and by melt immersion, to form thereon zinc phosphate layers containing manga- nese and nickel, said layers having an area1 density of less than 2 g/m2, by treatment with acidic phosphating solutions wherein the duration of the treatment is 3-20 set, the phosphating is carried out within a temperature range of 40-7O”C, and the phosphating solutions consist essentially of 0.02-0.75 g/L of zinc; 0.9-l .l g/L of manganese; 0.6-0.9 g/L of nickel; 12-16 g/L phosphate; IO-30 g/L of nitrate; 1.6- 3.0 points of free acid; and 12-40 points of total acid.

Apparatus for the Electrolytic Extraction of Metals U.S. fatenf5,372,683. Dec.. 13, 1994 J-N Kiihnvon Burg&M and IJ. Strlider, assignors to MC. Hemus G&H, Hanau, Germany

A method and apparatus for electrolytic recovery of metal from a first solution containing ions of the metal, comprising providing a first cell containing a first solution containing electrolyte and ions of metal to be recovered and an anode; providing a second cell containing a second solution containing an electrolyte and a

cathode having a negative voltage with respect to the anode in the first cell; providing a first electrically conductive endless band on a route having a first section in the first solution, and a second section in the second solution; and main- taining a current density, which is sufficient to cause the metal to be deposited on the first band in the first cell, released from the first band into the second solution, and deposited on the cathode in the second cell.

Apparatus for Selective Electroplating U.S. Patent 5,372,6X Dec. 13, 1994 J. M! Rischke and 7: Thomassen, assignors to Meco Equipment Engineers B. I4 HattcgeMsch, Nelher- lands

A method for selective electroplating of metal on metal or metallized products in an elongated strip comprising guiding a mask- ing belt and a product strip together about a periphery of a wheel or drum and along means for exposing the products to be plated to an electrolyte, with the wheel or drum having a layer of a material with a high coefficient of friction, which contacts the masking belt or product strip.

ELECTROPLATING OF ZINC DIE CASTINGS Sy S. K. Jalpta 225 pages hardcover $90.00

I’his book provides coverage of plating on zinc die castings starting with design and production with emphasis on its relation to plating. Subsequent chapters treat polishing, buffing and m&s finishing, cleaning and pretreatment and the equipment for plating. The balance of the book runs the gamut of the various metals that can be deposited. Each chapter devotes a portion to troubleshooting-causes of defects and remedies. Concluding chapters concern coloring, lacquering, stripping of deposits and analysis and testing.

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Target for Cathode Sputtering U.S. Paient5,372,6M Dec. 13, 1994 J. szczyrbowski, ass@nor to Leytdd AG, Ham, Germany

A cathode sputtering apparatus compris- ing a cathode, a plurality of target tiles, a plurality of target base plates to which respective the target tiles are fixed, and fixing means for fixing the marginal por- tions of the base plates to the cathode.

Aqueous Degreasing Composition U.S. Patent5,372,741. Dec. 13, 1994 L.C. Tomaszewski, assignor fo Enthon&Ml Inc., Warren, Mid.

An aqueous degreasing composition free of silicates, chelates, and inorganic phos- phates for desoiling of metal substrates comprising 17~55% by weight of an alkali builder containing no phosphates, chelates, or silicates; 2-88 by weight of salt of a polymerized alkyl naphthalene sulfonic acid; 1525% by weight of a phosphate ester of an alkali salt; 2-68 by weight of an ethoxylated fatty alcohol; 26% by weight of an alkyl imidazolinium carboxylated or sulfonated alkali salt; and the remainder being water.

for ELECTROLESS PLATING

WASTE TREATMENT SECONDARY CONTAINMENT

??No need for expensive tank passivation

??Flexible PVC or polyurethane construction

??Electronically lap-welded seams for superior strength

??Custom made to your exact dimensions

??Easy inexpensive drop-in installation

??High resistance to plating solutions

??Good heat transfer

Excellent for Electroless Nickel Plating

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