Think Lean – Create Value

Advanced Process CapabilitiesAdvanced Process Capabilitieson New Disk Deposition Equipmenton New Disk Deposition Equipment

Ren Xu, Ph.D.Technologist

Intevac

Diskcon Asia PacificMarch 2008

Think Lean – Create ValueProprietary 2/7/08_DiskconAP_Slide 2

Outline Industry OutlookIntevac OutlookNew TechnologyAdvanced Process Capabilities– Denser, higher Sp3 carbon (Mark VI)– Vapor deposition of lubricant (AccuLuber)– ICP for pre-(sputter) clean (Pre-Clean)– RF source for reactive sputter (RF Sputter)

Road Ahead– Next generation PMR (Linear Pass-by Source)– Patterned (bit or track) media and heat assisted

recording (Lean BPM)

Conclusions

Think Lean – Create ValueProprietary 2/7/08_DiskconAP_Slide 3

Media Processing Technology Needs

Strong Equipment Strong Equipment Technology Support Technology Support

Needed for 40% CAGR Needed for 40% CAGR AheadAhead

Source: TrendFocus, 2007

Demand for Digital Data

GrowthYear to Year

~ 60%Areal Density (GB/in2) ≤ 40%Minus

Growth In Hard Drives ~ 20%

Demand for Digital Data

GrowthYear to Year

~ 60%Areal Density (GB/in2) ≤ 40%Minus

Growth In Hard Drives ~ 20%

Think Lean – Create ValueProprietary 2/7/08_DiskconAP_Slide 4

Intevac HDD Equipment Outlook

Enabling New Media TechnologyEnabling New Media Technology

110 Systems Shipped World-Wide for PMR Ramp

Committed to Making 200 Lean Platform Extendable to All PMR, HAMR, DTR and BPM Technology Generations

Focus On Gen II and Beyond:– Extending Advanced Media

Process Capabilities;– Enhancement of System Efficiency;– Reduction of Cost of Ownership

Think Lean – Create ValueProprietary 2/7/08_DiskconAP_Slide 5

New Technology

Interface Layer– AccuLuber – New Carbon Technology

Magnetic Layer– RF Sputtering Source– New Magnetron Poles

Production Enhancement– Pre-Clean Source for Defect Reduction– Gen II

Future Technology– HAMR– Patterned Media

Think Lean – Create ValueProprietary 2/7/08_DiskconAP_Slide 6

Vacuum Vapor Lube System: AccuLuber AccuLuber Provides Improved Process Control and Defect Reduction High Throughput: 1200 Disk Per Hour in Parallel ModeEliminates the Use of Costly and Hazardous Solvents in the Lubrication Process– ~$150K USD savings in solvent usage

per luber per year– Eliminate need for solvent disposal and

atmospheric emission

User-Friendly InterfaceMultiple Units Shipped to CustomerKey Specs: 10-15A, 4 sec Process, Temperature 100-200C, +/-1A Uniformity

2B

0

5

10

150

45

90

135

180

225

270

315

IDMDOD

Think Lean – Create ValueProprietary 2/7/08_DiskconAP_Slide 7

Enhanced Carbon TechnologyDeveloped on the Basis of the Production Proven NCT Mark V TechnologyNCT Mark VI Source

– Gridless• No In-Situ Oxygen Cleaning Needed• Production Ready

– Higher Mass Density • Up to 2.3 g/cm3

– Higher Ratio of sp3 Bonds– Better Corrosion Resistance– Thinner COC (25A) and Comparable

performance

UltraUltra--Thin, HighThin, High--Density Carbon Overcoat for Excellent Density Carbon Overcoat for Excellent Corrosion Resistance and Parametric BenefitCorrosion Resistance and Parametric Benefit

Think Lean – Create ValueProprietary 2/7/08_DiskconAP_Slide 8

Film Density

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

0.18 0.19 0.20 0.21 0.22 0.23

Incidence (deg)

Ref

lect

ivity

VI 1VI 2VI 3V Std

2.06

2.21

2.02

2.04

Density (g/cm3)

Silicon

Emission=0.8 A

CarbonDensity of 2.2 g/cm3

Achieved– Further fine-tuning to

achieve 2.3 g/cm3 is in progress

MK VI Source Can Deliver Much Stronger Bombardment on the Disk

Comparing Gridded CCP Source

– Marketing — 2.3 g/cm3

– HGST published data —2.1 g/cm3

Think Lean – Create ValueProprietary 2/7/08_DiskconAP_Slide 9

RF Sputtering Source

Designed to Address Some Issues Observed in DC Sputtering of Oxide-Segregated Recording Layer in PMR

– Target Spitting– Low Target Utilization– Yield Drop Due to Particles

Compatible with 200 Lean

Both Auto and Manual Match Modes Will Be Available

– 3 KW Capability– RF Deposition Rate ~50% of DC

Rate for Metal Targets With Argon

Think Lean – Create ValueProprietary 2/7/08_DiskconAP_Slide 10

New Magnetron PolesPoles for Small Targets For 2.5 Inch Disks

SUL Poles– Higher Target Utilization (53% 65%)– 75% More Disk Deposition Per Target– Higher Sputter Rate

-3 -2 -1 0 1 2 30.0

0.2

0.4

0.6

0.8

1.0

New Std

Nor

mal

ized

rem

aini

ng ta

rget

thic

knes

s

Target radius (in)

Erosion Profiles for High Ms Targets

Think Lean – Create ValueProprietary 2/7/08_DiskconAP_Slide 11

Vacuum Sputter Pre-Clean Source for Defect Reduction and Yield Improvement

Wide Operation Range– 500W-3kW– 100 mTorr capable– Ar-O2 dual gas capability

200 Lean Compatible Design for Configuration at Stations Pre-Sputter

Fixed and Auto Tune Capability for Power Efficiency

Think Lean – Create ValueProprietary 2/7/08_DiskconAP_Slide 12

Pre-Clean Process and Benefit

Wash

Lube

Proposed Configuration with Pre –Clean1 2 3 4 5 6 7 8 9 10

Pre-Clean

H SL SUL1 SUL2 Ru SUL3 SUL4 IL1 IL2

20 19 18 17 16 15 14 13 12 11

COC COC COC Blank Cool Cool ML3 ML2 H ML1

Wash

Lube

1 2 3 4 5 6 7 8 9 10

Pre-Clean

H SL SUL1 SUL2 Ru SUL3 SUL4 IL1 IL2

20 19 18 17 16 15 14 13 12 11

COC COC COC Blank Cool Cool ML3 ML2 H ML1

Combination of Ar-O2 Allows for Tuning of Etch Efficiency for Various Types of Defects

Carbon-Type Defect Etch Rate: 3-30A/kW-Sec

Demonstrated Effective in Removal of Water Stain, Oil Droplet, and Other Organic-Based Defect

Customer Field Evaluation in Progress

Think Lean – Create ValueProprietary 2/7/08_DiskconAP_Slide 13

Equipment Technology Supporting Media Technology

0

200

400

600

800

1000

1200

1400

1600

1800

2000

PMR 1 PMR 2 PMR 3 PMR 4 HAMR Patterned

Are

al D

ensi

ty, G

bits

/in2

Advanced Sputter SourcesRF Sputtering CapabilityImproved/Advanced NCT Station Vapor Lube Technology

Advanced Sputter SourceNew NCT and Vapor LubeHigh Temperature Deposition

Areal Density GrowthAreal Density Growth

200 Lean Extendibility200 Lean Extendibility

High Throughput EtchHigh Throughput Planarization

IntevacIntevac’’s Equipment Strategys Equipment Strategy

Think Lean – Create ValueProprietary 2/7/08_DiskconAP_Slide 14

High Temperature Capability on 200L

Capability to Sputter Hard Magnetic Layers at Capability to Sputter Hard Magnetic Layers at High Temperature is Critical for HAMRHigh Temperature is Critical for HAMR

200L Platform Sequential Heating: st.1_4kw x 4 sec, st 2_2.25kw x 4 sec,

0

200

400

600

800

463 488 513 538 563Time (sec)

Ther

mal

Cou

ple

(C)

1st st.

2nd st.

Think Lean – Create ValueProprietary 2/7/08_DiskconAP_Slide 15

Lean_BPM Positioning in Media Mfg Line

Clean SubstrateClean Substrate

24 Station24 Station200 Lean200 Lean(Sputter)(Sputter)SeedLSeedL

ULULILIL

Multiple MagLMultiple MagLCOCCOC

AccuLuberAccuLuber(Vapor Lube)(Vapor Lube)LubricationLubrication

(GH)(GH)Glide TestGlide Test(Burnishing(BurnishingPass, GlidePass, Glide

Test)Test)

(UV/Heat)(UV/Heat)BondingBonding (Certification)(Certification)

Cert TestCert Test

Shipment

(TB)(TB)Tape Tape

BurnishBurnishNano ImprintLithography(Patterned

Resist)

QA

MultiMulti--StationStationLean BPMLean BPM(Patterning)(Patterning)

DeDe--Scum/TrimScum/TrimHard Mask EtchHard Mask Etch

Resist StripResist StripMag Stack EtchMag Stack Etch

PlanarizationPlanarizationCOCCOC

Continuous Media Proc/EqptContinuous Media Proc/Eqpt Nano Imprint LithographyNano Imprint Lithography Bit Patterned MediaBit Patterned Media

Think Lean – Create ValueProprietary 2/7/08_DiskconAP_Slide 16

THANK YOU

Over 110 200 LeanOver 110 200 Lean®® Systems in Production Systems in Production