MP4020

2006-10-27 1

TOSHIBA Power Transistor Module Silicon NPN Epitaxial Type (Fourd Darlington Power tTransistors in One)

MP4020

High Power Switching Applications Hammer Drive, Pulse Motor Drive and Inductive Load Switching • Small package by full molding (SIP 10 pins) • High collector power dissipation (4-device operation) : PT = 4 W (Ta = 25°C) • High collector current: IC (DC) = 2 A (max) • High DC current gain: hFE = 2000 (min) (VCE = 2 V, IC = 1 A) • Zener diode included between collector and base

Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Collector-base voltage VCBO 50 V

Collector-emitter voltage VCEO 60 ± 10 V

Emitter-base voltage VEBO 8 V

DC IC 2 Collector current

Pulse ICP 3 A

Continuous base current IB 0.5 A

Collector power dissipation

(1 device operation) PC 2.0 W

Collector power dissipation

(4 devices operation) PT 4.0 W

Junction temperature Tj 150 °C

Storage temperature range Tstg −55 to 150 °C

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

Array Configuration

Industrial Applications

Unit: mm

JEDEC ―

JEITA ―

TOSHIBA 2-25A1A

Weight: 2.1 g (typ.)

2

1

R1 R2

9

10

R1 ≈ 5 kΩ R2 ≈ 300 Ω

8

3 5

4

7

6

MP4020

2006-10-27 2

Thermal Characteristics

Characteristics Symbol Max Unit

Thermal resistance from junction to ambient

(4-devices operation, Ta = 25°C) ΣRth (j-a) 31.3 °C/W

Maximum lead temperature for soldering purposes

(3.2 mm from case for 10 s) TL 260 °C

Electrical Characteristics (Ta = 25°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Collector cut-off current ICBO VCB = 45 V, IE = 0 A ― ― 10 μA

Collector cut-off current ICEO VCE = 45 V, IB = 0 A ― ― 10 μA

Emitter cut-off current IEBO VEB = 8 V, IC = 0 A 0.8 ― 4.0 mA

Collector-emitter breakdown voltage V (BR) CEO IC = 10 mA, IB = 0 A 50 60 70 V

DC current gain hFE VCE = 2 V, IC = 1 A 2000 ― ― ―

Collector-emitter VCE (sat) IC = 1 A, IB = 1 mA ― ― 1.5 Saturation voltage

Base-emitter VBE (sat) IC = 1 A, IB = 1 mA ― ― 2.0 V

Transition frequency fT VCE = 2 V, IC = 0.5 A ― 100 ― MHz

Collector output capacitance Cob VCB = 10 V, IE = 0 A, f = 1 MHz ― 20 ― pF

Turn-on time ton ― 0.4 ―

Storage time tstg ― 4.0 ― Switching time

Fall time tf

IB1 = −IB2 = 1 mA, duty cycle ≤ 1%

― 0.6 ―

μs

Marking

I B1

20 μs

VCC = 30 V

Output

30 Ω

IB2

IB1Input

I B2

MP4020 JAPAN Lot No.

A line indicates lead (Pb)-free package orlead (Pb)-free finish.

Part No. (or abbreviation code)

MP4020

2006-10-27 3

Collector current IC (A)

hFE – IC

D

C c

urre

nt g

ain

hFE

Base current IB (mA)

VCE – IB

C

olle

ctor

-em

itter

vol

tage

V

CE

(V

) )

Collector-emitter voltage VCE (V)

IC – VCE

C

olle

ctor

cur

rent

I C

(A

)

Base-emitter voltage VBE (V)

IC – VBE

C

olle

ctor

cur

rent

I C

(A

)

Collector current IC (A)

VCE (sat) – IC

Col

lect

or-e

mitt

er s

atur

atio

n vo

ltage

V

CE

(sat

) (

V)

Collector current IC (A)

VBE (sat) – IC

Bas

e-em

itter

sat

urat

ion

volta

ge

VB

E (s

at)

(V

)

0.3 0.5 1 3 5 10 0.1

10

0.3

0.5

1

3

5

Common emitter

IC/IB = 500

25

Ta = −55°C

100

0.3 0.5 1 3 5 10 0.1

10

0.3

0.5

1

3

5

Common emitter

IC/IB = 500

25

Ta = −55°C

100

00 0.8 1.6 2.4 3.2

0.8

1.6

2.4

Common emitterVCE = 2 V

25Ta = 100°C −55

0 0

2 4 6 8

0.8

1.6

2.4

3 1 0.5 0.3

0.22

0.20

IB = 0.18 mA

Common emitterTa = 25°C

0

10000

100 0.03

Common emitter

VCE = 2 V

300

1000

3000

5000

0.05 0.1 0.3 1 0.5 3 5 10

25

Ta = 100°C

−55

500

00.1

0.3 1 10 30 100 3 300

2.4

0.4

1.6

2.0

0.8

1.2

Common emitterTa = 25°C

0.1

0.5

1.01.5

2.0

2.5 IC = 3.0 A

500

MP4020

2006-10-27 4

Ambient temperature Ta (°C)

PT – Ta

To

tal p

ower

dis

sipa

tion

PT

(W

)

Total power dissipation PT (W)

ΔTj – PT

Ju

nctio

n te

mpe

ratu

re in

crea

se Δ

T j

(°C

)

1 2 3 4 0

160

40

80

120

5 0

Attached on a circuit board(1) 1-device operation (2) 2-device operation (3) 3-device operation (4) 4-device operation

Circuit board

(1) (2) (3) (4)

rth – tw

Pulse width tw (s)

Tr

ansi

ent t

herm

al re

sist

ance

r th

(°

C/W

)

Collector-emitter voltage VCE (V)

Safe Operating Area

C

olle

ctor

cur

rent

I C

(A

)

0.001 0.01 0.1 1 10 100 1000 0.3

-No heat sink/Attached on a circuit board- (1) 1-device operation (2) 2-device operation (3) 3-device operation (4) 4-device operation Circuit board

(4)

(3)(2)

(1)

1

3

10

30

100

300 Curves should be applied in thermal limited area. (Single nonrepetitive pulse) The figure shows thermal resistance per device versus pulse width.

0.03 0.5

20

*: Single nonrepetitive pulse Ta = 25°C

Curves must be derated linearly with increase in temperature.

IC max (pulsed)*

10 ms*

1 ms*

0.05

0.1

0.3

0.5

1

3

5

10

1 3 5 10 30 50 100

100 μs*

VCEO max

0

8

40

2

4

6

80 120 160 200 0

(1) 1-device operation (2) 2-device operation (3) 3-device operation (4) 4-device operation Attached on a circuit board

Circuit board

(4)

(3)

(2)

(1)

MP4020

2006-10-27 5

RESTRICTIONS ON PRODUCT USE 20070701-EN

• The information contained herein is subject to change without notice.

• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.

• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk.

• The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.

• The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties.

• Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.