ASSEMBLY DEPARTMENT

PCB Assembly

Quick Turn Prototypes Automated SMT Production Assembly Operators & Process Certified to J-Standard-001 Assemble to IPC-A-610 Class II & III Fine Pitch SMT, BGA and Mixed Technology Full ESD & Environment Control Automated Optical Inspection (AOI) Full Paperless Doc Control, Traveler Generation, Serialization and Traceability MIS database BGA X-Ray & Rework Conformal Coating Box Build Assemblies

ASSEMBLY DEPARTMENT

ASSEMBLY DEPARTMENT

MYDATA AUTOMATION PICK & PLACE EQUIPMENT

HYDRA – Multi Mount Head Option

Capable up to 21,000 CPH

IPC 9850 Chip Net Throughput 17,500 CPH

IPC 9850 Chip Repeatability (X, Y, Theta) 69 μm, 3,0°

Component Specifications Min: 0.6 x 0.3 mm (0.02 x 0.01") (0201)

Midas - Single Mount head

Rated Speed (1) 6 100 CPH

IPC 9850 Fine Pitch Net Throughput * (2) 1 500 CPH

IPC 9850 Fine Pitch Repeatability 3σ(X, Y, Theta) (4) 25 μm, 0,08°

Component Specification Min: 0.4 x 0.2 mm (0.016" x 0.008") (01005)

High Res Camera

Max Active Field of View 15 x 15 mm (0.59" x 0.59")

Min Pitch 0.10 mm (4 mil)

Min Lead Width 0.05 mm (2 mil)

MYDATA AUTOMATION

MY12E & MY15’S SERIES PICK & PLACE EQUIPMENT

DEK Screen Printers

Best-in-class performance on Horizon 03iX features the following standard fit resources:

Process alignment capability 2 Cpk @ ± 25µm 6-Sigma

Machine alignment capability 2 Cpk @ ± 12.5µm 6-Sigma

12 second cycle time

High Throughput Conveyor enables core cycle time reduction to just 11 seconds

DEK USA HORIZON 03iX DEK USA HORIZON 03i

SURFACE MOUNT CAPABILITIES

Heller Re-flow oven (Airflow or N2 Ready)

The 1809 EXL(9 Zone) Re-flow ovens supports high mix / high volume throughput... at speeds up to 32

inches (80 centimeters) per minute.

Rapid response times and precise temperature controls assure process uniformity, regardless of

component density or board loading, with identical profile performance in either air or nitrogen.

Highest Yields and Tight Process Control

The most efficient heat transfer from extra high volume, high-velocity, heating modules, producing

heater module response of less than one second to temperature changes of less than 0.1°C, thereby

maintaining profile integrity for heavy board loads.

HELLER INDUSTRIES

1809 EXL RE-FLOW OVEN

DRS Rework Station Component Requirements:

Beam-splitter Vision System: No minimum size, 2.0” square, 1.0” height

Direct View (perimeter): No minimum size, 4.0” square, 2.0” height

Top & Bottom Side Clearance: (DRS24) Top=1.100”, Bottom=.920”

Accuracy and Repeatability:

Placement Accuracy: +/- 0.001” at 3 Sigma (or a true position of 1.4 mil). This is defined as the ability for the machine to hit the

target.

Repeatability: +/- 0.0003”. This is defined as the ability for the machine to return to the same spot.

Force Measurement System:

Component Placement Force: Up to 2000 grams in increments of 1 gram. Target point and +/- range adjustment throughout

process.

Heating Systems:

Top Heater: Patented 1000 watt, triple-pass (preheats incoming air) heating element with imbedded thermocouple for process

(temperature) control.

Bottom Heaters: 4000 watt convection preheater. DRS24 (20”W x 16”D).

Heater Controllers: All heaters controlled via a closed-loop, auto tuning PID controller. Self-calibrating to +/- 5 degrees C.

AIRVAC DRS24B REWORK EQUIPMENT

Veriteq/Vaisala Temperature & Humidity system Clean rooms and other critical environments require high performance environmental monitoring to

operate consistently and within product and process specifications. Humidity measurement can be

especially challenging and important in clean room environments, which can be negatively impacted by

or mold spores and other microbes. Vaisala’s high performance instruments and continuous monitoring

solutions reduce the risk of out-of-specification conditions and help keep your facility audit-ready and

compliant.

Technical Specifications

Internal Relative Humidity

Sensor

Type of sensor Integrated high-accuracy capacitive polymer RH sensor

Initial Accuracy ±1%RH over 10%RH to 90%RH at +20ºC to +30ºC

±2%RH over 10%RH to 90%RH at -20ºC to +70ºC

Operating range -35°C to +85°C, 0% RH to 100% RH (non-condensing)

Resolution 0.05% RH

1-year Accuracy

(*denotes Accuracy One Year

after original deployment)

*±2% RH over 10% RH to 90% RH at +20°C to +30°C

±3% RH over 10% RH to 90% RH at -20°C to +70°C

Calibration Interval Annual (recommended)

Internal Temperature Sensor

Initial Accuracy ±0.10ºC over +20ºC to +30ºC

±0.15ºC over -25ºC to +70ºC

Operating range -35 to +85°C (-31 to 185°F)

Resolution 0.02°C at +25°C

1-year Accuracy ±0.15°C over 20°C to +30°C

±0.25°C over -25°C to +70°C

Veriteq/Vaisala Temperature & Humidity System

Temperature and Humidity Graphs & Software

(24/7, 365 Days a Year)

AOI (YESTECH) Capture on the fly technology

3D Fusion Lighting (RGB+White LED's)

5 megapixel color imaging

1 top-down and 4 side angle cameras

Quick set-up

High speed, high defect coverage

Low false failure rate

Programmable conveyor for boards up to 20 x 22

Equally effective for paste, pre / post-reflow and final assembly

inspection.

Off-line programming maximizes machine utilization and real-time

SPC

monitoring provides a valuable yield enhancement solution.

Automated Inspection for:

• Solder defects

• Lead defects

• Component presence and position

• Correct part / polarity

• Through-hole parts

• Paste

Specifications

Throughput: Up to 10 sq. in./sec. > 500,000 components per hour

Maximum Board Size: 22” x 20” (560mm x 510mm)

Clearance: 2” (50mm) top and bottom

Minimum Component Size: 0201; 01005 with high magnification

option

False Calls: <500 PPM (<0.05% typical)

Defects Detected: Part: position, missing, wrong, polarity,

skew, tombstone

Lead: bent, lifted, bridging

Solder: open, insufficient, short, solder balls

NORDSON/YESTECH FX-12-110

Features / Processes Mass production

In Process Inspection

• Solder paste inspection (SPI) 01005 & larger

• Automated Optical Inspection (AOI) 01005 & larger

Selective Solder (Pb & Pb-Free) (ACE PRODUCTION TECHNOLOGIES)

The KISS-104 is the completely automated "in-line" version of the KISS-103 handling boards up to 18" x 24"

KISS-104 couples high throughput with precise process controls.

The programmable features provide the tools to set all process parameters, including immersion depths, pre-heat dwells, travel

distances and speeds, solder temperature and wave height.

Once set, the system will repeat precisely.

The KISS-104 will out produce 6 or more operators soldering with an iron while significantly increasing the solder joint quality and to

a predictable schedule.

SPECIFICATIONS:

PCB Panel Size

Minimum 2” x 2”

Maximum 18” x 24” (18” x 42” with manual step over)

Safe “Keep Away” (distance to adjacent pads) 1mm

Motion (Super Quick)

Z-Axis - Accuracy/Repeatability +/-.002" Speed 0-4” inches/second

X and Y Axis

Accuracy/Repeatability +/-.002" Speed 0-6 inches/second

Solder Pot

Temperature PID proportioning (0-400°C) ± 2°C

Solder Capacity - 30 lbs.

Pump - PC controlled

ACE PRODUCTION KISS-104

ACE PRODUCTION KISS-103

KISS-LTS (Re-tinning)

ACE PRODUCTION TECHNOLOGIES --Refurbishing of "Legacy Components"

--Removing the oxidized (plated) lead finish and replacing

with a fused intermetalic Sn/Pb finish.

--Gold Embrittlement Mitigation:

--Removes the gold from the components leads by

"solubilizing"

in molten Sn/Pb solder.

--Tin Whisker Mitigation:

--Replaces the tin plating with fused alloy.

--Convert RoHS components to Sn/Pb

SPECIFICATIONS:

Process area of the pallets

Length and Width 4” x 5”

Usable clearance above the pallet 4”

Usable clearance bellow the pallet 3”

Motion Z-Axis

Accuracy/Repeatability +/-.002"

Speed 0-15 inches/sec

Travel Distance = 3.0”

X Axis

Accuracy/Repeatability +/-.002"

Speed 0-10 inches/sec.

Solder Pot

Temperature Controller PID proportioning - (0-350°C) ± 2°C

Solder Capacity - 90 lbs for each pot.

Pump - Variable speed, programmable

Pre-Heater

Forced air, PID controlled - (0-350°C)

ACE PRODUCTION KISS LTS-200

AEGIS SOFTWARE Murrietta Circuits Enhances Traceability by Upgrading Aegis Software

The iView software from Aegis Industrial Software Corporation will enable Murrietta Circuits to trace product

history, material usage, and trends in all process, test, inspection and repair records. This upgrade will allow for

real-time tracking of orders, enable customizable reports of all collected data, provide date code and lot code

traceability of all components, and eliminate the dependency on paper copies.

Real-time tracking of orders will allow users to identify the exact location of a job and automatically re-route when

a defect is found. This automatic re-route will allow for more accurate tracking of each specific unit, while

collecting valuable data for process improvements. The data collection module will enable reports to be generated

for identifying all units containing a particular date code, lot code, part number, or serial number. These reports

serve as a valuable tool to identify process issues or defective components down to a specific lot code.

Aegis software will streamline the traceability of all components used on each board and can record every defect

down to the pin level. Traceability reports can also record all process revision records, operator feedback notes,

process deviations released during production, tools and consumables used, and all rework and repair for a

particular board. This extensive tracking history will make all job information available to customers, which will

be extremely beneficial for defect tracking.

AEGIS SOFTWARE

Being able to view all drawings and bill of materials in a web browser will further assist in the continuing efforts

of Murrietta Circuits to go paperless. iView allows for electronic user signoffs, drawing and bill of material

searches by part numbers or reference designators, and a zoom to component feature which will increase efficiency

for all orders. Additional documents can be electronically attached and viewed for each job, including any change

orders and ECNs.

The multitude of uses for the upgraded Aegis shop floor control system will greatly enhance current processes, and

customers will benefit from utilizing the detailed traceability.

• Paperless routing

• Controlled sign-off system

• Enables full traceability using barcodes

• Automatically records data

• Cleaner record of quality (lists all errors/defects found)

• Data Minor allows for customizable reports, specific data sets

• Extra steps like serialization, labeling, etc will be included in the process

• IView allows users to link to specs and customer documents

• Online inspections for parts when fully implemented

• Increases efficiency moving products

• Better recording and correction of defects

• Historical data is stored for future reference

• Color coded notifications of historically problematic areas on the board

• Able to handle sub-assemblies and box-builds

AqueousTechnologiesZero-

IonIonicContamination Tester

Process Control The built-in computer automatically calculates NaCl/square

equivalence (per mil spec), operates in an automatic or manual mode,

and is equipped with a built-in memory containing up to 50 test

results.

Built-In Data Logging Printer The Zero Ion tester is equipped with a built-in data-logging printer

that automatically records test date, lot/batch number and test results.

Submerged Sprays The submerged sprays provide excellent agitation of the

test solution while eliminating test inaccuracies caused

by carbon dioxide adsorption associated with other open-air spray

systems. The combination of submersion and spraying creates three

different fluid flow angles across the board surface. It is this random

angle flow of fluid that gives the Zero Ion system its superiority in

ionic contamination detection.

The Zero-Ion Ionic Contamination Tester meets

industrial cleanliness specifications including : MIL-STD-2000A,

MIL-P-28809,

IPC-TM-650, and ANSI/J-STD-001.

Unique Dual-Loop Flow System The Zero Ion tester utilizes a dynamic measurement method, the

method of choice for detecting (weak) ion activators commonly found

in no-clean fluxes. With dynamic measurement technology, the

contamination test solution is monitored and then filtered to supply

de-ionized test solution back to the test chamber, resulting in greater

solubility. The increased solubility eliminates the "saturation limit

effect", associated with other static measurement methods.

AQUEOUS TECHNOLOGIES

ZERO-ION-100A

PHOENIX PCBA Inspector 100 X-RAY

The phoenix pcba|inspector is a high-resolution

2D microfocus X-ray inspection system designed

for inspecting solder joints (e.g. BGA, QFN, QFP,

PTH, CSP, Flip Chip) in board assemblies, but

also for inspection of electronic and mechanic

components and more.

X-ray analyzer

2D X-ray imaging

100 kV X-ray Closed Tube

Automated micro-focus X-ray inspection

120V, 50/60 Hz

Max. tube voltage: 100 kV

Max. output: 10 W

Detail detectability: Up to 3 µm

Min. focus-object-distance: 4.5 mm

Geometric magnification (2D): Up to 75-fold

Max. object size (height x diameter): 28’’ x 22’’

(710 mm x 560 mm)

Max. object weight: 5 kg/ 11 lbs

Image chain: 672 x 568

PHOENIX

PCBA 100 X-RAY

WESTEK

TRITON IV BOARD WASHER

Westek TRITON IV SMT In-Line Aqueous Cleaner with On-Board Closed Loop System

18” Horizontal Load Section

Pre-Wash

Recirculating Heated Wash

Extended Wet Isolation Air Knife

Recirculating Heated Rinse

Final Rinse

Air Knife (15 HP)

Dwell

Air Knife (15 HP)

Static Grounding System

4.5” Standard Product Height Clearance

(1) 15HP High Pressure & Volume SS SMT Spray Pump in Wash

(1) 10HP High Pressure & Volume SS SMT Spray Pump in Rinse

Digital Temperature Readout and Control of Wash and Rinse

Multi-Directional Adjustable Cascade System

(2) Extra High Pressure 15 HP Air Knife Generators

Variable Height and Angle, Stainless Steel Tuned Air Knifes

Balancing Flow Meters in Prewash and Final Rinse

Automatic Start/Stop & Alarm Package

Aqueous Technologies

SMT 800/CL, CL Cleaner / Defluxer Batch Washer

De-fluxing systems are designed for both SMT & Through-hole de-fluxing applications

Provide target impact pressure of 12.8 ounces / sq in

Enhanced SPC data

Closed-Loop (SMT-CL Series)

In closed-loop (CL) configuration, all water is captured, re-deionized, and reused

Configurations are designed to remove all post-reflow water-soluble flux residues

Configuration does not require drain and automatically converts user's tap water in to high-quality deionized water

Aqueous Technologies

SMT 800/CL Batch Washer

CUSTOM PROFILING Reflow process (Note: the same concept is also used in Wave/Selective soldering methods)

In soldering, a thermal profile is a complex set of time-temperature values for a variety of process dimensions such as slope, soak, TAL, and

peak. Solder paste contains a mix of metal, flux, and solvents that aid in the phase change of the paste from semi-solid, to liquid to vapor;

and the metal from solid to liquid. For an effective soldering process, soldering must be carried out under carefully calibrated conditions in a

reflow oven

The Ramp-Soak-Spike (RSS)

Ramp is defined as the rate of change in temperature over time, expressed in degrees per second. The most commonly used process limit is

4 °C/sec, though many component and solder paste manufacturers specify the value as 2 °C/sec. Many components have a specification

where the rise in temperature should not exceed a specified temperature per second, such as 2 °C/sec. Rapid evaporation of the flux

contained in the solder paste can lead to defects, such as lead lift, tomb stoning, and solder balls. Additionally, rapid heat can lead to steam

generation within the component if the moisture content is high, resulting in the formation of micro-cracks.

In the soak segment of the profile, the solder paste approaches a phase change. The amount of energy introduced to both the component

and the PCB approaches equilibrium. In this stage, most of the flux evaporates out of the solder paste. The duration of the soak varies for

different pastes. The mass of the PCB is another factor that must be considered for the soak duration. An over-rapid heat transfer can cause

solder splattering and the production of solder balls, bridging and other defects. If the heat transfer is too slow, the flux concentration may

remain high and result in cold solder joints, voids and incomplete reflow.

After the soak segment, the profile enters the ramp-to-peak segment of the profile, which is a given temperature range and time exceeding

the melting temperature of the alloy. Successful profiles range in temperature up to 30 °C higher than liquidus, which is approximately 183

°C for eutectic and approximately 217 °C for lead-free.

The final area of this profile is the cooling section. A typical specification for the cool down is usually less than −6 °C/sec (falling slope).

Solder samples

Also known as X-outs, electrical test failures, profile boards or solder samples, bare PCBs with quality problems that cannot be assembled

and sold are great for profiling, pick-and-place tuning, process verification, or other engineering experiments on the assembly floor.

During the production life of a circuit assembly, it can be built on different assembly lines, in different factories, or even in different parts of

the world. Due to considerable variation among reflow oven performance, an assembly should get re-profiled each time it is run on a new

line, but this doesn’t always happen – often due to cost constraints. The availability of profile boards at zero cost to the assembler vastly

increases the odds of the assembly getting profiled and reflowed properly, minimizing solder defects and improving overall reliability.

CUSTOM PROFILING

CIRCUIT CAM DETAILED PROFILE LAYOUT

KIC LIGHT (OVEN INTERNAL PROFILER) DATA PAQ (EXTERNAL PROFILER)