Andwin Circuits PPT

Welcome to Andwin Circuits

http://www.andwinpcb.com

CONTENTS目录

1 公司简介 Company Profile

3 技术能力 Technical capabilities2 组织构架图 Organizational Chart

7 工艺流程 Fabrication flow chart6 设备展示 Equipments

4 产品结构 Products Configuration

5 产品展示 Products

8 企业精神 Enterprise spirit

Company ProfileAndwin Circuits as a industry leading of PCB manufacturer with in 12 Years.

Specializing in Multilayer PCB, Rigid flex PCB, HDI PCB, controlled impedance PCB and Radio Frequency Circuit quick turn prototype to mass products.

Also,we provide one-stop PCB solution from Components source to PCB assembly. This allows our customers to get-to-market faster, affordably, and more efficiently. Partner with us today and accelerate your innovative development projects.

AndWin is named as our ideal of “win and win”, Means we are able to be the best partner of yours, Base on the “Excellent quality”, “On time delivery”and “Reasonable price”!

Please believe our good service that will help you to provide The best service for your customer, You and us will continue to be successful!

Company Profile

艾迪微电路有限公司 Andwin Circuits.

NO.121,CuiGangXi RD,FuYong,BaoAn,

Shenzhen,GuangDong,China

●

♦Location

Andwin Circuits MCPCB Factory.1F/2,XinEr Industrial park,ShaJing,BaoAn,Shenzhen,GongDong,China

♦Milestones

• June 2012 ISO13485• May 2011 Russia office start• Apr.2011 Andwin PCB assembly

Division established• Mar.2010 New manufacturing area• June 2008 TS16949:2009• Mar.2008 AAA Customs High Credit

Enterprise• Oct.2007 Top 100 SMES in Innovation• Sep.2007 Office Shang Hai established• Sep.2007 Join Shenzhen PCB Industry

Assiciation• July.2007 CQC• May.2007 Clear Production

Feb.2006 MCPCB Division established

• Sep.2005 Load Production

• May 2005UL Certifiaction

• Aug. 2004 The area D expansion

• May 2004TS16949:2002

• May 2004ISO14001:2004

• May 2004ISO9001:2000

• Mar. 2004Shenzhen Environmental Protection Advanced Unit

• Mar. 2004Shenzhen Bao An Office start to operate

• Jan. 2003Andwin Circuits set up

♦Certification

♦Main Customers


Response Fast ( always in 3 Hours) Fast delivery and Quality guarantee 100% Payment net 30 days availabe for old customers Based on high quality raw materials More than 12 Years in PCB Industry Engineers are 15+ Years PCB experience 100% DRC(Design rule Checking) 100% AOI (Automatic Optic Inspection) 100% Electronic Test( E-Test)

♦Our Advantage

总经理 General Manager

副总经理Vice General Manager

财务部FinancialDept


总工程师 Chief Engineer


市场部MarketingDept

品质部Q A Dept

物料部P M C

工程部EngineeringDept

生产计划部P P C

维修部Maintenance Dept

采购部PurchaseDept

人事部PersonnelDept

生产部ProductionDept

总经办Executive

文控部 DocumentDept

工艺技术部Technical Dept

Organization chart

序号 Serial 项目 Technical parameters 技术能力 Technical capabilities

1 层数 Layers 1-48 layers

2 最大板尺寸 Max. board size 450x660mm （ 18"x26" ）

3 最小板厚 Min board thickness

4 层 0.38mm 15mil

6 层 0.55mm 22mil

8 层 0.80mm 32mil

10 层 1.00mm 40mil

4 最高铜厚 Copper Cald(Max.) 6 oz(outer)/ 4 oz(inner)

5 最小线宽 / 线隙 Min line Width/Space 0.075mm 3mil

6 最小孔径 Min hole size 0.15mm 6mil

7 孔壁铜厚 PTH hole thickness 0.025mm 1mil

8 金属孔孔径公差 PTH hole dia.tolerance ±0.075mm 3mil

9 非金属孔孔径公差 Non PTH hole dia.tolerance ±0.05mm 2mil

10 孔位公差 Hole position deviation ±0.05mm 2mil

11 外形公差 Outline tolerance ±0.10mm 4mil

Technical capabilities 1

序号 Serial 项目 Technical parameters 技术能力 Technical capabilities

12 最小绿油桥 Min S/M Pitch 0.075mm 3mil

13 板弯 / 板曲 Twist and Bow ≤1.0%

14 绝缘电阻 Insulation Resistance ＞ 1012Ω

15 测试电压 Test Voltage 50 ～ 300V

16 抗电强度 Electric strength ＞ 1.3KV/mm

17 耐电流 Current breakdown 10A

18 剥离强度 Peel strength 1.4N/mm

19 阻焊剂硬度 Soldermask abrasion ＞ 6H

20 抗热冲击 Thermal stress 288 20Sec℃21 防火等级 Flammability 94V-0

22 阻抗控制 Impedance control +/-10%(Differential)

23 盲 / 埋孔 Blind/Buried via √

24 表面处理 Surface Finished ENIG ， ImAg ， ImSn ， OSP ， Leaded

HAL ， Leaded Free HAL(SN100C) ， Finish Gold

25 板材 MatericalFR-4(Tg140°c,Tg170°c,Halogen Free ) Rogers,Alunminum/coper, Based, CEM-3, Getek, Teflon

Technical capabilities 2

Product mix

其它Others

电源Power

消费类 Consume

医疗 Medical

通信 Communication

1 Products application diagram

3

Products layers diagram

≥10L

8L

6L

DS

4L

2

Products material diagram

高频板High Frenquency

FR4, H-Tg

铝基板 / 陶瓷板 Aluminum copper/Ceramic board

Products 3 8-layer Multilayer Gold finger PCB

Layer Count: 12Outline Tolerance: +/-0.13mm

BaseMaterial: FR4 TG170Surface Finishing: ENIG Au 3 U”

Special: Flat routing

12-layer Multialyer PCB



Special: Long/short Gold finger 30 U”

6-layer Multilayer PCB

Layer Count: Outline Tolerance: +/-0.13mm


Special: Blind Via L2 - L5

4-layer Multilayer PCB


BaseMaterial: FR4 + Rogers 4350Surface Finishing: ENIG Au 3 U”

Special: ROGERS +FR4 Mix Lamination

Layer Count: 18Thickness: 6.0 mm


Special: 18 Layers , Military Application

18-layer Multilayer PCB4-layer Multilayer PCB

Layer Count: Thickness: 1.6mm


Special: Blind Via L2 - L3 ,Gold finger

Products 1 6-layer Flex-rigid Print Board

Layer Count: 6Outline Tolerance:±0.1mm

BaseMaterial:FR4 2layer 4layerSurface Finishing:lmmersion

Au0.025-0.07um

6-layer Flex-rigid Print Board


BaseMaterial:FR4 2layer 4layerSurface Finishing:lmmersion

Au0.025-0.07um



BaseMaterial:FR4 2layer, PI 2layerSurface Finishing:lmmersion

Au0.025-0.07um



BaseMaterial:FR4 4layer, PI 2layerSurface Finishing:

ENEPIG :0.07-0.15um

8-layer HDI Flex-rigid Print Board



Au0.025-0.07um




Au0.025-0.07um

Products 26-layer HDI Flex-rigid Print Board



Au0.025-0.07um

4-layer HDI Flex-rigid Print Board



Au0.025-0.07um

4-layer Flex-rigid Print Board(COB)



NI/PA :0.07-0.15um




NI/PA :0.07-0.15um




NI/PA :0.07-0.15um

2-layer Capacitive Screen PCB

Layer number: 2 Base material ： : non-adhesive ED

copperMin track width/gap ： 0.06/0.06mm

Outline tol ： ±0.1mmSurface treatment ： ENIG

Products 32-layer Metal core Board (MCPCB)Au


BaseMaterial: AluminumSurface Finishing: ENIG

Au0.025-0.07um

2-layer Metal core Board (MCPCB)Au



Au0.025-0.07um

1-layer Metal core Board (MCPCB)

1-layer Metal core Board (MCPCB)COB

Layer Count: 1Outline Tolerance: +/-0.2MM

BaseMaterial: CopperSurface Finishing: Plate sliver



Thermal conductivity : 3W/m.k

1-layer Metal core Board (MCPCB)

Layer Count: 1Outline Tolerance: +/-0.13mmBaseMaterial: MIRO CoM AL

Surface Finishing: ENIGThermal conductivity : 235 W/m.k

2-layer Metal core Board (MCPCB)Au


BaseMaterial: AluminumSurface Finishing: Plate sliver

Thermal conductivity: 375 W/m.k

Equipments 1

自动光学检测 AOI 压合 Lamination 沉铜 PTH

钻孔 Drilling 全自动电镀 Auto Panel Plating

Equipments 2

干膜 Dry film 蚀刻 Acid etching 水平线 Horizontal treatment lines

阻焊 Solder mask 丝印 Silkscreen Printing 沉金 ENIG

Equipments 3

喷锡线 HASL Line 锣边 Routing E-T 测试 E-Testing

飞针测试 Flying probe testing 真空包装 Vacuum packing 废水处理系统 Waste water treament system

Equipments 4

抗剥离强度测试仪Anti-peeling tester

金相切片仪Metalloscope

镀层测厚仪Plating thickness tester

二次元Quadratic element

MIT 弯折测试仪MIT Bending tester

阻抗测试仪Impedance tester

Fabrication flow chart 1

Fabrication flow chart 2

Enterprise spirit质量控制

QC产品目标

Product Aim环境方针

Environment Policy

优质高效

科学管理

持续改进

客户满意

准时交货率 :99%

一次合格率 :98%

客户投诉率 :1%

客户满意度 :98%

恪守法规

善用资源

节能降耗

保护环境

High quality and efficiency

Scientific management

Continuous improvement

Customer Satifaction

On time delivery Rate:99%

E-Testing passed Rate:98%

Complaints Rate:1%

Customer Satisfaction:98%

Abide by the regulations

Good-use of resources

Energy saving

Protect the environment

THANKS FOR YOUR ATTENTION!

To be the most reliable supplier of electronic circuit


Documents

Andwin Circuits PPT