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MaPSA-Light Development (1)
March 2014
+ =
MPA-wafer
Sensor
or MPA-MPW
6”
or 8”
Nov 2013
MaPSA-Light Development (1)
March 2014
+ =
MPA-wafer
Sensor
or MPA-Light-MPW
6”
or 8”
NEW
Sensor-Light4”
MaPSA-Light Development (2)• Try also assembly without requiring compatibility with TSV option,
to have a best-case comparison basis
March 2014
MPA wafer
MPA wafer-level Test
Sensor wafer
Sensor test
Sensor UBM, bump, dice
MPA TSV Option
MPA UBM, dice
MaPSA assembly
MaPSA test
Chip foundry Sensor foundry Assembler 1 (TSV) Assembler 2 (no TSV) Assembler 3 (only TSV) HEP
Nov 2013
Chats with TSV-capable companies
• IPdia– Visit to CERN 15 Jan
• IMEC– Visit to IMEC 26 Feb
• Both agreed that 1000-2000$/wafer was a likely TSV processing price– (Si sensor 6” wafer price estimate: 1200 CHF)
• Both spontaneously proposed alternatives to TSVs for MPA-MPA interconnectivity
March 2014
Outer Tracker Layout Evolution
March 2014
Tilted Barrel is becoming baseline (no need for MPA z-interconnectivity anymore)
MaPSA-Light Development (2)• TSV compatibility becomes low priority
March 2014
MPA wafer
MPA wafer-level Test
Sensor wafer
Sensor test
Sensor UBM, bump, dice
MPA TSV Option
MPA UBM, dice
MaPSA assembly
MaPSA test
Chip foundry Sensor foundry Assembler 1 (TSV)
Assembler 2 (no TSV) Assembler 3 (only TSV)
HEP
NEW
MaPSA-Light Development (3)
8
Substrate
Strip sensor
Cooling
SSA
March 2014
MAPSA
Nov 2013
MaPSA-Light Development (3)
9
March 2014
NEW
PS module completely re-designed to cope with thermal load
MPA and bumps are between sensors !
10
Strip sensor
March 2014
CoolingPixel Sensor
…Plus: Cannot get bumped MPAs from TSMCBecause of mixed wire/bump bond requirement
- Why not shift constraint to more flexible sensor producer ?
Flipping the MaPSA upside down
11
Strip sensor
March 2014
CoolingPixel Sensor
Strip sensor
Cooling
Extended Pixel Sensor
Proposal
Nov 2013
MaPSA-Light Development (3)
• Pixel Sensor is extended to include passive routing edge and wire bond area– Can this be done in 6” and 8” wafer?
• MPA has an additional I/O bump row– Can bumped 12” MPA-wafer be tested?
• Assembler does only MPA dicing and flip chipping• MPA directly cooled (sensor cooled through MPA)• Pix sensor HV connection as in 2S module• No material between pix and strip sensorMarch 2014
Proposal
Extended Pixel Sensor
Generous Development Sequence
March 2014
MPA-Light design
Req Doc
RFQ
Study
OK
MaPSA-Light Report
MaPSA Test
Production
Production
Q12014
Q2 Q3 Q4 Q12015
Sensor-Light design
Nov 2013
Slipping Development Sequence
March 2014
MPA-Light design
Req Doc
RFQ
Study
OK
MaPSA-Light Report
MaPSA Test
Production
Production
Q12014
Q2 Q3 Q4 Q12015
Sensor-Light design
NEW
Flipped MPA
Flipped MPA
