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Allegro Microsystems
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Allegro Microsystems
Líder en el desarrollo, fabricación y comercialización de circuitos integrados de alta
performance que incluyen sensores de efecto Hall y circuitos de potencia.
Genera innovadoras soluciones para aplicaciones en las industrias automotriz,
comunicaciones, informática / automatización de oficina, consumo y mercados industriales
Tiene su sede en Worcester, Massachusetts (USA) y centros de diseño, aplicaciones y soporte
de ventas ubicadas alrededor del mundo.
Desarrolla soluciones de packaging especiales que incorporan circuitos magnéticos para
simplificar problemas específicos de aplicaciones
Posee capacidad de fabricacion incluyendo procesos propietarios BCD (bipolar, CMOS,
DMOS) y tecnología BiCMOS que permite la fusión de circuitos digitales de alta densidad
con circuitos de potencia y estructuras de sensado magnético.
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Organización Global
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Magnetic Linear & Angular Position Sensor ICs
Linear Position Sensor ICs
Angular Position Sensor ICs
Magnetic Digital Position Sensor ICs
Hall-Effect Latches and Bipolar Switches
Hall-Effect Unipolar Switches
Dual Element Switches
Micropower Switches and Latches
Current Sensor ICs
50 to 200 A Integrated Conductor Sensor ICs
SIP Package 0 to >1000 A Sensor ICs
0 to 50 A Integrated Conductor Sensor ICs
High-Side Hot-Swap Hall Effect Based Current
Monitor IC
Magnetic Speed Sensor ICs
Camshaft Sensor ICs
Crankshaft Sensor ICs
Transmission Sensor ICs
Wheel Speed Sensor Ics
Products
Motor Driver & Interface ICs
Brushless DC Motor Drivers
Brush DC Motor Drivers
Bipolar Stepper Motor Drivers
High and Low Side Drivers
Photo and Ion Smoke Detector ICs
Regulators and Lighting
Single Output Regulators
Multiple Output Regulators
Low Noise Block Regulators for Satellite Set-
Top Boxes
LED Drivers for Backlighting
LED Drivers for Lighting
Xenon Photoflash Drivers
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Automotive – High Temperature
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Automotive – In Cabin
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Consumer Applications
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Allegro MicroSystems, Inc. introduces a revolutionary new package offering for Allegro’s current sensor IC family
of devices. Allegro’s smallest current sensor linear IC, the ACS711, is now housed in a 0.75 mm thick low profile
QFN package measuring only 3 mm x 3 mm. This new micro sized device is possibly the smallest fully
integrated linear current sensor IC in the world! With only a 0.6 mΩ internal resistance, this package can really
take the heat. With proper PCB design, the device can be used for applications with over 30 A continuous current
while reducing power consumption by an order of magnitude over existing sense resistor op-amp solutions
Packaging
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Mixed Signal ASICs
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Mixed Signal ASICs
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Requirements Communication
Solutions Exploration
System Modeling
Architectures Exploration
Process / Package definition
Area constraints, Initial floor-planning, Feasibility Analysis
Algorithms Exploration
Architectures / Algorithms Simulation and Validation
Features definition
Datasheet definition
Mixed Signal ASIC Design
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Analog / Digital Architecture Definition
ASIC Specification definition
Analog Design / Simulation
Digital Design / Verification
Mixed Mode Simulation
Mixed Signal ASIC Design
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Architecture Definition : Area / Speed / Power / Process considerations
RTL Coding / Simulation
Digital System High Level Modeling (System Verilog)
Verification
FPGA prototyping
Digital Design
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Synthesis
DFT Insertion
Equivalency Check
Post-synthesis Timing Analysis
Floorplanning
Placement
Clock Tree synthesis
Routing
Post-route timing analysis
Signoff Analysis
Digital Design
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RC extraction
Gate Level Simulation
Mixed Mode Simulation
Digital Design
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Manufacturing checks
DRC
LVS
Tape-out
Layout
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Mixed Signal ASICs
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Post Si Validation
Post Si Validation
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System Level / Digital, Analog Architecture Design
Analog Design
Digital Design (Frontend / Backend)
IC Layout
Wafer / Package Testing
Allegro Argentina Capabilities
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• Ricardo Scheinkerman
• http://www.allegromicro.com
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