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LHC Radiation Day, B. Dehning3 Location of Loss Detectors at IP8 At every element several detectors mounted on: cryostat support Detectors: Ionisation chambers Secondary emission left right
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29.11.2005LHC Radiation Day, B.
Dehning 1
Beam Loss Monitors
B. Dehning
29.11.2005LHC Radiation Day, B.
Dehning 2
BLM Locations in the Arcs
3 loss locations simulated: shower development in the cryostat, GEANT 3 & 4.
The positions of the BLMs are chosen to: minimize crosstalk reduce difference between inside and outside loss
BLM positionLoss location
29.11.2005LHC Radiation Day, B.
Dehning 3
Location of Loss Detectors at IP8
At every element several detectors mounted on:
cryostat support
Detectors: Ionisation
chambers Secondary
emission
N. Location IC SEM
1 BPMSW.1L8 1 12 MQXA.1L8 63 MQXB.A2L8 64 MQXA.3L8 65 TCTV.4L8.B1 1 16 TCLIA.4L8.B2 1 17 TCTH.4L8.B1 1 18 MBRC.4L8 1 19 MQY.A4L8 6
10 MQM.A5L8 611 TCLIB.6L8.B2 1 112 MQML.6L8 613 MQM.A7L8 614 MBA.8L8 6
MBA.8L8 615 MQML.8L8 616 MQM.9L8 617 MQML.10L8 618 MBA.11L8 6
MBA.11L8 619 MQ.11L8 6
20 MQ.12L8 621 MQ.13L8 622 MQ.14L8 623 MQ.15L8 624 MQ.16L8 6
N. Location IC SEM
1 BPMSW.1R8 1 12 MQXA.1R8 63 MQXB.A2R8 64 MQXA.3R8 65 TCDD.4R8 3 36 TCTV.4R8.B2 1 17 TDI.4R8 3 38 TCTH.4R8.B2 1 19 MBRC.4R8 1 1
10 MQY.A4R8 611 MQY.A5R8 612 MSIA.A6R8 3 313 MSIB.A6R8. 3 314 MQM.6R8 615 MQM.A7R8 616 MBA.8R8 6
MBA.8R8 617 MQML.8R8 618 MQM.9R8 619 MQML.10R8 620 MBA.11R8 6
MBA.11R8 621 MQ.11R8 6
22 MQ.12R8 623 MQ.13R8 624 MQ.14R8 625 MQ.15R8 626 MQ.16R8 6
left right
29.11.2005LHC Radiation Day, B.
Dehning 4
Ionisation chamber LHC Stainless steal cylinder Parallel electrodes separated by
0.5 cm Al electrodes Low pass filter at the HV input N2 gas filling at 100 mbar over
pressure Diameter 8.9 cm Length 60 cm Sensitive volume 1.5 l Voltage 1.5 kV Ion collection time 85 us
29.11.2005LHC Radiation Day, B.
Dehning 5
LHC acquisition board Current to Frequency
Converters (CFCs) Analogue to Digital
Converters (ADCs) Tunnel FPGAs:
Actel’s 54SX/A radiation tolerant.
Communication links:Gigabit Optical Links.
Surface FPGAs: Altera’s Stratix EP1S40 with 780 pins.
8 channels multiplexed
Redundant optical link
29.11.2005LHC Radiation Day, B.
Dehning 6
LHC tunnel card Not very complicated design: “simple” Large Dynamic Range (8 orders)
Current-to-Frequency Converter (CFC) Analogue-to-Digital Converter
Radiation tolerant (500 Gy, 1 1012 p/cm2) Bipolar Customs ASICs Triple module redundancy Reset time Integration time
V out
I +I -
ThresholdComparator
100 ns 100 ns to 100 s
29.11.2005LHC Radiation Day, B.
Dehning 7
Current to Frequency Converter and Radiation
Variation at the very low end of the dynamic range Insignificant variations at quench levels Radiation caused offset by DAC induced current compensation
CFC2-TOTAL-0Gy-1000Gy
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
1.0E+04
1.0E+05
1.0E+06
1.0E+07
1.E-11 1.E-10 1.E-09 1.E-08 1.E-07 1.E-06 1.E-05 1.E-04 1.E-03
I in [A]
f out
[Hz]
Ch2-CFC2-not-irr-1meas.Ch2-CFC2-not-irr-2meas.Ch2-CFC2-JFET-0GyCh2-CFC2-JFET-500GyCh2-CFC2-JFET-1000GyCh8-CFC2-not-irr-1meas.Ch8-CFC2-not-irr-2meas.Ch8-CFC2-JFETS-0GyCh8-CFC2-JFETS-300GyCh8-CFC2-JFETS-600GyCh4-CFC2-not-irr-1meas.Ch4-CFC2-not-irr-2meas.Ch4-CFC2-JFETS-0GyCh4-CFC2-JFETS-300GyCh4-CFC2-JFETS-600GyCh6-CFC2-not-irr-1meas.Ch6-CFC2-not-irr-2meas.Ch6-CFC2-JFETS-0GyCh6-CFC2-JFETS-300GyCh6-CFC2-JFETS-600GyCh8-CFC2-not-irr-1meas.Ch8-CFC2-not-irr-2meas.Ch8-CFC2-TOTAL-300GyCh8-not-irr-1meas.Ch8-not-irr-2meas.Ch7-not-irr-1meas.Ch7-not-irr-2meas.Ch5-not-irr-1meas.Ch5-not-irr-2meas.Ch3-not-irr-1meas.Ch3-not-irr-2meas.Ch1-not-irr-1meas.Ch1-not-irr-2meas.Ch1-CFC2-JFET-0Gy-not-irrCh1-CFC2-JFET-500Gy-not-irrCh1-CFC2-JFET-1000Gy-not-irrCh1-CFC2-JFETS-0Gy-not-irrCh1-CFC2-JFETS-300Gy-not-irrCh1-CFC2-JFETS-600Gy-not-irrCh1-CFC2-TOTA-300Gy-not-irr
Ch8-CFC2-TOTAL-0Gy-300Gy
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
1.0E+04
1.E-11 1.E-10 1.E-09 1.E-08 1.E-07 1.E-06I in [A]
f out
[Hz]
Ch8-CFC2-not-irr-1meas.Ch8-CFC2-not-irr-2meas.Ch8-CFC2-TOTAL-300Gy
Quench 7 TeV
Quench 7 TeV
2.5 pA to 1 mA50 nGy/s to 20 Gy/s
29.11.2005LHC Radiation Day, B.
Dehning 8
CompareCRCs
Secondary B Signal(256 bits)
S/W & TTLoutput
Check CRCvalidity
DeMux
1 2 3 … 8
Truncateextra/redundant bits
(leave 160 bits)
Status10-bits
Primary A Signal (256 bits)
Only CRC
(4 byte)
Only CRC
(4 byte)
Signal Select(A or B)
ErrorError
Error
Error
Check CRCvalidity
Error
Reception______________ _ _
Tx Check&Signal Choice
______________ _ _
Tunnel Status Check______________ _ _
Format Data
______________ _ _
LHC transmission check
Signal Select TableCRC32 check Comparison
of 4ByteCRCs
Output RemarksA B
Error Error Error Dump Both signals have error
Error Error OK Dump S/W trigger (CRCgenerate or check wrong)
Error OK Error Signal B S/W trigger (error at CRC detected)
Error OK OK Signal B S/W trigger (error at data part)
OK Error Error Signal A S/W trigger (error at CRC detected)
OK Error OK Signal A S/W trigger (error at data part)
OK OK Error Dump S/W trigger (one of the counters has error)
OK OK OK Signal A By default (both signals are correct)
At the Surface FPGA:
Signal CRC-32 Error check / detection
algorithm for each of the signals received.
Comparison of the pair of signals.
Select block Logic that chooses signal to
be used Identifies problematic areas.
Tunnel’s Status Check block HT, Power supplies
FPGA errors Temperature
29.11.2005LHC Radiation Day, B.
Dehning 9
Beam on FPGA, SEU & Transmission Errors check
Stop of transmission at 700 Gy (3 108
proton/s/cm2)
1. CRC errors on opt link B (red)
2. CRC A & B not equal (blue)3. CRC A errors (green)4. Loss of transmission B, A
(violet, blue)
29.11.2005LHC Radiation Day, B.
Dehning 10
Test Procedure of Signal Chain
Basic concept: Automatic test measurements in between of two fills
Measurement of 10 pA bias current at input of electronic Modulation of high voltage supply of chambers
Check of components in Ionisation chamber (R, C) Check of capacity of chamber (insulation) Check of cabling Check of stable signal between a few pA to some nA (quench level region)
Not checked: the gas gain of chamber (in case of leak about 50 % gain change, signal speed change – to be checked)
29.11.2005LHC Radiation Day, B.
Dehning 11
Some Specification Requirements DATA FOR THE CONTROL ROOM AND THE LOGGING SYSTEM
Loss rates normalized quench level, (energy and integration time-independent) (units need still to be defined)
Updated every second Allow frequency spectrum analysis Long term summation for comparisons with dose detectors
POST-MORTEM ANALYSIS Stored data: 100 - 1000 turns before post mortem trigger Average rates: a few seconds to 10 minutes before a beam-
dump False dumps
less than one per month (about 2 to 3 per month, simulations) BEAM 1/BEAM 2 DISCRIMINATION
If possible, higher tuning efficiency A set of movable BLM’s
29.11.2005LHC Radiation Day, B.
Dehning 12
Beam Dump at HERA
Aim of setup BLM system test Verification of Geant
simulation Beam losses dynamic
observations LHC measurement
setup 6 chambers in top of
internal dump 1 before and 1 after
the dump
29.11.2005LHC Radiation Day, B.
Dehning 13
Dose Measurements at the HERA Beam Dump
Protons: 1 1013
E = 920 GeV
Peak corresponds to 1.5 Gy
29.11.2005LHC Radiation Day, B.
Dehning 14
Dose Measurements at the HERA Beam Dump, zoom
29.11.2005LHC Radiation Day, B.
Dehning 15
SPS Ionisation Chamber Spectrum Response
Ionisation chambers:
H6 line measurements
HERA Dump Response to mixed
radiation field (chambers outside cryostat)
Comparisons with simulations (shown by H. Vincke)
Thesis M.Stockner SEM
Same procedure as for ion. ch.
BOOSTER PSI Thesis D. Kramer
Preliminary results longitudinal impact
29.11.2005LHC Radiation Day, B.
Dehning 16
Reserve Slides
29.11.2005LHC Radiation Day, B.
Dehning 17
LHC Bending Magnet Quench Levels, LHC Project Report 44
Quench energy density in SC coil
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
0.01 0.1 1 10 100 1000 10000 100000
loss duration [ms]
J/cm
3
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
Gy
Quench Energy [J/cm3] 7 Tev
Quench Energy [J/cm3] 450GeVdummy
Quench power in SC coil
1.00E-03
1.00E-02
1.00E-01
1.00E+00
1.00E+01
1.00E+02
1.00E+03
1.00E+04
0.01 0.1 1 10 100 1000 10000 100000
loss duration [ms]W
/cm
3
Quench Power[W/cm3] 7 TevQuench Power[W/cm3] 450 GeV
0.8 mJ/cm3 = 0.09 mJ/g (RHIC=2 mJ/g, Tevatron=0.5mJ/g)
38 mJ/cm3 = 5 mJ/g 5 mW/cm3 = 0.6 mW/g
(RHIC = 8 mW/g, Tevatron = 8mW/g)
29.11.2005LHC Radiation Day, B.
Dehning 18
Systematic Uncertainties at Quench Levels
relative accuracies Correction means
Electronics < 10 % Electronic calibration
Detector < 10 – 20 % Source, sim., measurements
Radiation & analog elec. about 1 %
fluence per proton < 10 - 30 %
sim., measurements with beam (sector test, DESY PhD)
Quench levels (sim.) < 200 %measurements with beam (sector test), Lab meas., sim. fellow)
Topology of losses (sim.) ? Simulations
29.11.2005LHC Radiation Day, B.
Dehning 19
Loss Levels and Required Accuracy
Relative loss levels450 GeV 7 TeV
Damage to components
320/5tran./slow
1000/25 tran./slo
w
Quench level 1 1Beam dump threshold for quench prevention
0.3 0.3/0.4 tran./slo
wWarning 0.1 0.1/0.25
tran./slow
Absolute precision (calibration)
< factor 2 initially: < factor 5
Relative precision for quench prevention
< 25%
Specification:
Accurately known quench levels will increase operational efficiency
29.11.2005LHC Radiation Day, B.
Dehning 20
TT41 Beam DUMP Beam Dump design
similar to HEARA dump
Dose for impact of 450 GeV protons