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Copyright ©2011 SENJU METAL INDUSTRY CO.,LTD.
Fine Pitch Bumping Formation Application Fine Pitch Bumping Formation Application -- PPS & Micro ball PPS & Micro ball --
Sep.08.2011Senju Metal IndustryR&D center Kaichi Tsuruta
Role of Senju Micro Soldering Material
Support for The Development Support for The Development of High Density Packaging Technologyof High Density Packaging Technology
Trend of Semiconductor Packaging
Demand for The Development ofDemand for The Development ofMicro Soldering TechnologyMicro Soldering Technology
Solder Material for Semiconductor
Y2005 Y2010
Fine Pitch Trend and Micro Soldering Methods
Micro Solder Ball Mounting
80um Pitch
Y2015
120um Pitch 60um Pitch 35um Pitch
写真提供:長瀬産業株式会社様
100um Pitch
Solder Paste Printing
Senju PPS Method
25um Pitch
Y20XX
PPS: Pre-coated by Powder Sheets
The Current Method
Copyright ©2011 SENJU METAL INDUSTRY CO.,LTD.
MicroMicro--Solder Precoat Technology Solder Precoat Technology by Precoat by Powder Sheet (PPS)by Precoat by Powder Sheet (PPS)
Micro solder bump by PPS
25um Pitch
35um Pitch
Sample by NAGASE & CO., LTD
Peripheral PCB
75μmP
Micro solder bump for Peripheral PCB by PPS
Sample by Hitachi chemical
Those issues may be resolved by PPS
Comparison of Micro‐Solder Bump Technologies
Variation of Thickness
Printability for fine pitch patterns
Solder Paste
(Screen Print)
Voids
Expensive mounting toolBall mount
Accuracy of mounting
Plating Limitation of metal compositions
PPS=Precoat by Powder Sheet
Features of PPS method
Features of PPS method1. Applicable to fine pitch (25 µm Pitch)2. Solder bump height is usually apx.4‐6 µm with 1 st PPS and
apx.10 μm height with 2 nd PPS for a wafer with 40 µ m pitch. 3. Small variation of Bump Height
σ<1 for a wafer with 40 μm pitch 4. No need of solder mask or alignment tools
5. Applicable for a variety of solder alloy composition
Structure of PPS sheet
Powder size:5~10umPowder size and alloy composition are selective for each application
Solder Powder
Base sheet (PET)
5um~10um
View from top side
Adhesive layer
Top view of PPS sheet
Cross section view
25um Pitch
35um Pitch
Surface×500(Bird’s eye view)
X‐Section×2.0kSurface×500(Bird’ eye view)
After UBM After Solder bump
Solder Bump by PPS
25um
35um
Si‐Sub
Solder BumpUBM
Solder BumpUBM
Si‐Sub
Sample by NAGASE & CO., LTD
1. Contact PPS sheet with work then press with heat
PPS process‐1
PPS transfer temperature should be lower than the melting point of solder alloy.
Press with heat
Under plate (40℃)
2. Removing PPS sheet
PPS process‐2
Cleaning
3. Flux+Reflow, Cleaning
PPS process‐3
Reflow temperature is higher than the melting point of solder alloy
fluxReflow
PPS bonder φ320mm Max
Upper heat plate
Lower heat plate
PPS process for peripheral PCB
Cross section of PPS bump
Void inspection by X ray viewer
Less voids
Voids of PPS Bump
PCB size 30×30×0.8 mm
# of Electrodes 60×60=3600 pads
Pitch 200 µm
Diameter of each pad
120 µm
Test Board
Mechanism of PPS method
Fts < Fimc
Selective transfer, Selective solder bump
Solder bumpFimc IMC
Electrode, pad
PET
Adhasive layer
Solder powder
PPS sheetFts
Copyright ©2011 SENJU METAL INDUSTRY CO.,LTD.
Senju Micro Ball TechnologySenju Micro Ball Technology
The Success Factor for Micro Soldering
Micro Solder Ball
30um
50um
Flux for Micro Soldering
DELTALUX MB-T100
Reflow Oven for Micro Soldering
SNR-850MB CX-430 /for Clean Room
Solder Ball M705-50umFlux MB-T100Reflow Oven SNR-850MB
wafer 8 inchPitch 85 um# of Bumps 3200K
Work Size
Soldering Materials and Equipment85um Pitch/50um Ball Bumping
Senju Micro Ball Joint Experience
Paste Micro Ball Plating
Void ○ ◎ △
Coplanarity ○ ◎ ○
Repair × ◎ ×
Pitch size ○ ◎ ◎
Solder composition variation ○ ◎ ×
For Environment ○ ○ △
Operation cost ◎ ○ △
Advantage of Micro Solder Ball Bumping
0.1m
m
0.2m
m
0.3m
m
0.7m
m
0.8m
m
1.0m
m
Ball Diameter
BGA Ball
Senju Solder Ball Lineup
The diameter range of Senju solder products is from 40um to 1mm. Senju can supply various size of ball answering the needs of customer.
Micro Ball
0.04
mm
Senju standard Micro Ball tolerances is +/-3um.
Control Cpk, Cir Trend & SPC. at RFC, DRB, MRB System Completely
0.0001
0.00015
0.0002
0.00025
0.0003
0.00035
0.0004
Sig
ma(
Dia
)
3 6 9 12 15 18 21 24 27 30 33
Sample
Avg=0.000248
LCL=0.000123
UCL=0.000374
I nd ividua l Measurement of Sigma(D ia )
Diameter Diameter StdevStdev..
0.0695
0.06975
0.07
0.07025
0.0705
0.07075
AV
G(D
ia)
3 6 9 12 15 18 21 24 27 30 33
Sample
Avg=0.070169
LCL=0.069694
UCL=0.070645
I nd ividua l Measurement of AVG(D ia )
Diameter Mean.Diameter Mean.
1
2
3
4
5
6
CpK
(Dia
)
3 6 9 12 15 18 21 24 27 30 33
Sample
Avg=3.88
LCL=2.04
UCL=5.73
I nd ividua l Measurement of CpK(D ia )
* LAS M705 70um
Micro Ball Process Capability
2011 2012 2013
Micro Ball Manufacturing (HVM Method)45um 40um Under 30um
Micro Ball Technology (Special Method)20um Under 20um
Micro Solder AlloySAC,SC Low Temp.Bi,In,ZnSAC
New Micro Soldering Materials Cu,Ni core Ball
Senju Micro Solder Ball DevelopmentTechnical Roadmap
Aug. 2011
Micro Ball Recyclable PBF Package
Demand for LAS ( Low Alpha Solder ) Product
Wafer
Memory Cell
Soft error model chart
Alpha particleAlpha particle
Miniaturization and High density
Soft errorSoft errorITRS 2009 Edition
Year of production 2011 2012 2013 1014 2015
DRAM ½ Pitch(nm) 40 36 32 28 25
The alpha particle discharged from solder is an incidence in the memory cell. It ionizes and electron-hole pair is generated. The hole is pulled to the substrate side and the electron is pulled to the memory cell side. It is information 0 as for the state that the electron is filled in the memory cell part, the electron is information 1 in the memory cell part as for empty. The malfunction of information 1→0 occurs.
Substrate
Soft errorSoft error
⊕⊕ ⊖⊖
⊖ ⊖
Ionization effect is strong!
Solder
Senju LAS Materials
D50
5
10
15
20
25
5um
Targ
et
7um
Targ
et
9um
Targ
et
D 0
207
D 0
308
D 0
409
D 0
510
Raw
pow
der
Dis tribution
LAS Solder PasteFor fine pitch bumping for substrate, wafer
LAS Solder BallFor super fine pitch & stable volume bumping on substrate, wafer
LAS Super Fine Solder PowderFor flexible wiring, bumping, research material for future
Senju LAS Material
Senju LAS Micro Ball StandardDiameter and Tolerance : 40-110um ±3umAlpha count : 0.02cph/cm^2 or lessSolder Composition : M705(SAC305), M200(SnCu), SnPb
Senju Low Alpha Grade
( cph/cm^2 )0.0200.0100.002 0.005
G3(0.002<G3<0.005)
G2(0.005<G2<0.010)
G1(0.010<G1<0.020)
LASG4
(G4<0.002)
◆LACS-4000M(SUMIKA)Sample area:900~1000cm^2Counting time:72~99hourCounting gas:PR-10(Ar90%+CH410%)
LACS-4000M Model 1950
Gas Proportional Alpha Particle Counter
◆Model 1950(Alpha Sciences)Sample area:900~1000cm^2Counting time:72~100hourCounting gas:PR-10(Ar90%+CH410%)
Senju can provide low alpha solder material. We have many experiences of low alpha product manufacturing (Solder Ball, Solder Paste, Solder Powder, etc…).Raw materials may be sourced internally or externally to best meet customer’s preferred low alpha limitations.
HAS material
0
5
10
15
20
1 2 3 4 5 6 7 8 9 101112131415161718192021222324252627282930Lot No.
Alp
ha c
ount
, cph
/cm
2
HAS material
LAS material
0.000
0.005
0.010
0.015
0.020
1 2 3 4 5 6 7 8 9 101112131415161718192021222324252627282930Lot No.
Alp
ha c
ount
, cph
/cm
2
LAS material
Reference : HAS (Reference : HAS (HHigh igh AAlpha lpha SSolder) Materialolder) Material
Reference : LAS (Reference : LAS (LLow ow AAlpha lpha SSolder) older) MaterialMaterial『 Senju Product Standard 』
G1 : < 0.02cph/cm2
G2 : < 0.01cph/cm2
G3 : < 0.005cph/cm2
G4 : < 0.002cph/cm2
Ex. HAS SAC Solder
Alpha count revel→ about 7~12cph/cm2
Ex. 0.005cph/cm^2 grade of SAC Solder
Senju Low Alpha Control Ability
Selected RM group
LAS RM(With alpha count CofC)
Meltingblending
Ag, Cu
Rare Sn, Pb or alloy (Sn/Pb, SA,SAC..etc)
Puremetal
RM incoming Alloy casting
Alpha count inspection
Composition inspection
Inspection
OK
OK
LAS product manufacturing
MultiVendor
Sphere, powder, others
Solder Sheet
The Senju-LAS product is blended and inspected by itself.
LAS Blending, Inspection Flow
Micro Sphere & Powder Mfg and Develop’t Established on 2006/12/ 01
Manufacturing
Sales
HQ
Iwate Plant Iwate Plant (HVM Plant for BGA/CSP Sphere)
Tochigi Plant (R & D) Tochigi Plant (R & D) (Initial Sphere Build & Mother Plant)
Senju Senju GikenGiken, Miyazaki , Miyazaki (HVM Plant for Micro Sphere
SMIC has the Policy Securing Capacity at the HVM Factory SMIC has the Policy Securing Capacity at the HVM Factory Micro Ball Shall be Shipped from Tochigi or Miyazaki Micro Ball Shall be Shipped from Tochigi or Miyazaki
Akita
Senju System Technologies
Hanamaki
KoriyamaSendai
Hokuriku
Hiroshima
SaitamaTechnical Center
Fukuoka
Kansai
Miyazaki
Suwa
Kyoto
OsakaNagoya
Oita
Senju Micro Ball Business Continuity Plan
If you have any question for our products, please feel free contact us.
Thank you.
Contact Person:Sneju Taiwan BranchClement Chang ([email protected])Lewis Huang ([email protected])
Senju Metal Industry Co., LTD.