3907 RFcircuit Synthesis Webcast Mar28 07

7/31/2019 3907 RFcircuit Synthesis Webcast Mar28 07

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RF Circuit Synthesis forPhysical Wireless

Design


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Overview

Subjects

Review Of Common Design Tasks

Break Down And Dissect Design Task

Review Non-Synthesis Methods

Show A Better Way To Solve Complex Design Challenges

Audience

Designers Tasked With Rapid Development Of System Components


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RF Wireless Community

CABLE

CELLULAR

RFID

GOVERMENT

INSTRUMENTS

SATELLITE

WIFI

NAVIGATION

COMM DEVICES

Wireless Devices


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System Architecture

Starting from a system level view

Assemblies of component units constitute a system

The component parameters are generated by system requirements

Made up of one or more

Amplifier

Mixer

Filters: Microwave and Passive Lumped

Couplers/splitters Oscillators etc.

We start by breaking down tasks to individual modules Design of one or more require unique skills


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Todays Focus is on Four Design Tasks Microwave Filter Design

Lumped Passive Filter Design

Signal Control Elements

Matching for Optimum Power Transfer

Component Design Tasks


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The Non-Synthesis Method

Experience is required to choose topology, equivalentcircuits and strategy for failed performance

Links to physical realization is a manual process

Conversion to micro-strip, slab-line, strip-line etc.

Does not guarantee optimum design

Best performance, Component count, Size,Materials

Matching tools are limited i.e. Smith chart

Time and Resource Consuming

Hours, days, or even weeks to complete

Missed deadlines

Board Turns

Non Synthesis Techniques

To Manufacture

Select TopologyAnd

Components

OptimizeResponse

Met Goals

Convert ToPhysical Format

YES

NO

Build DeviceTest Device

EMSolver?

YES

NO

Met Goals

Met Goals

YES

NO

NO

YES

Strategy?

Strategy?


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Microwave Filter Design Task

2.4 GHz WiFi Front End Microwave Filter System Specifications / Goals

Frequency- 2350-2550 MHz

Insertion Loss- -2dB

Shape- Butterworth Order- 3


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Which topology is best?

Distributed Filters Exhibit Recurring Band Pass

Where and how many is a function of filter type

COMB filters have control over the band where

response is repeated

Filter Size varies

Cost-COMB requires a capacitor for each resonator

We have selected a Hairpin Design for this demonstration


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Settings

Select Z0, Order, Start-Stop frequencies

Select Resonator Zo

Select Tapped / Coupled


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Advanced-TLINE automatically converts to a physical form including

discontinuities, bends, chamfers, and steps


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Synthesized Hairpin Filter

Hairpin Filter with Modeled Microstrip Loss and Dispersion

Advanced TLINE


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Using Built-in Optimizer

Fine tune for the discontinuities, bends, loss, dispersion effects etc.


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Using Monte Carlo Determine Effect of Loss Tan

Effect of etching tolerance e.g. spacing

Effect of Er


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Measure Filter

TESTLINK

Compare to Simulation

Measured

EM

Modeled


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Performance Summary

Center Frequency 2450 MHz 2390 MHz

Bandwidth 200 MHz 260 MHz

Insertion Loss 2 dB 3.2 dB

$ Cost ? ~$0.50

Note: Know your substrate material especially ER and Loss Tan


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Link data to SPECTRASYS behavioral model

Po=1.2 dB

NF=0.1dB


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MFILTER- A better way

Classical synthesis shapes

Butterworth, Chebyshev, Elliptical etc.

Multiple topologies

Instant schematic and graphical updates

Coupled or Tapped input Multiple physical realizations e.g. stripline, microstrip, inverted microstrip etc. via

Advanced T-Line

Automatic compensation of vias, grounds, steps, and T-Junctions

Direct link to layout and EM simulation engine

Monte Carlo, Yield and what If analysis

Measurement of Device via TESTLINK


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Lumped Filter Design Task

70 MHz IF Filter

System Specifications / Goals

Frequency- 60-80 MHz

Insertion Loss- 0.5dB ?

Shape- Butterworth Order- 14 ?


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PASSIVE FILTER - A Better Way

Start With Filter Type Shape

Low-pass, High-pass, Band-pass,Band-reject

Shape

Butterworth, Chebyshev, Bessel,Elliptical etc.

Subtype

Eight physical formats

Some Formats Lend Themselves Better toWide or Narrow Responses

Note: Changes in schematic and graph when parameters arechanged is Instantaneous


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Which Shape And Subtype To Pick?

Component Count

Response BW, Group Delay

Out Of Band Response

Symmetry, Roll Off

Ease of Manufacture

Common Inductance or Capacitance

Balanced Circuit at a Buttons Click!



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Multiple Filter Shapes

Butterworth

Chebyshev

Bessel

Singly Terminated

For Diplexers etc.



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Settings

Input / Output Resistance

Not limited to 50 ohms or symmetricalimpedances!

Cutoff Frequencies

Filter Order

Specify Cutoff Attenuation

Common L or C for some filter types



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Response of Synthesized Shunt C Coupled Filter

Shunt C Coupled filter results in common inductor

Five Sections Chosen


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Using Standard Values Results in Shifted Response

Tune Standard Values for best results

Original vs. standard values


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Replacing Ideal Std Values with Manufacturers S-data

Increased insertion loss due to finite Qs of components

Be Mindful of SRF and Qs of Manufacturers Componentsand The Frequency range of their data

Original vs. S-data values


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Perform Layout and EM Simulation


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EM simulation with S-Data Parts

Use Co-Simulation to Fine Tune Standard Valued S-Data

Only a single EM simulation is requiredsince copper pattern is invariant

Filter with S-data specified parts

EM Filter with S-data specified parts


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Pad and Dielectric Effects

More prominent at higher frequencies, 500MHz Filter example shown

Er= 3.9, 4.5, 4.9

H=10mil

H=30mil

H=59mil


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Pad and Dielectric Effects

More prominent at higher frequencies

Co-Simulation feature is used to re-tune filter

EM std values

L=39Ca=5.6Cb=3.9Cc=18Ccd=3.6

EM std values otpz

L=39Ca=3.3Cb=2.4Cc=7.5Ccd=2.4

EM results in shift due to pad effects Std value tuning brings filter back


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Performance Summary

Center Frequency 70 MHz

68.1 Std Pts

67 MHz

Bandwidth 20 MHz

17.3 Std Pts

17 MHz

Sections 14 5

Insertion Loss 0.5 dB 3.9 dB

$ Cost ? ~$2.90 (16x$0.15)

Note: Know your substrate material especially ER and LossTan


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When S-Parameter File is Substituted For Behavioral Model In System Simulator

Note: 3db Additional Loss And Increase In Spur Level (below noise floor) And AnIncrease Of 0.11dB In Noise Figure


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PASSIVE FILTER- A better way

Classical synthesis shapes

Butterworth, Chebyshev, Bessel, Singly Terminated etc.

Multiple topologies


Single or Balance types Direct link to layout and EM simulation engine

Co-Simulation aides final optimization

Monte Carlo and Yield analysis



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Signal Control Design Task

What is Signal Control?

Distribution And Control Of Power Through The Use Of

Couplers, Splitters, Dividers, Attenuators, Baluns

Where Is It Used?

Power Monitoring, Amplifiers, Mixers, Power Combining,Beam Forming


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Signal Control Elements

Splitters

Single or Multi-section, 0 deg, 180 deg

Couplers

Lange, Backward Wave, Lumped

Power Dividers Distributed, Lumped

Balun

Attenuators


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SIGNAL CONTROL, a better way!

Topology

Selection of over 43 topologies

Splitters

Couplers Power Dividers

Baluns

Attenuators

Si l C l D i T k


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Settings

Selection of:

Impedance

Coupling Factor

Upper/Lower cutoff

Number of Sections Number of Outputs

Optimization Goals

I/O line lengths


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Si l C l D i T k


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Options

Create a Layout

Use Advanced TLINE to Convert to Physical Format

Si l C t l D i T k


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Options

Manufacturing Process

Select Physical Form

Switch between any of theprocesses (e.g. ideal tomicrostrip, stripline to microstripetc.)

Accounts for discontinuities,corners, steps etc.

Uses selectable substrate

definition

Si l C t l D i T k


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Conversion to Microstrip Causes Shift

Shift due to non-ideal models, losses, dispersion etc.

Re-optimize element parameters to specifications

Shift due to Microstrip

Si l C t l D i T k


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Layout Is Created By Checking Box in Options Tab

EM Simulation Is Performed To Verify Design Goals

Si l C t l D i T k


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EM Simulation Shows Difference In Isolation Between Output Ports

EMPOWERs Ability To Co-Simulate Allows The Tuning Of IsolationResistor For Optimum Isolation

Optimum R= 91 ohms instead of 100 ohms

Si l C t l D i T k


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SIGNAL CONTROL- A better way

Over 43 Topologies

Splitters, Couplers, Baluns, Attenuators

0 deg, 90 deg, 180 deg types

Multiple outputs, Multiple stages


Optimization of final process Direct link to layout and EM simulation engine





Matching Design Task


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Where is Matching used?

At Almost Every Interface Between Connected Components

Minimize Power Loss Between Entities


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Complex Matching Issues

Simultaneous Matching For Noise Figure, Input/Output, and Interstage

Difficult Using Manual Techniques, Especially For Conditionally Stable Device

Selected Part Meets Our Gain And Noise Figure Needs

NE52418



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Conditionally Stable

Simultaneous Input/Output Match Is Not Possible

Good News, Noise Figure Meets Our Goal With 50 Ohm Input



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MATCH A Better Way

Ideal For Complex MultistageMatching

Real Or Complex Terminations

File Based Complex Data ForTerminations / Devices

Multitude Of Available MatchingStructures

Lumped And Or Distributed



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Nominal Goals Met With Interstage Matching Sections



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Matching Network Incorporated Into Design

Use Advance TLINE

Converts To Physical Process

Includes Steps, Discontinuities, Vias, etc.



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Monte Carlo Analysis

Matching


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Optimize Circuit For Response And Match

Measure Pertinent Parameters

Frequency Range 2.2 GHz-2.6 GHz

Gain 30dB +/- .5 dB

Noise Figure 1.06 dB

Match


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Replacing Behavioral Model With Design

No Significant Change In Spur Or Harmonic Content

Noise Figure Improved by 2dB



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MATCH- A better way

Multiple matching networks and topologies

Mix and match between distributed and lumped networks

Match to real, complex and S/Y/Z files

Broadband matching, Multi-stage matching


Direct link to layout and EM simulation engine



Link Data To SPECTRASYS Behavioral Model

Summary


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Summary

Reviewed Of Common Design Tasks

Reviewed Non-Synthesis Methods

Showed A Better Way To Solve Complex Design Challenges

Synthesis

Incorporating Standard Values

Substituted Measured S-Data For Accuracy Optimized Performance

Layout And EM Simulation For Verification

Exported Data For Incorporation Into Higher Level Design

We Showed A Comprehensive Set Of Tools, In a Common EnvironmentFor Rapid Development, Improving Time To Market With Fewer Re-Designs

More GENESYS Web Resources


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More GENESYS Web Resources

Agilent GENESYS home page

http://www.eagleware.com

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Video product demonstrationshttp://www.eagleware.com/apps/eagleware_demos.html

Agilent GENESYS discussion Forumshttp://www.agilent.com/find/eesof-ewforum

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Documents

3907 RFcircuit Synthesis Webcast Mar28 07