1Rendering date: 2015-10-21 14:54:43http://conductivity-app.org

CuETP

UNS:C11000EN:CW004A

Manufactures list:Aurubis (http://www.aurubis.com/en/) - Cu-ETP, Cu-ETP1Cupori Oy (http://www.cupori.com) - Cupori 110 PremiumDaechang Co., Ltd. (http://www.brasone.com/) - ETPDiehl Metall Stiftung & CO.KG (http://www.diehlmetall.de) - KD58Freeport McMoRan Copper & Gold (http://www.fcx.com/) - C110 - ETP CopperKGHM Polska Mied S.A. (http://www.kghm.pl/) - Cu-ETP-8-CLKM Europa Metal AG (http://www.kme.com/) - KME100La Farga (http://www.lfl.es) - Cu-ETP, Cu-ETP1Luvata (http://www.luvata.com/) - CuETPMontanwerke Brixlegg AG (http://www.montanwerke-brixlegg.com) - MB-ETP, MB-ETP1Mueller Industries (www.muellerindustries.com/) - ASTM B152 Alloy C11000Nexans (http://www.nexans.us/) - ETP copper, Cu-a1Palabora (http://www.palabora.com/) - Cu-ETP 1Pan Pacific Copper (http://www.ppcu.co.jp/eng/) - Tough Pitch Copper (ETP)Pegler Yorkshire Group LTD. (http://www.pegleryorkshire.co.uk) - ETPRevere Copper Products, Inc. (http://reverecopper.com/) - C11000Sociedad Contractual Minera el Abra (http://www.fcx.com/) - C110Sociedad Minera Cerro Verde S.A.A. (http://www.fcx.com/) - C110Sofia Med S.A. (http://www.sofiamed.bg) - Cu-ETPTenke Fungurume (http://www.fcx.com/) - C110Wieland-Werke AG (http://www.wieland.de/) - Wieland-K32/E-Cu58

CuETP is the most common copper. It is universal for electrical applications. CuETP has aminimum conductivity rating of 100% IACS and is required to be 99.9% pure. It has0.02% to 0.04% oxygen content (typical). Most ETP sold today will meet or exceed the101% IACS specification. As with OF copper, silver (Ag) content is counted as copper(Cu) for purity purposes. C11000C (Electrolytic Tough Pitch Copper) is an electrolyticrefined copper widely used for electrical and electronic applications. CuETP has theproperties required in all applications with a hydrogen-free atmosphere. In the presenceof H2 and heat all oxygen-bearing coppers suffer from so-called hydrogen embrittlement.This is a chemical reduction of copper oxide by diffusing hydrogen leading to formation ofH2O within the microstructure, resulting in embrittlement of the grain boundaries. Thephosphorus of our copper content is very low, so that electrical conductivity iscomparable to the best performing materials. C1100 is an oxygen containing copperwhich has a very high electrical and thermal conductivity. It has excellent formingproperties. Due to its oxygen content soldering and welding properties are limited. Thealloy is registered US EPA antimicrobial. Due to its high copper content of about 99% Cu-ETP provides the full antimicrobial properties of copper to inhibit the growth of bacteria,

2viruses and fungi which are in contact for a short period of time on copper containingsurfaces. Traditionally used ETP grade copper for electric applications, characterized byits content of hard copper oxides (Cu2O) with sizes of 510 m, which, for very smallwire diameters, significantly decrease their ductility. Electrolytic Tough Pitch Copper isnot suitable for case hardening. This material can be bent, soldered, drilled, riveted, andformed to almost any configuration. ETP Copper is available in round bar, squares, flatrectangular (bus bar), and certain profile shapes.Literature [Ref: 316, 409, 410, 411, 412, 413, 414, 325, 411, 254, 342, 340, 415, 268,347, 343, 345, 344, 143, 341, 346]

3Basic properties

Basic properties Value Comments

Density [g/cm3]8,89-8,94

8,327,93

Solid state,temperature:

20CSolid state,temperature:

1083CLiquid state,temperature:

1083CSpecific heat capacity

[J/(kg*K)] 385-386

Temperature coefficient ofelectrical resistance (0...100C)

[10-3/K]3,7

Electrical conductivity [T=20C,(% IACS)]

97100-101,5

H14 temperO60 temper

Thermal conductivity[W/(m*K)] 388

For highconductivitycopper, a

values of 387is an adjusted

valuecorrespondingto an electricalconductivity of101% IACS

Thermal expansion coefficient20...300C [10-6/K] 17,7

[Ref: 316, 409, 413, 254, 342, 340, 415, 268, 347, 343, 346,417, 418, 419, 420, 421, 422, 423]

Electrical conductivity is strongly influenced by chemical composition. A high level of colddeformation and small grain size decrease the electrical conductivity moderately.Minimum conductivity level can be specified [Ref: 316, 409, 410, 254, 340, 268, 344,143]

4Variation of density with amount of cold reduction by rolling for CuETP (C11000) andsimilar coppers (CuETP1). A - vacuum annealed 12 h at 880 C and cold drawn; B -vacuum annealed 12 h at 970 C and flat rolled; C - vacuum annealed 12 h at 995 Cand cold drawn; D - hot rolled, vacuum annealed 4 h at 600 C and drawn [Ref: 254]

Electrical conductivity of CuETP, CuETP1 according to KME [Ref: 417]

5The influence of impurities on the electrical conductivity of CuETP [Ref: 24, 56, 26, 27]

6Applications

Main applications

Typical uses: produced in all forms except pipe and used for building fronts, downspouts,flashing, gutters, roofing, screening, spouting, gaskets, radiators, busbars, electricalwire, stranded conductors, contacts, radio parts, switches, terminals, ball floats, butts,cotter pins, nails, rivets, soldering copper, tacks, chemical process equipment, kettles,pans, printing rolls, rotating bands, roadbed expansion plates, vats. Automotive industry:radiators, gaskets. Builders hardware: cotter pins, butts, ball floats, tacks, solderingcopper, rivets. Consumer: christmas ornaments. Electrical industry: transformer coils,switches, terminals, contacts, radio parts, busbars, terminal connectors, conductors,stranded conductors, cable strip. Fasteners. Industrial: printed circuit boards, stampedparts, pressure vessels, chemical process, equipment, chlorine cells, chimney capscreens, heat exchangers, printing rolls, anodes, rotating bands, pans, vats, heat sinks.Architecture: downspouts, flashing, roofing, gutters, building fronts, skylight frames,kitchen countertops.Preferred applications: transformer, fuse, relay box, punshed screen, cable strip, currentcarrying capacity. Literature: [Ref: 316, 409, 410, 411, 412, 413, 414, 325, 411, 254,342, 340, 415, 268, 347, 343, 345, 344, 143, 341, 346]

Kinds of semi-finished products/final products

Forms Available: sheet, strip, plate for locomotive fireboxes, rod for locomotive staybolts,flat products, rod, bar and shapes, wire, conductors, tubular products, miscellaneous

CuETP (C11000)Product Specification Literature

Plate for locomotivefireboxes ASME SB11 [Ref: 428]

Rod SAE J463 [Ref: 429]MIL-C-12166 [Ref: 430]Rod for locomotive

staybolts ASME SB12 [Ref: 431]

Sheet and strip AMS 4500 [Ref: 432]

WireAMS 4701 [Ref: 433]MIL-W-3318 [Ref: 434]MIL-W-6712 [Ref: 435]

ASTM and federal specifications for CuETP (C11000)

Product and condition Specification numberASTM FederalFlat products:

- General requirementsfor copper and copperalloy plate, sheet, strip

and rolled bar

B248 [Ref: 436] -

- Sheet, strip, plate androlled bar B152 [Ref: 373] QQ-C-576 [Ref: 389]

- Sheet, lead coated B101 [Ref: 437] -

7- Sheet and strip forbuilding construction B370 [Ref: 388] -

- Strip and flat wire B272 [Ref: 375] QQ-C-502 [Ref: 381]- Foil, strip and sheet for

printed circuits B451 [Ref: 438] -

Rod, bar and shapes:- General requirementsfor copper and copper

alloy rod, bar and shapesB249 [Ref: 334] -

- Rod, bar and shapes B133 [Ref: 372] QQ-C-502 [Ref: 381],QQ-C-576 [Ref: 389]- Rod, hot rolled B49 [Ref: 348] -

- Rod, bar and shapes forforging B124 [Ref: 380] QQ-C-502 [Ref: 381]

- Busbars, rods andshapes B187 [Ref: 374] QQ-B-825 [Ref: 440]

Wire- General requirementsfor copper and copper

alloy wireB250 [Ref: 441] -

- Hard drawn- Tinned

B1 [Ref: 385]B246 [Ref: 400]

QQ-W-343 [Ref: 404]-

- Medium-hard drawn- Tinned

B2 [Ref: 386]B246 [Ref: 400]

QQ-W-343 [Ref: 404]-

- Soft- Lead alloy coated- Nickiel coated

- Rectangular and square- Tinned

B3 [Ref: 387]B189 [Ref: 399]B355 [Ref: 403]

B48 [Ref: 371], B272[Ref: 375]

B33 [Ref: 396]

QQ-W-343 [Ref: 404]----

- Silver coated B298 [Ref: 402] -

- Trolley B47 [Ref: 442], B116[Ref: 398] -

Conductors- Bunch stranded B174 [Ref: 444]

- Concentric-lay stranded B8 [Ref: 445], B226 [Ref:446], B496 [Ref: 447]- Conductors for electronic

equipmentB286 [Ref: 401], B470

[Ref: 397]

- Rope-lay stranded B172 [Ref: 448], B173[Ref: 449]- Composite conductors(copper plus copper-clad

steel)B229 [Ref: 450]

Tubular products- Bus pipe and tube B188 [Ref: 379] QQ-B-825 [Ref: 440]

- Pipe - WW-P-377 [Ref: 451]- Welded copper tube B477 [Ref: 452]

Miscellaneous- Standard classification of

copper B224 [Ref: 453] -

- Electrolytic Cu wirebars,cakes, slabs, billets,ingots and ingot bars

B5 [Ref: 454] -

- Anodes - QQ-A-673 [Ref: 455]- Die forgings B283 [Ref: 456] -

8EN specification for CuETP (C11000)

Number Title - products

EN 13601Copper and copper alloys. Copper

rod, bar and wire for generalelectrical purposes

EN 13600 Copper and copper alloys. Seamlesscopper tubes for electrical purposes

EN 13602Copper and copper alloys. Drawn,

round copper wire for themanufacture of electrical conductors

EN 1652Copper and copper alloys. Plate,sheet, strip and circles for general

purposes

EN 1976 Copper and copper alloys. Castunwrought copper products

EN 1977 Copper and copper alloys. Copperdrawing stock (wire rod)

EN 13599Copper and copper alloys. Copperplate, sheet and strip for electrical

purposes

EN 13605Copper and copper alloys. Copper

profiles and profiled wire for electricalpurposes

EN 12165 Copper and copper alloys. Wroughtand unwrought forging stockEN 12420 Copper and copper alloys. Forgings

EN 13148 Copper and copper alloys. Hot-diptinned strip

9Chemical composition

Chemical composition Value CommentsAg [wt.%] 0,0009As [wt.%] 6E-05Bi [wt.%] 1E-05Cd [wt.%] 1E-06Co [wt.%] 3E-06Cr [wt.%] 9E-06Cu [wt.%] 99,97884 CalculatedFe [wt.%] 0,00016Mn [wt.%] 4E-06Ni [wt.%] 0,00017O2 [wt.%] 0,019P [wt.%] 0,0002Pb [wt.%] 7E-05S [wt.%] 0,00028Sb [wt.%] 6E-05Se [wt.%] 1E-05Sn [wt.%] 3E-05Te [wt.%] 2E-05Zn [wt.%] 0,00018

[Ref: 567]

* Chemical composition measured for wire rod (diameter 8.00 mm) obtained fromContirod technology

Composition limits: 99.90 Cu min (silver counted as copper). Silver has little effect onmechanical and electrical properties but does raise the recrystallization temperature andtends to produce a fine-grain copper. Iron as present in commercial copper, has no effecton mechanical properties, but even traces of iron can cause C11000 to be slightlyferromagnetic. Sulfur causes spewing and unsoundness, and is kept below 0.003% inordinary refinery practice. Selenium and tellurium are usually considered undesirableimpurities but may be added to improve machinability. Bismuth creates brittleness inamounts greater than 0.001%. Lead should not be present in amounts greater than0.005% if the copper is to be hot rolled. Cadmium is rarely present; its effect is totoughen copper without much loss in conductivity. Arsenic decreases the conductivity ofcopper noticeably, although it is often added intentionally to copper not used in electricalservice because it increases the toughness and heat resistance of the metal. Antimony issometimes added to the copper when a high recrystallization temperature is desired[Ref: 316, 409, 412, 254, 415, 343, 344]

Chemical composition of CuETP according to EN 1976, EN 1977

Chemical composition, wt%Other named elements Cu1) Bi O Pb

10

max max min(As + Bi + Cd + Co + Cr + Fe + Mn + Ni +O + P + Pb + S + Sb + Se + Si + Sn + Te

+ Zn) maximum 0,03%99,90 0,0005 0,00402) 0,005

1) Including Ag with maximum 0,015%2)Maximum permissible oxygen 0,060%

Literature: [Ref: 335, 336]

11

Chemical composition of CuETP1 according to EN 1976, EN 1977

Chemical composition, wt%Ag As Bi Cd Co Cr Fe Mn Ni O P Pb S Sb Se Si Sn Te Zn Cumax.0,0025

0,00051)

0,00022)

-1) -3) -1)0,00103)

-1) -3) 0,0400 -1) 0,00

050,0015 0,00041)

0,0002 2) -

3) -3) 0,0002 -3) -

1) (As + Cd + Cr + Mn + P + Sb) maximum 0,0015%2) (Bi + Se + Te) maximum 0,0003%, including (Se + Te) maximum 0,00030%

3) (Co + Fe + Ni + Si + Sn + Zn) maximum 0,0020%Literature: [Ref: 335, 336]

12

Mechanical properties

Mechanical properties Value CommentsUTS [MPa] 220-395YS [MPa] 69-365

Elongation [%] 4-55

Hardness10-6240-9525-64

HRBHRF

HR30T

Youngs modulus [GPa] 115115-130

O60 temperCold-worked(H) temper

Kirchhoffs modulus [GPa] 4444-49

O60 temperCold-worked(H) temper

Poisson ratio 0,33[Ref: 316, 409, 254, 342, 340, 415, 268, 343, 344, 143, 346,417, 418, 419, 420, 421, 422, 423, 66, 267, 355, 91, 354, 406]

Variation of tensile properties with amount of cold reduction by rolling for Cu-ETP(C11000) and similar coppers (Cu-ETP1) [Ref: 254]

13

Variation of hardness with amount of cold reduction by rolling for Cu-ETP (C11000) andsimilar coppers (Cu-ETP1) [Ref: 254]

Mechanical properties of CuETP, CuETP1 according to KME [Ref: 417]

Temper UTS, MPa YS, MPa Elongation A50, %

Hardness HV

R220 (a) 220 - 260 < 140 33 40 - 65R240 240 - 300 180 8 65 - 95R290 290 - 360 250 4 90 - 110R360 360 320 2 110

(a) Annealed

Mechanical properties of CuETP wire rod (diameter 8.0mm) used in electrical application[Ref: 316, 254, 343, 344, 143, 346, 417, 418, 419, 420, 421, 422, 423, 66, 267, 355,91, 354, 357, 358]

Material CuETP

Production technology - Contirod, Southwire,Continuus ProperziChemical

compositionCu + Ag

[%wt] 99,95 - 99,97 99,98

14

Content byweight ofelements

[ppm] 150 25

Oxygen [ppm] 150 - 400 160 - 200UTS [MPa] 220 - 240 220

Elongation A250 [%] 40 - 45 45 - 50Ductility [mm] 0,2 0,05

Mechanical properties of CuETP, CuETP1 wire rod [Ref: 567]

Productiontechnology

YS UTS Elongation A250[MPa] [MPa] [%]

Contirod 140,0 220,7 42,3

Tensile stress characteristic of CuETP wire rod (diameter 8.0mm) from Contirodtechnology [Ref: 567]

15

Tensile stress characteristic of CuETP wire rod (diameter 8.0mm) by Fujiwara [Ref: 357]

Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) after drawingprocess [Ref: 567]

16

Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) after drawingprocess [Ref: 567]

17

UTS/YS ratio vs strain of Cu-OFE wires (diameter 0,5-8.0 mm) after drawing process[Ref: 567]

18

Elongation A250 vs strain of Cu-ETP wires (diameter 0,5-8.0 mm) after drawing process[Ref: 567]

19

Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) after drawingprocess -logarithmic system [Ref: 567]

20

Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) after drawingprocess -logarithmic system [Ref: 567]

21

Typical mechanical properties of CuETP, CuETP1 [Ref: 316, 409, 254, 340, 268, 344, 91, 354]

Temper UTS,MPaYS (a),MPa Elongation in A50, %

Hardness Shearstrength,

MPa

Fatiguestrength (b),

MPaHRF HRB HR30T

Flat products, 1 mm thickOS050 220 69 45 40 - - 150 -OS025 235 76 45 45 - - 160 76H00 250 195 60 60 10 25 170 -H01 260 205 70 70 25 36 170 -H02 290 250 84 84 40 50 180 90H04 345 310 90 90 50 57 195 90H08 380 345 94 94 60 63 200 97H10 395 365 95 95 62 64 200 -H20 235 69 45 45 - - 160 -

Flat products, 6 mm thickOS050 220 69 50 40 - - 150 -H00 250 195 40 60 10 - 170 -H01 260 205 35 70 25 - 170 -H04 345 310 12 90 50 - 195 -M20 220 60 50 40 - - 150 -

Flat products, 25 mm thickH04 310 275 20 85 45 - 180 -

Rod, 6 mm in diameterH80(40%) 380 345 10 94 60 - 200 -

Rod, 25 mm in diameterOS050 220 69 55 40 - - 150 -H80(35%) 330 305 16 87 47 - 185 115(c)

M20 220 69 55 40 - - 150 -Rod, 50 mm in diameter

H80(16%) 310 275 20 85 45 - 180 -

Wire, 2 mm in diameterOS050 240 - 35(d) - - - 165 -

22

H04 280 - 1.5(e) - - - 200 -H08 455 - 1.5(e) - - - 230 -

Tube, 25 mm outside diameter, 1.65 mm wall thicknessOS050 220 69 45 40 - - 150 -OS025 235 76 45 45 - - 160 -H55(15%) 275 220 25 77 35 45 180 -

H80(40%) 380 345 8 95 60 63 200 -

Shapes, 13 mm in diameterOS050 220 69 50 40 - - 150 -H80(15%) 275 220 30 - 35 - 180 -

M20 220 69 50 40 - - 150 -M30 220 69 50 40 - - 150 -(a) At 0.5% extension under load. (b) At 108 cycles. (c) At 3 108 cycles in a rotating beam test. (d) Elongation in 254 mm. (e)

Elongation in 1500 mm.

23

Mechanical properties of CuETP, CuETP1 (flat, round, square, hexagonal) according to EN13601 by Aurubis [Ref: 418]

MetallurgicalState D

Dimensions, mm Hardness

UTSMPa

YS,MPa

ElongationRound, square,hexagonal Thickness Width HB HV A100

[%]A

[%]From upto To FromUpto To From

Upto To Min. Max. Min. Max.

D 2 - 80 0.5 - 40 1 - 200 Cold drawn product without any specific mechanical propertiesH035 (a) 2 - 80 0.5 - 40 1 - 200 35 65 35 65 - - - -

R200 (a) 2 - 80 1,0 - 40 5 - 200 - - - - 200 Max.120 25 35

H065 2 - 80 0,5 - 40 1 - 200 65 90 70 95 - - - -

R250 2 - 10 1,0 - 10 5 - 200 - - - - 250 Min.200 8 12

R250 2 10 30 - - - - - - - - - - 250 Min.180 - 15

R230 - 30 80 - 10 40 - 10 200 - - - - 230 Min.160 - 18

H085 2 - 40 0,5 - 20 1 - 120 85 110 90 115 - - - -H075 - 40 80 - 20 40 - 20 160 75 100 80 105 - - - -

R300 2 - 20 1,0 - 10 5 - 120 - - - - 300 Min.260 5 8

R280 - 20 40 - 10 20 - 10 120 - - - - 280 Min.240 - 10

R260 - 40 80 - 20 40 - 20 160 - - - - 260 Min.220 - 12

H100 2 - 10 0,5 - 5 1 - 120 100 - 110 - - - - -

R350 2 - 10 1,0 - 5 5 - 120 - - - - 350 Min.320 3 5

(a) Annealed

24

Mechanical properties of CuETP, CuETP1 according to EN13606 by Aurubis [Ref: 418]

Metallurgical StateDimensions, mm Hardness UTS MPa YS,

MPa

ElongationThickness Width HB HV A100 [%]

A[%]Max. Max. Min. Max. Min. Max. Min.

D 50 180 Same as drawnH035 (a) 50 180 35 65 35 70 - - - -R200 (a) 50 180 - - - - 200 Max. 120 25 35H065 10 150 65 95 70 100 - - -R240 10 150 - - - - 240 Min. 160 - 15H080 5 100 80 115 85 120 - - - -R280 5 100 - - - - 280 Min. 240 - 8

(a) Annealed

25

Exploitation properties

Heat resistance

Mechanical and electrical properties vs temperatures

Mechanical properties vs temperature of Cu-ETP wire rod (diameter 8.0mm) after 1 hourannealing process (At temperatures from 100 C to 400 C the UTS of Cu-ETP wire rod isstable, whilein the temperature range of 500 C to 900 decreases) [Ref: 567]

26

Elongation A250 vs temperature of Cu-ETP wire rod (diameter 8.0mm) after 1 hourannealing process [Ref: 567]

27

Variation of tensile properties and grain size of electrolytic tough pitch copper (Cu-ETP)and similar coppers (Cu-ETP1) [Ref: 254]

28

Short-time elevated-temperature tensile properties of Cu-ETP (C11000) and similarcoppers (Cu-ETP1) [Ref: 254]

Low-temperature tensile properties of Cu-ETP (C11000) and similar coppers (Cu-ETP1)[Ref: 254]

29

Tension stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) obtained from wirerod after annealing process [Ref: 567]

30

Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) obtained from wirerod after annealing process [Ref: 567]

Elongation vs strain of Cu-ETP wires (diameter 0.5-8.0 mm) obtained from wire rod afterannealing process [Ref: 567]

31

Softening resistance of Cu-ETP [Ref: 417]

Thermal expansion and enthalpy of Cu-ETP. (a) Total thermal expansion from -190 C.(b) Enthalpy (heat content) above 0 C [Ref: 254]

Thermal conductivity of Cu-ETP in different temperature [Ref: 254, 340, 415, 344, 267,91, 406]

Temperature Thermal conductivityK C W/mK4.2 -268.8 30020 -253 53077 -196 550194 -79 400

32

273 0 390373 100 380573 300 370973 700 300

Softening resistance of cold drawn Cu-ETP wires [Ref: 567]

33

Softening resistance of cold drawn Cu-OFE wires[Ref: 567]

Long-therm heat resistance, e.g. Arrhenius curve

34

Mechanical properties vs temperature of Cu-ETP wire rod (diameter 8.0mm) after 24hours annealing process [Ref: 567]

35

Elongation A250 vs temperature of Cu-ETP wire rod (diameter 8.0mm) after 24 hoursannealing process [Ref: 567]

36

Percentage reduction of area vs temperature of Cu-ETP wire rod (diameter 8.0mm) after24 hours annealing process [Ref: 567]

Half- softening temperature

Half-softening temperature of Cu-ETP wire [Ref: 567]

Diameter of wire Strain Half-softeningtemperature[mm] [-] [C]7,0 0,28 2655,5 0,76 2104,5 1,16 2102,5 2,38 1750,5 5,59 125

Corrosion resistance

Hydrogen embrittlement resistance

CuETP (C11000) is subjected to embrittlement when heated to 370 C or above in areducing atmosphere, as in annealing, brazing or welding. If hydrogen or carbonmonoxide is present in the reducing atmosphere embrittlement can be rapid. Literature:[Ref: 316, 409, 410, 411, 412, 413, 414, 325, 411, 254, 340, 268, 343, 143, 346, 335,336, 417, 418, 419, 420, 421, 422, 423, 267, 354, 424, 425, 426, 427, 92]

37

Other kind of corrosion elements

Type ofcorrosion Suitability Literature

Atmospheric Good[Ref: 254, 340, 415, 344,417, 419, 420, 421, 422,

423, 267, 406]Marine

environment Good[Ref: 254, 268, 344, 418,

423]Stress crack Good [Ref: 254, 340, 415, 344]

Hydrogenembrittlement

CuETP (C11000) is subjected toembrittlement when heated to 370 C orabove in a reducing atmosphere, as in

annealing, brazing or welding. If hydrogenor carbon monoxide is present in the

reducing atmosphere embrittlement can berapid

[Ref: 316, 409, 410, 411,412, 413, 414, 325, 411,254, 340, 268, 343, 143,346, 335, 336, 417, 418,419, 420, 421, 422, 423,267, 354, 242, 425, 426,

427, 92]

Electrolytic Good [Ref: 254, 340, 268, 347,423, 406]

38

Other

C11000 has excellent corrosion resistanceto weathering and very good resistance to

many chemicals. It is often usedspecifically for corrosion resistance. It issuitable for use with most waters, and canbe used underground because it resists soilcorrosion. It resists non-oxidising mineraland organic acids, caustic solutions and

saline solutions. Depending onconcentration and specific conditions ofexposure, copper generally resists: acidsmineral acids such as hydrochloric andsulphuric acids; organic acids such asacetic acid (including acetates and

vinegar), carbolic, citric, formic, oxalic,tartaric and fatty acids; acidic solutions

containing sulphur, such as the sulphurousacid and sulphite solutions used in pulp

mills. Alkalies fused sodium and potassiumhydroxide; concentrated and dilute caustic

solutions. Salt solutions aluminiumchloride, aluminium sulphate, calciumchloride, copper sulphate, sodiumcarbonate, sodium nitrate, sodium

sulphate, zinc sulphate. Waters all potablewaters, many industrial and mine waters,

seawater and brackish water. Thecorrosion resistance of C11000 is notadequate for: ammonia, amines and

ammonium salts; oxidizing acids such aschromic and nitric acids and their salts;

ferric chloride; persulphates andperchlorates; mercury and mercury salts.Copper may also corrode in aerated non

oxidising acids such as sulphuric and aceticacids, although it is practically immunefrom these acids if air is completely

excluded. Copper is not suitable for usewith acetylene, which can react to form anacetylide which is explosive. C11000 isconsidered to be immune to stress

corrosion cracking in ammonia and thesimilar media which cause season cracking

in brass and other copper alloys.

[Ref: 254, 342, 268, 347,344, 346, 417, 421, 66,

267, 354]

www.copper.org

Rheological resistance

Stress relaxation

39

Relaxation at stress level 0.5 Yield Strength [Ref: 419]

Stress relaxation curves for Cu-ETP (C11000) and similar coppers (Cu-ETP1). Data areH80 temper wire, 2 mm in diameter, and represent the time-temperature combinationnecessary to produce a 5% reduction in tensile strength [Ref: 254]

Creep

40

Creep properties of CuETP, CuETP1 (C11000)

Temper

Testingtemperature Stress Duration oftest

Totalextension(a) Intercept Minimumcreep rate

C MPa h % % % per1000 hStrip, 2.5mm thick

OS030130

55 2500 2.6 2.0 0.15100 2600 10.0 7.6 1.2140 170 29.8(b) - 39

175 55 2000 3.3 2.3 0.65100 350 15(b) 8.0 6.3

H01130

55 8250 0.20 0.15 0.01100 8600 0.67 0.26 0.042140 1750 2.4(b) 0.32 0.45

175 55 6850 1.14 0.14 0.088100 1100 2.0 0.22 0.66

H02 13055 7200 0.24 0.13 0.01100 8600 1.02 0.25 0.054140 4680 3.4(b) 0.36 0.27

175 55 1050 3.3(b) - 0.6

H06 13055 8250 1.58 0.08 0.035100 8700 7.31 0.16 0.055140 4030 11(b) 0.24 0.17

Rod, 3.2 mm diameter

OS025 260

2.5 6000 0.08 0.016 0.0114.1 6000 0.19 0.010 0.0307.2 6500 0.64 0.113 0.08013.8 6500 2.88 0.87 0.306

H08 205

7.2 6500 0.06 0.045 0.01114.5 6500 0.20 0.112 0.01228 6500 1.08 0.41 0.09750 6500 5.42 2.47 0.44

(a) Total extension is initial extension (not given in table) plus intercept plus the product ofminimum creep rate and duration.

(b) Rupture testLiterature: [Ref: 254]

Wear resistance

Friction resistance

Values given below apply to any of the unalloyed copperd in contact with the indicatedmaterials without lubrication of any kind between the contacting surfaces:

Opposing material Coefficient of frictionStatic SlidingCarbon steel 0.53 0.36Cast iron 1.05 0.29Glass 0.68 0.53

Literature: [Ref: 254]

41

Fatigue resistance

Fatigue cracking

Temper Fatigue strength at 108 cycles in

a reversed bending test , MPaFlat products, 1 mm thick

OS025 76H02 90H04 90H08 97

Rod, 25 mm in diameter

H80 (35%) 115 (At 3 108 cycles in a rotating

beam test)Literature: [Ref: 254]

Values shown in table are typical for all tough pitch, oxygen-free, phosphorus-deoxidizedand arsenical coppers. Copper does not exhibit an endurance limit under fatigue loadingand, on the average, will fracture in fatigue at the stated number od cycles whensubjected to an alternating stress equal to the corresponding fatigue strenght (see Fig.)[Ref: 254]

Rotating-beam fatigue strength of Cu-ETP (C11000) wire, 2 mm in diameter, H80 temper[Ref: 254]

The fatigue strength is defined as the maximum bending stress amplitude which amaterial withstands for 107 load cycles under symmetrical alternate load withoutbreaking. It is dependent on the temper tested and is about 1/3 of the tensile strength[Ref: 419].

42

Impact strength

Typical impact strength of Cu-ETP (Cu-ETP1)

Product and condition Impact strength, JCharpy V-notch

Hot rolled, annealed 96Charpy keyhole-notch

As-cast 11As-hot rolled 43Rod- Annealed

- Commercial temper5235

IzodRod- Annealed and drawn 30%

- Drawn 30%5445

Plate- As-hot rolled- Annealed 5253(a)

39(b)

Cold rolled 50% 26(a)12(b)(a) Parallel to rolling direction. (b) Transverse to rolling direction

Literature: [Ref: 254]

43

Fabrication properties

Fabrication properties Value CommentsSoldering ExcellentBrazing Good

Hot dip tinning ExcellentElectrolytic tinning ExcellentElectrolytic silvering Excellent

Electrolytic nickel coating ExcellentLaser welding Less suitable

Oxyacetylene Welding NotRecommended

Gas Shielded Arc Welding NotRecommended

Coated Metal Arc Welding NotRecommendedResistance welding Less suitable

Spot Weld NotRecommended

Seam Weld NotRecommendedButt Weld Good

Capacity for Being Hot Formed ExcellentForgeability Rating 65Machinability Rating 20 Less suitable

[Ref: 254, 340, 415, 268, 343, 344, 417, 418, 419, 422, 423,267, 91, 354, 406, 427]

44

Technological properties

Technological properties Value Comments Literature

Melting temperature [C] 1083

[Ref: 316, 254, 342, 340,

415, 268, 344,143, 341, 417,418, 419, 420,421, 422, 423,267, 355, 91,354, 406]

Casting temperature [C] 1140-1200

[Ref: 316, 254, 342, 340,

415, 268, 343,344, 346, 417,418, 419, 420,421, 422, 423,66, 267, 355,91, 354, 406]

Annealling temperature [C] 475-750

[Ref: 254, 340, 268, 344,

421, 422, 423,66, 267, 91,

357]

Stress relievieng temperature[C] 150-200

[Ref: 254, 340, 268, 417,

418, 419, 423,267, 91, 354,

406]

Hot working temperature [C] 750-875

[Ref: 254, 342, 340, 268,

344, 66, 267,91, 406]

45

Time - temperature relationships for annealing Cu-ETP and similar coppers (Cu-ETP1)[Ref: 254]

46

References:

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26. Effect of internal oxidation on the residual resistivity of dilute Cu alloys, -Sekula S. T., Bull. Am. Phys. Soc., 6 (1961) 173

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66. The Metallurgy of Copper Wire - Dr. Horace Pops

91. Key to Metals - Data Base - www.keytometals.com

92. Comparative study of electrical and mechanical properties of fire-refinedand electrolytically refined cold-drawn copper wires - Monica Martinez, Ana I.Fernandez, Merce Segarra, Helena Xuriguera, Ferran Espiell, Nuria Ferrer, J Mater Sci(2007) 42:77457749

143. Copper in the automotive industry - Hansjorg Lipowsky, Emin Arpaci, Wiley-vch

242. Structure and strength of the age hardened CuNiSi alloy - D.M. Zhao, Q.M.Dong, P. Liu, B.X. Kang, J.L. Huang, Z.H. Jin, Materials Chemistry and Physics 79 (2003)8186

254. Copper and copper alloys - J.Davis, ASM International, 2001

267. MatWeb - Data Base - www.matweb.com

268. Copper Development Association Inc. - www.copper.org

316. The influence of parameters of the casting process on shaping of materialproperties of oxygen-free copper for highly advanced applications in electronicsand electrical engineering - M. Walkowicz, Doctoral thesis, AGH University of Scienceand Technology, Krakow 2012

325. Problem of hydrogen embrittlement of copper used for conductors infireproof cables - T. Knych, B. Smyrak, M. Walkowicz, Electrical Review, 2011

334. ASTM B249/B249 M 11 Standard specification for general requirementsfor wrought copper and copper alloy rod, bar, shapes and forgings - 2011

335. EN 1976:1998 Copper and copper alloys. Cast unwrought copper products -

336. EN 1977:1998 Copper and copper alloys. Copper drawing stock (wire rod) -

340. Electrical and Magnetic Properties of Metals - Materials Data Series, ASMReady Reference, The Materials Information Society 2000

341. Metallurgy of Copper - J. Newton, C. L. Wilson, John Wiley And Sons Inc. 1942

342. Casting - D. M. Stefanescu, ASM Handbook, The Materials Information Society1988

47

343. Copper. History & Metallurgy - F. Habashi, Laval University, Quebec City, Canada2009

344. Copper: its trade, manufacture, use, and environmental status - J. Gnter,ed. by J. Konrad, A. Kundig, 1999

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348. ASTM B49-98, Standard specification for copper rod drawing stock forelectrical purposes - 2004

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357. Properties and applications of high-purity copper - S. Fujiwara, I. Nishino, S.Kuramochi, M. Oaky, C. Nagata, First International Conference on Processing Materialsfor Properties, The Minerals, Metals & Materials Society, November 7-10, 1993

358. Continuous copper rod production from 100 percent scrap - O. Guixa Arderiu,G. Properzi, 1996

371. ASTM B48 - 00(2011) Standard Specification for Soft Rectangular andSquare Bare Copper Wire for Electrical Conductors -

372. ASTM B133-93A Specification for Copper Rod, Bar, and Shapes - (Withdrawn1994)

373. ASTM B152 / B152M - 13 Standard Specification for Copper Sheet, Strip,Plate, and Rolled Bar -

374. ASTM B187 / B187M - 11 Standard Specification for Copper, Bus Bar, Rod,and Shapes and General Purpose Rod, Bar, and Shapes -

375. ASTM B272 - 12 Standard Specification for Copper Flat Products withFinished (Rolled or Drawn) Edges (Flat Wire and Strip) -

379. ASTM B188 - 10 Standard Specification for Seamless Copper Bus Pipe andTube -

380. ASTM B124 / B124M - 12 Standard Specification for Copper and CopperAlloy Forging Rod, Bar, and Shapes -

381. QQ-C-502C (Notice-1), Federal Specification: Copper Rods And Shapes; AndFlat Products With Finished Edges (Flat Wire, Strips And Bars) - (03-Apr-1991)[S/S By ASTM-B133 and ASTM-B272]

385. ASTM B1 - 12 Standard Specification for Hard-Drawn Copper Wire -

386. ASTM B2 - 12e1 Standard Specification for Medium-Hard-Drawn Copper

48

Wire -

387. ASTM B3 - 12 Standard Specification for Soft or Annealed Copper Wire -

388. ASTM B370 - 12 Standard Specification for Copper Sheet and Strip forBuilding Construction -

389. QQ-C-576B, Federal Specification, Copper Flat Products With Slit, Slit AndEdge-Rolled, Sheared, Sawed, Or Machined Edges, (Plate, Bar, Sheet, And Strip)- (12 Jul 1961)

396. ASTM B33 - 10 Standard Specification for Tin-Coated Soft or AnnealedCopper Wire for Electrical Purposes -

397. ASTM B470 - 02(2012) Standard Specification for Bonded CopperConductors for Use in Hookup Wires for Electronic Equipment -

398. ASTM B116 - 95(2012) Standard Specification for Figure-9 Deep-Groovedand Figure-8 Copper Trolley Wire for Industrial Haulage -

399. ASTM B189 - 05(2010) Standard Specification for Lead-Coated and Lead-Alloy-Coated Soft Copper Wire for Electrical Purposes -

400. ASTM B246 - 05(2010) Standard Specification for Tinned Hard-Drawn andMedium-Hard-Drawn Copper Wire for Electrical Purposes -

401. ASTM B286 - 07(2012) Standard Specification for Copper Conductors forUse in Hookup Wire for Electronic Equipment -

402. ASTM B298 - 12 Standard Specification for Silver-Coated Soft or AnnealedCopper Wire -

403. ASTM B355 - 11 Standard Specification for Nickel-Coated Soft or AnnealedCopper Wire -

404. QQ-W-343F, Federal Specification: Wire, Electrical, Copper (Uninsulated) -(19 Nov 1990)

406. Data Sheet - Kanthal

409. The characterization of the oxygen-free copper wire rod produced with theUpcast technology - T. Knych, A. Mamala, B. Smyrak, Rudy i Metale Nieelazne, 2007

410. Parameterization of materials characteristic of oxygen free cooper used inelectronics and electrotechnics - T. Knych, B. Smyrak, M. Walkowicz, S. Pabian,Hutnik Wiadomoci Hutnicze, 2009

411. Research on the influence of the structural state of Cu-ETP wire rod on theannealing susceptibility of wires - T. Knych, A. Mamala, B. Smyrak, M. Walkowicz,International Technical Conference Monterrey, Mexico 2010

412. Investigation of the recrystallization temperature of wires made of copperfrom ETP and OFC - T. Knych, B. Smyrak, M. Walkowicz, P. Osuch, Rudy i MetaleNieelazne, 2010

413. Research of oxygen free copper of Upcast technology for electric andelectronic uses - T. Knych, B. Smyrak, M. Walkowicz, Erzmetall World of Metallurgy:Internationale Fachzeitschrift fr Metallurgie, 2011

49

414. Dynamic recrystallization of continuous cast copper wire rod and the rapidtensile test - T. Knych, A. Mamala, B. Smyrak, M. Walkowicz, Wire JournalInternational, November 2012

415. Pure Metals Properties: A Scientific-Technical Handbook - A. Buch, ASMInternational 1999

417. Data Sheet - Cu-ETP C11000, Data Sheet KME 100 - KME

418. Data Sheet - Cu-ETP - Aurubis

419. Data Sheet - C11000 Wieland-K322, Rolled Products - Wieland

420. Data Sheet - Electrolytic Tough Pitch Copper C11000 - NBMMETALS

421. Copper Alloys C11000, Metal Suppliers: Material Property Data -

422. Data Sheet - Copper - C11000 - ETP - Little Falls Alloys

423. Data Sheet - Copper No. C11000 - Anchor Bronze & Metals Inc.

424. Effects of trace amounts of impurities on the recrystallization behavior ofhigh-purity tough-pitch copper - Coutsouradis D., Diderrich E., Smets J., Crocq G.,Pauwels L., Centre National de Recherches Metallurgiques, 1974

425. Effects of impurities on the annealability and resistivity of oxygen-bearingcopper - Bigellow L. K., Chen J. H., Metallurgical Transactions B, 1976

426. Impurity effects in high-conductivity copper - Hsu Y. T., OReilly B., Journal ofMetals, Materials & Minerals, 1977

427. Effet des impurets sur les mcanismes de recristallisation du cuivre trfil- Jakani S., Praca doktorska, Universit de Paris XI, Orsay, Francja, 2004

428. ASME SB11: Copper Plates for Locomotive Fireboxes -

429. SAE J463: Wrought Copper and Copper Alloys - 1981

430. ARMY MIL-C-12166: Copper Rod For Crusher Cylinders - 1997

431. ASME SB12: Specification for Copper Rods for Locomotive Staybolts -

432. AMS 4500: Copper Sheet, Strip And Plate, Soft Annealed -

433. AMS 4701: Copper Brazing Alloy AMS 4701 -

434. MIL-W-3318A: Wire, Copper; and Wire, Steel, Copperclad -

435. MIL-W-6712C: Military Specification, Wire, Metallizing - (3 Oct 1984)

436. ASTM B248 - 12 Standard Specification for General Requirements forWrought Copper and Copper-Alloy Plate, Sheet, Strip, and Rolled Bar -

437. ASTM B 10107 Specification for Lead-coated Copper Sheet and Strip forBuilding Construction -

438. ASTM B451-93 Specification for Copper Foil, Strip, and Sheet for Printed

50

Circuits and Carrier Tapes - (Withdrawn 1998)

440. QQ B 825 Bus Bar, Copper, Aluminum Or Aluminum Alloy -

441. ASTM B250 / B250M - 12 Standard Specification for General Requirementsfor Wrought Copper Alloy Wire -

442. ASTM B47 - 95a(2012) Standard Specification for Copper Trolley Wire -

444. ASTM B174 - 10 Standard Specification for Bunch-Stranded CopperConductors for Electrical Conductors -

445. ASTM B8 - 11 Standard Specification for Concentric-Lay-Stranded CopperConductors, Hard, Medium-Hard, or Soft -

446. ASTM B226 - 11 Standard Specification for Cored, Annular, Concentric-Lay-Stranded Copper Conductors -

447. ASTM B496 - 04(2010)e1 Standard Specification for Compact RoundConcentric-Lay-Stranded Copper Conductors -

448. ASTM B172 - 10 Standard Specification for Rope-Lay-Stranded CopperConductors Having Bunch-Stranded Members, for Electrical Conductors -

449. ASTM B173 - 10 Standard Specification for Rope-Lay-Stranded CopperConductors Having Concentric-Stranded Members, for Electrical Conductors -

450. ASTM B229 - 12 Standard Specification for Concentric-Lay-Stranded Copperand Copper-Clad Steel Composite Conductors -

451. WW P 377 Revision D Amendment 1 Pipe, Copper, Seamless, StandardSizes - Revision D Amendment 1 -

452. ASTM B477 - 97(2012) Standard Specification for Gold-Silver-NickelElectrical Contact Alloy -

453. ASTM B224 - 10 Standard Classification of Coppers -

454. ASTM B5 - 11 Standard Specification for High Conductivity Tough-PitchCopper Refinery Shapes -

455. QQA673 Anode, Plating -

456. ASTM B283 / B283M - 12 Standard Specification for Copper and Copper-Alloy Die Forgings (Hot-Pressed) -

567. AGH-UST - own research - contact person: tknych@agh.edu.pl