AFFORDABLE “BREATHING WALL” AFFORDABLE “BREATHING WALL” Building Envelope DesignBuilding Envelope Design

For conventional North American wood For conventional North American wood frame and panelized (SIP’s) constructionframe and panelized (SIP’s) construction

“Breath of Life” building recommendations

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THE CHALLENGETHE CHALLENGEthat all materials and processes be:that all materials and processes be:

NON- (OR VERY LOW) TOXICNON- (OR VERY LOW) TOXIC– CONTAINING LITTLE OR NO HARMFUL SUBSTANCES CONTAINING LITTLE OR NO HARMFUL SUBSTANCES – IN PRODUCING OR IN FINAL APPLIED PRODUCT IN PRODUCING OR IN FINAL APPLIED PRODUCT

FIRE, MOLD, WATER & SHRINK RESISTANTFIRE, MOLD, WATER & SHRINK RESISTANT– CAN SUSTAIN LONG TERM WATER EMERSIONCAN SUSTAIN LONG TERM WATER EMERSION

NON DISRUPTIVE TO BUILDING PROCESSNON DISRUPTIVE TO BUILDING PROCESS– LITTLE OR NO LEARNING CURVELITTLE OR NO LEARNING CURVE– READILY AVAILBLE ORDERED MATERIALSREADILY AVAILBLE ORDERED MATERIALS

AFFORDABLEAFFORDABLE– CAN BE FINANCED CONVENTIONALLYCAN BE FINANCED CONVENTIONALLY– COMPARIBLE IN PRICE TO CONVENTIONALCOMPARIBLE IN PRICE TO CONVENTIONAL

SUSTAINABLESUSTAINABLE– READILY AVAILBLE RENEWABLE RESOURCESREADILY AVAILBLE RENEWABLE RESOURCES– PRODUCES LITTLE OR POLUTION OR WASTEPRODUCES LITTLE OR POLUTION OR WASTE

NON CONDUCTIVE NON CONDUCTIVE – (THERMALLY & ELECTRONICALLY)(THERMALLY & ELECTRONICALLY)

A Natural PrescriptionA Natural PrescriptionFOR A CONVENTIONAL SLAB ON GRADE STICK FRAMED BUILDING ENVELOPEFOR A CONVENTIONAL SLAB ON GRADE STICK FRAMED BUILDING ENVELOPE

FOUNDATION:FOUNDATION:– USE NON CONDUCTIVE REBAR IN FOOTINGSUSE NON CONDUCTIVE REBAR IN FOOTINGS

USE FIBERGLASS OR NEW BASALT REBARUSE FIBERGLASS OR NEW BASALT REBAR

- REPLACE VAPOR BARRIER UNDER SLAB- REPLACE VAPOR BARRIER UNDER SLAB ADD “BREATHING” CLAY TREATED WOOD CHIPS LAYER OR ADD “BREATHING” CLAY TREATED WOOD CHIPS LAYER OR

OTHER NON-HYDROSCOPIC AREATED, INSULATIVE, NON OTHER NON-HYDROSCOPIC AREATED, INSULATIVE, NON CODUCTIVE MATERIALS UNDER SLAB -(2” to 4” deep)CODUCTIVE MATERIALS UNDER SLAB -(2” to 4” deep)

– USE NON CONDUCTIVE REBAR UNDER SLABUSE NON CONDUCTIVE REBAR UNDER SLAB WALLS:WALLS:

– MGO/CLAY MASTIC UNDER UNTREATED SILL PLATEMGO/CLAY MASTIC UNDER UNTREATED SILL PLATE– MGO/CLAY SLURRY COATING ON ENTIRE FRAMEMGO/CLAY SLURRY COATING ON ENTIRE FRAME

DONE BEFORE SHEETING APPLIEDDONE BEFORE SHEETING APPLIED– MGO CEMENT/FIBER BOARD EXTERIOR SHEETINGMGO CEMENT/FIBER BOARD EXTERIOR SHEETING– NON OR LOW TOXIC INSULATIONNON OR LOW TOXIC INSULATION– MGO CEMENT/FIBER BOARD INTERIOR SHEETINGMGO CEMENT/FIBER BOARD INTERIOR SHEETING– BREATHING, LOW OR NON TOXIC STUCCOBREATHING, LOW OR NON TOXIC STUCCO

A Natural PrescriptionA Natural PrescriptionFOR A CONVENTIONAL SLAB ON GRADE STICK FRAMED BUILDING ENVELOPEFOR A CONVENTIONAL SLAB ON GRADE STICK FRAMED BUILDING ENVELOPE

FRAMED SECOND FLOOR:FRAMED SECOND FLOOR:– ENTIRE JOIST AREA MGO/CLAY MISTEDENTIRE JOIST AREA MGO/CLAY MISTED– MGO CEMENT/FIBER BOARD SHEETING OVERMGO CEMENT/FIBER BOARD SHEETING OVER

BOARD CAN BE PRE STAINED/SCORED/”UV”HARDENEDBOARD CAN BE PRE STAINED/SCORED/”UV”HARDENED– NON OR LOW TOXIC INSULATION ADDEDNON OR LOW TOXIC INSULATION ADDED

COTTON,CELLULOSE, PERLITE (ECT)COTTON,CELLULOSE, PERLITE (ECT)

ROOF:ROOF:– ENTIRE RAFTER/TRUSS AREA MGO/CLAY MISTEDENTIRE RAFTER/TRUSS AREA MGO/CLAY MISTED– MGO CEMENT/FIBER BOARD SHEETING OVERMGO CEMENT/FIBER BOARD SHEETING OVER– USE LEAST TOXIC/CONDUCTIVE FINISH ROOF OVERUSE LEAST TOXIC/CONDUCTIVE FINISH ROOF OVER

CLAY TILE, CONCRETE TILE, COMPO (ECO) SHAKE (ECT)CLAY TILE, CONCRETE TILE, COMPO (ECO) SHAKE (ECT)

A Natural PrescriptionA Natural PrescriptionFOR A CONVENTIONAL SLAB ON GRADE STICK FRAMED BUILDING ENVELOPEFOR A CONVENTIONAL SLAB ON GRADE STICK FRAMED BUILDING ENVELOPE

NON- (OR VERY LOW) TOXICNON- (OR VERY LOW) TOXIC– CONTAINS ONLY NATURAL MINERALS (NO POLYMERS)-<008% SILICA CONTENTCONTAINS ONLY NATURAL MINERALS (NO POLYMERS)-<008% SILICA CONTENT– PRODUCTION REQUIRES <20% OF THE ENERGY TO PRODUCE PORTLAND CEMENTPRODUCTION REQUIRES <20% OF THE ENERGY TO PRODUCE PORTLAND CEMENT

FIRE, MOLD, WATER & SHRINK RESISTANTFIRE, MOLD, WATER & SHRINK RESISTANT– CAN SUSTAIN LONG TERM UNDER WATER EMERSION-UL,ASTM, ICC APPROVALSCAN SUSTAIN LONG TERM UNDER WATER EMERSION-UL,ASTM, ICC APPROVALS

NON DISRUPTIVE TO BUILDING PROCESSNON DISRUPTIVE TO BUILDING PROCESS– LITTLE OR NO LEARNING CURVE-IF YOU CAN USE HARDI BOARD YOUR READYLITTLE OR NO LEARNING CURVE-IF YOU CAN USE HARDI BOARD YOUR READY– DIRECTLY REPLACES PLYWOOD, OSB AND SHEETROCK IN SAME SIZES & RATINGSDIRECTLY REPLACES PLYWOOD, OSB AND SHEETROCK IN SAME SIZES & RATINGS– READILY AVAILBLE ORDERED MATERIALS IN BULKREADILY AVAILBLE ORDERED MATERIALS IN BULK

AFFORDABLEAFFORDABLE– CAN BE FINANCED CONVENTIONALLY (SAME AS HARDIBOARD)CAN BE FINANCED CONVENTIONALLY (SAME AS HARDIBOARD)– COMPARIBLE IN PRICE TO CONVENTIONAL HARDIBOARD SHEETED BUILDINGCOMPARIBLE IN PRICE TO CONVENTIONAL HARDIBOARD SHEETED BUILDING

SUSTAINABLESUSTAINABLE– READILY AVAILBLE RENEWABLE RESOURCES (~8%OF EARTHS SURFACE MGO)READILY AVAILBLE RENEWABLE RESOURCES (~8%OF EARTHS SURFACE MGO)– PRODUCES LITTLE OR POLUTION OR WASTE,<20% OF ENERGY NEEDED FOR P.C.PRODUCES LITTLE OR POLUTION OR WASTE,<20% OF ENERGY NEEDED FOR P.C.

NON CONDUCTIVE NON CONDUCTIVE – THERMALLY AND ELECTRONICALLY LESS CONDUCTIVE THAN SHTRK, OSB OR P.W.THERMALLY AND ELECTRONICALLY LESS CONDUCTIVE THAN SHTRK, OSB OR P.W.

BONDS TO ALL THINGS CELULOSEBONDS TO ALL THINGS CELULOSE- - WITHOUT SPECIAL PRETREATMENTWITHOUT SPECIAL PRETREATMENT

WHY MGO CEMENT & MGO/FIBER BOARD?

A Natural PrescriptionA Natural PrescriptionFOR A CONVENTIONAL SLAB ON GRADE STICK FRAMED BUILDING ENVELOPEFOR A CONVENTIONAL SLAB ON GRADE STICK FRAMED BUILDING ENVELOPE

THE KELLY BUTCHER RESIDENCE, NORTH CENTRAL MINNESOTA

A Natural PrescriptionA Natural PrescriptionFOR A CONVENTIONAL SLAB ON GRADE STICK FRAMED BUILDING ENVELOPEFOR A CONVENTIONAL SLAB ON GRADE STICK FRAMED BUILDING ENVELOPE

THE FUTURETHE FUTURE

Mgo floor joists

Mgo wall panels

Mgo fire doors

Mgo ICC approval

(S.I.P.’s)