ALU EHS Form for Components

8/10/2019 ALU EHS Form for Components

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Please specify:

Please list the locations certi0ed or re"istered accordin"ly:

4 5-$t "s o.ere "n 'or omp$n'6s En."ronment po!""es0

(please check the appropriate boxes below)

Hazardous Substances and Chemicals(e.g., material handling, storage, recycling, disposal, spill control)

Waste Management(e.g., waste stream monitoring, control, treatment, disposal)

Enironmentally Conscious !esign(e.g., enironmental aspects in the design phase o" products,restriction in the use o" hazardous substances such as in #oHS)

$ollution $reention(e.g., energy and resource conseration, waste reduction, pac%aging)

&ir Emissions(e.g., emission characterization, monitoring, control, mitigation)

Enironmental $ermits(e.g., permit registration, maintenance, compliance reporting)

'ther ($lease speci"ic )

7 Does 'or omp$n' ons"er En."ronment$!, He$!t- $n S$#et' "sses "nse!et"n3 "ts spp!"ers $n8 or 9s"ness p$rtners0

YesHo:0 No

*" your company has not consideredhealth, sa"ety and enironmental issueswith regard to its relations with itssuppliers and+or partners, are there

plans to do so

Yes Within what time "rame

No

Comments

; 5-$t proesses or ot-er me-$n"sms o 'o -$.e "n p!$e to ensre t-$t'or spp!"ers pro."e 'o :"t- prots $n omponents omp!"$nt to

re3!$t"ons $n8or stomer re


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/ROD@CT EH&S INFORMATION

Answers to the following questions may be used by Alcatel-Lucent to develop ECMA typeecodeclaration for its own products(see ECMA standard !"# http#$$www%ecma-international%org$publications$standards$Ecma-!"%htm&%

T-e ontr$t m$' o.er se.er$! prot #$m"!"es8 t'pes /!e$se spe"#' #or e$-$ns:er t-e set o# prots to :-"- "t $pp!"es

S?st$nes "n prots

T-e prots e!".ere to A!$te!Lent m$' ?e "nte3r$te "n e"n3 "nto ons"er$t"on t-e $?o.e st$tement, p!e$se $ns:er t-e#o!!o:"n3


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+4Are or"n$te 3$ses $s ene "n t-e E@ F!or"n$te *$s Re3!$t"on(2006/842/EC) e3, s!#r -e$or"e present "n $n' o# 'or protsand intentionally added, i&e&, in concentrations exceedin" the natural !ac"roundlevels0

7es 8o

If yes, please specify product family:

If yes, please list product families to hich your anser applies:

/!e$se pro."e en o# !"#e tre$tment "n#orm$t"on #or 'or prots, $t !e$sto.er"n3 "tems !"ste "n Anne 1, e"t-er ?' sen"n3 oment$t"on $tt$-e tot-"s omp!ete EH&S #orm, or ?' re#err"n3 to t-e @RL :e?s"te $ress(es) :-ere"n#orm$t"on $n ?e #on%

Ref& E#1$23orm24 ;(-/ Edition date: +ay 5//6


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ANNE +%

L"st o# RoHS eempt"onsuorescent lamps not exceedin" ; m" per lamp&

5& +ercury in strai"ht >uorescent lamps for "eneral purposes not exceedin":? halophosphate -/ m"? triphosphate ith normal lifetime ; m"? triphosphate ith lon" lifetime @ m"&

9& +ercury in strai"ht >uorescent lamps for special purposes&

.& +ercury in other lamps not speci0cally mentioned in this Annex&

;& Lead in "lass of cathode ray tu!es, electronic components and >uorescenttu!es&

& Lead as an alloyin" element in steel containin" up to /,9; B lead !y ei"ht,aluminum containin" up to /,. B lead !y ei"ht and as a copper alloycontainin" up to . B lead !y ei"ht&

=& ? Lead in hi"h meltin" temperature type solders %i&e& lead !ased alloyscontainin" @; B !y ei"ht or more lead',

? lead in solders for servers-, stora"e and stora"e array systems, netorinfrastructure equipment for sitchin", si"nalin", and transmission as ellas netor mana"ement for telecommunications,

? lead in electronic ceramic parts %e&"& pieCoelectronic devices'&D

@& 4admium and its compounds in electrical contacts and cadmium platin"except for applications !anned under irective 6-(99@(EE4 %-' amendin"

irective =(=6(EE4 %5' relatin" to restrictions on the maretin" and use ofcertain dan"erous su!stances and preparations&

6& #exavalent chromium as an anti2corrosion of the car!on steel coolin"system in a!sorption refri"erators&

6a& FAnnulledG eca HE in polymeric applications&

6!& P! in lead !ronCe !earin" shells and !ushes&

- 3or the purpose of the exemption, solderD is de0ned as the Alloys used to createmetallur"ical !onds !eteen to or more metal surfaces to achieve an electrical and(or

physical connection&


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-/&--&Lead used in compliant pin connector systems&

-5&Lead as a coatin" material for the thermal conduction module c2rin"&

-9&Lead and cadmium in optical and 0lter "lass&

-.&Lead in solders consistin" of more than to elements for the connection!eteen the pins and the paca"e of microprocessors ith a lead content ofmore than @/B and less than @;B !y ei"ht&

-;&Lead in solders to complete a via!le electrical connection !eteensemiconductor die and carrier ithin inte"rated circuit 3lip 4hip paca"es&

-&Lead in linear incandescent lamps ith silicate coated tu!es&

-=&Lead halide as radiant a"ent in #i"h Intensity ischar"e %#I' lamps used

for professional repro"raphy applications&

-@&Lead as activator in the >uorescent poder %- B lead !y ei"ht or less' ofdischar"e lamps hen used as sun tannin" lamps containin" phosphorssuch as H$P %Ha$i5;:P!' as ell as hen used as speciality lamps fordiaCo2printin" repro"raphy, litho"raphy, insect traps, photochemical andcurin" processes containin" phosphors such as $+$ %%$r,Ha'5+"$i5=:P!'&

-6&Lead ith P!Hi$n2#" and P!In$n2#" in speci0c compositions as mainamal"am and ith P!$n2#" as auxiliary amal"am in very compact Ener"y$avin" Lamps %E$L'&

5/&Lead oxide in "lass used for !ondin" front and rear su!strates of >at>uorescent lamps used for Liquid 4rystal isplays %L4'&

5-&Lead and cadmium in printin" ins for the application of enamels on!orosilicate "lass&

55&Lead as impurity in RIJ %rare earth iron "arnet' 3araday rotators used for0!re optic communications systems&

59&Lead in 0nishes of 0ne pitch components other than connectors ith a pitchof /&; mm or less ith 8i3e lead frames and lead in 0nishes of 0ne pitch

components other than connectors ith a pitch of /&; mm or less ithcopper lead2frames&

5.&Lead in solders for the solderin" to machined throu"h hole discoidal andplanar array ceramic multilayer capacitors&

5;&Lead oxide in plasma display panels %PP' and surface conduction electronemitter displays %$E' used in structural elementsK nota!ly in the front andrear "lass dielectric layer, the !us electrode, the !lac stripe, the addresselectrode, the !arrier ri!s, the seal frit and frit rin" as ell as in print pastes&

5&Lead oxide in the "lass envelope of Hlac Li"ht Hlue %HLH' lamps&

Ref& E#1$23orm24 =(-/ Edition date: +ay 5//6


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5=&Lead alloys as solder for transducers used in hi"h2poered %desi"nated tooperate for several hours at acoustic poer levels of -5; dH $PL and a!ove'loudspeaers&

5@&FExpiredG #exavalent chromium in corrosive preventive coatin"s ofunpainted metal sheetin"s and fasteners used for corrosion protection andElectroma"netic Interface $hieldin" in equipment fallin" under cate"orythree of irective 5//5(6(E4 %I< and telecommunications equipment'&Exemption "ranted until - uly 5//=&

56&Lead !ound in crystal "lass as de0ned in Annex I %4ate"ories -, 5, 9, and .'of 4ouncil irective 6(.69(EE4&

Ref& E#1$23orm24 @(-/ Edition date: +ay 5//6


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ANNE 1

In#orm$t"on to ?e m$e $.$"!$?!e to re'!ers

&

Producer: Mcompany name, other on addressin" the producerN

$cope of information sheet: M product cate"ory as in Annex IA of OEEE irective, or typeof equipment as in Annex -H of OEEE irective, orproducers Product 3amily, or sin"le products identi0ed !y!rand and model name N

Component or M$ter"$! Rem$r>s 8 Lo$t"on

Hattery %internal Q' containin" +ercury %#"'(8i4ad(Lithium( ther

Hacli"htin" lamps of L4(ame retardants other thanin Printed 4ircuit Assem!lies QQQ

Liquid 4rystal isplays ith a surface "reater than -//cm5

4apacitors ith P4Hs

4apacitors ith su!stances of concernQQQQ S hei"ht N 5;mm, diameter N 5; mm or proportionately similarvolume

As!estos

Refractory ceramic 0!res

Radio2active su!stances

Heryllium xide

ther forms of Heryllium

Jasses 2 hich fall under Re"ulation %E4' 5/9=(5/// andall hydrocar!ons %#4'&

Mtype of "as, properties,volume and(or ei"htN

4omponents ith pressurised "as hich need specialattention %Pressure N -,; !ar' QQQQQ

Mtype of "as, pressure level,dischar"e methodN

Liquids QQQQQ if volume N -/ cl %or equivalence inei"ht, e&"& for P4H, oil&&&'

Mtype of liquid, dischar"emethodN

+echanical components that store mechanical ener"y%i&e& sprin"s' or equivalent parts hich need specialattention QQQQQ

%diameter N -/ mm and hei"ht N 5; mm orproportionally similar volume and expandin"'

T Arro indicates the need for the location of the compartment ( su!stances

ithin the product& Ohen the location of su!stance( components is requested, it isat the part level, e&"&, main !oard, housin", etc&

Ref& E#1$23orm24 6(-/ Edition date: +ay 5//6


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Q Internal means that !atteries can only !e removed !y openin" the product !ymeans of tool%s'&

QQ $u!stances are considered to !e in the product if present a!ove the levelsspeci0ed in 4ommission ecision 5//;(-@(E4 related to irective 5//5(6;(%E4'%Ro#$ irective' or if their use is permitted throu"h exemptions in the Annex ofirective 5//5(6;%E4'&

QQQ

Documents

ALU EHS Form for Components