obtained from a neutral salt elec- trochemical pickling process with an acid solution thereby forming an acid pickling solution; and con- tacting a stainless steel metal substrate with the acid pickling solution for a time sufficient to pickle the stainless steel metal substrate.

US. Patent 6,398,877. June 4,2002 C. T Magliocca, Tacoma, Wash. A method of cleaning parts with a solvent while maintaining a rela- tively high degree of purity of the solvent the method comprising placing the parts to be washed in a wash basin; causing the parts to be washed with solvent in the basin; directing the solvent to flow by the force of gravity from the wash basins to a centrifugal filter and operating the centrifu- gal filter to separate from the sol- vent impurities in the solvent; collecting the solvent separated from the centrifugal filter in a reservoir; and recirculating the solvent from the reservoir back to

the wash basin for further use in washing the parts in the basin.

QlOf DWPEB EL Pl.&rlE VS. Patent 6,398,884. June 4,2002 K. Kyono, et al., assignors to Kawasaki Steel Corp., Kobe, Japan Methods of producing steel plate, hot-dipped steel plate, and alloy hot dipped steel plate.

ELElCTRGPLATING A~~A~~GG

US. Patent 6,398,926. June 4, 2002 L.F! Mahneke, assignors to Techpoint Pacific Singapore Pte Ltd., Singapore An electroplating apparatus com- prising a substantially planar chuck having an upper surface for the substrate to be disposed there- on; means located on the upper surface for securing the substrate thereon; and a barrier element extending from the upper surface for securing the substrate thereon; and a barrier element extending from the upper surface and adapt- ed to abut the bottom surface of the substrate, the barrier element for inhibiting fluid from flowing beyond the periphery of the bottom surface of the substrate.

US. Patent 6,398,934. June 4,2002 K. Klein, et al., assignors to E. I. du Pont de Nemours and Co., Wilmington, Del. A 2-component concentrate suit- able for the preparation of cathod- ic electrodeposition coating com- positions comprising in combination a binder component comprising an aqueous dispersion of a cathodic electrodeposition binder having groups of active hydrogen being cross-linkable with a blocked polyisocyante; and a cross-linking component of an anhydrous, organic solution of an oxime-blocked isocyanate-func- tional adductof an aromatic poly- isocyanate.

APPARATUS FOR PLATING COPPER

QAI PAR‘I’I~ULATE GRAPHITE

US. Patent 6,398,936. June 4,2002 C-B. Lin and J-l? Lin, Taiwan A process for plating copper on particulate graphite comprising cleaning and drying graphite par- ticles; wetting the graphite parti- cles with a plating solution con- taining copper ions; dripping the

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graphite particles as wetted by the plating solution on a rotating displacing metal disk containing displacing metal having an oxida- tion potential greater than that of copper to have the copper dis- placed from the plating solution and plated on the graphite to form copper-plated graphite par- ticles with water and drying the copper-plated graphite particles.

US. Patent 6,398,937. June 4,2002 R. Menini and J; Fourniel; assignors to National Research Council of Canada, Boucheruille, Canada A method of plating blind vias in printed circuits comprising pro- viding a printed circuit board to be plated; providing a plating cell containing solution for plating in the blind vias or through holes of printed circuit board, the cell fur- ther including anodes; the provid- ing ultrasonic vibration means for vibrating the plating solution dur- ing electrodeposition; introducing a gas for localized agitation of the plating solution around the print- ed circuit board; and vibrating the

solution to electroplate the blind vias or through holes.

US Patent 6,398,939. June 4,2002 J-L. Huens and P Peckham, assignors to Phelps Dodge Corp., Phc&x, Ark A method of electrowinning cop- per comprising vertically orient- ing a cathode plate between two, spaced-apart, vertical anode plates within a tank; negatively energizing the cathode plate and positively energizing the anode plates; and causing a vertical, upward flow of electrolyte through gaps between the cath- ode plate and anode plates by forcing electrolyte into the tank below the cathode and anode plates and by collecting elec- trolyte with a plurality of collec- tor ports disposed across the tank between the anode plates.

US. Patent 6,398,941. June 4,2002 B. Wei, assignor to General Electrical Co., Schenectady, N.Y.

A method of shaping a workpiece with a tool comprising defining a gap between an initial tool shape and the workpiece with a plurali- ty of boundary elements repre- senting the initial tool shape; forming a matrix equation con- taining the boundary elements; solving the matrix equation to determine values for the potential and normal gradient values asso- ciated with the boundary ele- ments; directly determining an equipotential line in the gap using forward boundary element method; and forming the tool to have a surface and which coin- cides with the equipotential line; and forming the workpiece with the tool.

S.H. Kim, et al., assignors to Korean Advanced Institute ofscience and Technology, Tajeon, Rep. of Korea An electrochemical machining process for the fabrication of a cylindrical microphobe.

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144 Metal Finishing