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Agenda / Presentations
Henkel Electronic Materials
Technical Workshop
at Iskratel/Kranj-Slovenija
30th September 2014
Henkel Electronic Materials
Josef Schneider
Regional Sales Manager
Henkel, Electronic Materials
Eastern Europe & India & Middle East & Africa
1. Introduction
2. Henkel Electronic Materials
3. Amtest
Topics
Henkel Electronic Materials
Henkel Electronic Materials4
Image
Who we areFamily Company with more than 130 Years of History
Founded 1876
Historical basis: Chemicals based on
natural oils & fats
Preferred stocks traded since 1985
Family owns > 59 % of ordinary stocks
47.000 Employees
Henkel Electronic Materials5
Laundry & Home Care Beauty Care Adhesive Technologies
Who we areGlobal leading positions in consumer andindustrial businesses
Consumer Businesses Industrial Business
Henkel Electronic Materials6
Adhesive TechnologiesFive Business Segments
We leverage our engineering expertise across our business units
Packaging
and
Consumer
Goods
Consumer,
Craftsmen
and
Building
Transport
and
Metal
General
IndustryElectronics
Henkel Electronic Materials7
Henkel Electronic Materials8
Our Technology Brands
Who We AreOur Brands
1997
2000
2005
2008
• PCB Assembly
Solder Material
• PCB Assembly
Solder Material
• Semiconductor &
PCB Assembly
• Semiconductor
Mold Compound
• Printed Circuit
Board (PCB)
• Printed Electronics
• Semiconductor
Assembly
Our Manufacturer Brand
ECA
NCA
SMA
ABP
Underfill
Sealants
Encapsulants
Light cure
Adhesives
NCP
Solder Paste
Liquid Flux
Solder Wire
Solder Bar
Accessories
Assembly Film
Thermal
(Interface)
Management
Materials
Thermally
conductive
Adhesive
Abbreviations:
CBP = Circuit Board Protection ECA = Electrically Conductive Adhesive LPM = Low Pressure Molding
PCM = Powder Compression Molding NCP = Non Conductive Paste WBC = Wafer Backside Coating
LCA = Light Cure Adhesives NCA = Non Conductive Adhesive SMA = Surface Mount Adhesives
ABP = Assembly Bench Products TCA = Thermally Conductive Adhesives
DDF = Daughter Die Attach Film CDAF = Conductive Die Attach Film
Conformal
Coating
Encapsulant
Potting
Gasketing
LPM (Macromelt)
Die Attach Film
- DDF
- CDAF
WBC
Mold
Compound
Molding
Powder
Circuit BoardProtection
Solder Materials
Inks &
Coatings
Die Attach Paste
Film &
TIM2
Assembly
Adhesives
AssemblyLiquids
MoldCompound
TIM &Assembly
Films
El. conductive
Non-
Conductive
Conductive
Inks
Non-
Conductive
Inks
Blendable
Resistors
Shielding
Coatings
9 Product Lines
Henkel Electronic Materials
Henkel Electronic Materials10
Electronics Assembly Materials
Assembly Adhesives
LiquidsThermalMaterials
Die Attach Adhesives
SolderMaterials
Molding Compounds
Inks & Coatings
Henkel Solutions
Ma
rke
t N
ee
ds
High Reliability
Sustainability
Customer Mfg.Efficiency
Miniaturization
Market-Tailored Product Solutions
Low Pressure
Molding
Surface Mount
Adhesives
Encapsulants
(Glob Top)
CSP Underfills
(Cornerbond)
Thermal
Management
Materials
Assembly Film
Adhesives
Potting
Compound Conformal
Coatings
Solder
Materials
Encapsulants
(Dam & Fill)
Gasketing
Sealants
Electrically
Conductive
Pastes
Non-Conductive
Pastes
Printed
Inks
Technical Service + Application Labs around the World
EMEA:
- Hemel Hempstead-UK
- Westerlo-Belgium
Henkel Electronic Materials
Worldwide Capabilities
Customer focused Organization
Unique Application Know-How
Broad Scope of Technology
Henkel creates competitive Advantage
Henkel Electronic Materials
Amtest
• Since October 2013: • Authorized Distributor for Henkel Electronic Materials
• Sales Territory: • Croatia, Slovenia, Serbia, Macedonia, Bosnia-Herzegovina, Serbia,
Kosova and Montenegro.
• Henkel Electronic Material Portfolio• All Product Groups
• Exception: Solderpaste/Solderwire/Solderbar/Flux
• Henkel Contact• David Chua / Regional Account Manager for Adriatic Region
• Mobil +44 7796537340
Henkel Electronic Materials
Agenda / Presentations
Henkel Electronic Materials
# Questions
# Lead Template
# Marketing Feedback Form
# Presentation Download from Amtest Webpage after this Technical Workshop
