product; masks for use in plating injection, which cover at least a lead-missing portion of the semiconductor product; and elec- trode means for electroplating external leads of the semiconductor product.

Sputtering Apparatus U.S. Patent 5,417,633. May 23, 1995 D.J. Harra and L.D. Hartsough, assignors to Varian Associates Inc. Pa/o Alto, Calif.

A sputtering apparatus having a rotating magnet array and fixed electromagnets.

Cathode Sputtering Process U.S. Patent 5,417,634. May 23, 1995 R. Latz, assignor to Leybo/d AG, Hanau, Germany

An arrangement for generating a plasma by means of cathode sputtering.

Zinc-Nickel Alloy Plating Bath U.S. Patent $417,640. May 23, 1995 D.G. Block and C.V. Bishop, assignors to McGean- Rohco Inc., C/eve/and

An aqueous alkaline plating bath for the electrodeposition of a zinc-nickel alloy coating on a substrate, which comprises zinc ions; nickel ions; and at least one heterocyclic compound.

High Pressure Waterjet Nozzle U.S. Patent 5,421,517. June 6, 1995 J.R. Knudson et a/., assignors to United Technologies Corp., Hartford, Conn.

A nozzle for use in a system having a source of pressurized fluid and a source of motive power for rotating and translating the nozzle along a nozzle trajectory at a standoff distance from a workpiece surface, for emitting pressurized fluid along the nozzle trajectory to remove surface coat- ings from the workpiece.

Blast Nozzle U.S. Patent 5,421,766. June 6, 1995 J.D. Shank, assignor to Church d Dwight Co. Inc., Princeton, NJ.

A blast nozzle for preventing the accu- mulation of static electric charge during blast cleaning operations.

Media Control Valve U.S. Patent 5,421,767. June 6, 1995 W. E. Spears and J. Il. Shank, assignors to Church & Dwight Co. Inc., Princeton, NJ.

A media control valve for dispensing and metering particulate abrasive media from a supply pot to a compressed air stream.

Abrasive Cloth Dresser U.S. Patent 5,421,766. June 6, 1995 Y Fujiwara et a/., assignors to Mitsubishi Materials Corp., Tokyo

An abrasive cloth dresser assembly for a lapping apparatus, which rotates a piece of abrasive cloth and an object relative to and in contact relation to one another for pol- ishing the surface of the object along with an abrasive.

Parts Cleaning Systems U.S. Patent 5,421,663. June 6, 1995 D.R. Bowden, assignor to Bowden industries Inc., Huntsvile, A/a.

An industrial machine for cleaning parts retained in one or more open mesh baskets.

Apparatus for Coating Circuit Boards U.S. Patent 5,421,664. June 6, 1995 H.J. Schafer, assignor to Hans Jurgen Schafer, Germany

In a curtain pouring apparatus for coat- ing circuit boards with a photopolymeriz- able lacquer, the improvement comprising a heatable roll disposed in a gutter heatable vat above a conveyor belt for the circuit

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Manufacturers and world- wide suppliers of ANION and CATION ION EXCHANGE MEMBRANES.

APPLICATIONS E-Coat for Anion and Cation paint systems.

Recovery of precious metals.

Desalination.

Demineralization. PPG

Electrodialysis. Approved

YEuaRAumIMmc 52G00hktPlau?.GknRodbNJO7452 Fa: 201-447-2132

201447-3044

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- Tank q Magnets

>F !i? Replaceable Tips

COfllltXiO~S . and Acorn Studs

METAL FINISHING . JANUARY 1996 93

boards and a heatable doctor blade is ap- plied against the roll and infrared lamps are arranged parallel to the doctor blade.

Powder Spray Booth U.S. Patent 5,421,666. June 6, 1995 F: Trevisan, Verona, /&t/y

Adjustable section powder spraying booth.

Method for Cleaing U.S. Patent 5,421,&?99. June 6, 1995 CR. Hamilton et a/., assignors to Golden Technologies Co. Inc., Golden, Co/o.

A method for cleaning manufacturing lubricants and coolants from metal contain- ers, comprising contacting with a terpene cleaning agent having a pH between 6 and 9; whereby the surface of the containers cleaned has a roughness average that is less than the roughness average of containers cleaned using an acidic or caustic cleaning agent.

Surface Treatment for Aluminum U.S. Patent 5,421,913. June 6, 1996 S. lkeda and S. Meguro, assignors to Nippon Paint Co. Ltd., Japan

A surface treatment bath for aluminum or its alloys consisting essentially of tO_ 1000 ppm of niobium ion and/or tantalum ion, 10-500 ppm of zirconium ion and/or titanium ion, l&500 ppm of phosphate ion, and l-50 ppm of isolated fluorine ion released from compounds selected from the group consisting of HF, NH_,F, NH,HFz, NaF and NaHF,, and having a pH of 1.5- 4.0.

Regeneration of Acid Cupric Chloride Etchant U.S. Patent 5,421,966. June 6, 7995 J.E. Ox/ey, New Haven, Corm.

A process for electrolytic regeneration of an acid cupric chloride etching bath comprising an electrolytic cell with a flow- through anode and means for flowing a liquid anolyte through the anode, and a planar cathode having means for contacting with a catholyte; flowing a solution con- taining cuprous chloride through the anode to contact all of the interior surface and flowing the same solution into contact with the cathode; and maintaining the current density and potential so as to plate metallic copper from the catholyte at the cathode, and produce cupric chloride at the anode without hydrogen or chlorine evolution.

Vacuum Coating Device U.S. Patent 5,421,979. June 6, 1995 D. E. Stevenson, assignor to Photran Corp., Lakevile, Minn.

A load-lock drum-type coating appara- tus.

Electrodeposited Copper Foil U.S. Patent 5,421,9&l June 6, 1995 S.J. Clouser et al., assignors to Gould Inc., Eastlake, Ohio

A process for making electrodeposited copper foil, comprising preparing a copper deposition bath comprising water, copper ions, sulfate ions and at least one active sulfur-containing material, said bath con- taining less than 5 ppm chloride ions; and applying electric current to electrodeposit copper onto a rotating cathode using a cur-

rent density in the range of 800 to 3000 A/ft, and continuously removing copper foil from the cathode, said electric current being direct current or alternating current with a direct current bias.

Photoresist Waste Treatment U.S. Patent 5,422,032. June 6, 1995 J.A. Brown, assignor to Viktron Ltd. Partnership, Carol Stream, 111.

A method and composition for waste treatment of organic strippers containing metals.

Precision High Rate Electroplating Cell U.S. Patent 5,421,987. June 6, 1995 G. Tzanavafas, San Jose, Calif. and U. Cohen, Pa/o Alto, Calif.

A method of electroplating a metal film on the surface of a substrate using an an- ode/jet assembly having an anode portion and a plurality of nozzles, comprising po- sitioning the substrate near the nozzles such that a flow of an electroplating solu- tion through the nozzles is directed sub- stantially normal to the surface; causing relative rotation to occur between the an- ode/jet assembly and the substrate; supply- ing an electroplating solution to the anode/ jet assembly such that a substantially uniform flow distribution of the electro- plating solution strikes the surface of the substrate as the relative rotation occurs be- tween the anode/jet assembly and the sub- strate, and generating an electroplating cur- rent through the electroplating solution between the anode/jet assembly and the substrate.

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Hazardous Waste Reduction in Metal Finishing Industry

by PRC Environmental Management, Inc. 205 pages $42.00

This study conducted for the State of California identifies three categories of waste reduction technology available to metal finishers; namely, source reduction, recycling and alternative treatments. a generic audit procedure is provided along with three extensive case histories.

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94 METAL FINISHING . JANUARY 1996