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this doc gives you an overview on all Back end test solutions at aps solutions GmbH
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Contact Solutions
Gutenbergstrasse 1 D-82178 Puchheim-Munich Germany Phone: +49-(0)89-841027-0 Fax: +49-(0)89-841027-11 www.aps -munic h.com
aps Solutions GmbH
Technology for
Better Contacts
aps Solutions GmbH
Spring Pin Socket
• Crown, conical, round, ect.
• Pitch below 0,2 mm
• Kelvin Option: 0,4mm
• Temp -40°C to +150°C
• Higher temp on request
• Easy to install
• Low Resistance < 50 mOhm
• Frequency rage up to 6 Ghz
• Plunger Material : Au alloy /
PdCo Alloy / SK4 / BeCu
• Plating: Gold, Pd-Alloy, Nano,
Multilayer(4L)
BGA – LGA – SO – TSOP I & II – QFP – LCC – QFN/MLF/MLP – CSP – MCM – WLCSP Many more …
Technology for
Better Contacts
aps Solutions GmbH
U-Contact Socket
• pitch down to 0.3mm
• Kelvin: 0,4mm
• Up to 1million operations
• (on specified condition)
• High frequency Characteristics
• Bandwidth [email protected]
• Current up to 2A
• Inductance <0.1nH
SOP – SSOP – TSSOP – QFP – QFN – PLCC – LCC
Technology for
Better Contacts
aps Solutions GmbH
PCR Socket
BGA – LGA – QFN
• Pressure conductive Rubber
• Pitches down to 0.3mm
• Min. contact resistance: ~ 20m Ω
average ~ 40mΩ
• Up to 3000 contacts
• Max. Bandwidth: -1dB@18,3GHz
• Temperature range: -40°C – +125°C
• Life time: ~300k
• Easy to install on site
Technology for
Better Contacts
aps Solutions GmbH
WLCSP Probe Head
• Planarity: ±35µm • Bandwidth: 6 Ghz • Current Rating: >1A (0,4mm Pitch) • Pitches: < 0.2mm • Kelvin / Force & Sense (0.4mm pitch) • Lifetime: >1000k • Universal Probe Head
Technology for
Better Contacts
aps Solutions GmbH
Co-Axial Test Socket
•• FFoorr BBGGAA,,QQFFNN •• PPii ttcchh:: 00..55,, 00..6655,, 00..88,, 11..00,, 11..2277mmmm •• AApppprroopprr iiaattee ooppeerraatt iinngg ffrreeqquueennccyy uupp ttoo
1133 GGHHzz •• Impedance match:50, 75, 90
BBGGAA –– QQFFNN
Technology for
Better Contacts
aps Solutions GmbH
Package on Package
For LGA, and BGA Package Types
Bottom View
Top View
Technology for
Better Contacts
• For BGA and LGA applications • Standard Spring Pin • Kelvin options • Pitches < 0,4 mm • Kelvin / Force & Sense Pitch 0,4mm • High Current
Technology for
Better Contacts
aps Solutions GmbH
Spring Pin Probe Card
Reduced Cost of Ownership • Easy in Operation • Easy to Maintain • Seperated Die Test
• Pitches 150µm possible • Planarity ± 35µm • Bandwidth 6.1 Ghz (@-1dB) • Current Rating >1A (0,4mm Pitch) • Lifetime >1000k • Long contact travel (OD up to 200um)
Manual Option
Technology for
Better Contacts
aps Solutions GmbH
Active Thermal Control
• ATC – for monitoring the IC´s testing temperature d uring characterization
• Max Temperature range (without loading): -60°C - +1 75°C • Temperature Accuracy: +-0,1°C (constant loading) • TEC cooling power (customized selection): 460W max • Termerature input: t-Type termocouple • Ramping time (without loading): • ambient to +175°C: ~200sec • ambient to -60°C: ~400sec • Die Crack prevention • Over Temperature protection • Customized software GUI • Manual • Semi – Automatic • Automatic
Cleaning of Spring pin and rigid pin test sockets
aps Solutions GmbH
Laser Cleaning
Technology for
Better Contacts
Principle:
Uses Flat Top Laser Beam (collimated—non focused)
with hybrid waveleng th and shockwave effect.
Result:
Handheld Scan System
Options:
RReeffrreesshhmmeenntt && rreeppaaii rr :: Options: • needle adjustment
• pin count 1-20 • pin count 22-30
• exchange of Pcb and needle adjustment • pin count 1-20 • pin count 22-30 • exchange of all needles (all other parts remain) • per # of pins • exchange of pcb and all needles • per # of pins • all components of test head have to be replaced (like new probe head) • per # of pins We produce, repair and refresh various types of Kelvin-Contact-Sets with tungsten probes for specific test handlers.
aps Solutions GmbH
Kelvin – Contact - Set
Technology for
Better Contacts