A Canadian innovation centre in Québecfor the packaging of the next generation of microelectronics chips

and microsystems

COLLABORATIVE

Defense

Aerospace

Telecommunications EnvironmentSensors

Health care

Transport

Power

Energy

Microelectronics

Internet – Every time anybody sends a request for information on the Internet, our microchips power network to find the fastest route.

Video games – Console video games rely on powerful microchips to compute images.

Aerospace – When the defence industry needs to develop the next generation of equipment, microchips will be at the core of the capabilities.

Health – Sophisticated medical scans are powered by Canada microchips to render images.

Environment – Canada microchips enable computations behind the predictions for climate change and prediction of natural disasters in the Barcelona Supercomputing Center.

Leading Edge Canadian Microelectronics -Everywhere, in Everyday lives

When Rover and Pathfinder sent images from Mars, the image sensor systems relied on microchips to render the images.

Automotive – In today's new cars, sensors powered by Canada microchips monitor vital functionning ranging from tire pressure to fuel injection system.

“We are at the doorstep of the largest shift in the semiconductor industry ever, one that will dwarf the PC and even the consumer electronics eras ”

“The approaching era of electronics technology advancement – the Fusion Era – will be massive in scope, encompassing the fields of information technology, biotechnology, and nanotechnology and will create boundless opportunities for new growth to the semiconductor industry”

Dr. Chang-Gyu Hwang, president-CEO, Samsung Semiconductor, IEDM Conference, Dec. 2006

Microelectronics industry entering a new era of major change at fundamental level

The Fusion Era: A Profound Change for the Industry, An Economic

Opportunity for Canada• This new microelectronics economic era must be

invented and refined– The technical challenges are very significant– The novel solutions will result in worldwide impact of our

talented people• Innovation is a key ingredient of success in this era

– Needs to be linked to Canada’s research facilities, universities and industry partners and to international research centres

– Needs to be channelled through collaboration at all levels– Canada is well positioned to leverage this opportunity and

reap the rewards

Key Technology Challenges Triple Convergence

• Power now limits traditional scalability– Power supply and thermal dissipation are severely challenged– The solutions are both exotic and tailored to the problem

• Semiconductor material selection for scalability– New dielectric material (porous and fragile)– Materials’ properties a real issue– Mechanical integrity is critical

• System architecture shifting to multi-core, multi-threads– Need new materials– Require the development of 3 dimensional and optoelectronic

solutions – Need faster access time to data

Northeast corridor of microelectronics

Albany MolecularResearch

Global Research

Burlington

Fishkill

Poughkeepsie

Albany

Niskayuna

Waterbury

SherbrookeBromont

Dynamic North-East Corridor •33 000 microelectronics jobs• Investments of 11 billion $US •World class centre of excellence in microtechnologies

•Synergy between universities and research institutions

•84 500 high technology jobs in Canada reinforced by corridor economic activities

•Anchored by Albany Nanotech at southern tip

Existing Model: Minatec / LETI

• 4 billion € in investment• 45 000 jobs created• 13350 microelectronics

professionals• 3500 R&D jobs• Integrated innovation approach• Strategy of alliances • Powerful concentration of know-

how

Existing Model: Minatec / LETI• Integrated innovation approach

– From immediate industrial applications to the exploration of disruptive technologies

• Powerful concentration of know-how and tools – 3 500 engineers, researchers and academics on site

• Strategy of alliances and international partnerships– Dynamics of networks and collaborations linked to centres of

excellence reinforce the effectiveness of Minatec• Policy of continuous and ambitious investment

– 4 billion Euros invested over the last 10 years by the microelectronics players in Grenoble-Isère

• Huge pool of jobs dedicated to state of the art science technology– Powerful local workforce 13 350 microelectronics professionals

Existing Model: Albany Nanotech• $4.2 billion in investment • 800 000 ft2 of research space• 2 000 jobs• 250 partners• Created in 2001• Development of next generation microchips• Research projects supported by industry, including:

– IBM, Toshiba, AMD, Freescale, STMicroelectronics, Infineon and Samsung, in partnership with University of Albany

• R&D at the MiQro Innovation Collaborative Centre will be complementary and focused on assembly, advanced packaging and test of new microchips

• Technology focus provided by the presence of university partnersand world class research institutions

Positioning Canada in the global high tech economy:from strategy to reality

Leading edge microelectronics:everywhere in everyday lives

Building on an existing coalition:low risk, high return

A magnet to attract resources

A partnershipto compete globally5

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COLLABORATIVE

MiQro Innovation Collaborative Centre

• Original partnership between Université de Sherbrooke, DALSA Semiconductor, IBM Bromont and the TechnoParc Bromont– Active recruitment of future industrial and academic

partners– Unique opportunity for connecting university and

industry researchers• Integrated research approach – from

fundamental research to commercialization• State-of-the-art infrastructure to attract, train and

retain highly qualified personnel

Overview of Centre

• Investment of $218 M

• $ 83 million building• $ 95 million equipment• $ 40 million founding partners

and equipment manufacturers

• Development of a Technology Cluster– Technology crossroads/showcase– 250 specialized scientific jobs– Retention and development of HQP– Scholarships and internships– Visiting international researchers

• 2 buildings of ~120 000 ft2 in total– Clean rooms: ~60 000 ft2– Space reserved for incubation

• Technology transfer– University-industry

partnerships• Spinoffs and entrepreneurship

– Emergence of new companies• Economic impact

– Consolidation of industrial leadership

• Schedule– Pre-concept, construction and

processes coming online by end 2011

COLLABORATIVE

The Centre : cleanrooms

MEMS

Future partners

Packaging of microchips

Laboratories

Canadian Universities

Research institutions and Associations

International centres

Equipment manufacturers Industrials

Private R&Dcentres

Private R&Dcentres

MICC Ecosystem

Funding for collaborative projects

COLLABORATIVE

Impact• Development of a technology cluster • Technology transfer

– Close university industry partnerships• Spinoffs and entrepreneurship

– Emergence of new companies• In harmony with local environment

– Integrated within the Technoparc Bromont• Technology crossroads• International visibility (microelectronics

hub)

Founding Partnership• Université de Sherbrooke

– A leader in research technology transfer in Canada (26 spinoffs, 330 patents, 360 partners)

• DALSA Semiconductor– Dedicated to front end specialty semiconductor

manufacturing processes such as MEMS and 3D Wafer Level Packaging - ranked by YoleDevelopment as one of the top MEMS pure play foundries in the world

• IBM Bromont– Specialized in transforming the world’s most

advanced semiconductor wafers into leading edge microelectronic solutions for the full range of IBM hardware and key partners.

DALSA’s involvement in MEMSDedicated to specialty semiconductor manufacturing processes of: MEMS, 3D Wafer Level Packaging, High Voltage CMOS, CCD Image Sensors, and Analog Mixed Signal CMOSRanked by Yole Development as one of the top MEMS pure play foundries in the worldIn operation in Bromont since 1973400 employees at the Bromont site 154K sq ft operation on a 52 acre site, when fully loaded a $100M operation the majority of which is exported to US, Europe and AsiaPresently sell into the automotive, PC, cell phone, digital camera, medical, industrial, and aerospace markets.Gross R&D approx $8M/yearSome awards:

"Prix développement des exportations“ 2004 Manufacturiers et Exportateurs du Canada."Entreprise de l'année" - 2004 - Chambre de Commerce du Québec

IBM BromontDedicated to the bond assembly and test of the most advanced, powerful microchips in production in the world;Among leading high tech exporters in all of Canada;In operation in Bromont for 35 years;2,400 employees;Operates at full capacity (850,000 sq. ft) with yearly exports of 700 M$ in products to IBM, Cisco, Microsoft, Sony and Nintendo and more;Sustained annual R&D investments of $15-20 M.

UdeS – Research in Microelectronics and Information Engineering

• Training objective of 200 new graduate students over 5 years

• More than 30 research professors in these areas– 4 research chairs– 7 centres, teams and research laboratories

• Four faculties, from fundamental research to applications:– Engineering– Science – Medicine and health sciences– Physical Education

Primary Centre Pre-Competitive Research –Semiconductor Packaging Technology Focus

Pre-competitive Research

Semiconductor Packaging and packaging Inspection Technologies

IBM: Packaging and Test of 300mm advanced lithography (45-32-22 nm) microchips. Lead free, thermal dissipation, carrier design…

DALSA: Materials, processes for 200mm (integrated) MEMS & 3D WLP

DALSA’s involvement in MEMS

• Salary Base ~ $25M/year• Since 2002:

• 40M$ R&D Investment • 70M$ Capital Investment

• Unsurpassed Innovation ~65 patents including ~35 in the MEMS/3D-WLP field

• ~ 30 local suppliers. ~ $5.5M/year local business

• The only ”pure play semiconductor foundry” in Canada.

• MEMS and 3D-WLP foundry business is a growth driver for the company

• Internationally acknowledged as one of the top three “Pure Play” MEMS foundries –500M$ market with 30% CAGR

• MEMS are changing how electronics interact with outside world (sensing and actuating) and the MEMS revolution has a seed in Bromont

SEMICONDUCTOR FOUNDRY BUSINESS

DALSA’s involvement in MEMS

• Automotive– Pressure sensors, accelerometers, rollover detectors

• Industrial– Micro fluidics, pressure sensors

• Consumer– Cell Phones: Motion sensing gyros &

Accelerometers, Microphones, RF components– Printers: Ink jet heads– Game console: Motion sensing Gyros &

Accelerometers– PC: Microphones– GPS: Motion sensing Gyros & Accelerometers

• Medical and Life Sciences– Lab on a chip– Gas detection

WHICH END MARKETS ARE DRIVING MEMS AND 3D-WLP GROWTH?

An increasing number of cell phones incorporate MEMS microphone, speakers, and gyros

DALSA’s involvement in MEMS

MEMS MARKET FORECAST 2007 – 20121

(IN MILLIONS)

Motion sensors are revolutionizing the world of cell phones, GPS, game consoles, cars, etc…

MEMS microphones are making their way in cell phones and PC

DALSA’s involvement in MEMSDEVELOPMENT OF NEW MATERIALS AND PROCESSES

– Advanced Photopolymers:• Study and develop novel polymer materials to be incorporated in

micromachining processes • Invent technique(s) to quantify & realize/improve the adhesion of

current and novel thick polymer layers on various films• Achieve a very high aspect ratio with a vertical resist profile (optimize

coating, exposure, develop) needed for plating and regular coat exposure and developing can also be used as a structural material

• Develop fast process to strip thick polymers (all literature research to date indicates very slow, one wafer at a time, process times). Unacceptable for a business. Develop new approaches to quicken the process.

• Develop different coating techniques (spin and spray coating technologies) to accommodate cavity filling, conformal coating requirements

DALSA’s involvement in MEMS– Low-stress Silicon Nitride (LSN):

• Development of a repeatable process of LSN considering WIW (within wafer) and WTW (wafer to wafer) thickness, RI, and stress variation

• Evaluation of material properties (FTIR analysis, stress gradients, etc.)

• Custom develop, evaluate, and install CRITICAL customized quartzware cleaning system (quartz tube, liner, boats etc) without etching quartz while etching LSN for cleaning of quartzware

• Evaluation and implementation of in situ particle monitoring system

– Low-stress Doped Silicon:• Analyze and model current deposition processes used for

synthesizing low-stress doped silicon thin films• Study and quantify impact of deposition process parameters in

detail in order to optimize the deposition process or to develop new approaches

DALSA’s involvement in MEMS– Wet Oxidation Filling of Deep Trenches:

• Study and model the DRIE process step and optimize the techniquefor achieving high quality deep trenches and explore novel approaches

• Study and analyze the specific processing steps required for deep trench formation including:

– Strip and cleaning trenches– Low-stress nitride development– Stress balanced trenches– Electrical isolation testing– Hermiticity testing– Etchback process characterization

DALSA’s involvement in MEMS– Anhydrous HF Release :

• Using methanol and anhydrous HF as mixtures, develop robust recipes and perform electromechanical reliability tests

– Wafer bonding:• Develop specialized low-temperature wafer-level bonding

technologies such as plasma-activated bonding, solder bonding, eutectic bonding and thermo-compression bonding to ensure flexible technologies for complex wafer-level devices integration, such as integrated MEMS, hermetic WLP, and 3D interconnects.

DALSA’s involvement in MEMS

• 1X aligner with F/B capability• i-line 5X aligner with F/B capability• Spin and Spray resist coaters• DRIE cluster tool• RIE cluster tool• Anhydrous HF cluster tool• Automated wet etch benches• Wet & Dry resist strippers• Wafer bonders and debonders• Atmospheric and LPCVD vertical

furnaces

• Wafer dicers – saw and laser –with associated cleaning tools

• CMP & Grinders• Sputter• PECVD• Screen printer• Advanced metrology tool• Advanced IR metrology tool• Advanced inspection tool

EQUIPMENT SET FOR MEMS R&D