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ADVANCED CMOS TECHNOLOGY 2020 (The 10/7/5 nm Nodes) May 27, 28, 29, 2020; An ONLINE Course 1. Detailed step-by-step 10/7 nm FinFET fabrication process (front-end & back-end) 2. FinFET manufacturing issues and solutions 3. 5 nm Horizontal Nanowire fabrication process flow 4. DRAM Memory Fabrication and Yield Issues 5. Detailed 3D Flash fabrication process flow and manufacturing issues 6. Future memory technologies 7. Extensive SEM/TEM Survey of Leading-edge devices 8. EUV Applications, Power Solutions and Status Update 9. 3D Packaging Versus 3D Monolithic packaging status update 10. CMOS Technology Forecast: 5 nm, 3 nm, 2 nm nodes COURSE CONTENT IS UPDATED & TECHNICALLY CURRENT THROUGH MAY 2020 © 2020 Threshold Systems Inc. All rights reserved. www.ThresholdSystems.com COVERED ARE 10/7NM FINFET, 3D FLASH AND 5NM NANOWIRE FABRICATION DETAILS

ADVANCED CMOS TECHNOLOGY 2020 · • Materials Suppliers & Applications Engineers • Patent Attorneys Dr. Moshe Preil is a world-class lithographer with over 30 years of experience

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Page 1: ADVANCED CMOS TECHNOLOGY 2020 · • Materials Suppliers & Applications Engineers • Patent Attorneys Dr. Moshe Preil is a world-class lithographer with over 30 years of experience

ADVANCED CMOS TECHNOLOGY 2020(The 10/7/5 nm Nodes)May 27, 28, 29, 2020; An ONLINE Course

1. Detailed step-by-step 10/7 nm FinFET fabrication process (front-end & back-end)

2. FinFET manufacturing issues and solutions

3. 5 nm Horizontal Nanowire fabrication process flow

4. DRAM Memory Fabrication and Yield Issues

5. Detailed 3D Flash fabrication process flow and manufacturing issues

6. Future memory technologies

7. Extensive SEM/TEM Survey of Leading-edge devices

8. EUV Applications, Power Solutions and Status Update

9. 3D Packaging Versus 3D Monolithic packaging status update

10. CMOS Technology Forecast: 5 nm, 3 nm, 2 nm nodes

COURSE CONTENT IS UPDATED & TECHNICALLY CURRENT THROUGH MAY 2020

© 2020 Threshold Systems Inc. All rights reserved.

www.ThresholdSystems.com

COVERED ARE 10/7NM FINFET, 3D FLASH AND 5NM NANOWIRE

FABRICATION DETAILS

Page 2: ADVANCED CMOS TECHNOLOGY 2020 · • Materials Suppliers & Applications Engineers • Patent Attorneys Dr. Moshe Preil is a world-class lithographer with over 30 years of experience

THE 10/7/5 NM NODES

This is the best and the most important course that you

can attend this year to learn about the key technical break-

throughs in Logic and Memory that have enabled 10/7 nm

node technology, and the manufacturing challenges of 3D

Flash, 7 nm FinFETs and 5 nm Nanowires.

Course Contents

Online Learning

© 2020 Threshold Systems Inc. All rights reserved.

1. Process integration. The 10/7 nm technology nodes represent landmarks in semiconductor manufacturing.

•Theenduringmythofatechnologynode •Marketforces:theshifttomobileapplications •TheIdsatequation •Ion/Ioffcurves,scalingmethodology 2. Detailed 10/7 nm FinFET Fabrication Sequence. The FinFet

represents a radical departure in transistor architecture. • Adetailedstep-by-step10/7nmFinFETfabricationprocess• FinFETHigh-k/MetalGateintegration• CobaltcontactsandCobaltmetallines•DetailsofBack-Endmetallizationmethodologiesandair-gapdielectrics

3. Nanowires at the 5 nm Node •ThedrivetoGate-All-Around(GAA)devices •NanowireSCEcontrolandscaling •Adetailed5nmNanowirefabricationprocess •Keyfabricationdetailsandmanufacturingproblems •VerticalversushorizontalNanowires:advantagesand disadvantages

4. Planar Flash & DRAM Memory. •DRAMmemoryfunctionandnomenclature •DRAMscalinglimits •Thecapacitor-lessDRAMmemorycell •PlanarFlashoperationandfunction •PlanarFlashscalingtechniques

5. 3D Flash Memory •Adetailedstep-by-stepSamsung3DNAND Flashfabricationprocess •Staircasefabricationmethodology •TheroleofALDin3DFlashfabrication •TheIntel-Micron3DNANDprocess

6. Advanced Lithography. •PhysicalLimitsofLithographyTools •ImmersionLithography–principlesandpractice •Double,TripleandQuadruplepatterning •EUVLithography:status,problemsandsolutions •ResolutionEnhancementTechnologies •Photoresist:chemicallyamplifiedresistissues •EmergingLithographyTechnologies(DSA)

7. Emerging Memory Technologies. •Cross-pointmemory •PhaseChangeMemory(PCRAM) •ResistiveRAM(ReRAM) •SpinTorqueTransferRAM(STT-RAM)–thebrightest prospect?

8. Survey of leading edge devices. This part of the course presents a visual feast of TEMs and SEMs of real-world, leading edge devices for Logic, DRAM, and Flash memory. It is presented by Dick James, the Fellow Emeritus of TechInsights.

9. 3D Packaging versus Monolithic 3D - which way to go? •TSVtechnology:design,processingandproduction •Interposers:theshortcutto3Dpackaging •Monolithic3Dfabricationprocesses •Annealing3DMonolithicstructures •TheInternetofThings(IoT).

10. The Way forward: a CMOS technology forecast. •Thetransitionto3Ddevices(Logic&FlashMemory) •TheFutureofMemoryandLogic •NewnanoscaleeffectsandtheirimpactonfutureCMOS device architecture and materials •Futuredevices:Quantumwelldevices,TunnelFETsandQuantumWires •IsMoore’slawfinallycomingtoanend?

Advanced CMOS Technology - An Online Course

TheCovid-19pandemicandthetravelrestrictionsithasimposedhavechangedthelandscapeoftechnicalinstructionfromtraditionalinstructor-leadclassroomlearningtowardadistributedlearningexperiencethatenablestheinstructorandthestudentstobeinsociallydistantlocations.Thislearningsolutioneliminateshighcostandinconvenienceassociatedwithhavingstudentstraveltoonelocationforinstruction.Itoffersasafe,flexibile,convenientandlessexpensivelearningexperiencethattraditionalclassroominstructiondoesnothave.Itisalsoidealforcompanieswithaglobalbusinessmodelandwhoseemployeesarescatteredaroundtheworld.

Page 3: ADVANCED CMOS TECHNOLOGY 2020 · • Materials Suppliers & Applications Engineers • Patent Attorneys Dr. Moshe Preil is a world-class lithographer with over 30 years of experience

• EquipmentSuppliers&MetrologyEngineers• FablessDesignEngineersandManagers• FoundryInterfaceEngineersandManagers• DeviceandProcessEngineers• Design Engineers

• ProductEngineers• ProcessDevelopment&ProcessIntegrationEngineers• ProcessEquipment&MarketingManagers• MaterialsSuppliers&ApplicationsEngineers• PatentAttorneys

Dr. Moshe Preil isaworld-classlithographerwithover30yearsofexperienceinthefield.HehasworkedatAMD,Luminescent,ASMLandmostrecentlyhewastheManagerofEmergingLithographyTechnologyatGlobalFoundries.CurrentlyheistheSeniorMarketingManagerinthePatterningDivisionatKLA-Tencor.Hehasleadteamstaskedwithinvestigatingstate-of-the-artLithographytoolsandprocessessuchasDirectedSelfAssembly(DSA)ande-BeamDi-rectWrite(EBDW)aswellasmanagedanEUVlithographytool.Adramaticandengagingpublicspeaker,Dr.Preilhastaughtnumerouscoursesonthesubjectofopticallithography,haspublishedextensivelyinthisfield,andiswidelyregardedasagiftedandinspiringinstructor.

Dick James is theFellowEmeritus forTechInsights, anOttawa,Canada-based reverseengineeringcompany thatspecializesinsemiconductorsandelectronicsystems.

DickjoinedTechInsightspredicessor,Chipworks,in1995andactsasaconsultanttoTechInsights’staffandcustom-ers,dealingwith themicrostructural characterizationofdevices,bothprocess andpackaging.He is alsoamuchsought-afterspeakerat technicalconferencesandapopularbloggeratTechInsights.comandElectroIQ.com,andotherpublications.

Dickgraduatedin1971withaM.Sc.inMicroelectronicsandSemiconductorDevicesfromtheUniversityofSouthamp-toninEngland,andaB.Sc.inAppliedChemistryfromtheUniversityofSalford.Hehasover40years’experienceinprocessdevelopment,design,manufacturing,packagingandreverseengineeringofsemiconductordevicesandisaworldauthorityontheinterpretationandanalysisofScanningandTransmissinElectronMicrographs.

Jerry Healeyhasbeenatechnicalprofessionalinthesemiconductorindustryfor30years,8yearsofwhichwerespentasaDeviceEngineeratMotorolaSemiconductor.HewasformerlyaninstructorforUCBerkeleyExtension(College of Engineering), andwas also employed as a Process Integration Engineer at both Sematech and theAdvancedTechnologyDevelopmentFacility(ATDF),whereheworkedonadvancedtechnologynodedevelopment.

Heisarenownedlecturerinthefieldofsiliconprocessing,andhisareasofexpertiseincludeprocessintegration,technologytransferofnewprocessesfromR&Dintomanufacturing,NanowireandFinFETfabrication.Hisaudienc-esrememberhimforthebreadthofhisknowledgeregardingsemiconductormanufacturing,hisengaginglecturestyle,andtheinsightfulcolorgraphicsheusestoillustratehislectures.

Thebestinstructorsinthebusinessteachthiscourse.Alloftheinstructorsareworld-classexpertsintheirfields,withdecadesofin-dustryexperience.However,thesepresentershavebeenselectednotjustfortheirdeeptechnicalexpertise,butalsofortheirabilitytopresentcomplextechnicalinformationinaclearandengagingmanner.Eachoftheseinstructorsisanexperiencedandskilledpublicspeaker,andtheaccompanyingcoursenotesforthisseminarareprofuselyillustratedwithhigh-quality3DcolorgraphicsandrelevantSEMsandTEMs.Wewantyoutoleavethiscoursewithaclearunderstandingofthekeyenablingtechnologiesthathavemadethe10/7nmnodetechnologiesareality,aswellasanunderstandingofwhatthecentraltechnicalchallengesareforthe5nmnode.Afteryouhavecompletedthiscourseyouwillneveragainleaveameetingwonderingwhatpeopleweretalkingabout.

How Online Learning Works:

Threshold Systems, Inc.,

527QueenAnneCourt,

San Antonio, TX 78229

512-576-6404www.ThresholdSystems.com

ADVANCED CMOS TECHNOLOGY - AN ONLINE COURSE MAY 27, 28, 29, 2020

$1,695

© 2020 Threshold Systems Inc. All rights reserved.

Who Should Attend:

Shortlyafterregisterationyouwillbeemailedalinkthatwilltakeyoutotheonlineclassroomthedayofthecourse.TheweekbeforetheclassbeginsabinderofcolorcoursenoteswillbeshippedtoyouviaFedexorUPS.

TheclassisthreedayslongandwillbeginonMay27,2020at8:30PDT.Onthatdayyousimplyclickonthelinkthathasbeenprovidedandyouwillbeseamlesslytakentotheonlineclassroomwhereyouwillbeabletosee,hearandinteractwiththeinstructor.

Tuition:

Course Instructors: