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AutoChips Company Profile

www.autochips.com

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Agenda

AutoChips Overview

Competitive Solution

Product Roadmap

Process & Quality Control

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Confidential AAutoChips Overview

• Set up on Dec, 2013

• China IC company holding by NavInfo

• Over 600M RMB of revenue in 2017Entity

• Automotive Chipset and solution provider

• IVI (In-vehicle infotainment) chipset, Telematics chipset, Automotive Audio, Vehicle body control MCU, MEMS

Business

• 280+ employees

• Located at Hefei , Shenzhen & ShanghaiOperation

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AEC-Q100 & TS16949

AEC-Q100

FoundryAssembly &Testing House

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ATC shipped over 35,000 thousand IVI chipset

IVI chipset shipment is over 220K/month and keeps

growing in OEM

IVI chipset Adopted by over 120 vehicle models

in China market

3 generation IVI SoC chipset covered

WinCE/Linux/Android OS

AutoChips 2017

1ST and the only dedicated Automotive

IC design house in China1

3

100

200

30000

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IVI Customer Base

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IVI OEM Market Achievement

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Agenda

AutoChips Overview

Competitive Solution

Product Roadmap

Process & Quality Control

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Confidential B

AutoChips Product Lines

Y2009 Y2010 Y2011 Y2012 Y2013 Y2014 Y2015 Y2016 Y2017 Y2018 Y2019 2020 2021 2022

Infotainment

Audio

Amplifier

MCU

Telematics

e-Cockpit

MEMS

Automotive ChipsetTurnkey Plus Solution

New

Energy

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Confidential AAutoChips Technology Roadmap

Infotainment

•Audio•Decoder•Hi-Fi Audio DSP

•Video Decoder•Navigation•Connectivity•DVD/CD Servo

E-Cockpit

•Digital Cluster•Image Processing ADAS•AVM•2G/3G/4G•802.11 b/g/n/ac/p•Phone Link

Autopilot

•Hardware Security•Vision Engine•V2V•High Accuracy Map •Deep Learning•Big Data

Car Body Control

•MCU•BLDC Control•In Vehicle Bus•Embedded Flash

Active Safety

•MEMS•P Sensor•G Sensor

•Gateway

Advanced SoC Design Low Power Design Function Safety

Quality Assurance System AEC -Q100 -40~85/105/125⁰C Zero Defect

Power Audio AMP, Power Management

2014 2018

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AutoChips Roadmap (1)~2017 2018 2019 2020

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

IVI

V2X

AC82x5

• Cortex A7 x 4 1.0GHz

• Mali 400MP2

• 1280 x 800 display

• AEC-Q100

AC8227L

• Cortex A7 x 4, 1.2GHz

• Mali 450MP2

• 1080p Display

AC8015

• Cortex A53 x 4, 1.5GHz

• Mali T820MP2

• Dual 1080p Display

• HD encoder

• Ethernet AVB

• Hyperviser

• AEC-Q100

MT3561/2

• Cortex A53 x 4/8, 1.2GHz

• Mali 450MP2

• 1080P display

• 2.5/3/4G LTE Modem cat 4

AC8257

• Cortex A72 x 4, 2.5GHz

• Mali T880MP4

• 1080P + 720P dual display

• 2.5/3/4G LTE Modem cat 9

• -40~85

MT3561A

AC8025

• Cortex A53 x 8, 1.5GHz

• Mail T820MP4

• Dual 1080p Display

• HD encoder

• Ethernet AVB

• Hyperviser

• AEC-Q100

• -40~85

* Chipset include Bluetooth, GNSS and WiFi chip

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AutoChips Roadmap (2)~2017 2018 2019 2020

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

AMP

MCU

• 4 x 45W /4Ω max

• Start Stop,

• Diagnostics

• Tj:150• Flexiwatt25

AC7325

AC7335

• 4 x 72W /2Ω max

• Tj:150• I2C bus• high side driver

• Tj:150• Flexiwatt27

AC7315

AC7815

• CM3 100MHz

• 16*12-bit ADC

• CAN 2.0B/LIN2.1

• I2C/SPI/UART/PWM

• Embedded Flash

• AEC-Q100

AC7835

• CM3 120MHz

• CAN FD

• Ethernet

• AEC-Q100

• CM0+ 72MHz

• CAN FD/LIN2.1

• FOC

• AEC-Q100

AC7865

• CR4 120MNz

• CAN FD

• Ethernet

• AEC-Q100

AC7825

• T8051 48MHz

• CAN2.0B/LIN2.1

• AEC-Q100

AC7811

• AEC-Q100

Grade1

AC7821

AC7831

AC7851

AC7855

AC7861

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AutoChips Roadmap (3)~2017 2018 2019 2020

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

MEMS

AC5111

• P Sensor 0~950kPa

• X, Z axis G Sensor

• Ta: -40~125

AC5121

• P Sensor 0~1500kPa

• X, Z axis G Sensor

• Ta: -40~125

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ATC IVI Platform Key Value

Google:

• Android automotive exclusive participant in

China

Leading Technology

• Phone link: CarPlay/CarLife/Miracast/WeLink/

MHL/USB Link/etc.

• Professional sound effect: AutoSurroundTM

• Exclusive MHL remote control technology

Rich Connectivity Solution

• GNSS: GPS, Beidou, Glonass

• Bluetooth: BT4.1, BLE

• WIFI: 802.11b/g/n/ac, dual band

• 4G: module, Build-in Modem

Platform Solution in HW/SW/SYS

• WinCE/Android/Linux

• DVD Serve/Diskless/AVN/DA/MP5/SmartMirror

• OEM/OES/DOP/AM

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Agenda

AutoChips Overview

Competitive Solution

Product Roadmap

Process & Quality Control

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AC781x Series Block Diagram

*5V Tolerance:

3.3V VDD, support 5V tolerance

(CAN, I2C, UART)AC781x

Clocks

8MHz Internal

RC Oscillator

32.768KHz

Internal LP

Oscillator

4 - 30 MHz

External Crystal

Oscillator

System

Power

Management

Low-voltage

Detection

Watchdog

12-channel DMA

Core

ARM Cortex-M3

Up to 100MHz

Timers

One 6-channel

PWM

Three 2-channel

PWM

One 8-channel

32bit Timer

One Pulse Width

Detection Timer

One Real-time

Clock

Memory Interfaces

Up to 256 KB

eFlash

Up to 64 KB

RAM

IO

Up to 68 GPIO

External Interrupt

Communications

6 x UART

(1 x SWLIN)

2 x CAN

1 x LIN

2 x SPI

2 x I2C

Analog

One 16-channel

12-bit ADC

Two Analog

ComparatorJTAG/SW Debug

3.3V/5V PowerSeven 5V

Tolerance PIN*

Programmable

Voltage Detection

ETM trace

1 x Q-SPI

(16M serial flash)

Programmable

CRC

Aliased SRAM

Bitband Region

Power On Reset

T-sensor

Advanced

Embedded Flash

Access Engine

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AC781x Series Key Features

32bit ARM Cortex-M3 up to 100MHz

Embedded Flash up to 256KByte, with Advanced Embedded Flash Access Engine

Build-in SRAM up to 64KByte

CAN x 2, LIN x 1, and UART LIN x 1

Stop current: 5uA, Standby current: 2uA

2.7-5.5V power supply

ESD HBM 6KV, CDM 750V

Temperature range: -40 to 125 °C

UCOS (Integration Test Pass)

Package options

– 80-pin LQFP

– 64-pin LQFP

LQFP80 (12 x 12) LQFP64 (7 x 7)

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AEFAE

0

20

40

60

80

100

120

eFlash Boot@72MHz SRAM Boot@72MHz eFlash Boot@100MHz SRAM Boot@100MHz

Coremark Benchmark

S*32 AC781x

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AutoChips Automotive MCU IDE

ARM Keil uVision V5

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AC781x Series Demo Board

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AC7811 BCM Applications

Power Windows

Wing mirror

Control/Heater

Door lock Control

Child Locks

Door

Brake lamp

Rear fog lamp

Rear cornering lamp

RearLamp

Low Beam High Beam Front Cornering Lamp Front Fog lamp

FrontLamp

Power Seats

Heated Seats

Memory Seats

Seats

Lighting ControllerWiper ControllerInfotainment /GPSHVAC

Auto Console

Power Tailgate Visual Reversing

Image

Tailgate

Power SunroofRain Sensors

Sunroof

Internal Use

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AC7811 BLDC motor Application

32-bitARM Cortex-

M3

CAN

LIN

GPIO

12-bitADC

PWM

AC7811

LDO

12V

current

Hall sensor

GPIOSwitch

Diagnostics

Internal Use

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AC7811 Headlamp Application

32-bitARM Cortex-

M3

CAN

LIN

GPIO12-bitADC

GPIO/PWM

AC7811

LDO

12V

ADC

Switch

Switch Diagnostics

Internal Use

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AC7811 DC motor Application

32-bitARM Cortex-

M3

CAN

LIN

GPIO

12-bitADC

GPIO/PWM

AC7811

LDO12V

current

Switch

Diagnostics

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Agenda

AutoChips Overview

Process & Quality Control

Competitive Solution

Product Roadmap

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Incoming Quality Control

Laser Marking

Isolation(STI formation)

Well Implant

Gate Ox Formation

Gate Formation

Spacer Formation

Source/Drain Implant

ILD Formation (ILD:Inter Layer Dielectric)

Contact Hole Formation

IMD Formation (IMD:Inter Metal Dielectric)

Metal Pattern Formation

Passivation Formation

Metal Pad Formation

Alloy

Wafer Acceptance Test

Outgoing Quality Control =>Packing & Shipping

Blank Wafer

Wafer Fab Process

Processed Wafer

Document Control

Visual Inspection

Prober set up/correlation

Chip Probe Test (CP)

Visual inspection

Packing & Shipping

Chip Probe Test

:Incoming Material

:Inspection Process

:Manufacturing Process

Process & Quality Control---Wafer & Testing

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Probed Wafer

Substrate

wire

Mold Comp.

Solder Ball/Flux

Incoming Quality Control

Backside Grinding

Wafer Saw

Die Attach

Wire Bonding

Visual Inspection

Molding

IC Top Marking

Solder Ball Mount

IC Singulation

Final Inspection

Packing & Shipping

IC Packaging

Packaged IC

Document Control

Visual Inspection

Function Test

EQC (Electric Quality Control)

Lead Scan

Final Inspection

Baking

Packing & Shipping

:Incoming Material

:Inspection Process

:Manufacturing Process

Function Test

Process & Quality Control---Package & Testing

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