Electroforming Process U.S. Patent 5,516,415. May 14, 1996 G. Palumbo et al., assignors to Ontario Hydra, Toronto, Canada

A process for in situ electroforming a structural reinforcing layer of metal bonded to an internal wall of a degraded section of metal tube, comprising mechanically cleaning the internal tube wall surface in the tube section; inserting a probe into the metal tube and moving it so that it spans the degraded tube section, the probe having an electrode extending substantially along its length, sealing means at each end for containment of fluids within the tube sec- tion, and circulation means for flowing flu- ids into and out of the tube section; elec- trodepositing a strike layer of metal on the internal wall of the tube section by flowing an electrolyte containing at least one metal salt of interest through the section and ap- plying a direct current between the elec- trode and the metal tube to cause the elec- trodeposition of a metal layer not exceeding 1Opm thick; and electroforming a structural layer of metal on the strike layer by flowing an electrolyte containing at least one metal salt of interest through the section and applying a pulsed direct

current between the electrode and the metal tube at a pulse frequency of IO0 to 1000 Hz with a duty cycle in the range 10-40% for a sufficient time to electroform a metal layer 0.1 to 2 mm thick, so that the tube section is restored to its original mechani- cal properties, said structural electroformed layer having an ultrafine grain microstruc- ture, which provides the layer with a high degree of hardness, stiffness, and strength while maintaining excellent ductility.

Plating Apparatus U.S. Patent 5,516,416. May 14, 1996 DE Canaperi and K.H. Fluffing, assignors to IBM Corp., Yorktown Heights, N.Y.

An apparatus and method for electro- plating pin grid array packaging modules.

Apparatus for Composite Plating U.S. Patent 5,516,417. May 14, 1996 T Kondou et al, assignors to Honda Giken Kogyo KK, Tokyo

A method and apparatus for applying composite plating on a hollow member.

Patterned Electroplating U.S. Patent 5,516,418. May 14, 1996 SK Doss et at., assignors to BM Corp., Armonk, N. Y

A process for forming a thin film mag- netic head comprising forming a layer of hydroxyquinoline on a metallized sub- strate; coating the layer with a radiation- sensitive polymeric film; patternwise ex- posing the polymeric film to radiation; developing the film to patternwise expose the substrate; electroplating metal onto the exposed portions of the substrate; and re- moving remaining polymeric film from the substrate to form the magnetic head.

Hard Iron Plating of Aluminum U.S. Patent 5,516,419. May 74, 1996 N.H. Phan and S. Troup-Packman, assignors to Hughes Aircraft Co., Los Angeles

A ferrous solution for plating an alumi- num cathode with an iron layer in the pres- ence of an iron anode, said iron layer hav- ing a microhardness of at least about 40 Rockwell C, said solution consisting of ferrous iron having a concentration ranging from 0.65 to 2.0 M; at least one anion selected from the group consisting of sulfa-

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