450 mm Industry Briefing · 2014. 6. 26. · Briefing Agenda Tom Jefferson 450 mm Program Manager. 13 July 2011 8 July 2011 450 mm Briefing ... ISMI ITB is nearing completion

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450 mm Industry Briefing

July 13, 2011SEMICON West


Opening Remarks

Richard YoungVice President of Manufacturing Technology

13 July 2011 3

Momentum is Accelerating

• Participation in the 450 mm Program has doubled in last 18 months

• Clear signals are coming from IC device makers

• Equipment supply base community is signaling a willingness to engage and support transition

• Interaction between the 450 mm consortium and industry is intensifying in pace and breadth

• Site expansion at the College of Nanoscale Science and Engineering (CSNE) is in preparation

13 July 2011 4

Supply Chain Alignment

• Silicon supply in good shape

• Test Wafer infrastructure– Cleaner and greater supply from SEMATECH

• 450 mm equipment delivered and capability expanding – New capability coming to CNSE/SEMATECH– New capabilities also expected at supplier sites – Collaborative cost sharing procurement model in pilot– Required capabilities in development now – most from

multiple providers

13 July 2011 5

Consortium Approach

• Key lessons learned from I300I comprehended– Learning is helping to accelerate timeline

• Collaboration will continue to be critical for a cost- effective and timely 450 mm transition

The consortium test bed helps enable a 60% reduction in time to standards versus 300 mm

13 July 2011 6

Consortium Roles Next Steps

• Consortia have been effective by creating a platform for consensus building to leverage experience and expertise of a larger community – 450 mm is an industry-wide transition for which we need all the best ideas

in play• Equipment development and demonstration testing: use lessons learned from

previous transitions and emphasize a balanced set of objectives – Involve supplier community through supplier training– Continuously refine performance metrics factoring emphasis on cost,

productivity, or process capability • Align the technology roadmap: collaboratively work with consortium members

on aligning the technology roadmap requirements for 450 mm introduction.• Publish performance objectives, schedules, and roadmaps providing the

semiconductor original equipment manufacturers (OEMs) the necessary input for collaboration

• Set aggressive but achievable resource conservation targets• SEMATECH will use its cost models with consortium members to evaluate,

validate, and align cost efficiency expectations for the 450 mm transition


Briefing Agenda

Tom Jefferson450 mm Program Manager

13 July 2011 8

July 2011 450 mm Briefing Agenda

• 2011 450 mm Program Overview

• 450 mm Process and Metrology Readiness– Silicon and Starting Materials– Test Wafer Operations– Equipment Development– Demonstration Test Methodology

• Summary and Key Messages

• Question and Discussion Session

13 July 2011 999

450 mm Consortium Mission StatementEnable a cost-effective 450 mm transition through coordination and

development of infrastructure, guidance, and industry readiness

450 mm Program Mission and Organization

MaterialsEquipment

Guidelines Testing

450 mm Program Scope

13 July 2011 10

450 mm Timeline - 2006–present

2006 2007 2008 2009 2010

450 mm Program launched

450 mm lot size (25)/carrier (FOUP)

defined

Wafer thickness defined (925 µm)

1st sc-Si wafers

1st sintered wafers

1st metrology tool

1st process tool

450 mm EPMs

2011

450 mm standards: loadport/FOUP/ wafers

NY funds 450 mm Program

1st wafers processed at supplier sites

13 July 2011 11

450 mm Progress - 2010–>2011

Jul-2010 Jul-2011Wafers ~440 wafers loaned to 25

suppliers•~750 wafers loaned to >40 suppliers

Equipment •3 450 mm tools operational or on order for consortium cleanroom•450 mm development underway for

13 July 2011 1212

450 mm Momentum is Accelerating

Record capex leads to 28% fab equipment growth in 2011, says SEMI

March 3, 2011: “…For the first time, SEMI's World Fab Forecast data identify seven facilities in the near future that are candidates for 450 mm readiness …”

Splinter Seeks Consensus on 450-mm TransitionMay 24, 2011: “…Applied will step up its 450-mm-related equipment development … will have its 450-mm tools ready ‘when the customers need them’…”

TSMC KICKS OFF 450 mm WAFER FAB PLANFebruary 11, 2011: “…to invest in 450 mm wafer fab, slated to come on line in 2015 after entering into pilot run in 2013 …”

13 July 2011 13

05

1015202530354045

Dec'09 Jul'10 Dec.10 Jul'11

# CompaniesEngaged with450mm Program

Engaged: Providing equipment, materials, or services to the 450 mm Program

450 mm Momentum is Accelerating

13 July 2011 1414

Recent 450 mm Progress

Q2’11

FOUPs/MACs

450 mm Stocker

13 July 2011 151515

450 mm Program Strategy and Projected Scope

~30 tools for test wafer generation

15–20 test wafer tools mature enough to be demo tools

~80 additional

demo tools

supportsSilicon and Test Wafer Generation

1IDM Equipment Selections for 450 mm Pilot

Lines

4

Equipment Demonstration

2Equipment

Development+ =

3

450 mm Consortium Scope

13 July 2011 16

Expanded Cleanroom Capacity at CNSE


Silicon and Starting Materials

Mike Goldstein (Intel)

13 July 2011 18

450 mm Silicon Supply Update

• Silicon suppliers have installed 450 mm dedicated equipment and are manufacturing developmental test wafers in large volume, improving the wafer quality.

• Hundreds of wafers have been shipped successfully in multi application carriers (MACs).

• Cleaning methodology has been improved. Current 90 nm particle levels are below 200 per wafer. Further improvement is expected after tools enabling detection

13 July 2011 19

Wafer Geometry - Kuroda Precision Industries

SORI 12.1um GBIR 0.686um

ERO - Start -0.108m

Cross PV 0.540um

13 July 2011 20

Wafer Geometry- Kobelco

13 July 2011 21

Improved Mechanical Test Wafers

• NMM has developed an improved mechanical test wafer with a sag similar to single crystal wafers.

21

240°ring support

120°

5Φ450/Φ440

Shape of supporter

Gravitational sag measurement system

13 July 2011 22

450 mm Wafer Bank

• The 450 mm consortium offers wafer loans to suppliers for development of 450 mm equipment and components.

• Initiated in Q1’08, the Wafer Bank has provided a total of 720 wafers to over 40 different organizations.

• The Wafer Bank is currently transitioning from bare wafer loans to processed wafers in support of tool development.

22

13 July 2011 2313 July 2011 23

Quartz Crucibles• Single crystal silicon ingots are pulled out of molten silicon in a quartz

crucible.

• 450 mm crystal growing brings new challenges in size and robustnessfor crucible manufacturers. For the same crystal length as a 300 mm ingot:

– The polysilicon charge required to grow the ingot is ~2.4x larger.– The crystal pull time is almost double.

• Several companies are manufacturing quartz crucibles. I would like to recognize the help of Japan Super Quartz and Heraeus Quarzglas who were supportive of the program from the beginning.

23

13 July 2011 2413 July 2011 24

Quartz Parts • Quartz parts are an essential component of the IC manufacturing cycle.

• There are two aspects in quartz manufacturing:– Raw materials – tubes, rods, clear and opaque solid materials produced from high purity natural

or synthetic quartz– Components fabrication, hot and cold – diffusion tubes and boats, domes, rings, windows…

Components are fabricated according to OEMs’ designs, using lathes, machine center special fixtures, annealing furnaces, and cleaning baths.

• We would like to recognize the support of two companies in the development: Tosoh Quartz and Heraeus Quarzglas:

– Tosoh Quartz has supplied quartzware to the semiconductor industry since the 2” wafer generation and is working with OEMs on 450 mm designs and prototypes. Equipment and facilities are ready to support 450 mm wafers manufacturing and cleaning for install (CFI).

– Heraeus Quarzglas is the largest vertically integrated quartz glass producer in the world for natural and synthetic quartz glass. Currently Heraeus is preparing for 450 mm wafer generation both with raw materials and fabricated parts.

24

13 July 2011 2525

Quartzware Scaling

200 mm 200 mm 300 mm 450 mm300 mm 450 mm

13 July 2011 26

Summary

• We are engaged with materials suppliers to support 450 mm development needs.

• The silicon supply line is in good shape.

• Consortium ongoing activities include– Materials to enable process test wafer generation activities– Continued silicon suppliers benchmarking – Supporting suppliers’ quality continuous improvement programs – Working with the SEMI silicon wafer committee to generate

a 450 mm prime wafer spec

26


Test Wafer Operations

Sang-dong Kwon (Samsung)

13 July 2011 28

• Current Consortium Cleanroom Operations• Wafer Quality Improvements• Infrastructure Plans• Summary

Overview

13 July 2011 29

Consortium 450 mm Operations

Wafer Sorter

SC1/SC2 cleaning at high particle removal

efficiencies

Enables cleaner silicon shipping

Automated, clean, safe wafer handling and notch

alignment

FOUP WasherWet Clean Tool

13 July 2011 30

Consortium 450 mm Metrology

Enables defect measurements down to 90 nm

Enables thickness measurements for dielectric materials

Defect/Edge Inspection Thin Film Thickness

13 July 2011 31

450 mm Wafer Quality is Improving

2010: >3000 defects/wafer 2011:

13 July 2011 32

450 mm Stocker• Scheduled for installation in consortium

cleanroom in August– Enables tracking of stored in-process WIP

and empty carriers

450 mm PGV Improvements• Ultra-narrow person-guided vehicles

(PGVs) developed and in use in consortium cleanroom– Critical for safe 450 mm operations– Reduces the required loading space– Dual-side operations compatible with

SEMI-compliant FOUPs and MACs

Improved Consortium 450 mm Infrastructure

13 July 2011 33

Summary

• Increased consortium cleanroom operations have resulted in cleaner wafers and better wafer shipping.

• The 450 mm Program is supporting multiple centralized metrology operations.

• Factory infrastructure components to enable safe and secure 450 mm operations are being implemented now.

• Requests for wafer loans are rapidly increasing.


450 mm Equipment Development

Tom Abell (Intel)

13 July 2011 35

Test Wafer Infrastructure

• New capabilities coming to CNSE cleanroom.• New cost-sharing procurements have been made

in three significant areas.• Collaborative experiments are expanding with

multiple suppliers for tool development and test wafer processing.

• Requests for Information across the tool set are being sent to understand test wafer and demonstration tool plans.

• Patterning strategy has been defined for early test wafer generation and demonstration paths.

13 July 2011 36

New Capability Coming to CNSE

• 450 mm-capable manual 4-point probe from CDE tested on metal-deposited 450 mm wafers– Shipment expected within weeks

13 July 2011 37

New Cost-Sharing Equipment Coming to CNSE

• LPCVD equipment for poly/nitride deposition from EugeneTech has been selected for cost sharing– Tool under construction for end-of-year qualification

• Advanced defect detection metrology from Hitachi Hi- Tech has been selected for cost sharing– Tool will be capable of

13 July 2011 38

Collaborative Experiments

• Work is continuing with tool types external to the consortium– TOX, wet cleans, wet oxide etch, defect inspection, VPD metals

measurement, ellipsometry, PECVD oxide

• Experiments are underway and results from new tool types being received– Plasma oxide etch, metal deposition, nanoimprint

• New test wafer capabilities have been identified for experiments– Implant for resist damage, post-ash wet clean, wet poly etch

• New capabilities are being actively investigated

13 July 2011 39

Recent Test Wafer Results

notch

SiO2 rate

Plasma etch of blanket PECVD Oxide

Thermal oxide growth

Average: 457.8 nmUniformity: 21.0nm(3), ±3.3%

notch

SiO2 thickness(nm)

2nd run of PECVD OxideOxford Instruments

Wet oxide etch

Artifact from previous film

13 July 2011 40

450 mm Test Wafer Generation - Proof of Concept and Capabilities Sought

Capabilities Tested and Proven:>90 nm defect detection – at CNSESC1/SC2 wet cleans – at CNSEAdvanced particle wet clean – at supplierAdvanced wet oxide etch – at supplierManual ellipsometer – at ISMI and at supplierManual 4-point probe metrology – to ship to CNSEThermal oxide – at supplierPECVD oxide – at supplierOxide etch – at supplierVPD metals measurement – at labAdvanced defect detection – at supplierTi metallization – at supplierCoater – at supplierNIL – at supplierDielectric dry etch – at supplier

Capabilities ready to be tested:Implant for photoresist damage – at supplierPost-ash wet clean – at supplier

Capabilities to be Built and Shipped to Consortium:60% capabilities shown, ready to test or being built

13 July 2011 41

Cost-Sharing Overview

• The consortium recognizes that the historical financial risk model for funding a wafer size transition is no longer relevant

• Risk sharing with tool suppliers is expected to realize the 450 mm transition– Cost sharing is the planned mechanism to lower the financial risk– Realistic cost for building tools is expected

• Request for Information (RFI) is the first step towards cost sharing– Initial discussion format to cover entire development scope through

demonstration tools – Preparation for cost-sharing selection process

13 July 2011 42

RFI Progress• 13 RFIs sent to suppliers to cover 15 capabilities:

– TOX, PVD Ti/TiN, wet particle cleans, wet oxide etch, wet post-ash clean, dielectric etch, ash, dielectric CMP, track, CD SEM, nanoimprint, automated dielectric film metrology, HE implant, MC implant, HC implant

• 5 RFI’s in review to be sent soon:– Solvent cleans, backside cleans, TXRF, Cu barrier/seed, Cu plating

• 10 RFI’s planned for the near future:– Standard lithography, defect review SEM, metal film thickness (pump-

probe), coater for nanoimprint, optical CD, implant metrology, automated 4- point probe, stress/bow, metals CMP, PVD Ni, W dep

Sample of returned timelines for test wafer and demonstration toolsCapability Now Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

Wet CleansThermal Oxide

PVDAshCMP

ETCHCD SEM

NanoimprintDiel. Flm Thk.

Test Wafer Tool Demostration Tool

Availability --> 2011 2012 2013

13 July 2011 43

Consortium Patterning Strategy

• Nanoimprint technology (NIL) for test wafer generation with demonstration roadmaps–

13 July 2011 44

EVG Step and Repeat Imprint Approach

450 mm S&R Imprint Flow

EVG 770 Gen II NIL Stepper

Step and RepeatUV NIL (hard and soft stamps)

EVG101

Resist ProcessingCoatResist Stripping

Imprint die x on wafer

Cure imprint polymer and de- emboss template

Move to next die and

imprint again

13 July 2011 45

EVG770 Gen II NIL Stepper 450 mm Wafer Processing

450 mm wafer loaded on the EVG770 wafer stage.

Imprint die x on wafer

Cure imprint polymer and de- emboss template

Move to next die and imprint

again

13 July 2011 46

World‘s First 450 mm Step and Repeat Imprinted Wafer with 35 nm Features

450 mm wafer with 12 imprinted die next to a 300 mm ruler. The replicated structures are 35 nm half-pitch line and space structures 50 nm deep using EVG’s proprietary high resolution hybrid stamp

technology.

High resolution replica of the circular hybrid stamp. The 4 boxes contain the 35 nm high

resolution features

Close up of a 35 nm line and space box with 10x magnification

13 July 2011 47

Metrology of Imprinted Features


450 mm Demonstration Test Methodology

Yi-Lang Wu (tsmc)

13 July 2011 49

Purpose and Benefits of the 450 mm DTM

• Purpose– Enables data-based device maker equipment selection for

450 mm pilot lines

• Benefits– Clear and consistent procedures

• testing methodology• data collection tools• reporting

– Tests items scaled up for wafer size transition with focus on the functionality required for demonstration

– Test methodology for supplier self-assessment before an EMA

13 July 2011 50

A.24. Manf. Goals

A.22. FIMA

EMA Appendix 1 Characteristic

Checklists

A.1 Design SpecPassive Data Coll.

Mech. Dry Cycle

Gauges Studies

Test Planning

Marathon Tests

Sensitivity (DOE)

Demonstration Test Method (DTM)

Equipment Maturity Assessment (EMA)

Baseline Characterization

Demonstration Testing

1 2 3

DTM Scope

Results of an EMA will define the appropriate level of testing

13 July 2011 51

ReportedResults

DTM

ReportsResultsChecklists

Checklists

Checklists

Data Collection

Assessments

Tests

Evaluations

Foundations

Foun

dation

s

DTM/EMA

Feedback

What’s Important

User, Working, &Advisory Groups

Supplier Input

Known orExisting Data

DTM – Demonstration Test Method

1. Performance2. Standards3. Guidelines

Expected Results

Planning

Method/Approach

Equipment Demonstration - Process Overview

13 July 2011 52

450 mm DTM Supplier Training• Oct 17, 2011– EMA/DTM training for suppliers at ISMI

Manufacturing Week, Austin, TX

• Dec (date TBD) – EMA/DTM training for industry and suppliers at SEMICON Japan, Makuhari Messe

• Supplier participants will learn the demonstration testing process in detail through interactive training:

– Supplier responsibilities– Consortium responsibilities– Test goals and procedures– Test reports and documentation


Closing Remarks and Key Messages

13 July 2011 54

The Case for Collaboration

Success of the 450 mm transition depends on comprehensive industry-wide collaboration

Consortia and related groups have historically been effectiveCollaboration

- Is a cost-effective approach for pre-competitive development- Leverages the expertise and experience of the larger community

- Aligns participants on common goals and timelines

Governments Suppliers

IC Makers Universities

13 July 2011 55

Materials and Contact Information

• Materials from today’s meeting can be found at the following URL: http://ismi.sematech.org/meetings/archives/450 mm

– Document should be posted by end of July 13.

• To obtain further information or to engage in opportunities with the 450 mm Program:

Tom Jefferson450 mm Program [email protected]

13 July 2011 5656

Key Messages

• 450 mm Readiness is increasing in all areas of the supply chain and progress is accelerating rapidly

• Solutions for many of the capabilities required to enable the transition are now in development – most from multiple providers

• Collaboration will continue to be critical for a cost effective and timely 450 mm transition

13 July 2011 57

450 mm Forecast is Positive

Key Messages, cont.

13 July 2011 5858

Closing Thoughts

“Don’t be encumbered by history. Go off and do something wonderful.”

- Robert Noyce

“Coming together is a beginning; keeping together is progress; working together is success.”

- Henry Ford

19 July 2011 59

13 July 2011 60

Questions and Discussion

450 mm Industry BriefingOpening RemarksMomentum is AcceleratingSupply Chain AlignmentConsortium ApproachConsortium Roles�Next Steps Briefing Agenda�July 2011 450 mm Briefing AgendaSlide Number 9450 mm Timeline - 2006–present450 mm Progress - 2010–>2011450 mm Momentum is AcceleratingSlide Number 13Recent 450 mm Progress450 mm Program Strategy and Projected ScopeExpanded Cleanroom Capacity at CNSESilicon and Starting Materials450 mm Silicon Supply UpdateWafer Geometry �- Kuroda Precision IndustriesSlide Number 20Improved Mechanical Test Wafers450 mm Wafer BankQuartz CruciblesQuartz Parts Slide Number 25SummaryTest Wafer OperationsSlide Number 28Slide Number 29Consortium 450 mm Metrology450 mm Wafer Quality is ImprovingSlide Number 32Summary450 mm Equipment DevelopmentTest Wafer InfrastructureNew Capability Coming to CNSENew Cost-Sharing Equipment Coming to CNSECollaborative ExperimentsRecent Test Wafer Results450 mm Test Wafer Generation�- Proof of Concept and Capabilities SoughtCost-Sharing OverviewRFI ProgressConsortium Patterning StrategyEVG Step and Repeat Imprint ApproachEVG770 Gen II NIL Stepper 450 mm Wafer ProcessingWorld‘s First 450 mm Step and Repeat Imprinted Wafer with 35 nm FeaturesMetrology of Imprinted Features450 mm Demonstration Test MethodologyPurpose and Benefits of the �450 mm DTMDTM ScopeSlide Number 51450 mm DTM Supplier TrainingClosing Remarks and Key MessagesThe Case for CollaborationMaterials and Contact InformationKey MessagesSlide Number 57Closing ThoughtsSlide Number 59Questions and Discussion

Documents

450 mm Industry Briefing · 2014. 6. 26. · Briefing Agenda Tom Jefferson 450 mm Program Manager. 13 July 2011 8 July 2011 450 mm Briefing ... ISMI ITB is nearing completion