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EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
17th European Microelectronics and Packaging Conference
„ A Comprehensive Overview on Today`s CeramicStubstrate Technologies“
Rimini, 16.06.2009 Franz Bechtold
VIA electronic GmbH, Hermsdorf
www.via-electronic.de
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
• Introduction
• Ceramic Substrates as Fired
• Multilayer Substrates HTCC and LTCC
• Ceramic Substrates between Silicon and PCB
• Market for Hybrid Circuits
• Applications Fields for Ceramic Based Hybrid Integrated Circuits
• Materials, Board and Technology Providers
• Perspectives and Challanges
• Conclusion and Acknowledgement
Content
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Introduction
Thickfilm Alumina Substrates
ZrO2 Stabilised Alumina Substrates
Aluminum Nitride Substrates
Direct Bonded Copper Substrates
Thickfilm Technology
HTCC Technology
LTCC Technology
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Ceramic Substrates As Fired
ZrO2 stabilised Al2O3 Substrate AlN substrates
Thermomechanical stability
Flexural strength
Elasticity.
Cabable for DBC
low thickness
Thermal Conductivity
Si matched TCE
Capable for Thickfilm
Capable for DBC
Courtesy of Ceramtec
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Ceramic Substrates As Fired
Standard Substrates, extruded and dry pressed devices
Ceramic tubes for heater elements, dry pressed alumina pressure sensor membranes and micro cooler components are applied in special applications in harsh environment.
Courtesy of Ceramtec
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Multilayer Substrats HTCC and LTCC
HTCC
Material Systems not available
High temperature ceramics with refratory metal inks
Full system capability achieved by Ni/Au Plating
Cofire and postfired resistors not possible proprietary material
LTCC
Low temperature material systems with noble metal conductor inks available.
(DuPont, Heraeus, Ferro, ESL, CeramTec)
High material complexity with full system capability including resistors
SME Foundries on the open Market (MSE, Selmic, C-Mac and VIA)
Captive materials and processes inside big entities (Bosch, Epcos)
Proprietary Materials and processes in big enterprises
Tape blanking
Via punching
Via filling
conductor printing
Stacking
Lamination
scribing/cerving
Burnout, Cofiring
Singulation
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Multilayer Substrats HTCC and LTCC
HTCC
Thermal Conductivity 20W/m*K
Mechanical strength 400 MPa/mm
Brazing strength > 50 N/mm2
Condctor resistivity inside >10 mOhm/sq
Good RF Performance
Integrated resistors not possible
LTCC
Thermal conductivty 3 W/m*K
Mechanical Strenght 200 MPa/mm2 Brazing strength > 30 N/mm2
Conductor resistivity <5 mOhm/sq
Very good RF Performance
Integrated resistors possible
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Ceramic Substrates between Silicon and PCB
Typical NRE Costs :
•1.000€ for PCB•5.000 € for thickfilm board•10.000 to 15.000 € for HTCC and LTCC •Up to 250.000 € ASICS.
Typical Material Content (per 150cm2):
• almost pure silicon for Asics, • low priced plastics together with a few glass fibres and 5g of Cu for PCB • expensive green ceramic sheets and about 3g of noble metals for
conductors and resistors in the case of LTCC • and a few less expensive Alumina sheets together with about 3g of
refractory metals for the conductor.
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Ceramic Substrates between Silicon and PCB
132614101,0100.000 Panels
163216121,510.000Panels
204020152,01000 panels
SiliconLTCCHTCCThickfilm
PCB
Table 1: Average Material costs in €
200262650,50100.000 Panels
300323291,0010.000Panels
5004040151,501000 panels
SiliconLTCC
HTCCThickfilm
PCB
Table 2: Average Process cost
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Ceramic Substrates between Silicon and PCB
2135240151,50100.000 Panels
3166448212,5010.000Panels
5208060303,501000 panels
Silicon
LTCC
HTCC
Thickfilm
PCB
Table 4: Total costs at different volumes
0,360,350,270,600.06100.000 Panels
0,570,440,330,860,1010.000Panels
1,280,630,471,400,181000 panels
Silicon
LTCC
HTCC
Thickfilm
PCB
Table 5: Total cost per circuit60.000k15000k15.000k2.500k2.500k100.000
Panels
6.000k1.500k1.500k250k250k10.000Panels
600k150k150k25k25k1000 panels
SiliconLTCCHTCCThickfilmPCB
Table 6: Minimum number of circuits to be realised(yield losses not included)
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Ceramic Substrates between Silicon and PCB
1252030,1Thermal ConductivityIn W/m*K (RT to 400°C)
100350210-Flexural strength In Mpa
37660290
TCE z < tgTCE z > tg
37616Thermal Coefficient of Expansion(TCE) x,y
-15>4040Break down voltageIn V/µm
106>1012>1012>1011Volume resistivityIn Ohm*m (RT)
>20>20>203Guaranteed Life time in years
SiHTCCLTCCPCBTable 7: Technicalcharacteristics
Technical Performance
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Ceramic Substrates between Silicon and PCB
<10-8<10-8<10-8>10-3Hermeticity in Torr
000<0,3Water absorptionIn %
L, R, CL L, R, CLIntegration of Passive components
2200200200Line pitch
--
0,00040,001
0,0020,005
0,0250,020
Loss Tangent 1MHzLoss Tnangent 10GHz
12,0-
9,89,0
7,857.83
4,7-
Dielectric Const. 1MHzDielectric Const. 10GHz
<30<15<5<1Conductor ResistanceIn mOhm/square
SiHTCCLTCCPCBTable 7: Technicalcharacteristics
Technical Performance
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Market for Hybrid Circuits
Market for Hybrids, ZVEI Yearly Report 2008, Handbuc h der Leiterplattentechnik,2003
European market: 1.200 Bn €
Regional distribution:
Germany 48%
France 14%
UK 14%
Benelux 9%
Italy 5%
Scandinavia 5%
Others 5%
Distribution to Market sections:
Automotive: 40%
Telecom: 30%
Industrial: 15%
Military, Avionic: 10%,
others: 5%
.
Technology Distribution:
Thick film with 38%
LTCC with 36,5%
DCB 21%
Thin film 4,5%
The captive market is about 2/3 of the total market
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Application Fields for Alumina Based Hybrids
•Robustness •aggressive environment•hot oil
•high degree of miniaturisation •printed resistors on top of the dielectric •high reliability in harsh envionment
Oil sensorDual Inline Hybrid Circuit for power stations
Courtesy of Siegert electronicCourtesy of Siegert electronic
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Application Fields for Alumina Based Hybrids
•Robustness •Matched TCE Component/Sustrate
•Chip on Board •High Power, high Currency •Thick wire, thick Silver
Yarn tension sensor pricnipleSmart Power Gear Controll Unit
Courtesy of Micro HybridCourtesy of Siegert electronic
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Application Fields for Alumina Based Hybrids
•Thickfilm integrated Sonsor•Electronic close to the sensor
•Long term stable Youngs Modulus •Stress free packed pressuer sensor
Sensor System, Open FrameYarn tension sensor system
Courtesy of Micro HybridCourtesy of Micro-Hybrid
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Application Fields for Aluminum Nitride Based Hybrids
•Up to 1600 V and 24 A•200W/m*K•Glop top, silicone and plastic package
•high power Dissipation •high heat conductivity•Low cost sealing
H-Bridge Hybrid Circuit, Open FrameH-Bridge Hybrid Circuit
Courtesy of Lust HybridCourtesy of Lust Hybrid
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Application Fields for Aluminum Nitride Based Hybrids
•On ZrO2 stabilized 0,25mm Alumina•On Aluminum Nitride•Double sided, Cu Vias•Excellent thermal properties
•Silicon Matched TCE 3ppm•260x15x7mm size•Low weight
Direct bonded Copper 100 to 300µmSatellite CCD Camera Board
Courtesy of Electrovac Curamik:Courtesy of Anceram
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
• 300µm Cu lines and integrated heat sinks• 180 W/m*K thermal conductivity•Double sided, Cu Via technology• low cost 250mm ZrO2 stabilised Alumina
Hermetically sealed DBC on AlN
Courtesy of Electrovac Curamik:
Application Fields for Aluminum Nitride Based Hybrids
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
HTCC Applications
• Hermeticity• Robustness•High density 40µm internal lines•Very small outline
• miniaturisation, reliability•15 layers, 20.000 vias •75µ lines and vias
Tosa/Rosa Fibre optic transmissions Aerospace Multichip Module 50x50mm
Courtesy of Egide:Courtesy of MDBA-France and Egide
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
LTCC Material System Background
5,66,47,04,55,8α [ppm K-1](25-300°C)
TCE
≤ 0,4≤ 0,4≤ 0,3≤1,41- 20 GHz
AgAgAgAgConductor
Insertion loss [dB inch -1]
< 2< 2<1520-40 GHz
≤ 2151-20 GHz
≤ 1≤ 4< 2< 1< 2≤ 1 GHz
Dielektric losses tan δδδδ [10-3]
4,65,97,4-20-40 GHz
9,17,4-1-20 GHz
9,14,75,97,57,4≤ 1 GHz
Permittivity εεεε
CT 2000Heraeus
41110ESL
A6Ferro
943DuPont
951DuPont
Commercial LTCC materials
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
LTCC Material System Background
20E = 7Inductor, capac.
Co/postMetallisation
1 (tr.)10 to 10MOhm
ResistorpostfireRuO2-Bi2O3
5010 to 10kOhm
ResistorBuriedRuO2-Bi2O3
30Not qualifiedResistorCofireRuO2-Bi2O3
InsulatorPostfireDielectric glass
Solder stopCofireDielectric glass
203/30 mOhmWire/solderPostfireAg, AgPd
203/30 mOhmWire/solderpostfireAu, AuPtPd
203/30/3 mOhm
Wire/solder/bond
cofireAg/AgPd/Au
203/30 mOhmWire/soldercofireAg/AgPd
203/30 mOhmWire/soldercofireAu/AuPt
Tol.%propertiesFunctionProcessMaterial
Table 9: Material System 951 DuPont
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
High Volume LTCC Applications
• Robustness•Under the Hood•Close to the working unit
• miniaturisation, reliability, Costs•-40/+155°C•50g
ABS/ESP8 Controller Gear Car Controll (source: W.C. Heraeus)
Courtesy of Bosch:Courtesy of Siemens-VDO
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
High Volume LTCC Applications
• Robustness•Under the Hood•Close to the working unit
• miniaturisation, reliability, Costs•-40/+155°C•50g
Transmision Controll Unit Steer by Wire
Courtesy of Bosch:Courtesy of Bosch
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
High Volume LTCC Applications
• miniaturisation•reliability, Costs• RF capability• K20/K8 Technology• passive integration
Front end for mobile phones
Courtesy of Epcos
Chip&Wire bondingFlip Chip
Surface MountingTechnology
Glob Top
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Low Volume LTCC Applications
• Vaccum cmpatible• Spectroscopic neutral • Thermal management
• Reliability• Modularity• Flexibility
Fully integratedd X-Ray detector SystemCustomised LTCC Packages for Sensors
Courtesy of Ketek and VIACourtesy of VIA electronic
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Low Volume LTCC Applications
• Miniaturisation• RF capabiltiy• Passive integrated RF components
T/R Modules (Source: Workshop MakroNano2006)
Courtesy of Ericsson
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Materials Provider
Thickfilm inksLTCC material systems
DuPont
Thickfilm inksLTCC material systems
Heraeus
AlN substrates thinfilm/thickfilmActive brazed Copper
AnCeram
Al2O3 substrates 96%, 99%, Al2O3 ZrO2 stabilised, Al2O3 dry pressed and extruded parts AlNSubstrates thinfilm/thickfilm LTCC dielectric tapeLaserscribing and cuttingSingle sided cofired metallisation
CeramTec
Materials and servicesTable 10Supplier
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Technology Provider
LTCCVIA electronic
ThinfilmSiegert TFT
ThickfilmSiegert Electronic
Thickfilm, LTCCSelmic
ThinfilmReinhardt Microtech
Thickfilm, ThinfilmRadeberger Hybridelektronik
Thickfilm, LTCCMicro System Engineering
ThickfilmMicro Circuit Engineering
ThickfilmMicro-Hybrid
ThickfilmMicrotel
ThickfilmMicrodul
ThickfilmLust
ThickfilmLewicki
ThickfilmHybrid Electronic
ThinfilmHightec
LTCCEpcos
HTCCEgide
Direct bonded Copper Curamik
Thickfilm, LTCCC-Mac
Thickfilm, ThinfilmAdvanced Microelectronics
ThickfilmAB Mikroelektronik
Technology servicesTechnology Provider
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Perspectives and Challanges
High currency conductor, micro cooler, high temp.
High power/high complexity integration
Energy efficiency
no XY shrinkage, excellent planarity and accuracy
Integration of optical and electrical conductors
MOEMS Packaging
TCE matching of Ceramic to Si, no XY shrinkage
3D integration, hermeticity, Wafer level packaging
MEMS Packaging
New and adapted materials, new and adepted processe
3D interconnection, passive integration, thermal management
System in Package
Flatness, TCE matching of Ceramic to PCB,High pin count, QFP, LGA, BGA
Heterogeneous Integration
Chemical performanceBiocompatibilityFluidic interfaces
Lab on Chip, integrated fluidic, integrated reactors and sensors
Biotechnology, chemical sensors
Technical RequirementsChallangeOpportunity
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
R&D Roadmaps
Microsystems and sensors are constantly increasing and require new packaging solutions.R&D efforts are put into innovative
LTCC technology DBC high temperature thickfilm
. The R&D road maps for LTCC ceramic are dominated
cost improvements at process level(self constrained sintering, high resolution screen printing, micro vialaser drilling, wafer level packaging)
cost improvements at integration leve(new functional materials like high k, low k, high permeability and TCE graduation and cost improvements by combined technologies
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
R&D Roadmaps
Tungsten/Aluminumnitride Interface•Tape casting•Tungsten ink preparation• Cofiring
AlN Multilayer System development
Courtesy of Fraunhofer IKTS
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Conclusion
Ceramic substrates provide economic and ecologic solutions at low, medium and high volumes for high reliability applications.
Increasing power and operating temperatures of the electronic devices needs well adjusted thermal properties of the ceramic board technology selected.
Increasing frequency of the electronic devices arrives to the request for passive integration of RF functions and thermal management
EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de
A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies
Acknowledgement
This presentation was supported by:
Dr. Knuth Baumgärtel, Micro-Hybrid, HermsdorfDr. Dieter Brunner, Anceram, Bindlach, Walter Distler, Siegert electronic, CadolzburgDr. Erwin Effenberger, ZVEI, FrankfurtDr. Marco Fritsch, Fraunhofer IKTS, DresdenThomas Heise, Ceramtec, Marktredwitz Dr. Sebastian Brunner, Epcos, DeutschlandsbergMichel. Massiot, Egide, BolleneChristina Modes, W.C. Heraeus, HanauWalter Röthlingshöfer, Bosch, ReutlingenDr. Jürgen Schulz-Harder, Electrovac Curamik, Ralf Stötter, Ketek, MünchenThomas. Walther, Lust Hybrid, Hermsdorf