Automotive Electronics in Extreme Environments - … Pradeep Lall... · cave3 NSF Center for Advanced Vehicle and Extreme Environment Electronics Automotive Electronics in Extreme

cave3NSF Center for Advanced Vehicle and Extreme Environment Electronics

Automotive Electronics in Extreme Environments

Pradeep LallMacFarlane Endowed Professor and Director

Auburn UniversityNSF‐CAVE3 Electronics Research Center

Auburn, AL 36849Tele: (334)844‐3424

E‐mail: [email protected]

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cave3

cave.auburn.eduEmail: [email protected]

Tele: (334) 844-3424

A National Science Foundation CenterAutomotive Companies

iceda.com

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cave3

Component Reliability and Prognostic Health

Management Systems

Chip‐Level Interconnects, Flip‐Chip and Underfills Connectors,

System‐Level Interconnects and

Wear Mechanisms

Harsh Electronics Systems and

Manufacturing

LeadfreeSolders Alloys Constitutive and Wetting Behavior

Flexible Hybrid Electronics

CAVE3 Facts

Started in 1999 Located on Auburn University

Campus Phase‐III NSF‐Center Research Focus on Harsh Envts 17‐Faculty (Engr & Sciences) 53‐Students 15‐Laboratories

cave3

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cave3

2002CAVE3 Responsible for extracting infield modules with upto 175,000 miles on the odometer to develop revised qualification guidelines for thermal cycling for 1000 cycles down from 3000 cycles.

CAVE3 TV‐3C MODULE

2003CAVE3 Responsible for proving use of large BGAs in automotive modules on metal‐backed substrates.

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Traditional Automotive Electronic Systems

Johnson, et.al., The Changing Automotive Environment:High-Temperature Electronics, IEEE Transactions On Electronics Packaging Manufacturing, Vol. 27, No. 3, July 2004

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Driving Assists•Antilock Braking System•Traction Control System•Park Distance Controls•Power steering•Power braking•Electronic Stabilization Programme

•Adaptive Cruise Control•Electronic Brake Force Distribution

• Rain Sensors

Core-Functionality Systems Enabled by Electronics

Safety Systems•Airbags• Emergency Braking System • Early Crash Sensors• Brake Disc Wipers• Active Rollover Protection System

Navigation & Communication• GPS• Parking assist

Engine Control•ECUs•Electronic Fuel Injection•Powertrain Control Module

Propulsion Systems• Hybrid Engines• Regenerative Braking

Image Courtesy: Actel Corporation

Source: Actel pioneering new markets for FPGAs in automobiles, EE TIMES

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Courtesy of IDTechEx, Flexible and Printed Electronics in the Automotive Industry, Feb 17, 2016

Flexible Electronics in Automotive Applications

Ref: The future is flexible in the automotive world, SmartKem, 2016

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How Google is shaping the rules of the driverless road, Paul Ingrassia, Alexandria Sage and David Shepardson, Reuters, April 26, 2016

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Automotive Temperature Extremes

R. Thompson, Proc. SMTA/CAVE Workshop Harsh Environment Electronics, Dearborn, MI, Jun. 24–25, 2003

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Automotive Temperature Extremes

Johnson, et.al., The Changing Automotive Environment:High-Temperature Electronics, IEEE Transactions On Electronics Packaging Manufacturing, Vol. 27, No. 3, July 2004

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Automotive Operational Temperatures


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Automotive Operational Temperatures

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C. Larner, Proc. Issues of Defining and Designing for the High Temperature Automotive Electronics Environment, SMTA/CAVE Workshop Harsh Environment Electronics, Dearborn, MI, Jun. 24–25, 2003

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C. Larner, Proc. Issues of Defining and Designing for the High Temperature Automotive Electronics Environment, SMTA/CAVE Workshop Harsh Environment Electronics, Dearborn, MI, Jun. 24–25, 2003

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Component Challenges for Automotive Electronics• Most common automotive packages: SOIC, TSSOP, SOT, TQFP, and QFN (growing)

• Traditional challenges still exist around 150C/Grade 0 reliability• Materials: metallurgy, delamination, board level reliability• Thermal: max temperature, usage profiles, overtemp protection

• New challenges anticipated• Higher voltage & isolation• Lead free materials• New electrical current paths

• Change is complex• When is a new technology “automotive ready”?• What are the true standards and requirements?

Ref: Romig, M., IPACK2017‐74398

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M. Hundt, Improved Reliability of Gold to Aluminum Bonding in Plastic Packages for High Temperature, High Current Applications, Proc. SMTA/CAVE Workshop Harsh Environment Electronics, Dearborn, MI, Jun. 24–25, 2003

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Transition to Cu WB and Ag WB

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Crack Initiation and Propagation@175C Crack initiation

Crack Propagation

Complete Cracking

Continuous IMC formation, crack expansion

1128 Hrs

1176 Hrs

1224 Hrs

1272 Hrs

1320 Hrs

1368 Hrs

Oxidation of Cu‐Al intermetallics during operation at high temperature and high humidity may cause oxidation of IMC, followed by crack initiation, and eventual failure.

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Tensile Stress Compressive Stress

Problem: Rapid Assessment of Propensity for Tin Whisker Formation in Platings

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0

20

40

60

80

100

0 0.005 0.01 0.015 0.02

σ yy

(MPa

)

ϵyy

SAC105 30 DaysAging at 25C

30 DAYS @ 25C + 10/sec @ 25C30 DAYS @ 25C + 35/sec @ 25C30 DAYS @ 25C + 50/sec @ 25C30 DAYS @ 25C + 75/sec @ 25C

Problem: Measure High Strain-Rate Properties of SAC Alloys at Strain Rate of 1-100 sec-1

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Time, t (sec)0 2000 4000 6000 8000

Stra

in,

0.00

0.02

0.04

0.06

0.08

As Reflowed100 oC, 0.5 Months100 oC, 1 Month100 oC, 2 Months100 oC, 3 Months100 oC, 4 Months100 oC, 5 Months100 oC, 6 Months

Aging Conditions

SAC 205, RFT = 25 oC = 15 MPa

CREEPExample Data – Aging at 100 oC

SAC205

Increasing Aging Time

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CREEP RATEEffects of Aging ‐ SAC105

Aging Time (months)

0 1 2 3 4 5 6

Stra

in R

ate

(sec

-1)

10-10

10-9

10-8

10-7

10-6

10-5

10-4

10-3

10-2

10-1

Aging at RTAging at 50 oCAging at 75 oCAging at 100 oCAging at 125 oC

SAC105, RFT = 25 oC = 15 MPa

SAC105CreepRange

Cross-Over Points

Tin-LeadCreepRange

The Time Duration Before the Cross‐Over Depends on the Composition of the SAC Alloy and the Aging Temperature. Increased Silver Content Increases the Aging Time Required Before the Cross‐Over Occurs.

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Wire Harnesses in Automobiles

It Takes a Lot of Wiring to Keep a Modern Vehicle Moving (Witness this Bentley’s Harness), J. P. Huffman, Car and Driver, May 23, 2016.Fewer Wires, Lighter Cars, Kathy Pretz, The Institute, 12 April 2013

“About 50 MCUs are found in mid‐priced cars, almost 140 in high‐end models. This cabling—and the harnesses involved—makes up the third heaviest and costliest component in a car, right behind the chassis and engine…. and with more features being added each new model year, the harnesses are getting bigger and heavier. The average is now about 100 kilograms”

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In-Mold Electronics

ApplicationsControls in automobiles and domestic appliances.

AdvantagesBy removing bulky physical switches, significant cost and weight savings can be achieved.

Ref: Courtesy of DuPont

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Engine Control Module

Reference: Toyota Electronic Throttle Webinar, March 12, 2010

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On-Board Diagnostics

OBD‐II Connector and Fault Codes Explained, Kiril Mucevski, May 12, 2015

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Overview of Prognostic Health Management for Systems @CAVE3

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t = 0, 1, 2, 3, …… …………………T-1, T, T+1,…………….

Shock and Vibration

Feature Extraction and Damage Assessment

MultipleSensor Data

System Self-Load

Damage Pre-Cursors

Physics-Based Models

ConditionDiagnosis

DamageProgression

Remaining Useful Life

Shock and Vibration

Feature Extraction and Damage Assessment

MultipleSensor Data

System Self-Load

Damage Pre-Cursors

Physics-Based Models

ConditionDiagnosis

DamageProgression

Remaining Useful Life

Thermo-mechanics

Interrogation of Latent Damage

Leading Indicators of Failure

Unknown Usage Profile

Redeployment Decisions

Damage Progression

Thermo-mechanics

Interrogation of Latent Damage

Leading Indicators of Failure

Unknown Usage Profile

Redeployment Decisions

Damage Progression

cave3 Prognostics Framework

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Kalman Filter Based RUL

2 2.5 3 3.5 4 4.5 5 5.53.1

3.11

3.12

3.13

Res

ista

nce

[ohm

]

Time =2.7259 [Hr]

2 3 4 5 6 7 8 9 103.1

3.11

3.12

3.13

RULpredicted= 7.6776 RULactual= 2.9917

Time [Hrs]

Res

ista

nce

[ohm

]

2 2.5 3 3.5 4 4.5 5 5.53.1

3.11

3.12

3.13

Res

ista

nce

[ohm

]

Time =3.3754 [Hr]

2 3 4 5 6 73.1

3.11

3.12

3.13


Time [Hrs]

Res

ista

nce

[ohm

]2 2.5 3 3.5 4 4.5 5 5.5

3.1

3.11

3.12

3.13

Res

ista

nce

[ohm

]

Time =4.025 [Hr]

2 2.5 3 3.5 4 4.5 5 5.53.1

3.11

3.12

3.13


Time [Hrs]

Res

ista

nce

[ohm

]

Problem: Remaining Useful Life Assessment of Board Assembly Under Vibration @CAVE3

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Problem: Prognostication of PBGA Assembly Anomalies and Fault Mode Classification @CAVE3

Karhunen Loéve Transform

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Battery Technology in EV

Battery in a Tesla S Model chassis. The 85kWh battery has 7,616 type 18650 cells in parallel/serial configuration.Source: Tesla Motors

Reference: BU‐1003: Electric Vehicle (EV), http://batteryuniversity.com/learn/article/electric_vehicle_ev

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Driving range as a function of battery performance. A new EV battery only charges to about 80% and discharges to 30%. As the battery ages, more of the usable battery bandwidth is demanded, which will result in increased stress and enhanced aging

Battery Technology in EV

Reference: BU‐1003: Electric Vehicle (EV), http://batteryuniversity.com/learn/article/electric_vehicle_ev

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Prognostication of SOC for Batteries @CAVE3

Work StationNI Labview

Environment

Environmental Chamber

Lithium Battery

Source Meter

Load

Charge ProfileControl Signal

Discharge ProfileControl Signal

Selection Signal

Temperatureof the Battery

Voltageof the Battery

Current of theBattery

Data Logger

Current Transducer

Uc Vref Vout

5V 2. 5V

Ref: Lall, P., Zhang, H., Survivability and Remaining Useful Life Assessment of Flexible Batteries in Wearable Electronics, Proceedings of the FlexTech Conference, Monterrey, CA, Feb 28-Mar 4, 2016

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Effect of Environment on SOC

Battery Capacity and Normalized Capacity

-0.2

0

0.2

0.4

0.6

0.8

1

1.2

0 50 100 150 200 250

Nor

mal

ized

Cap

acity

Cycle

Normalized Capacity vs Cycle Number at Different Test Condition

40C Normalized Capacity

25C Normalized Capacity

25C Normalized Capacity With Bending

40C button Normalized Capacity

25C Button Normalized Capacity

Ref: Lall, P., Zhang, H., Survivability and Remaining Useful Life Assessment of Flexible Batteries in Wearable Electronics, Proceedings of the FlexTech Conference, Monterrey, CA, Feb 28-Mar 4, 2016

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Summary and Conclusions

• Proliferation of electronics in automotive platforms requires the survivability assurance of advanced semiconductor packaging in harsh environments.

• Mitigation of risk with the use of new material, interface and assembly architectures requires design of damage tolerant structures in addition to advancements in understanding of failure mechanisms and acceleration factors.

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Automotive Electronics in Extreme Environments - … Pradeep Lall... · cave3 NSF Center for Advanced Vehicle and Extreme Environment Electronics Automotive Electronics in Extreme