two weeks.

10-4. Disposition of nonconforming

1. If find any supplier defect during assembly line, supplier must change the good product for every defect after

recognition.

2. Both supplier and customer should analysis the reason and discuss the disposition of nonconforming when the

reason of nonconforming is not sure.

10-5. Agreement items.

Both sides should discuss together when the following problems happen:

1. There is any problem of standard of quality assurance, and both sides think that must be modifier.

2. There is any argument item which does not record in the quality assurance.

3. Any other special problem.

10-6. Standard of the Product Appearance Test

Manner of appearance test

1. The test must be under 20W*2 or 40W fluorescent light, and the distance of view must be at 30 cm.

2. When test the model of Transmissive product must add the reflective plate.

3.The test direction is base on about around 45 degree of vertical line.

4. Definition of Area:

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A Area: Viewing area

B Area: Out of viewing area

10-7. Basic principle:

1. It will accord to the AQL when the standard can not be described.

2. The sample of the lowest acceptable quality level must be discussed by both supplier and customer when any

dispute happened.

3. Must add new item on time when it is necessary.

11. INSPECTION SPECIFICATION

11-1. Electrical Testing

1. Missing vertical, horizontal segment, segment contrast defect.

2. Missing character, dot or icon.

3. Display malfunction.

4. No function or no display.

5. Current consumption exceeds product specifications.

6. LCD viewing angle defect.

7. Mixed product types.

8. Contrast defect

11-2. Black or white spots on LCD (display only)

1. White and black spots on display 0.20mm, no more than three white or black spots present.

2. Densely spaced: No more than two spots or lines within 5mm

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11-3. LCD black spots, white spots, contamination (non-display)

1. Round type: As following drawing

=(x+y)/2

X

Y

SIZE Acceptable QTY

0.10 Accept no dense

0.100.15 2

0.150.20 1

total 2

2. Line Type: (As following drawing)

wL

Length Width Acceptable QTY

--- W0.02 Accept no dense

L3.0 0.02< W0.03

L2.5 0.03< W0.05 2

--- 0.05< W As round type

11-4. Polarizer bubbles

If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction.

Size Acceptable QTY

0.20 Accept no dense

0.20< 0.50 2

11-5. Scratches

Follow NO.3 LCD black spots, white spots, contamination

11-6. Chipped glassSymbols:

X: Chip length y: Chip width z: Chip thickness

K: Seal width t: Glass thickness a: LCD side length

L: Electrode pad length

1. General Glass chip:

1-1 Chip on panel surface and crack between panels:

z: chip thickness y: chip width x: chip length

z

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1-2 Corner crack:

z: chip thickness y: chip width x: chip length

z

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12. RELIABILITY

Test Item Sample Type Test Condition Test result determinant

gist

Normal temperature 703;240HHigh temperature

storage Broad temperature 803;240H

Normal temperature -203;240HLow temperature

storage Broad temperature -303;240H

Normal temperature 503,90%

3%RH;240H

High temperature

/humidity storage

Broad temperature 603,90%

3%RH;240H

the inspection of

Appearance and function

character.

Normal temperature 603;96HHigh temperature

operation Broad temperature 703;96H

Normal temperature 03;96HLow temperature

operation Broad temperature -203;96H

Normal temperature 403,90%

3%RH;96H

High temperature

/humidity operation

Broad temperature 503,90%

3%RH;96H

No objection of the function

character; no fatal objection of

the appearance.

Normal temperature -203,30min703

,30min;10cycle

inspect the objections

appearancefunction & the

whole structure

Temperature Shock

Broad temperature -303,30min

80

3,30min;10cycle

The inspection of appearance

function & the whole structure

Discharge modality:

Air discharge.Discharge voltage:

2KV/4 KV/6K

8KV/12KV/15KV

.no software error & objection

in 2KV~12KV,nohardware errors & objection in

15KV.

ESD test ALL

Discharge modality:

Contact discharge

Discharge voltage:

2KV/4 KV/6KV/

8KV

no software errors & objection

in 2KV~12KV,no

hardware errors & objection in

8KV.

Bend test ALL Bend velocity:

60time/min;

Bendtimes:50000tims

Stimulate the folders repeat

folding, no objection of display

functionVibration test ALL frequencyrange:10HZ~55

HZ;swing:0.75mm;Z-

axist direction: 60min.

the inspection of appearance

function & the whole structure

High

Temperature

braise test

ALL 120~123,100%RH,

1.2~2ATM;8H

The inspection of LCD(no

paster)samples' frame glue,

envelop glue and leakage of

LC.

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13. SUGGESTIONS FOR USING LCD MODULES

13-1. Handling of LCM

1. The LCD screen is made of glass. Don't give excessive external shock, or drop from a high place.

2. If the LCD screen is damaged and the liquid crystal leaks out, do not lick and swallow. When the liquid is attach to

your hand, skin, cloth etc, wash it off by using soap and water thoroughly and immediately.

3. Don't apply excessive force on the surface of the LCM.

4. If the surface is contaminated ,clean it with soft cloth. If the LCM is severely contaminated , use Isopropyl

alcohol/Ethyl alcohol to clean. Other solvents may damage the polarizer . The following solvents is especially

prohibited: water , ketone Aromatic solvents etc.

5. Exercise care to minimize corrosion of the electrode. Corrosion of the electrodes is accelerated by water droplets,

moisture condensation or a current flow in a high-humidity environment.

6. Install the LCD Module by using the mounting holes. When mounting the LCD module make sure it is free of

twisting, warping and distortion. In particular, do not forcibly pull or bend the I/O cable or the backlight cable.

7. Dont disassemble the LCM.

8. To prevent destruction of the elements by static electricity, be careful to maintain an optimum work environment.

- Be sure to ground the body when handling the LCD modules.

- Tools required for assembling, such as soldering irons, must be properly grounded.

- To reduce the amount of static electricity generated, do not conduct assembling and other work under

dry conditions.

- The LCD module is coated with a film to protect the display surface. Exercise care when peeling off this

protective film since static electricity may be generated.

9. Do not alter, modify or change the the shape of the tab on the metal frame.10. Do not make extra holes on the printed circuit board, modify its shape or change the positions of components to be

attached.

11. Do not damage or modify the pattern writing on the printed circuit board.

12. Absolutely do not modify the zebra rubber strip (conductive rubber) or heat seal connector

13. Except for soldering the interface, do not make any alterations or modifications with a soldering iron.

14. Do not drop, bend or twist LCM.

13-2. Storage

1. Store in an ambient temperature of 5 to 45 C, and in a relative humidity of 40% to 60%. Don't expose to sunlight

or fluorescent light.

2. Storage in a clean environment, free from dust, active gas, and solvent.

3. Store in antistatic container.

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14. PACKING

Packing Method

(1) (2)

(3) (4)

(5) (6)

(7) (8)

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1. Put module into tray cavity :

2. Tray stacking

3. Put 1 cardboard under the tray stack and 1 cardboard above:

4. Fix the cardboard to the tray stack with adhesive tape:

5

. Put the tray stack and 4 pcs desiccant into the LDPE bag

6. Fix the LDPE bag with adhesive tape:

7. Put LDPE bag with tray stack into carton.:

8. Carton sealing with adhesive tape.