Training09

Typewritten Text

620.1126bro

592 Index

Brittle, 3, 83, 106, 152, 172-186, 232, 511, 519

Brittle behavior, 106 Brittle cleavage rupture, 247 Brittle crack, 171 Brittle fracture, 92, 99, 106, 108, 148,

239,243,292,318,332,334 Brittleness, 297 Bubbles, 471 Buckle, 304 Buckling, 305 Buckling strength, 304 Burning, 45 Burns, 4

C coated with boride ofTi, Zr, Hffiber, 326 C coated with carbides fiber, 327 C coated with Ni fiber, 327 C coated with Si02 + SiC fiber, 327 C coated with TiB fiber, 327 C fiber, 326-328 C-mode scanning acoustic microscopy

(C-S~l, 385-386 C scan, 300 Carbides, 4, 63 Carbides of Nb, Ta, W fiber, 530 Carbon, 288, 297 Carbon (graphite, amorphous Cl fiber, 326 Carbon fiber--epoxy resin, 301, 304, 306,

308 Carbon fiber--epoxy resin laminate, 300,

302 Carbon-fiber-reinforced composite, 316 Carbon-fiber-reinforced polycarbonate,

316 Carbon-reinforced poly(amide-imidel, 317 Carbon tetrachloride, 49 Carburization, 512-515 Carcinogens, 49 Case-hardened, 4, 45 Case studies, 459 Cast iron, 4 Casting, 4, 473 Catastrophic fracture, 108, 109 Cathode, 51, 59 Cathodic cleaning, 48, 50-52, 58, 59 Cathodoluminescence, 395 Causes of failure, 3-6 Caustic embrittlement, 3 Cavitation, 4 Cavities, 494, 496 Cellulose acetate, 33, 46, 58, 59, 62 Centrifugal force, 475, 482 Centrifugal stress, 469 Ceramic matrix composite (CMCl, 291,

319,320,323 CF8C stainless steel, 529 Chalk, 245 Charpy test, 47, 146,215,268,273,274,

279,283 Check valve, 522 Chemical characterization, 388, 389 Chemical damage, 43, 44 Chemical etching, 52

Chemical potential, 329 Chemical-etch cleaning, 48 Chevron marks, 107,240,249 Chevron pattern, 107,240 Chip carrier, 369 Chip-scale packaging (CSPl, 404 Chlorofluorocarbon, 441 Chlorine, 56 Chord length, 478 Chromatic aberration, 9, 397 Chromic acid, 54, 60, 71 Chromium plating, 508 Clamshell marks, 251 Cleaning, 31, 57, 58, 61, 70 Cleaning for electronic packages, 449 Cleavage, 5, 63-66, 128-134, 136--141,

167,190,268,279,369,370,495, 512, 515

Cleavage fracture, 129 Cleavage plane, 133-137, 171,279 Cleavage step, 134 Cleave, 126 Close-packed directions, 123 Close-packed planes, 123 CMOS, 343, 356 Coalescence, 316 Coating, 321

.Coating breakup, 331 Coefficient of thermal expansion (CTEl,

329,369,423 Cold solder joints, 423 Cold-worked condition, 462, 464, 465,

467,503,507 Collimate, 8 Compact tension specimen, 320 Composition, 4 Compressed air, 45, 58 Compressive fracture, 306 Compressive prestressing, 323 Compressive strength, 297, 304, 305 Conchoidal marks, 175-178,251,253,

256,258,260,261,265,276 Condenser lens, 8 Connector, 425, 427, 428, 434 Constraint, 89, 92 Contacts, 427, 428 Contamination, 343, 366, 367, 370, 371,

392,396-398 Continuous fibers, 293 Copper traces, 414, 415, 420 Core, 318 Corrosion, 5, 48, 52, 53, 56, 188, 344, 358,

362,364,368,384,428,431,434, 435,466,468,501,506,507

Corrosion fatigue, 3, 44, 48 Corrosion inhibitors, 54, 58 Corrosion pit, 316 Corrosion products, 42, 50, 59, 212,223,

460,461,463,467 Corrosion-assisted fatigue, 66, 188, 189 Coupling agent, 303 Crack, 4, 109,408,412,415,422,430 Crack arrest, 337, 338 Crack blunting, 164,301

Crack closure Crack coalesc Crack deflect Crack detecti Crack front, I Crack growtn Crack impedi Crack initiati Crack nuelea Crack openin Crack propa~

140,154, 187,336,

Crack spread Crack tip, 45 Crack tip int Cracked cone Craters, 436 Crazing, 297 Creep, 3, 55, Creep cavitie Creep curve, Creep deforn Creep fractu Creep rate, 1 Creep voids, Critical reso! Critical reso:

125, 12S Critical strel Cross-linkin, Cross slip, 1 Crows-feet D

Crushed res Crushing, 2! Crystalline, Crystallogrf Crystallogn Cup-and-cOl

240,24; Curling, 22' Current in j Curve trace Cut conduc1

Cutting, 29 Cycle ratio,

Damagera' Datum pIal Dealloying, Debonding

321, 3~ Debris, 31,

70, 21~

Decarburil DecohesioI Defects, H Deformati'

Delaminat 340,3 410,4

Delta ferr: Dendrites

467

Fiber-rein! compo

Fiber-rein! 293, 2~

Fiber split Fiber stree Fiber sUrfl Fiberglass Fibrillar, 2 Fibrillatiol Fibrous &1 Fibrous zo

271,5 Filet weld. Filter, 9 Fine topo~

Fins, 4 First-level Fishmoutl Flame cut Flashover, Flat failw Flat fractl Flex failul Flex fatigl Flex kink Flex split, Flexible P Flexural f Flip-chip, Fluoresce Flutes, IE Flux, 467 Fluxes in Flywheel Formatio: Fourier tJ

trosc, Four-poir Forward

(FBS Fractogrl Fracture· Fracture Fracture Fracture Fracture Fracture Fracture Freezing Freon, 4~

Fretting Fretting Frosty j(

Gage ler Galling, Galvani: Gate, 3"1 Gate old Gate old Glass, 2 Glass til

596 Index

Icicle, 443 Image, 9 Impact, 4, 47, 154, 517 Impact energy, 268 Impact fracture, 135,274 Impact samples, 104, 263, 268 Impact test, 268, 272 Impregnation, 530 In situ composites, 329 Incipient melting, 181 Inclusions, 4, 49, 52, 144, 147,258,350,

490,491,495,498,516 Index of refraction, 10 Induction hardening, 249, 258 Inductively coupled plasma--emission

(ICP-El, 389 Inductively coupled plasma-mass

spectroscopy (ICP-MSl, 389 Infant mortality, 350 Infiltration technique, 325 Infrared imaging/microscopy/micrography,

376-379,382,384-386 Infrared thermography, 379 Inhibitor compounds, 46 Injection-molded glass-filled

polypropylene, 299 In-phase buckling, 305, 340 Inspection, 3, 56 Insulation breakdown in connector

failures, 427 Interdendritic porosity, 472, 473 Interemetallic compounds, 332 Interface, 321, 334 Interface bond strength, 301 Interface cracking, 301 Interfacial bond strength, 304 Interfacial bonding, 319, 329 Interfacial debonding, 292, 295, 306, 333 Interfacial shear failure, 292, 295 Interference, 10 Intergranular embrittlement, 522 Intergranular failure, 65 Intergranular fracture, 65, 149, 150,

153-157, 172, 178, 179, 181-185, 219, 286

Interlaminar shear strength, 298 Intermetallic, 351, 366-369, 383-384,

388,408,413,438,439,442 Interstitials, 353, 355 Intralaminar shear crack, 306, 308 Intrusion, 159 Inversion region, 371 Investment casting, 325 Ionic contamination-induced inversion,

370,372

K,114 K/,l11 K" 87, 506 ~O, 309 Kalling's etch, 526 Ketones, 49, 58 Kevlar 49, 297, 304, 305 Kevlar 49-€poxy resin composite, 301, 303

Keyways, 258, 265 Kink band formation, 303 Kink bands, 292, 294, 301, 306 Kink zone, 304, 305 Kirkendall effect, 361 Kirkendall voids, 368-369

Lacerations, 311 Lacquer, 55 Lag,366 Laminae, 288,298,300, 301,304-307 Larehup,353,356,400 Lateral shift method, 36, 38, 39 Leaching, 443 Lead frame, 364, 366, 367, 370 Lead-free solder, 451, 453-455 Leads, packaging, 410 Leaflike artifacts, 314 Leakage, 351 Leaks,390 Lens error, 9 Lenticular silver screen, 39 Lift, 475, 482 Lift coefficient, 475 Light-gathering angle, 10 Light microscopy (LMl, 388 Line defects, 405

. Lines of force, 86 Liquid crystal, 375, 400 Liquid metal embrittlement (LMEl,

44,48 Liquid penetrants, 56 Liquid-phase sintering, 325, 531 Litigation, 7 Load-elongation curve, 75 Loading, 74, 157 Loading cycles, 250 Loading type, 259, 266 Local melting, 3, 181 Local tearing, 218 Logic, 375 Long-fiber-reinforced composite, 293, 295 Longitudinal compression, 340 Longitudinal tension, 339 Loop, 366 Low-angle boundary, 135 Low-cycle axial fatigue, 220, 276 Low-energy electron microscopy (LEEMl,

400 Low-voltage mode, 396 Lubricants, 2, 353 Lubricating, 396

Machining, 4 Macroexamination, 7, 45 Macrofractographic features, 261 Macrofractography, 122, 231, 232 Macromechanism, 232 Macroscopic orientation, 73 Magnetic force microscopy (MFMl, 399 Magnetic gage, 532 Magnetic measurements, 525 Magnetic particle inspection (MPIl, 56 Magnification, 12, 553, 554

Maintenance, Manhattan eff Maraging stee MAR-M200aI Martensite, 5~

Material selec Mating fractw Matrix cracki:r Matte texture Maximum nor

90,244 Maximum she

340 Maximum Strl

Measling, 416 Mechanical at Mechanical ac Mechanical be Mechanical d! Mechanical fa Mechanical kE Mechanical pI Mechanical tv Mechanical w Mechanics, 7i Mechanisms, Melt impregn Melt infiltrati Melt spun fib Melting, 187, Memory, 375 Metal, 288, 21 Metal-coated Metal matrix Metal oxide s

353,372 Metal oxide s

transisto 371,372

Metallic allo) Metallic fibeI Metallization

364,366, Metallograph Metric convel Microanalysi Microchemicl Microcompos Microcrackin Microcracks, Microexamin Microfractog: Microfractog: Micrograph, Micropores, : Microprobe, : MicroprocesE Microscopy, , Microstructu Microvoid co Microvoids, I Microwave, : Migration, 3, Mineral, 28S

5

:04-307

9

~E), i I

598 Index

Oil-immersion lens, 10 Open circuit, 351, 373, 395 Optical microscope/microscopy (OM), 8,

16,17,22,375,379-380 Optical path, 17 Organic fiber brush, 48 Organic solvents, 49, 58, 70 Orthophosphoric acid, 54, 60, 71 Overcurrent failures, 436, 437, 439 Overlaps, 311 Overload, 187 Overload fracture, 169 Oxalic acid, 527 Oxidation, 3,44,45,47, 59, 178, 187,

251,405 Oxidation products, 71 Oxide ceramic fibers, 328 Oxide-nitrogen dislocations, 405 Oxides, 58-60,62,175,527 Oyster-shell marks, 250

Package, 365,367, 368,371, 374,376, 378,387,401

Packaging, 364 PAI,316 Parallax, 37 Parameter, 373 Particle, 288 Passivation, 379, 381, 392,398,399 Pasty state, 180 Pearlite, 64, 66, 212, 221, 271, 272, 511,

513,517,520,522 Pearlitic steel, 103 PEEK,316 PEEK/C, 320 Peeling, 292, 293 Peening, 258 Pe'netration, 4 Perspective, 36 Phase diagram, 473, 475 Phase transformation toughening, 323 Phosphoric acid, 54, 60, 71 Photogrammetry, 39, 40 Photographic plane, 40 Photography, 379 Photomultiplier, 20 Photon, 400 Photon emission microscopy, 400 Pinhole, 418, 444 Pinhole photographs, 11 Pin-in-hole (PIH), 405, 406, 411, 423 Pipe, 357 Pips, 436, 439 Pits, 379, 385, 414 Pitting, 501, 506, 507 Planar slip, 187 Planck's constant, 25 Plane strain, 94-95, 103-104 Plane stress, 92-95, 102 Plastic deformation, 3, 74, 130, 138, 141,

152, 157-158, 167, 180-182, 238, 244,246,250,306,364,448,465, 470,485,508,517,527

Plastic leaded chip carrier (PLCC), 386, 406

Plate fracture, 107 Plate thickness, 240 Plated-through-hole (PTHl, 405, 418,443 Plating, 4,187,418,515-522 Plating cracks, 422, 430 Plating folds, 421, 427 Pliers, 55 Pocket viewers, 38 Poisson's ratio, 89 Polarized method, 39 Polyester, 294 Polyimide, 366, 367 Polymer matrix composites, 293 Polymers, 289, 353 Polypropylene, 298 Polyvinyl alcohol, 33 Popcorn(ing), 371, 409, 415, 416 Pore corrosion, 431, 435 Porosity, 466, 471, 473 Powder metallurgy, 325, 530 Power dissipation in connector failures,

427 PPS, 316, 318, 319 PPS/C, 318 Precipitates, 355 Precipitation, 4, 385 Precipitation hardening, 366, 475, 483 Preservation techniques, 42, 45 Primary cracks, 44, 55, 56 Primary fracture, 55 Principal normal stress, 81--84 Principal planes, 81 Principal point, 40 Principal shear stresses, 81-84 Principal stresses, 79-81, 85, 247 Printed-circuit board (PCB), 363, 404,

405 Printed wiring board (PWB), 404, 405 Prior austenite grains, 494, 511-515, 520 Processing, 4 Projector lens, 15 Pullout, 316, 319, 330, 332 Purple plague, 368

Quality control, 3 Quantitative stereoscopy, 39 Quasicleavage, 152-155, 186,218,219,

268, 274 Quench cracking, 4

Radial lines, 268 Radial marks, 104-106,233,236-238,

240,246-247,250,262,264-268, 270-274,276,470,471,493,529

Radial shear marks, 237 Radial zone, 235, 240-242 Radiation damage, 4, 351, 357 Radiography, 376-378, 382 Railroad rails, 491 Rapid crack propagation, 114 Raster, 17

Ratchet I Red plag Refractio Reilly in! ReinforcE Relays, 4 Replica, '

61-6 174,

Residual Resin fra Resin sm Resin tea Resolutio Resolved Resolved Resolvin! Retained Reticulat Reverse 1

(RBE Reversed Reversed Reversed Ripple m River pat Rock calli Rodine #1 Rolling, 2 Rolling C(

Rosettes, Rotating. Rotating Rotation Roundin~ Rub marl Rubbing, Rupture, Rupture: Rust, 31, Rust inhi Rustares' Rutherfol

(RBE

SAE 105l Safety fa' Salt stea: Saltwate: Sample j: Sand,35: Sand cas Saphikor Scannin~

377­Scannin~

17-2 388­

Scannin~ (SLA

Scannine Scannine

(SNl

600 Index

Simulation, 6, 7, 374, 376-378 Single crystal, 122, 124, 141 Skin, 318 Slag, 390, 530 Slant fracture, 93, 96, 100-104, 108 Slip, 122-128, 130, 141, 142, 148, 164 Slip bands, 123, 137, 158, 161 Slip direction, 123 Slip-induced dislocations, 405 Slip lines, 123, 137, 141, 158 Slip planes, 123, 125, 148, 164 Slip system, 123-124 Slip traces, 126, 148, 150, 212 Small-outline integrated circuit (SOlC)

SMA,406 Snakeskin, 330, 331 Sn-coated Saphikon fibers, 322 Sodium carbonate, 51, 59 Sodium cyanide, 51, 59 Sodium hydroxide, 51, 54, 60, 71 Soft brushes, 57 Solder bumps, 408 Solders and solderability, 371, 401, 423,

436-455 Solidification, 498 Solution treating, 473 Solvent, 449 Soot, 514 Span length, 478 Specific modulus, 322 Spe~ific strength, 322 Specification failure, 344, 347 Specimen absorbed current, 392 Spherical aberration, 9 Spikes, 345,346,350, 361,395,398 Splined shaft, 243, 258, 263, 264 Splitting, 292, 293 Spring, 246 Stable crack, 45 Stable crack growth, 53, 102, 302 Stacking fault, 355, 405, 407-410 Stage I offatigue, 158-161 Stage II offatigue, 159, 161, 164, 169,

175 Stage III of fatigue, 169 Stainless steel, 522 Stainless-steel fiber, 325, 339 Stake and socket, 293 Stamping, 4 Standard thermal profile (STP), 382 Starved solder joints, 444, 448 Static fracture, 318 Static random access memory (SRAM),

353 Static tension, 318 Steel punch, 515 Stereo angle, 37 Stereo image, 37 Stereo imaging, 36, 206 Stereo pairs, 38-40, 208-211, 218-220,

519 Stereo projection, 39 Stereo viewer, 31 Stereo viewing, 379

Stereomicroscopy, 31, 36, 45, 48, 58-61 Stereopsis, 38 Stitch bond, 368 Stonehenge effect, 424 Stop marks, 251 Strain hardening, 75, 96 Strain magnification, 301 Strain rate, 79, 100-103, 152, 179 Strength, 345, 347 Strength of composite, 291 Stress analysis, 475 Stress concentration, 45, 84, 109, 114,

250,257,337 Stress concentration factor, 87-88, 506 Stress concentrator, 87, 534 Stress corrosion, 309 Stress corrosion cracking (SCC), 4, 44,

48,66,157,183,185,187,223, 467-468

Stress fracture, 365 Stress intensity, 86 Stress intensity factor, 64 Stress level, 252, 254, 257-261, 266, 509 Stress magnification, 301 Stress raisers, 3, 87 Stress-strain curves, 291, 292, 301 Stress-strain diagram, 75-79 Stretching, 148,212,219 Striation (see Fatigue striations) Striation spacing, 165-168 Stringers, 209 Studs, 363 Subcritical crack growth, 114 Subgrains, 138 Subjects, 8 Sulfamic acid, 71 Sulfuric acid, 51 Superconducting composites, 329 Surface coating, 45-46 Surface energy, 110 Surface mount technology (SMT), 405,

406, 411, 423, 443 Surface pits, 309 Surface wear, 293 Sweeping, 366 Swirl pattern, 243, 244, 273 Switches, 436

T 50/201 (S), 331 T6T1451F155,313 T6T1451F185,313 Ta fiber, 325 Tail of comet, 387 Tape-automated bonding (TAB), 401 Tear, 130, 134, 187,225 Tear cracks, 302 Tear dimples, 141, 146 Tear loading, 141 Tear ridges, 134, 152-155 Tearing, 4, 152, 156,212 Tearing topography surface, 153, 156 Technora-epoxy composite, 306 Tectyl 506, 46-47 Temper embrittlement, 157,516

Tempera! Tempera! Temperec

(TMI Temperin Tensile bi Tensile C\

Tensile d1 Tensile fa Tensile fr

304, : Tensile 10 Tensile m 'IP,nsile s~

270-: Tensile st

470, i Tensile st Tensile te Tensile te

114, : Tension, f Tension O'

Tension-u Terminolc Thermal; Thermal (

453, , Thermal ( Thermal j Thermal i Thermal] Thermal! Thermall

447, ' Thermite Thermopl Thermopl Thermopl Thin shee Third-levI Through-! Ti-clad Be Tide marli Tilt boune Tilt methc Tin-bismu Tin-platee Tire track Titanium Toluene, 4 Tombstoni Tongue, 1: Topograpt Topology, ' Torsion, 4: Torsion de Torsion fa Torsion ov Torsion tel Torsional, Toughenin ToughnesE Tramp ele

58-61

9

.114,

9,506

4,44, i3,

166,509

,405,

~,

Temperature, 100 Temperature conversions, 537-541 Tempered martensite embrittlement

(TME),516 Tempering, 270-274, 277, 280, 515 Tensile bar, 97 Tensile curve, 292 Tensile ductility, 482 Tensile failure, 292 Tensile fracture, 83, 96, 243, 285, 286,

304,306,321,331 Tensile loading, 84, 161, 332 Tensile overload, 232, 240, 262 ~sile sample, 76, 104, 106, 266,

270-272,278,279 Tensile strength, 76, 77,289,298,301,

470,504 Tensile stress, 158, 161, 164, 165, 364 Tensile tearing, 145 Tensile test, 55, 74-76, 103, 108, 109,

114,157,210,272,274,278,292 Tension, 62, 84, 85, 267, 364 Tension overload, 220 Tension-tension fatigue, 318 Terminology, 345, 347, 348 Thermal analysis, 389 Thermal cycling, 3, 369, 394, 448,

453,454 Thermal expansion, 515 Thermal fatigue, 345,347, 349 Thermal imaging, 377 Thermal ratcheting, 445 Thermal shock, 4 Thermal stress, 418, 423, 424, 445,

447,497 Thermite process, 491, 492 Thermoplastic-based molded circuits, 414 Thermoplastic matrix composite, 314-316 Thermoplastics, 288 Thin sheet, 102 Third-level packaging, 401, 424--436 Through-thickness compression, 339, 341 Ti-clad Be fiber, 529 Tide marks, 250 Tilt boundary, 140 Tilt method, 36-38 Tin-bismuth solder alloys, 454, 455 Tin-plated contacts, 428 Tire tracks, 167, 173,174,212 Titanium matrix composite, 335 Toluene, 49, 58, 62 Tombstoning, 423, 424, 431, 432 Tongue, 131, 135, 139, 140 Topograph~ 362,377, 397,399, 400 Topology, 7 Torffion, 45, 84, 85, 142,273 Torsion deformation bands, 243 Torsion fatigue, 258, 265, 346, 347 Torsion overload, 241, 243-246 Torsion test, 280 Torsional dimples, 146 Toughening, 312, 319, 320, 323 Toughness, 6, 114,315,329 Tramp elements, 534

Index 601

Transformation stress, 497 Transgranular cleavage, 279 Transgranular fracture, 172, 184, 188,

463, 467 Transient overload conditions, 431, 434 Transients, 346-348, 354, 356 Transistor, 358, 359, 373, 381, 391 Transition temperature, 152, 400 Transmission, 485 Transmission electron microscopy (TEM),

14-17,21,22,212,380,390,391 Transverse compression, 340, 341 Transverse cracking, 330, 332 Transverse strength, 301 Transverse tensile fracture, 331 Transverse tension, 339 Triaxial stress, 89-92, 97, 246 Trichloroethylene, 49 True strain, 78 True stress, 78 True stress-true strain curve, 78, 103 Tunneling, 399 Twin, 130-137 Twin plane, 135 Twinning, 122, 129 Twist boundary, 140 Two-stage yielding, 339

Ultimate strength, 76 Ultimate tensile strength (UTS), 76, 289,

337,5iO Ultrasonic cleaning, 31, 46, 49, 50-52, 59,

62;492,527 Underbead cracking, 4 Undercuts, 4 Unidirectional solidification, 326 Unstable crack growth, 62, 102, 114,302 UV radiation, 309

Vacuum bellows, 459, 460, 464, 466 Vacuum deposition, 33 Vacuum impregnation, 326 Valence, 23 Varnish,58 Via, 362, 363, 395 Vibration, 4, 346,347,350,366,483,

491,504 Virtual image, 12 Visual examination, 5, 44 VMOS,356 Void coalescence, 5, 106, 137-153, 169,

175,177,180,261,264,268,272, 274,276,279,487,512

Void growth, 333 Void nucleation, 143, 144 Voids, 142, 148, 182,298,301,304,358,

362,365,387,391,392 Voltage contrast (Ve), 395

W fiber, 325, 332, 339 W fibers in MAR-M200 composite, 333 W/1%Th02 fiber, 325 Wallner lines, 212, 221 Warp fibers, 414

I

602 Index

Warping, 3, 346, 348 Water quenching, 473 Water swelling, 309 Wavelength-dispersive spectrometry

(WDS), 25, 379, 390, 398, 399 Wea~ 4, 187, 346, 348, 350 Web, 493 Wedge bond, 366 Wedge cracks, 181, 182 Weld, 45, 139, 144,495-499,526,529 Weld metal, 495, 534 Weld root, 534 Welding, 4, 492 Wettability, 330 Wetting, 332 Wetting problems, 439, 440, 443-445 Whiske~ 348, 350, 359, 364,392,428,433 Whisker pullout, 323 White plague, 368 Wicking, 415, 421, 422, 430 Width-to-Iength ratio, 239 Width-to-thickness ratio, 100 Winchester drive, 396 Wire bond, 366, 369, 370, 401,406, 408 Wire cutters, 507-510 Wires, 500

Wood,288 Woody fracture, 146, 147 Work hardening, 75, 96, 339 Working, 3

X-ray analysis, 66 X-ray diffraction, 23, 26, 30, 377-378 X-ray emission, 24 X-ray photoelectron spectroscopy (XPS),

377-378 X-ray photon, 24 X-ray radiography, 379, 381 X-ray spectrum, 25-29 Xylene, 49, 58

Yield point, 76, 186 Yield-point behavior, 77 Yield-point stress, 76 Yield strength, 6, 76, 77, 109, 114, 157,

334, 510, 512 Yielding, 297 Young's modulus, 78

Zener diode, 383 Zeroth-level packaging, 401, 405, 406 Zipperlike artifacts, 313

ABOUTT

CHARLIER

Engineerir Emeritus f several tea Distinguisl and theAl! IntematiOl

AsHOKCH(

the Office LaboratolJ several tea and a co-rE