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2013 iNEMI Roadmap
2013 Webinar Series
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About iNEMI
International Electronics Manufacturing Initiative (iNEMI) is an industry-led
consortium of 110 global manufacturers, suppliers, industry associations,
government agencies and universities. A Non Profit Fully Funded by Member
Dues; In Operation Since 1994.
Visit us at www.inemi.org
5 Key Deliverables:
• Technology Roadmaps
• Collaborative Deployment
Projects
• Research Priorities Document
• Proactive Forums
• Position Papers
Mission: Forecast and Accelerate improvements in the Electronics
Manufacturing Industry for a Sustainable Future.
2
Optoelectronics and
Optical Storage
Organic Printed
Circuit Boards
Magnetic and
Optical Storage
Supply Chain
Management
Semiconductors
iNEMI
Information
Management
TWG
iNEMI
Mass Data
Storage TWG
iNEMI / IPC / EIPC
/ TPCA
Organic PWB
TWG
iNEMI / ITRS /
MIG/PSMA
Packaging
TWG
iNEMI
Board
Assembly
TWG
Interconnect
Substrates—Ceramic
iNEMI Roadmap
iNEMI
Optoelectronics
TWG
Fourteen Contributing Organizations
iNEMI / MIG
/ ITRS
MEMS
TWG
iNEMI
Passives
TWG
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iNEMI Optoelectronics Roadmap
Tom Hausken
Dick Otte
Bill Bottom
Kim Kimerling
iNemi Roadmap, Optical Electronics Chapter
“Optical Electronic Data Transfer:
Technical Gaps, Needs and Non-Needs”
Richard Otte
TWG Chair Promex Industries Inc.
iNemi Webinar July 26, 2013
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Agenda
• iNemi OE Roadmap Overview
• Photons vs Electrons
• Application Needs
– Telecom
– Active Optical Cables
– Photonic Backplanes
– Microprocessor IO Bandwidth Density Need
– On-Chip Optical Interconnect
• Notions From the Roadmap Efforts
– Recent Potentially Important Innovations
– Potential Black Swans
iNemi OE Roadmap
Overview
7
Roadmap Sources
• iNemi Optical Data Communications Chapter
– http://www.inemi.org/2011-inemi-roadmap
• Collaborators
– MIT Communications Technology Roadmap
– International Technology Roadmap for
Semiconductors, Assembly & Packaging TWG
– IPC
– OIDA
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Table 17. In-to and Out-of Package - Key Atttribute Needs
Intended to cover Optical IO for SiP (System in a Package) for distance on-card and longer
Optical source in a separate die, on the chip or in the chip.
Year 2011 2013 2015 2017 2023
Data rate/lane, fiber or
waveguide, Gb/s
10 14 25 40 40
Optical media; fiber
waveguide
Fiber/ Some
Waveguide
Fiber/Waveguid
e
Fiber/Waveguid
e
Fiber/Waveguide Waveguide/Some
fiber
Optical wavelength 850/1350/1550 850/1350/1550 850/1350/1550 850/1350/1550 850/1350/1550
#I/O per chip 96 128 512 1024 8192
max #
wavelengths/waveguide
1 1 4 8 32
Wavelength spacing, nm NA NA 20 40 10
Optical power,
mw/wavelength
0.1 to 1.0 0.1 to 1.0 0.1 to 1.0 0.1 to 1.0 0.1 to 1.0
Optical mode; multi/single multimode multimode multimode/sing
lemode
multimode/single
mode
multimode/single
mode
Light Source; VCSEL, other
laser, in-chip, etc.
VCSEL VCSEL VCSEL/in-chip VCSEL/in-chip VCSEL/in-chip
Physical Modulation Method
(direct or secondary)
direct direct direct direct direct
Construction; hybrid,
Integrated, etc.
SiP SiP SiP/hybrid/sour
ce integrated in
chip
SiP/hybrid/sourc
e integrated in
chip
SiP/hybrid/source
integrated in chip
Optical off-package density;
Gb/s/mm2
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Optical Connector density;
Gb/s/mm2
45
Power/bit, pJ 20 10 <5 <3 <1
Transceiver cost, $/Gbs $ 2.24 $ 1.43 $ 0.92 $ 0.59 $ 0.19
Technology Status (ITRS format) Manufacturab
le solutions
exist, and are
being
optimized
Manufacturab
le Solutions
are Known
Manufacturab
le solutions
are NOT
known
Photons vs Electrons
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Photons vs Electrons for Data
Communications Photonic Electronic Comparison,
photonic/electro
nic
Waveguide/
conductor pitch
1 + 2 micron = 3
microns +/-
2 x 22 nm = 0.044
microns
1:68
Channels/mm 8 to 333
depending on
crosstalk &
cladding req’d
22,700 at 22 nm
node
1:2840 to 1:68
Bandwidth/chan
nel
128 x 40 Gbit/sec
= 5+Tbit/sec
10Gbit/sec 512:1 or more
Energy/bit Only Launch &
Receive losses,
2 to 25 pJ/bit is
SOA
As low as
0.1pJ/bit on-
chip. Greater
due to I2R + tan
delta with
distance.
Photons less if
distance greater
than a few cm
Cross coupling Easily eliminated Major Issue Photons win!
Application Needs
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Telecom Needs
• Drivers:
– Providing capacity with need growing +40%/yr.
– Minimizing Cost
– Increasing energy efficiency
– Providing more bandwidth to more users
• Solutions:
– Transmit more data through provisioned plant
• Lane data rates to 100 Gb/s, then 400, 1Tb/s, …. ??
• Greater spectral efficiency; 10 bits/Hz ?
– Stay in the Optical domain, especially to serve more end users
• Switch optically; avoid optical-to-electronic-to-optical conversions
– Develop a new network architecture to capitalize on optical capabilities
• Software defined network
• 1000 x 1000 switching
• No fixed wavelength grid
• Etc.
• Utilize Photonic Integrated Circuits (InP) ??
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Optical Data Communication & Telecom
• The Telecom View of optical technologies is evolving:
– OE was viewed as a long haul technology
– Increasingly, OE is viewed more broadly:
• An enabler of FTTX
• An energy and space saver
• An enabler of alternate architectures
– Implies much higher volumes and lower cost
implementations
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Active Optical Cables
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Figure 3: A 2010 Data Center requires about 25 megawatts of power so energy saving technology is
important.
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AOC:
An Optical Electronic Success
• Saves 75% of power and space
• Growing rapidly
• The Low Adoption RISK Accelerated Acceptance !!
– Could go back to copper if he did not work.
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Active Optical Cable Needs
• Drivers
– Reducing interconnect power
– Reducing interconnect size and space
• Solutions; Continuing Evolution
– More connector/electrical replacements
– Less power (@ ~10pJ/bit @ 10Gb/s, going to 25Gb/s)
– Smaller Size
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Photonic Backplane
Optical backplane
Daughter-board
Optical connector
Opto-electrical
connector
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Photonic Backplane Needs
• Driver
– Require less power and space at data rates > 10Gb/s than is required in an electronic backplane
– Electronics limited to ~20Gb/s at 1 meter
• Solutions
– A Physical Architecture that combines optical and electrical
– A robust optical & electrical card to backplane connector.
• Able to tolerate dust resulting from air cooling
– An architecture that eliminates the backplane
• PERC supercomputer “drawer” concept
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22
A. Shibata,
Japanese Electronics
Packaging
and Circuits Association
(JEITA)
Optical backplane
Daughter-board
Optical connector
Electric connector
Flexible optical circuit/
optical cables with connector
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24
25
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Microprocessor Bandwidth
Density Need • Drivers
– The ITRS Roadmap forecasts IO doubling every 2
years; 2.5Tb/s in 2012 to 80Tb/s (32X) in 2022.
– ITRS Roadmap 2022 Projection
• 40 Gb/s modulation/wavelength
• 40 watts for IO or 0.5pJ/bit.
• Density of 89Gb/s/mm2 IF a 30 mm x 30 mm package
• Cost of <$0.14/Gb/s
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Table AP 23 Optical IO for SiP (System in a Package) for distance on-card and longer.Year 2012 2014 2016 2018 2020 2022
Max Package I/O Data Rate, Gb/s 2,500 5,000 10,000 20,000 40,000 80,000
Max IO Power dissipation, watts 40 40 40 40 40 40
Optical media; fiber, waveguide, optical viaRibbon Fiber Fiber/Waveguide Fiber/Waveguide Fiber/Waveguide
Waveguide/Some
fiber
Waveguide/Some
fiber
Optical wavelength 850 850/1350/1550 850/1350/1551 850/1350/1553 850/1350/1551 1350/1551
Max Data rate/Optical Lane, Gb/s 10 25 25 25 40 40
max # wavelengths/waveguide 1 1 4 8 8 16
Max Data rate/Optical IO, Gb/s 10 25 100 200 320 640
Optical #I/O per package 250 200 100 100 125 125
Wavelength spacing, nm NA NA NA NA 20 5
Optical power, mw/wavelength 0.1 to 1.0 0.1 to 1.0 0.1 to 1.1 0.1 to 1.3 0.1 to 1.0 0.1 to 1.0
Optical mode; multi/singlemultimode
multimode/single
mode
multimode/single
mode
multimode/single
mode
multimode/singlem
ode
multimode/single
mode
Light Source; VCSEL, laser, in-chip, etc. VCSEL/hybrid VCSEL/hybrid VCSEL/in-chip VCSEL/in-chip VCSEL/in-chip VCSEL/in-chip
Physical Modulation Method (direct or
secondary modulators)direct direct direct direct direct modulators direct modulators
Construction; hybrid, Integrated, etc. SiP SiP
SiP/hybrid/sourc
e integrated in
package
SiP/hybrid/sourc
e integrated in
package
SiP/hybrid/source
integrated in chip
SiP/hybrid/sourc
e integrated in
chip
Optical off-package density; Gb/s/mm2 of
board space. 30 mm x 30 mm footprint2.8 5.6 11.1 22.2 44.4 88.9
Optical Connector density; Gb/s/mm of SiP
edge 4 x 30 mm21 42 83 167 333 667
Max Power/bit, pJ 16.0 8.0 4.0 2.0 1.0 0.5
Optical IO Cost, $/Gbs $ 1.34 $ 0.86 $ 0.55 $ 0.35 $ 0.23 $ 0.14
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Microprocessor Bandwidth
Density Need • Solutions of Interest
– Replace electrical differential pair IO with Optical Sources and Detectors; 1 data lane per optical IO.
• Add optical IO parts to CMOS substrate
• Source driver and TIA built into CMOS chip
• Build waveguides in PCB
– Separate Electronics and Photonics: Electronic Package on Photonic Interposer with optical multiplexing
• Source driver and TIA built into CMOS chip
• Integrate Optical sources, detectors, waveguides, multiplexers, demultiplexers into an interposer
• Build waveguides in PCB
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Fabrication Alternatives To Implement Microprocessor
Optical IO
I. Assemble Discrete parts II. Integrate on a Platform
Mounts on optically Enabled Daughter card With Waveguides and 45
o mirrors combined
With conventional copper traces. Optical connectors might be added at card edge.
0.6 mm solder ball on 1 mm pitch Quad photodetector chip, 0.25 x 0.5 mm Quad VCSEL chip, 0.25 x 0.5 mm Optical focus element to collimate light
$689/package 12.Tb/s 3.2 pJ/bit @ 40W $151/package 48Tb/s 0.8pJ/bit @ 40W
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Photonic Interposer
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Things Learned Re: Optical IO Implementation
• Assemblying hundreds of individual parts is expensive. • Electronic substrates are used to Increase pitch; they are spacial impedance matchers between chips
(~0.170 mm pitch) and circuit boards (1.0 mm). • VCSELs, PINs, waveguides and multiplexers are small compared to electrical IOs. • Microprocessor package size may be limited by the number of IO needed for power and ground. • De-multiplexers are relatively large (Is this always true ?) • When optical devices are made with integration, the cost depends only slightly on the # of devices per
unit area. • Cost and density views do not depend on SM or MM; space for either is available. • The Optical IO data rate is no longer space or size limited but multiplex/ demultiplex density limited.
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On Chip
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On-Chip Optical Issues
Optical, Potential Electrical, Now
Point to Point on Chip
Power 1 ? pJ/bit To 10 pJ/bit ~ 0.1pJ/bit up to 1 mm
Lane Density, pitch ~ 3 micron pitch ~ 0.044 micron pitch
Data Rate/”connection” 10 ? Tb/s per
waveguide
100 Gb/s per conductor
pair
On-to & Off-of Chip
IO Data density,
Gb/s/mm2
>10Tb/s/0.16 mm2 25Gb/s/mm2
Power 1 ? pJ/bit To 10 pJ/bit 0.8 pJ/bit (1V, 50 Ohm)
Data rate/IO 1Tb/s 20Gb/s
“Reach” Meters ~25 cm
Notions From The Roadmap
Efforts
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• The Optical Interposer concept • Continual Improvement in Ring Oscillator Technology • The demonstration of lasing in several new material systems • Multi core fiber • “Clear curve” fiber; 2mm radius
Recent Potentially Important Innovations
37
Potential Black Swans Implication
An All Optical Digital Signal
Regenerator
Unlimited regeneration in the optical
domain without conversion to the
electronic domain. Eliminate
amplifiers and their noise input.
A method of terminating and
connectorizing glass fiber as easily as
plastic optical fiber.
Major cost savings and increase in
applications.
An 95+% efficient converter of
electrical energy to narrow bandwidth
light that is easily modulated.
Power saving; implementation of
many proposed concepts.
An Architecture that utilizes free-space
for optical interconnect
New hardware architecture that,
ideally, is “better” than current
architecture.
Meta Materials Development What Unique Capabilities might
Emerge ?
Questions and Answers
39
20 Technology Roadmaps
39
Organic PCB Board
Assembly Customer
Optoelectronics Large Area, Flexible Electronics
Energy Storage &
Conversion Systems
Modeling, Simulation,
and Design
Packaging
&
Component
Substrates
Semiconductor
Technology
Final
Assembly
Mass Storage (Magnetic & Optical)
Passive Components
Information
Management
Systems
Test, Inspection &
Measurement
Environmentally
Conscious
Electronics
Ceramic
Substrates
Thermal
Management
Connectors
MEMS/
Sensors
Red=Business Green=Engineering Aqua=Manufacturing Blue=Component & Subsystem
Solid State Illumination
Photovoltaics
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2013 iNEMI Roadmap Webinar Series
For access to the link to the recording
for this webinar go to:
http://www.inemi.org/node/2036#rm
2013 Roadmap Pricing
• Full roadmap $3000*
(USB drive)
• Single chapter $ 500
(PDF download)
• Special pricing for research
institutes, universities, gov’t
agencies & non-profits
• Full roadmap $ 500*
• Chapter $ 100
* + $100 shipping outside North America
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www.inemi.org Email contacts:
Chuck Richardson
Bob Pfahl