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EWM-C103FD01E Specifications subject to change without notice, contact your sales representatives for the most update information. REV 1.0 Page 1 of 21 Apr. 10, 2011 EWM-C103FD01E Datasheet

Advantech EWM-C103FD01E DS V1.0 20110410downloadt.advantech.com/ProductFile/PIS/EWM-C103FD...EWM-C103FD01E Specifications subject to change without notice, contact your sales representatives

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EWM-C103FD01E

Specifications subject to change without notice, contact your sales representatives for the most update information. REV 1.0 Page 1 of 21 Apr. 10, 2011

EWM-C103FD01E Datasheet

EWM-C103FD01E

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CONTENTS 1. Overview ............................................................................................ 4 

2. Features ............................................................................................. 5 2.1  General Characteristics ................................................................................................... 5 2.2  RF Functionatilies ........................................................................................................... 6 

3. HARDWARE DESCRIPTION ............................................................ 10 3.1  System Interface ........................................................................................................... 10 3.2  Functional Diagram ....................................................................................................... 10 3.3  Pin Assignment and Description .................................................................................... 11 3.4  Terminal Definition ......................................................................................................... 13 3.5  Electrical Characteristics ............................................................................................... 14 

4. Mechanical Dimension.................................................................... 18 4.1  Top View ........................................................................................................................ 18 4.2  Bottom View .................................................................................................................. 19 4.3  Side View ...................................................................................................................... 20 

Appendix: Part Number Table ........................................................... 21 

EWM-C103FD01E

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Revision History

Rev. Date History

1.0 2011/4/10 1. 1st release

Advantech reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Advantech is believed to be accurate and reliable. However, Advantech does not assure any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. Copyright © 1983-2011 Advantech Co., Ltd. All rights reserved.

EWM-C103FD01E

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1. Overview

This document describes all the functions, features, and interfaces of the HSDPA PCI Express Mini Card Module – EWM-C103FD01E. The EWM-C103FD01E HSDPA module supports dual band WCDMA/HSDPA and quad-band GSM/GPRS/EDGE network connection capability.

The EWM-C103FD01E HSDPA module can provides high speed data connection, the data

speed of downlink and uplink path is up to 3.6 Mbps and 384 Kbps respectively. Furthermore, users can ease to use this module by using the “HSPA Modem” application softwarw that we provide for Windows XP and Vista system.

With the EWM-C103FD01E HSDPA module, devices are enhanced in both functionality and

usability based on state of the art wireless technology.

EWM-C103FD01E

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2. Features 2.1 General Characteristics

Bands:Dual Band WCDMA and Quad Band GSM)

Band TX RX GSM850 824 ~ 849 MHz 869 ~ 894 MHz

EGSM900 880 ~ 915 MHz 925 ~ 960 MHz

DCS1800 1710 ~ 1785 MHz 1805 ~ 1880 MHz

PCS1900 1850 ~ 1910 MHz 1930 ~ 1990 MHz

WCDMA900 882 ~ 912 MHz 927 ~ 957 MHz

WCDMA2100 1920 ~ 1980 MHz 2110 ~ 2170 MHz

Support SIM Interface:1.8V/3V

Environmental

– Operational temperature:-20 ~ +60℃

– Storage temperature:-40 ~ +85℃

Form Factor

– Dimension:50.95 x 30 x 3.6 mm

– Weight:10g

Power:3.3V ~ 3.6V

Power Consumption

– Data Mode:

Band Typ Max Unit GSM850 / PCL=5 360 390 mA

EGSM900 / PCL=5 360 390 mA

DCS / PCL=0 310 340 mA

PCS / PCL=0 310 340 mA

WCDMA (all band) 750 820 mA

– EDGE & GPRS Multislot :

GMSK 8PSK Band Slot 1 Slot 2 Slot 3 Slot 4 Slot 1 Slot 2 Slot 3 Slot 4

GSM850 < 380mA < 635mA < 755mA < 775mA < 280mA < 310mA < 425mA < 505mA

GSM900 < 380mA < 635mA < 755mA < 775mA < 280mA < 310mA < 425mA < 505mA

DCS1800 < 330mA < 525mA < 610mA < 640mA < 200mA < 305mA < 340mA < 375mA

PCS1900 < 330mA < 525mA < 610mA < 640mA < 200mA < 305mA < 340mA < 375mA

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– Sleeping Mode :

Typ (Average) Max (Average) Unit GSM / MFRM=2 5 6 mA

GSM / MFRM=9 3 4.5 mA

DCS / MFRM=2 5 6 mA

DCS / MFRM=9 3.4 5 mA

PCS / MFRM=2 5 6 mA

PCS / MFRM=9 3.1 4.5 mA

WCDMA / DRX=6 (0.64 S) 5.7 6.5 mA

WCDMA / DRX=9 (5.12 S) 3.2 4.5 mA

Shutdown current 10 50 mA

Hardware Interface:

– 52 Pins PCI Express Mini Card connector interface – 1 RF Antenna Coaxial Connectors

2.2 RF Functionatilies

Maximum TX Power

Band Max Min GSM850 33 dBm ±2dBm 5 dBm ±5dBm

EGSM 33 dBm ±2dBm 5 dBm ±5dBm

DCS 30 dBm ±2dBm 0 dBm ±5dBm

PCS 30 dBm ±2dBm 0 dBm ±5dBm

GSM850(EDGE) 27 dBm ±3dBm 5 dBm ±5dBm

EGSM(EDGE) 27 dBm ±3dBm 5 dBm ±5dBm

DCS(EDGE) 26 dBm ±3dBm 2 dBm ±5dBm

PCS(EDGE) 26 dBm ±3dBm 2 dBm ±5dBm

UMTS-2100 24 dBm +1/-3dBm Lest than -50dBm

UMTS-900 24 dBm +1/-3dBm Lest than -50dBm

1/15≦βo/βd≦12/15 (HS-DPCCH) 24 dBm +1/-3dBm

13/15≦βo/βd≦15/8 (HS-DPCCH) 23 dBm +2/-3dBm

15/7≦βo/βd≦15/0 (HS-DPCCH) 22 dBm +3/-3dBm

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Parametric Performance

Band (GSM) Peak Phase Error RMS Phase Error GSM850 <20° <5°

EGSM <20° <5°

DCS <20° <5°

PCS <20° <5°

Band (WCDMA) Error Vector Magnitude UMTS-2100 (HS-DPCCH) <17.5%

UMTS-900 (HS-DPCCH) <17.5%

Sensitivity

Band Typical ETSI GSM850 -107 dBm -104 dBm

EGSM -107 dBm -104 dBm

DCS -107 dBm -103 dBm

PCS -107 dBm -103 dBm

EDGE (GMSK modulation) -107 dBm -104 dBm

EDGE (8-PSK modulation) -104 dBm -102 dBm

UMTS-2100 -110 dBm -106.7 dBm

UMTS-900 -109.5 dBm -104.7 dBm

Radio Frequency

GSM850 (850 MHz) Frequency Range TX:824-849 MHz;RX:869-894 MHz

Channel Spacing 200 KHz

Number of Channels 124 Carriers x 8 (TDMA)

Modulation GMSK / 8-PSK

Duplex Spacing 45 MHz

Frequency Stability +/- 0.1 ppm (Uplink TX)

Power Output 33 dBm Class 4 (2 W peak) – 5 dBm

Output Impedance 50 Ohm

Spurious Emission -36 dBm up to 1GHz (< -30dBm > 1GHz)

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EGSM (900 MHz) Frequency Range TX:880-915 MHz;RX:925-960 MHz

Channel Spacing 200 KHz

Number of Channels 124 Carriers x 8 (TDMA)

Modulation GMSK / 8-PSK

Duplex Spacing 45 MHz

Frequency Stability +/- 0.1 ppm (Uplink TX)

Power Output 33 dBm Class 4 (2 W peak) – 5 dBm

Output Impedance 50 Ohm

Spurious Emission -36 dBm up to 1GHz (< -30dBm > 1GHz)

DCS (1800 MHz) Frequency Range TX:1710-1785 MHz;RX:1805-1880 MHz

Channel Spacing 200 KHz

Number of Channels 374 Carriers x 8 (TDMA)

Modulation GMSK / 8-PSK

Duplex Spacing 95 MHz

Frequency Stability +/- 0.1 ppm (Uplink TX)

Power Output 30 dBm Class 1 (1 W peak) – 0 dBm

Output Impedance 50 Ohm

Spurious Emission -36 dBm up to 1GHz (< -30dBm > 1GHz)

Compatible with phase 2 feature

PCS (1900 MHz) Frequency Range TX:1850-1910 MHz;RX:1930-1990 MHz

Channel Spacing 200 KHz

Number of Channels 299 Carriers x 8 (TDMA)

Modulation GMSK / 8-PSK

Duplex Spacing 80 MHz

Frequency Stability +/- 0.1 ppm (Uplink TX)

Power Output 30 dBm Class 1 (1 W peak) – 0 dBm

Output Impedance 50 Ohm

Spurious Emission -36 dBm up to 1GHz (< -30dBm > 1GHz)

Compatible with phase 2 feature

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WCDMA_BC 1 (2100 MHz) Frequency Range TX:1920-1980 MHz;RX:2110-2170 MHz

Channel Spacing 200 KHz

Number of Channels 299 Carriers x 8 (TDMA)

Modulation QPSK

Duplex Spacing 190 MHz

Frequency Stability +/- 0.1 ppm (Uplink TX)

Power Output 24 dBm +1/-3dBm –less than -50dBm

Output Impedance 50 Ohm

Spurious Emission

-60dBm(860-895MHz);-60dBm(921-925MHz);-67dBm(925-935MHz); -79dBm(935-960MHz);-67dBm(1475.9-1500.9MHz);-71dBm(1805-1880MHz); -60dBm(1844.9-1879.9MHz);-41dBm(1884.5-1919.6MHz); -60dBm(2110-2170MHz); -60dBm(2620-2690MHz);

WCDMA_BC 8 (900 MHz) Frequency Range TX:882-912 MHz;RX:927-957 MHz

Channel Spacing 200 KHz

Number of Channels 299 Carriers x 8 (TDMA)

Modulation QPSK

Duplex Spacing 80 MHz

Frequency Stability +/- 0.1 ppm (Uplink TX)

Power Output 24 dBm +1/-3dBm –less than -50dBm

Output Impedance 50 Ohm

Spurious Emission -67dBm(925-935MHz);-79dBm(935-960MHz);-71dBm(1805-1880MHz); -60dBm(1830-1880MHz);-41dBm(1885-1920MHz);-60dBm(2110MHz-2170Mz); -60dBm(2620-2690MHz);

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3. HARDWARE DESCRIPTION 3.1 System Interface

System Interface

Signal Pin Counts. Description Power 5 3.3V power source

GND 13 Return current path

USB 2 USB serial data interface compliant to the USB 2.0 specification

W_DISABLE# 1 Enable/ Disable the HSDPA module

UIM 4 SIM function

LED 1 Status indicator

Antenna Interface

Signal Group Connector no. Description ANT 1 Antenna interface

3.2 Functional Diagram

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3.3 Pin Assignment and Description Pin No. Definition Basic Description Type

1 NC No connect. Should be left open.

2 +3.3Vaux 3.3V power source VCC

3 NC No connect. Should be left open.

4 GND Return current path GND

5 NC No connect. Should be left open.

6 NC No connect. Should be left open.

7 NC No connect. Should be left open.

8 UIM_PWR Power source for the USIM Output

9 GND Return current path GND

10 UIM_DATA USIM data signal Input/ Output

11 NC No connect. Should be left open.

12 UIM_CLK USIM clock signal Output

13 NC No connect. Should be left open.

14 UIM_RESET USIM reset signal Output

15 GND Return current path GND

16 NC No connect. Should be left open.

17 NC No connect. Should be left open.

18 GND Return current path GND

19 NC No connect. Should be left open.

20 W_DISABLE# Active low signal.

This signal is used by the system to shutdown the HSDPA module. Input

21 GND Return current path GND

22 NC No connect. Should be left open.

23 NC No connect. Should be left open.

24 +3.3Vaux 3.3Vaux power supply VCC

25 NC No connect. Should be left open.

26 GND Return current path GND

27 GND Return current path GND

28 NC No connect. Should be left open.

29 GND Return current path GND

30 NC No connect. Should be left open.

31 NC No connect. Should be left open.

32 NC No connect. Should be left open.

33 NC No connect. Should be left open.

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Pin No. Definition Basic Description Type

34 GND Return current path GND

35 GND Return current path GND

36 USB_D- USB serial data interface (negative) Input/ Output

37 GND Return current path GND

38 USB_D+ USB serial data interface (positive) Input/ Output

39 +3.3Vaux 3.3V power source VCC

40 GND Return current path GND

41 +3.3Vaux 3.3V power source VCC

42 LED_WWAN# Active low signal. WAN status LED driver. Output

43 GND Return current path GND

44 NC No connect. Should be left open.

45 NC No connect. Should be left open.

46 NC No connect. Should be left open.

47 NC No connect. Should be left open.

48 NC No connect. Should be left open.

49 NC No connect. Should be left open.

50 GND Return current path GND

51 NC No connect. Should be left open.

52 +3.3Vaux 3.3V power source VCC

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3.4 Terminal Definition

Recommend antenna connect (Hirose Coaxial Connectors)

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System connector (PCIE Express interface compatibility Mini Card Electromechanical Specification Revision 1.1.)

3.5 Electrical Characteristics

DC characteristics (Power Supply)

Symbol Parameter Min Typ Max Unit +3.3Vaus Power Supply Voltage 3.2 3.3 3.6 V

Isys (peak) System Max Current Consumption 2.0 2.2 A

Isys (avg.) System Max Current Consumption 0.8 1.0 A

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Control Interface (W_DISABLE#)

Symbol Parameter Min Max Unit VIH High Level Input Voltage 0.7Vcc V

VIL Low Level Input Voltage 0.3Vcc V

Tpwron Power-on sequence interval 1.5 sec

High Level:Device Power on Low Level:Device Power off

W_DISABLE# must stay high at least tpwron to power on the Device.

USB Transceiver DC characteristics (The USB interface is powered from 3.3V power source.)

Symbol Parameter Min Max Unit Input Levels for Low/ Full Speed

VIH High 2.0 V

VIL Low 0.8 V

VDI Differential Input Sensitivity 0.2 V

Input Levels for High Speed

VHSSQ High Speed Squelch Detection Threshold 100 150 mV

VHSDSC High Speed Disconnection Detection Threshold 100 150 mV

Output Levels for Low/ Full Speed

VOL Low 0.0 0.3 V

VOH High 2.85 3.3 V

Output Levels for High Speed

VHSOI High Speed Idle Level -10.0 10.0 mV

VHSOH High Speed Data Signaling High 360 440 mV

VHSOL High Speed Data Signaling Low -10.0 10.0 mV

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USIM Interface

Pin Name Description Type 8 UIM_PWR Power source for the USIM Output

10 UIM_DATA USIM data signal Input/ Output

12 UIM_CLK USIM clock signal Output

14 UIM_RESET USIM reset signal Output

Symbol Parameter Min Max Unit VIH Logic High Input Voltage 0.65 x VSIM VSIM + 0.3 V

VIL Logic Low Input Voltage -0.3 0.35 x VSIM V

IIH Input High Leakage Current - 1 uA

IIL Input Low Leakage Current -1 - uA

VOH Logic High Output Voltage VSIM - 0.45 VSIM V

VOL Logic Low Output Voltage 0 0.45 V

IOZH High-Level, Three-State Leakage Current - 1 uA

IOZL Low-Level, Three-State Leakage Current -1 - uA

Type I (8 Pins UIM socket)

Type II (6 Pins UIM socket)

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Current Driver Interface

Parameter Min Typ Max Unit LED_WWAN 10 mA

LED Application Circuit

Recommend to reserve "Resistor" and "Capacitor" for improve RF wireless performance.

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4. Mechanical Dimension

4.1 Top View

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4.2 Bottom View

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4.3 Side View

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Appendix: Part Number Table

Product Advantech PN

UMTS2100/UMTS900 (3G dual band) + quad band GPRS/EDGE EWM-C103FD01E