Automotive Materials for Automotive Electronic Applications

Materials for Automotive Electronic Applications

Automotive

MATERIALS FOR AUTOMOTIVEELECTRONIC APPLICATIONS

Powertrain• Engine• Transmission

interior•Multimedia• SeatingSystems• SafetySystems

• InstrumentPanelSystems

thermal• EngineCooling• HAVC• HeatingSystems

• Battery• Controller• DCtoDCConverter

• ElectronicVehicleChargeSystems

• Inverters

Body• BodyElectronics• ExteriorLighting

•Wheel• SecuritySystems

SenSorS• AmmoniaSensor• PressureSensor• OxygenSensor• TemperatureSensor• DigitalSpeedand

Position Sensor

• FlatResponseKnockSensor

• RainSensor•MassAirFlowSensor• BrakeSensor• AccelerationSensor

• ElectronicCenter

electrical/electronic architecture

Addressingtheneedsoftoday’sadvancedautomotiveindustry,Henkelhasdevelopedabroadrangeofconductivepasteandfilmadhesives,glob-topandunderfillencapsulants,conformalcoatings,sealants,pottingencapsulantsandsolderproducts.Oursolutionsareusedinawiderangeofvehicleelectronicandsensorcomponentsforcommonrailfuelsystems,safetyelectronics,engineandpowertrainmanagement,infotainment,andlightingapplications.

hyBrid & electric Vehicle ProductS

PRINTEDCIRCUITBOARDASSEMBLYMATERIALSHenkelistheworld’sleadingandmostprogressiveproviderofqualifiedmaterialsforsemiconductorpackaging,printedcircuitboard(PCB)assemblyandadvancedsolderingsolutions.

LowPressureMolding

Sealant

Encapsulants(GlobTop)

Surface Mount Adhesives

CSPUnderfills(Cornerbond)

ThermalManagement

Materials

AssemblyFilmAdhesives

SolderMaterials

Encapsulants(Dam&Fill)

PrintedInks

PottingCompound Conformal

Coatings ElectricallyConductive

Pastes

1 | Automotive Electronic Automotive Electronic | 2

circuit Board Protection•LowPressureMolding•Potting•ConformalCoatings•Gasketing&Sealants

Printed inKS•TransparentConductiveInks•SilverInks•BlendableResistiveInks•DielectricInks

thermal manaGement materialS•AdhesivePastes•Phase-ChangeMaterials•ThermalGreases

aSSemBly adheSiVeS•Pastes-ElectronicallyConductive•Films-ElectronicallyConductive

Solder materialS•High-ReliabilityAlloy•High-ReliabilityPastes•LiquidFluxes•CoreWires

chiP on Board (coB) encaPSulantS

underFillS SurFace mount adheSiVeS

henKel electronicS aSSemBly Poroduct lineS

applications Key Solutions

Ammonia Sensor CircuitBoardProtectionSolderMaterialsMaterials

Pressure SensorCircuitBoardProtection AssemblyAdhesivesSolderMaterials

OxygenSensor CircuitBoardProtectionSolderMaterials

Temperature SensorCircuitBoardProtectionAssemblyAdhesivesSolderMaterials

DigitalSpeedandPositionSensor

CircuitBoardProtection PrintedInksAssemblyAdhesivesSolderMaterials

FlatResponseKnockSensorCircuitBoardProtection AssemblyAdhesivesSolderMaterials

Rain Sensor CircuitBoardProtection AssemblyAdhesives

MassAirFlowSensor AssemblyAdhesivesSolderMaterials

BrakeSensorCircuitBoardProtection AssemblyAdhesivesSolderMaterials

Acceleration Sensor

CircuitBoardProtection PrintedInks AssemblyAdhesivesSolderMaterials

Sensors


engine

Electronic Control Units

CircuitBoardProtectionAssemblyAdhesivesSolderMaterials Underfills

transmission

ElectronicIgnitionModulesCircuitBoardProtection ThermalManagementMaterialsSolderMaterials

IgnitionCoils CircuitBoardProtectionSolderMaterials

Electronic Transmission Controllers

CircuitBoardProtectionSolderMaterials

Powertrain

3 | Automotive Electronic

MassAirFlowSensor

BrakeSensor

Electronic Control Units

electrical/electronic architecture

Body applications Key Solutions

Body electronics

BodyControlModulesCircuitBoardProtectionAssemblyAdhesivesSolderMaterials

exterior lighting

LEDSystems

CircuitBoardProtection ThermalInterfaceMaterials DieAttach Encapsulant

wheel

Tire PerssureCircuitBoardProtectionSolderMaterials

Securlty & Safety Systems

PedestrianProtectionCircuitBoardProtectionSolderMaterials

KeylessEntryCircuitBoardProtectionSolderMaterials


electronic center

SealedPrintedCircuitBoardElectrical Centers


BatteryMonitoringDeviceCircuitBoardProtectionSolderMaterials

PowerFlexívelElectricalCenters CircuitBoardProtection

SolidStateRelaysCircuitBoardProtectionSolderMaterials

SolidStateRelays

LEDSystem

Automotive Electronic | 4

interior

thermal applications Key Solutions

engine cooling

CoolingFanControllers CircuitBoardProtectionThermalManagementMaterials

hVac

ElectronicHeatingSystems PrintedInks

ElectronicAirConditionControllers CircuitBoardProtection

heating Systems

MirrorHeat PrintedInks


multimedia

Multiple Antenna Reception Systems


Display,Audio&NavigationSystems

CircuitBoardProtectionPrinkedInksThermalManagementMaterials AssemblyAdhesivesUnderfills

Seating Systems

Electronic Seat ControllersCircuitBoardProtectionAssemblyAdhesivesSolderMaterials

SeatBeltSystems CircuitBoardProtectionSolderMaterials

SeatHeaters PrinkedInks

Safety Systems

AirBagSystems CircuitBoardProtectionSolderMaterials

instrument Panel Systems

Instrument Clusters CircuitBoardProtectionPrinkedInksSolderMaterials

Head-upDisplaysCircuitBoardProtectionPrintedInksSolderMaterials

MirrorHeat

Multimedia

hybrid & electric Vehicle Products


Battery

HybridVehicleBatteryPackSystems

CircuitBoardProtectionThermalManagementMaterialsSolderMaterials

BatteryManagementControllerCircuitBoardProtectionSolderMaterialsThermalManagementMaterials

UniversalOn-boardBatteryCharger


controller

HybridandEVController

CircuitBoardProtectionAssemblyAdhesivesSolderMaterialsUnderfills

dc to dc converter

Universal2.2kWDC/DCConverter

AssemblyAdhesivesSolderMaterials

electronic Vehicle charge Systems

PortableElectricVehicleCharger CircuitBoardProtection

inverters

TractionInverterforHybridElectricVehicles

CircuitBoardProtectionThermalMangementMaterials


Hybrid&ElectricVehicle


CIRCUITBOARDPROTECTION


circuit Board Protection

LOWPRESSUREMOLDING POTTING CONFOMALCOATINGSGASKETING&

SEALANTS

POLYAMIDE POLYOLEFIN URETHANES EPOxIES SILICONESONE-

COMPONENT ACRYLICSURETHANEACRYLATES

URETHANES SILICONES GASKETS SEALANTS

Polyamide AdhesiontoPlastics IncreasedHardness

ExcellentAdhesiontoMetals,Plastics,Tough

Surfaces

Two-Component

Room Temperature

Cure

Two-ComponentHeatCure

Two-ComponentRoom Temperature Cure

Amber Black Amber Black Blaze Orange Amber Black Opaque White HYSOLUS1150

HYSOLES1004

HYSOLES1000

HYSOLES2500

LOCTITE®

5092HYSOL

EO 1058HYSOL PC62 HYSOL

PC40-UMHYSOL PC 18M

HYSOLECCOCOAT

SC 3613

LOCTITE® NUVA-SIL

5089

LOCTITE® 5210

TECHNOMELT®

PA 673TECHNOMELT®

PA 678TECHNOMELT®

PA 633TECHNOMELT®

PA 638TECHNOMELT®

PA 341TECHNOMELT®

PA 641TECHNOMELT®

PA 646TECHNOMELT®

PA 5735HYSOLUS1151

HYSOLES1301

HYSOLES1002

HYSOL STYCAST2651MM

(Catalyst 9 or 23LV)

LOCTITE®

5140HYSOL

EO 7038

HYSO ECCOCOAT

UV 7993

TECHNOMELT®

PA 682TECHNOMELT®

PA 687TECHNOMELT®

PA 652TECHNOMELT®

PA 657HYSOLUS1750

HYSOLES2202

HYSOLES1900

HYSOL STYCAST2850FT


LOCTITE®

5945

HYSOLUS2050

HYSOLSTYCAST2651-40

HYSOLES1901

HYSOL STYCAST2850KT


HYSOLUS2350

HYSOL STYCAST2651MM

(Catalyst 11)

HYSOLES2207

HYSOLUS2650

HYSOL STYCAST2850FT

(Catalyst 11)

HYSOLUS2651

HYSOL STYCAST2850KT

(Catalyst 11)

HYSOLSTYCAST

U2500


Henkel’s renowned TECHNOMELT® low pressure molding solution is delivering superior sealing adhesion and excellent temperature and solvent resistance. The simplicity of these materials is their advantage: because the entire TECHNOMELT® operation takes place at low pressure, cycle time is short, and fine or fragile circuitry is not damaged, delivering measurable improvements over that of traditional potting or encapsulating processes. PCB and circuitry protection is essential in modern, challenging applications; and Henkel delivers manufacturers proven, reliable solutions and peace of mind.

what iS technomelt® ?An innovative technology to serve the increasing demands for circuit board protection in the electronics market. Its low pressure and high speeds are suitable for sensitive electronic components in manufacturing environments. The technology allows for unique design beyond the form / fit / function of traditional encapsulating materials.

aPPlicationS• Automotive Sensors

• Switches

• Engine Control Units

• Lighting Display Boards

• Micro-Inverters

• Power Regulators

• Industrial Sensors

• Medical Sensors


low PreSSure moldinG

technomelt® circuit Board Protection ProductS

Polyamide: hiGh temPerature reSiStance

PRODUCTFORMER

NAMEDESCRIPTION COLOR

PERFORMANCE TEMPERATURE

SHOREAHARDNESS

SOFTENINGPOINT

TECHNOMELT® PA 673

MACROMELT OM 673 Moldable polyamide with good adhesion for

higher temperature applications, such as in an automotive under-hood.

Amber

-40°C TO 140°C 90 187°C ± 5°CTECHNOMELT®

PA 678MACROMELT

OM 678Black

TECHNOMELT® PA 682

MACROMELT OM 682

Moldable polyamide for the most demanding high humidity applications, such as on the

inside of an automobile tire. Formulated for very low water vapor transmission.

Amber


PA 687MACROMELT

OM 687Black

Polyamide: adheSion to PlaSticS

PRODUCTFORMER



SHOREAHARDNESS

SOFTENINGPOINT

TECHNOMELT® PA 633

MACROMELT OM 633 Moldable polyamide with service temperature

up to 130°C, such as in an automotive firewall.

Amber


PA 638MACROMELT

OM 638Black

TECHNOMELT®

PA 652MACROMELT

OM 652Moldable polyamide, where excellent adhesion and cold temperature flexibility are important, such as in an automotive exterior. Also used extensively in white goods.

Amber


PA 657MACROMELT

OM 657Black

Polyamide: increaSed hardneSS

PRODUCTFORMER



SHOREAHARDNESS

SOFTENINGPOINT

TECHNOMELT® PA 341

MACROMELT OM 341

High performance thermoplastic polyamide designed to offer safety blaze orange color for easy identification of components. Typically used to encapsulate high voltage modules.

Safety Blaze Orange -25°C TO 125°C 92 173°C ± 5°C

TECHNOMELT® PA 641

MACROMELT OM 641 Moldable polyamide, where strength and

hardness are needed, such as in memory sticks and computer connectors.

Amber

-40°C TO 130°C 92 175°C ± 5°C

TECHNOMELT® PA 646

MACROMELT OM 646

Black

PolyoleFin: excellent adheSion to metalS, PlaSticS, touGh SurFaceS

PRODUCTFORMER



SHOREAHARDNESS

SOFTENINGPOINT

TECHNOMELT® AS 5735

MACROMELT MM Q-5375

Moldable polyolefin for demanding moisture and solvent resistance. Excellent adhesion to the most difficult substrates. Compatible with a secondary overmold with a harder polyamide.

Opaque White -30°C TO 100°C 55 139°C ± 5°C



urethaneS – two-comPonent room temPerature cure

PRODUCT DESCRIPTION MIx RATIO BYWEIGHT COLOR

RECOMMENDEDCURE

SCHEDULE

ALTERNATE CURE CYCLE

VISCOSITY mPa.s(cP)

POT LIFE AT 25°C HARDNESS

THERMALCONDUCTIVITY

W/M*C

FLAMMABILITYRATING

TEMPERATURE RANGE

SHELF LIFE

HYSOL US1150

Extended polybutadiene/MDI base, mineral filled, medium hardness, ambient cure urethane encapsulant/sealant. This material can be used for potting electronics or devices for protection against environmental hazards.

21:100 Black 24 to 48 hours @ 25°C

2 to 4 hours @ 60°C 3,500

40 to 60

minutes60A 0.486 94V-0 -65°C

to 125°C12

months

HYSOL US1151

Low viscosity, reenterable potting and encapsulation compound. It has excellent low temperature properties. It can be used to encapsulate electronics for various applications including under-the-hood automotive and marine.

12.8:100 Black 24 hours @ 25°C

2 to 4 hours @ 60°C 1,000

45 to 60

minutes30A/7800 0.18 None -65°C

to 125°C12

months

HYSOL US1750

Elastomeric polyurethane, is a water white, clear, medical grade, fast gel potting material. It is ideal for blood heat exchanger, dialyzer and oxygenerator units.

50.5:49.5Water white clear

16 hours @ 25°C

1 hour @ 60°C 510 5 minutes 78A 0.19 None -40°C

to 125°C12

months

HYSOL US2050

Quick set, optically clear polyurethane compound that exhibits excellent ultraviolet resistance. The excellent electrical properties also suggest its use for electrical and electronic component encapsulation.

100:55 Clear 48 hours @ 25°C

2 hours @ 60°C 1,200 4 minutes 90A 0.18 None -40°C

to 125°C12

months

HYSOL US2350

Flexible, flame retardant, mineral filled, polyurethane compound. This potting compound has long pot life, and is low viscosity so it flows well and adheres to many substrates.

21.2:100 Black 24 hours @ 25°C

2 hours @ 60°C 2,400 45

minutes 85A 0.51 94V-0 -65°C to 125°C

12 months

HYSOL US2650

Inexpensive, low viscosity, flexible, flame retardant, castor oil/MDI-based urethane potting/encapsulating compound. This material was designed for potting indoor and outdoor telephone connector blocks. It is suitable for potting and encapsulating other electronic or electrical devices or assemblies.

21.2:100 Tan 16 hours @ 25°C

1 hour @ 60°C 3,500 19.5

minutes 83A 0.47 94V-0 -65°C to 125°C

12 months

HYSOL US2651

Unfilled, low viscosity, reenterable potting and encapsulation compound. It can be used to encapsulate electronics for automotive applications including under the hood.

52.3:47.7 Clear amber

16 hours @ 25°C

1 hour @ 65°C 1,000 10 minutes 6000 0.18 None -65°C

to 125°C12

months

HYSOL STYCAST U2500

Encapsulant designed for transformer, PCBs and other insulation applications. Allows complete impregnation of either small slightly wound coils or large castings.

100:7 Amber 24 hours @ 25°C

4 hours @ 60°C 6,000 2 hours 72A 0.5 None -40°C

to 125°C 6 months

PottinG


ePoxieS – two-comPonent heat cure

PRODUCT DESCRIPTIONMIx RATIO BYWEIGHT

COLORRECOMMENDEDCURESCHEDULE

ALTERNATE CURECYCLE

VISCOSITY mPa.s(cP)

POT LIFE AT 25°C

HARDNESSTHERMAL

CONDUCTIVITYW/M*C

FLAMMABILITYRATING

TEMPERATURE RANGE

SHELF LIFE

HYSOL ES1004

Casting compound formulated to meet the needs for flame-out, easily handled casting systems. The cured system is nonburning of self-extinguishing according to ASTM D 635 and meets UL requirements for 94V-0.

100:13 Black2 hours @ 80°C

plus 2 hours @ 150°C

None 26,000 8 hours 88D 0.6 94V-0-40°C

to 150°C12

months

HYSOL ES1301

Silica filled epoxy casting system recommended for coils, transformers, and general purpose casting.

100:38 Black4 hours @ 110°C

2 hours @ 125°C

1,600 > 8 hours 90D 0.42 None-40°C

to 150°C12

months

HYSOL ES2202

Unfilled epoxy system with a high operating temperature and long pot life. Recommended for servo stators, high temperature resistors, transformers, and high temperature cast shapes.

100:25Clear/Amber

2 hours @ 80°C plus 2 hours

@ 150°CNone 8,000 8 hours 85D 0.2 None

-40°C to 180°C

12 months

HYSOL STYCAST 2651-40

Two-component, easy to use, low viscosity, epoxy encapsulant with excellent adhesion to metals, plastics and ceramics.

100:10.5 Black60 minutes

@ 120°C

Gel @ 75°C plus 2 hours @ 105°C

5,000 4 hours 85D 0.5 None-75°C

to 175°C12

months

HYSOL STYCAST 2651MM (Catalyst 11)

Filled, low viscosity, general purpose, epoxy encapsulant which requires low viscosity and low abrasion. It is especially useful for machine dispensing and for parts that require post molding machining.


@ 120°C

4 hours @ 100°C or 16 hours

@ 85°C13,000 > 4 hours 89D 0.6 None

-55°C to 155°C

12 months

HYSOL STYCAST 2850FT (Catalyst 11)

Two-component, thermally conductive epoxy encapsulant that can be used with a variety of catalysts. Used in the encapsulation of components which need heat dissipation and thermal shock properties.


@ 120°C


@ 85°C64,000 > 4 hours 96D 1.28 None

-55°C to 155°C

12 months

HYSOL STYCAST 2850KT (Catalyst 11)

Two-component, thermally conductive epoxy encapsulant designed for replacement for heat sinks in nonintegrated electrical components and assemblies.


@ 120°C


@ 85°C125,000 > 4 hours 95D 2.78 None

-55°C to 155°C

12 months


PottinG


SiliconeS

PRODUCT DESCRIPTION CURETYPE

LOCTITE® 5092Used for potting, coating and sealing ofvarious automotive, electronic, military and industrialcomponents.

uv

LOCTITE® 5140

Is used for potting, coating and sealing ofvarious automotive, electronic, military and industrialcomponents. LOCTITE® 5140™ resists weathering, moisture,ozone and retains its properities through severe environments.This product is typically used in applications up to 200 °C.

Room temperature vulcanizing

LOCTITE® 5954

Typical applications include stamped sheet metal covers(timing covers and oil sumps) where good oil resistance andthe ability to withstand high joint-movement is required.It withstands on line, low pressure tests carried out beforeproduct begins to cure. In addition, LOCTITE® 5945™ is a slowskinning material to provide for longer “open times”.

Room temperature vulcanizing

one-comPonent

PRODUCT DESCRIPTIONCURE TYPE

RECOMMENDEDCURESCHEDULE

VISCOSITYMPA.S(cP)

CTE(ppm/°C)

TG(°C)%

FILLERPOT LIFEAT25°C

STORAGETEMP

HYSOL EO 1058

Provides excellent environmental and thermalprotection to encapsulated parts. This product is especiallysuited for use in protecting sensors used in harshenvironments such as automotive applications.

Heat cure

2 hours @ 140 °C 3 hours @ 125 °C

50,000 24 140 62 10 days @ 25°C @ -40 °C

HYSOL EO 7038

One component epoxy potting system, formulated toprotect sensors used in harsh environments, such asautomotive applications.

Heat3 hours @ 130°C2 hours @ 140°C

40,000 30 173 75 3 days @ 25°C -20 °C

ePoxieS – two-comPonent room temPerature cure

PRODUCT DESCRIPTION

MIx RATIO BY

WEIGHT

COLOR RECOMMENDEDCURESCHEDULE

ALTERNATE CURECYCLE

VISCOSITY mPa.s(cP)

POT LIFE AT 25°C HARDNESS

THERMALCONDUCTIVITY

W/M*C

FLAMMABILITYRATING

TEMPERATURE RANGE

SHELF LIFE

HYSOL ES1000

Two-component, long pot life, casting system. This low cost, flexible system is filled with a nonabrasive filler for machine metering/dispensing. Good thermal shock resistance and low exotherm, making it suitable for encapsulation of various components and modules.

100:90 Black 36 hours @ 25°C

3 hours @ 60°C 25,000 180

minutes 75D 0.42 94HB -25°C to 105°C

12 months

HYSOL ES1002

Two-component casting system with excellent handling properties. This low cost, flexible system is filled with a nonabrasive filler for machine metering/dispensing or regular hand mixer applications.

100:100 Black 36 hours @ 25°C

3 hours @ 60°C 19,500 60

minutes 88D 0.644 94V-0 -25°C to 105°C

12 months

HYSOL ES1900

Transparent, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications where clarity and excellent structural, mechanical and electrical properties are required.

100:46 Clear 24 hours @ 25°C

2 hours @ 65°C 6,000 10 minutes 90D 0.2 None -60°C

to 125°C12

months

HYSOL ES1901

Fast-setting, toughened, medium viscosity, industrial grade epoxy adhesive. Ideal for bonding plastic, metal, glass, wood, ceramic, rubber, and masonry materials where flexibility is needed. Designed for a variety of applications such as flex circuits, cable boots, and staking fillet bonds.

100:105 Clear 24 hours @ 25°C

1 hour @ 65°C 2,400 3 minutes 55D 0.2 None -40°C

to 105°C12

months

HYSOL ES2207

Filled, resilient, low viscosity, room temperature cure epoxy potting compound. This material has excellent adhesion to many substrates, and has good surface appearance.

100:15.8 Black 24 hours @ 25°C

2 hours @ 65°C 8,800 90

minutes 75D 0.4 94V-0 -40°C to 125°C

12 months

HYSOL ES2500

Resilient, low cost, fast gelling, potting compound. Designed for easy 2 to 1 meter-mix-dispense machinery and low abrasion. This material is ideal for potting and encapsulating high volume parts.

100:29.5 Black 16 hours @ 25°C

1 hour @ 65°C 1,500 10 minutes 70D 0.288 94HB -40°C

to 105°C12

months

HYSOL STYCAST 2651MM (Catalyst 9 or 23LV)

Filled, low viscosity, general purpose, epoxy encapsulant which requires low viscosity and low abrasion. It is especially useful for machine dispensing and for parts that require post molding machining.

100:7 Black 24 hours @ 25°C


to 130°C12

months

HYSOL STYCAST 2850FT (Catalyst 9 or 23LV)

Two-component, thermally conductive epoxy encapsulant that can be used with a variety of catalysts. Used in the encapsulation of components which need heat dissipation and thermal shock properties.

100:3.5 Black 24 hours @ 25°C


to 130°C12

months

HYSOL STYCAST 2850KT (Catalyst 9 or 23LV)

Two-component, thermally conductive epoxy encapsulant designed for replacement for heat sinks in nonintegrated electrical components and assemblies.

100:2.0 Black 24 hours @ 25°C


to 130°C12

months


conFormal coatinGS

acrylicS

PRODUCT DESCRIPTION CURESCHEDULES VISCOSITYmPa.s(cP)OPERATING

TEMPERATURERANGE

HYSOL PC62

Conformal coating that provides environmental and mechanical protection. Toluene-free alternative with superior toughness and abrasion resistance.

45 minutes @ 75°C 50 -40°C to 125°C

urethane acrylateS


TEMPERATURERANGE

HYSOL PC40-UMSolvent-free, low viscosity, rapid gel, UV-moisture cure, one-component conformal coating.

30 seconds UV + 3 days @ RT

500 -40°C to 135°C

urethaneS


TEMPERATURERANGE

HYSOL PC18MFlexible, one-component, solvent-based urethane coating that may be cured at room temperature. Meets MIL-I-46058C.

2 hours @ 60°C 350 -40°C to 110°C

HYSOL ECCOCOAT UV7993

Conformal coating designed to provide rugged protection from moisture and harsh chemicals. It is compatible with industry standard solder masks, no-clean fluxes, metalization, components and substrate materials.

50 hours @ 25°Cat > 70% humidity

120 -40°C to 105°C

SiliconeS


TEMPERATURERANGE

HYSOL ECCOCOAT SC3613

One-component, protective coating engineered to meet high reliability performance requirements for the optoelectronic/semiconductor industry. It minimizes alpha particle interactions with sensitive circuitry.

< 5 minutes @ 175°C 3,500 -40°C to 200°C

GaSKetS

PRODUCT DESCRIPTION CURESCHEDULES CHEMISTRYVISCOSITYmPa.s

(cP)SHOREAHARDNESS

LOCTITE® NUVA-SIL 5089

Used for gasketing and sealing applications. Upon exposure to sufficient UV light and/or atmospheric moisture, this product cures to form a durable, flexible rubber sealant. Typical applications include gasketing/sealing of enclosures that require a rapid curing, post-applied sealant that facilitates immediate on-part inspection.

60 seconds UV + 3 days @ RT

Alkoxy Silicone 100,000 > 25

SealantS

PRODUCT DESCRIPTION CURESCHEDULES CHEMISTRYVISCOSITYmPa.s

(cP)SHOREAHARDNESS

LOCTITE® 5210

One-component, ultra-fast-curing, non-corrosive RTV silicone designed for potting, wire tacking, selective sealing, vibration dampening and repair/rework applications on PCBs. Suited for high-volume manufacturing and is particularly effective for automotive electronics applications or other harsh environments. Fast surface cure allows material to be handled quickly after dispensing.

24 hours @ 25 °C Alkoxy Silicone N/A 48

GaSKetinG & SealantS


PRINTEDINKS


Printed inKS

TRANSPARENT CONDUCTIVEINKS

SILVERINKSBLENDABLERESISTIVE

INKSDIELECTRICINKS

LOCTITE® ECI 5000 E&C SeriesLOCTITE®

M 4100 E&C LOCTITE® M 2010 RS

MOD2 E &CLOCTITE® EDAG

1020A E&C

LOCTITE® EDAG PM 460A E&C

LOCTITE®

M 2012 RS MOD2 E&C

LOCTITE® EDAG PF 455B E&C

LOCTITE® ECI 1004 E&CLOCTITE®

M 2013 RS MOD2 E&C

LOCTITE® M 7000 A BLU E&C

LOCTITE® M 2014 RS MOD2 E&C


tranSParent conductiVe inKSPRODUCT DESCRIPTION APPLICATION

VOLUMERESISTIVITY (Ohm/sq/mil)

CHEMISTRY(UV/SOLVENT/WATER-BASED)

LOCTITE® ECI 5000 E&C Series

Highly-conductive, screen-printable ink.Very low resistance with good transparency

Displays - Touch screens <60-200 Solvent

SilVer inKSPRODUCT DESCRIPTION APPLICATION



LOCTITE® M 4100 E&C

Thermoset conductive ink designed for potentiometers or rigid board applications.

Automotive - Rigid circuits, LED attach <0.040 Solvent

LOCTITE® EDAG PM 460A E&C

Fast - drying silver ink for flexographic or rotogravure printing. For fast-speed web printing.

RFID - High-volume silver ink applicationsAutomotive

<0.010 Solvent

LOCTITE® ECI 1004 E&C

Halogen-free, silver-filled, printable ink with fine line printing capabilities.

Displays - Touch screens <0.030 Solvent

BlendaBle reSiStiVe inKSPRODUCT DESCRIPTION APPLICATION




Thermoset, screen-printable, rigid-silver/carbon-blended ink, blendable for specific resistance targets.

Automotive - Printed potentiometers, resistors, heaters, tribological application

10 Ohms/sq/mil ± 15% Solvent


Screen - printable, thermoset, rigid carbon ink, blendable for specific resistance targets.

Automotive - Printed potentiometers, resistors, heaters, tribological applications









10,000 Ohms/sq/mil ± 15% Solvent




100,000 Ohms/sq/mil ± 15%

Solvent

dielectric inKSPRODUCT DESCRIPTION APPLICATION



LOCTITE® EDAG 1020A E&C

Screen - printable, UV-curable, dielectric ink for plastic film and paper substrates. Good flexibility and humidity resistance.

Consumer - Flexible circuits, desktop keyboards, notebook keyboards Automotive

<2 x 109 UV

LOCTITE® EDAG PF 455B E&C

Screen - printable, UV-curable, dielectric ink For plastic film. Excellent humidity resistance.

RFID - Flexible circuitsConsumer - Printed electronic circuitryAutomotive

<2 x 109 UV

LOCTITE® M 7000 A BLU E&C

Screen - printable, solvent-based dielectric Ink for rigid substrates.

Automotive - Compatible with M 2000 E&C series inks. Rigid circuits, LED attach

<2 x 109 Solvent


THERMALMANAGEMENTMATERIALS


thermal manaGement materialS

ADHESIVEPASTES

PHASE-CHANGE MATERIALS

THERMALGREASES

LOCTITE® ABLESTIK TE3530

LOCTITE® EIF 1000

LOCTITE®

TCP 8175M1

LOCTITE®

5404LOCTITE®

PSX 8LOCTITE®

NSWC 100

LOCTITE® PSX4000 SERIES

(D, PM, PE, LV)

LOCTITE®

TC 4

LOCTITE® ECF 1000

LOCTITE®

TC 8M

LOCTITE® TCF 1000

LOCTITE®

TG 100

adheSiVe PaSteS

PRODUCT DESCRIPTION

MILSTANDARD883,METHOD

5011 APPROVED

NASA OUTGASSINGASTM E 595-77/84/90APPROVED

CURETYPECURE

SCHEDULESVISCOSITY

(cPs)

THERMALCONDUCTIVITY

(W/mK)

VOLUME RESISTIVITY(OHM.CM)

SHELFLIFE

LOCTITE® ABLESTIK TE3530

One-component, low temperature curing, thermally conductive epoxy adhesive.

_ _ Heat 30 min. @ 100°C 60,000 2.3 1.0 x 1015 6 months @ -18°C to -25°C

LOCTITE® 5404

Self-shimming, flexible silicone adhesive for high temperature resistant applications such as ceramic boards.

_ _ Heat 10 min. @ 150°C Paste 1.0 2.9 x 1014 5 months @ 5°C

PhaSe-chanGe materialS

PRODUCT DESCRIPTION

THERMAL IMPEDANCE(°C-in.2/W@80psi)

THERMALIMPEDANCE(°C-IN.2/W@ 550 kPa)

THERMALCONDUCTIVITY

(W/mK)

PHASE CHANGE

TEMP. (°C)

VOLUME RESISTIVITY (OHM.CM)

DIELECTRIC STRENGTH

(V/MIL)THICKNESS (IN.)

LOCTITE® EIF 1000

Industry-standard electrically insulating phase change material.

0.12 0.78 0.45 60 N/A4,500

minimum0.002-0.006

LOCTITE® PSX 8

Unsupported film with superior thermal performance even at low pressure. Direct attach to heat sink at room temperature without adhesive.

0.003 0.022 3.4 45 N/A N/A 0.008

LOCTITE® PSX4000 SERIES(D, PM, PE, LV)

Repeatable phase change thermal interface material. Supplied as a paste that can be stenciled, needle dispensed, screen printed, or applied manually onto a heat sink, baseplate or other surfaces.

0.003 0.022 3.4 45 N/A N/A 0.0005-0.010+

LOCTITE® ECF 1000

Excellent thermal performance particularly at higher pressures. Typically used on RF devices and SCRs where electrical conductivity is required (silver filled).

0.003 0.022 3.14 51 2 N/A 0.004

LOCTITE® TCF 1000

Industry-standard, phase change thermal interface material. Suitable for power IGBTs, semiconductors, DCDC converters and other electrically isolated packages.

0.022 0.143 1 60 1.0 x 1012 N/A 0.0025-0.008

thermal GreaSeS

PRODUCT DESCRIPTIONTHERMAL

CONDUCTIVITY(W/mK)VOLUMERESISTIVITY

(OHM.CM)DIELECTRICSTRENGTH

(V/MIL)THICKNESS (IN.)

LOCTITE® TCP 8175M1High thermal conductivity, high temperature stability, high thixo (or non-sag), electrically insulating, self-shimming silicone thermal grease.

2.3 1.00E+15 480 7 mils spacers

LOCTITE® NSWC 100 Non-silicone, water-cleanable thermal compound. 1.4 1.9 x 1015 250 minimum 0.0005 to 0.010+

LOCTITE® TC 4Thermally conductive, high temperature silicone thermal grease.

1.5 1 x 1013 500 0.0005 to 0.010+

LOCTITE® TC 8M High thermal conductivity, high temperature thermal grease. 2.3 1 x 1013 500 0.0005 to 0.010+

LOCTITE® TG 100 Ultra-high performance thermal grease. 3.4 N/A N/A 0.0005 to 0.010+


ASSEMBLYADHESIVES


aSSemBly adheSiVeS

PaSteS FilmS

ElectricallyConductive ElectricallyConductive

ABLESTIKABLEBOND 84-1 LMISR4

HYSOL ECCOBONDCE3103WLV

HYSOL CF3550

ABLESTIKICP-3535M1

HYSOL ECCOBONDCE3520-3

ABLESTIKICP-4001

HYSOL ECCOBONDCE8500

LOCTITE® 3880

adheSiVeS PaSteS - electrically conductiVe

PRODUCT DESCRIPTION CURETYPE CURESCHEDULESVISCOSITY mPa.s(cP)

VOLUME RESISTIVITY(OHM,CM)

SHELFLIFE POT LIFE

ABLESTIK ABLEBOND 84-1LMISR4

Electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. Excellent dispensability, minimal tailing and stringing.

Heat 1 hour @ 175°C 8,000 0.000112 months @ -40°C

–

ABLESTIK ICP-3535M1

Recommended for mounting lower cost tin (Sn) finished components onto the conductive trace terminations of printed circuit boards or co-fired ceramic circuitry. Designed for a pplications with small size components, where no bleeding or wicking is tolerated. Applied by stencil printing.

Heat1 hour @ 150°C or

10 minutes @ 175°C80,000 0.004

6 months @ -40°C

–

ABLESTIK ICP-4001

Silicone paste specifically designed for applications where a high degree of flexibility is required.

Heat 35 minutes @ 140°C 40,000 0.00045 months @ -40°C

24 hours @ 25°C

HYSOL ECCOBOND CE3103WLV

Electrically conductive adhesive for thin film PV assembly with superior contact resistance stability. Low viscosity for fine line dispensing.

Heat10 minutes @

120°C or 3 minutes @ 150°C

15,000 to 25,000

0.000812 months @ -40°C

3 days @ 25°C

HYSOL ECCOBOND CE3520-3

Electrically conductive adhesive combines a high elasticity with a good adhesion on a variety of surfaces, making it suitable for applications with mismatched CTE. Used on substrate attach and heat sink bonding.

Heat60 minutes @

120°C or 30 minutes @ 150°C

73,000 0.026 months @ -18 to

-25°C

3 days @ 18°C to

25°C

HYSOL ECCOBOND CE8500

One-component, solventless, electrically conductive, low stress adhesive for mismatched CTE applications.

Heat

90 minutes @ 120°C or

40 minutes @150°C or

15 minutes @ 175°C

120,000 to 140,000

0.00024 months @ -25°C to

-18°C–

LOCTITE® 3880

Electrically conductive adhesive for bonding of metals, ceramics, rubbers and plastics with superior adhesion, electrical and thermal conductivity.

Heat10 minutes @ 125 °C 6 minutes @ 150°C 3 minutes @ 175°C

50,000 to 130,000

0.0086 months

@ 0°C–

adheSiVeS FilmS - electrically conductiVe

PRODUCT DESCRIPTION

TENSILE STRENGTH,LAPSHEAR

(PSI)

THERMALCONDUCTIVITY

(W/mK)

VOLUME RESISTIVITY (OHM.CM)

PRIMARYCURE CYCLE

STORAGELIFE

FILM THICKNESSAVAILABLE(MILS)

HYSOL CF3350

For electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance.

3,400 7 0.000230 minutes

@ 150°C9 months @

5ºC2 or 4 mils (±0.5 mils)


SOLDERMATERIALS

Solder materialS

HIGH-RELIABILITY

ALLOY

HIGH-RELIABILITYPASTES

LIqUIDFLUxES COREWIRES

90ISCHalogen-

FreeHalide-

FreeVOC-Free

Halogen-Free

No-CleanHalogen

-Free

No-CleanHalide-Free

WaterWash

Halogen-Free

No-CleanWaterWash

LOCTITE® MULTICORE

HF 200

LOCTITE® MULTICORE

LF 318

LOCTITE®

MULTICOREM 300

LOCTITE®

MULTICOREMF 390HR

LOCTITE®

MULTICOREMF 210

LOCTITE®

MULTICOREHydro X20

LOCTITE®

MULTICOREC 400

LOCTITE®

MULTICOREC 502

LOCTITE®

MULTICOREHydro X

LOCTITE® MULTICORE

HF 212

LOCTITE®

MULTICOREMFR 301

LOCTITE®

MULTICOREC 511

LOCTITE® MULTICOREHF 250DP

FAILUREMECHANISMS HIGH-RELIABILITYALLOYSvs.TRADITIONALALLOYS[1][2][3]

Thermal Cycling

• Thermal cycling causes stress to build within the soldered assembly• Stress relief mechanism is crack propagation through the solder joint• 90iSC alloy gives reduced electrical failures in comparison to SnPb in both -40ºC+150ºC and -40ºC+125ºC• Under -40ºC+150ºC, 90iSC has similar electrical failure levels to SnPb at -40ºC+125ºC

Thermal Shock• Thermal shock testing is a more extreme version of thermal cycling• Failure mechanism is the same as thermal cycling, but failure occurs earlier• 90iSC alloy has outperformed SnPb and SAC alloys in thermal shock testing

Vibration• 20% of airborne failures are attributed to vibrational stress[4]

• SAC alloys have been shown to fail more frequently than SnPb alloys• 90iSC alloy returns the failure resistance performance back to SnPb standards

Drop Test

• Drop test resistance should not be compromised • 90iSC has reduced ductility over standard alloys • 90iSC alloy gives similar results to standard SAC with same failure mode• Failure mechanism is crack propagation along the intermetallic

Creep• Creep resistance at a specified temperature is directly linked to thermal cycle failure• 90iSC alloy has a similar plastic strain constant at 150ºC when compared to SnPb at 80ºC

[1] Lead-free Solders for High-Reliability Applications: High-cycle Fatigue Studies, Barry N., University of Birmingham, 2008[2] Live project seminar, Ratchev R., Berlin 2008[3] Fraunhofer[4] Designing Electronics for High Vibration and Shock, Dave S. Steinberg, Steinberg & Associates

hiGh-reliaBility alloyAbreakthroughinsolderalloydevelopment,Henkel’shighlyreliable,lead-freesolderalloy,90iSC,providessuperiorthermalcycling,thermalshock,vibrationandcreepresistancewhilemaintainingsolderabilityandvoidlevelsovertraditionalSACandSnPbsolder.Developedwithandgloballyacceptedbytheautomotiveindustry,90iSCistheworld’sleadinglead-free,RoHS-compliantsolderalloy.

Automotive Electronic | 2423 | Automotive Electronic

hiGh-reliaBility Solder PaSteS90iSChasexceptionalperformanceinhigh-reliabilityapplications.Itiscompatiblewithseverallead-freeandhalogen-freefluxsystems,ensuringadaptabilityforcustomizedmanufacturingrequirements.ThealloyiseasilyintegratedintoLOCTITE®MULTICOREHF200,LOCTITE®MULTICOREHF212,LOCTITE®MULTICOREHF250DPandLOCTITE® MULTICORE LF318fluxtechnologies.

FLUx TECHNOLOGY

ELECTRONICS ASSEMBLY MARKET

ROHSCOMPLIANT APPLICATION

HighReliability Pb-free

SolderAlloy(90iSC)

Industry Pb-freeStandardSolderAlloy(SAC305)

Printing Dispensing

Halogen-Free

LOCTITE® MULTICORE

HF 200

Handheldcomputing • • •

LOCTITE® MULTICORE

HF 212AppliancesAerospace

AutomotiveMedicalLightingDisplays

SolarWireless Datacom

Infrastructure

• • •

LOCTITE® MULTICOREHF 250DP*

• • •

Halide-FreeLOCTITE®

MULTICORE LF 318

• • • •

haloGen-Free

PRODUCT DESCRIPTION ALLOYMETAL

LOADING (%WEIGHT)

PARTICLE SIZE DISTRIBUTION

IPCTACK(g/mm2)

APPLICATIONIPC/J-STD-004B CLASSIFICATION

LOCTITE® MULTICORE HF 200

A halogen-free, no clean, high tack, low voiding Pb-free solder paste. Suitable for high-speed printing demands. Designed for small-medium size boards. Excellent abandon time and stencil work-life. Excellent fine pitch coalescence. Exceptional solderability in both air and nitrogen across a wide range of challenging surface finishes including OSP copper.

90iSC (Hi-Rel)** 96SC (SAC387) 97SC (SAC305)

88.5AGS (type 3)DAP (type 4)

DAP+ (type 4.5)2.7

Printing 50 -140mms-1 ROL0

LOCTITE® MULTICORE HF 212

A halogen-free, no clean, high tack, low voiding Pb-free solder paste. Designed for medium-large size boards. Excellent abandon time and stencil work-life. Excellent fine pitch coalescence. Exceptional solderability in both air and nitrogen across a wide range of challenging surface finishes including OSP copper. Optimized for long soak reflow.

90iSC (Hi-Rel)** 97SC (SAC305)

88.5AGS (type 3)DAP (type 4)

3.0Printing

40 -120mms-1 ROL0

LOCTITE® MULTICORE HF 250DP

A halogen-free, no clean, type 5, low voiding Pb-free solder dispensing paste. A dispensing solution for all halogen-free requirements.

96SC (SAC387) 84 KBP (type 5) 0.8Dispensing Gauge 23-27

ROL0

halide-Free

PRODUCT DESCRIPTION ALLOYMETAL

LOADING (%WEIGHT)

PARTICLE SIZE DISTRIBUTION

IPCTACK(g/mm2)

APPLICATIONIPC/J-STD-004B CLASSIFICATION

LOCTITE® MULTICORE LF 318

A halide-free, no-clean, Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing. Ability to resist component movement during high-speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and nitrogen reflow ovens and across a wide range of surface finishes.

90iSC (Hi-Rel)** 96SC (SAC387) 97SC (SAC305)

88.584

AGS (type 3) 1.8

Printing 25-150mms-1 DispensingGauge 23

ROL0

* All Electronics Assembly Market** High Reliability.


liquid FluxeSHenkel’sliquidfluxformulationsdeliversolutionsformultiplewavesolderingprocessesaswellasforreworkandtechnologybuildprocessessuchaslasersoldering.No-clean,low-residue,VOC-freeandhalogen-freefluxesareallpartofacomprehensivefluxportfoliodesignedtoaccommodatevaryingrequirements.

cored wireSHenkel’sLOCTITE®MULTICOREbrandcoredwireutilizesaward-winningmultiplefluxcoretechnologytodeliverevenfluxdistributionthroughoutthesolderwire.Thefast-wettingmaterialoffersexcellentsolderjointreliabilityandisavailableintraditionaltin-lead,lead-freeandhalogen-freeformulations.

PRODUCT DESCRIPTIONSOLID

CONTENT(%)ACIDVALUE (mgKOH/g)

APPLICATIONIPC/J-STD-004BCLASSIFICATION

Voc-Free haloGen-FreeLOCTITE® MULTICORE MF 300

General purpose, VOC-free (water-based), no-clean, halogen-free and resin-free flux with special formulation to minimize solder balling. Compatible with lead-free processes.

4.6 37 Spray/Foam ORM0

no-clean haloGen-FreeLOCTITE® MULTICORE MF 390HR

Halogen-free, liquid flux designed for exceptional through-hole fill and recommended for automotive electronics and general electrical soldering applications.

6.0 20-25 Spray/Foam ROL0

no-clean halide-Free

LOCTITE® MULTICORE MF 210

No clean, resin-free, halide-free liquid flux designed for surfaces with poor solderability. Recommended for consumer electronics and general electrical soldering applications, particularly where high throughput is desirable.

2.9 22.5 Spray/Foam ORM0

LOCTITE® MULTICORE MFR 301

Higher solids, halide-free flux for better wetting on reduced solderability surfaces and to minimize bridging on complex geometries. Fully Pb-free and dual wave compatible. Solvent-based flux may be thinned with IPA.

6.0 40 Spray/Foam ROM0

water waSh

PRODUCT DESCRIPTIONSOLID

CONTENT(%)ACIDVALUE (mgKOH/g)

APPLICATIONIPC/J-STD-004BCLASSIFICATION

LOCTITE® MULTICORE Hydro X20

Water soluble flux is formulated for use on electronic assemblies designe d for water cleaning. Hydro X20 will solder copper, assemblies-designed, nickel and mild steel efficiently.

2.0 24 Spray/Foam ORH1

PRODUCT DESCRIPTIONFLUx CONTENTAPPROxIMATE (%BYWEIGHT)

ALLOY (SnPb)

ALLOY (Pb-Free)

IPC/J-STD-004BCLASSIFICATION

haloGen-FreeLOCTITE® MULTICORE C 400

Halogen-free, no-clean, clear residue, cored solder wire with increased flux content for improved wetting on challenging surfaces.

2.2Sn60Sn62Sn63

96SC (SAC387)97SC (SAC305)

99C (SnCu)ROL0

no-cleanLOCTITE® MULTICORE C 502

No-clean, clear residue, cored solder wire with medium activity flux with good wetting on difficult substrates.

2.7Sn60Sn62Sn63

96SC (SAC387)97SC (SAC305)

99C (SnCu)ROM1

LOCTITE® MULTICORE C 511

No-clean, amber residue, heat stable cored solder wire. Good wetting on difficult substrates.

2.7Sn60Sn62Sn63

96SC (SAC387)97SC (SAC305)

99C (SnCu)ROM1

water waShLOCTITE® MULTICORE Hydro X

High activity, water washable, flux-cored solder wire with excellent wetting on difficult substrates.

2.0Sn60Sn62Sn63

96SC (SAC387)97SC (SAC305)

99C (SnCu)ORH1



CHIPONBOARD(COB)ENCAPSULANTS

GloB toPS - uV cure

PRODUCT DESCRIPTION CURETYPERECOMMENDED CURESCHEDULES

VISCOSITYmPa.s(cP)

Tg(ºC) POT LIFE STORAGETEMP.

UV 9052

One component, dual cure (UV & moisture) adhesive designed as an encapsulant for sensitive electronic components. XUV 9052 has excellent resistance to a variety of chemicals and fluids, making it ideal for encapsulating components that may be exposed to moisture, automotive fluids and/or harsh chemicals.

UV/Moisture

300 W/in, 5-10 ss,

0.5-1 Joules (medium pressure

mercury vapor lamp)

4,1000 6424 hours @ 25°C

-20ºC

UV 9060F

One component, dual cure (UV & moisture) adhesive designed as an encapsulant for sensitive electroniccomponents. UV 9060F has excellent resistance to a variety of chemicals and fluids, and contains a fluorescent tracer for easy identification under UV black light.

UV/moisture300 W/in,

5-25 ss11,000 75 - 5°C


PacKaGe on Board - caPillary FlowS - non-reworKaBle

PRODUCT DESCRIPTIONRECOMMENDEDCURE

SCHEDULEVISCOSITY mPa.s(cP)

CTE (ppm/°C)

Tg POT LIFESTORAGETEMP.

HYSOL E1172A Fast cure at low temp high Tg underfill for temperature stable applications. Qualified for automotive applications.

3 minutes @ 135°C or 3 minutes @ 150°C

17,000 27 13548 hours @ 25°C

-40°C

HYSOL E1216MPartially filled (10 μm filler) non-reworkable, fast flow underfill. Qualified for automotiveapplications.

3.5 minutes @ 150ºC 3,252 40 1154 days @ 25 ºC

-20ºC

HYSOL FP4531

Originally designed as flip-chip underfill, proven workability at high temperature conditions. Qualified for automotive applications.

7 minutes @ 160°C 10,000 28 16124 hours @ 25°C

-40°C

UNDERFILLS

underFillS

CAPILLARYFLOWS

HYSOL E1172A

HYSOL E1216M

HYSOL FP4531

chiP on Board (coB)encaPSulantS

GLOBTOPS

UF 9052

UV 9060F


diSPenSe adheSiVeS

PRODUCT DESCRIPTION COLOR CURESCHEDULES APPLICATIONSTORAGE

TEMP SHELFLIFE

LOCTITE® 3621

For the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Suited for applications where very high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Suited where dispense speeds greater than 35,000 dots/h are required.

Red 90 seconds @ 150°C

3 - 4 minutes @ 125°C

Very high speed syringe dispense

47,000 DPH capable

2°C - 8°C 10 months

Screen Print/Pin tranSFer adheSiVeS

PRODUCT DESCRIPTION COLOR CURESCHEDULES APPLICATIONSTORAGE

TEMP SHELFLIFE

LOCTITE® 3616

Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Suited to printing a range of dot heights with one stencil thickness and where high wet strength characteristics, and high print speeds are required.

Red90 seconds @ 150°C

2 – 3 minutes @ 125°C

Stencil print (60 - 150 mm/s)

2°C – 8°C 9 months

SURFACE MOUNT ADHESIVES

SurFace mount adheSiVeS

DISPENSEADHESIVESSCREENPRINT/PIN

TRANSFERADHESIVES

LOCTITE® 3621 LOCTITE® 3616


HENKELELECTRONICSMATERIALS

Our worldwide service, manufacturing, sales and product development network delivers the global footprint that enables your company to be competitive – regardless of your requirements or location.

california, uSa Henkel Electronics

Headquarters

Withqualityandreliabilityasthefoundationofeveryformulation,Henkelmaterialsareanintegralpartofmanufacturingoperationsaroundtheglobe,servingcustomersinvariouselectronicsassemblymarkets:

•Handheld

• Appliance

•DigitalPrinting

•Computing

• Aerospace

• Automotive

•Medical

•Opto-electronic

•Lighting

•Displays

• Solar

•WirelessDatacomInfrastructure

americaSheadquarterS:united StateSHenkel Electronic Materials LLC14000 Jamboree RoadIrvine, CA 92606, USATel: +1.714.368.8000Tel: +1.800.562.8483Customer Support: +1.888.943.6535Fax: +1.714.368.2265

Henkel Electronic Materials LLC20021 Susana RoadRancho Dominguez, CA 90221, USATel: +1.310.764.4600Fax: +1.310.605.2274

BraZilHenkel BrazilAv. Prof. Vernon Krieble, 9106690-250 Itapevi,Sao Paulo, BrazilTel: +55.11.4143.7000

euroPeBelGiumHenkel Electronics Materials (Belgium)N.V. Nijverheidsstraat 7 B-2260Westerlo, BelgiumTel: +32.1457.5611Fax: +32.1458.5530

aSia-PaciFicchinaNo. 332 Meigui South RoadWaiGaoQiao Free Trade ZoneShanghai 200131, P.R. ChinaTel:+86.21.3898.4800Fax:+86.21.5048.4169

Henkel Huawei Electronics Co., Ltd.Songtiao Industrial Park LianyungangJiangsu Province 222006, ChinaTel: +86.518.8515.5342Fax: +86.518.8515.3801

JaPanHenkel Japan Ltd.27-7, Shin Isogo-choIsogo-ku Yokohama, 235-0017JapanTel: +81.45.286.0184

KoreaHenkel Technologies (Korea) Ltd.8th FloorDae Ryung Techno Town II569-21 Gasan-dong,Geumcheon-gu, Seoul 153-771KoreaTel: +82.2.6675.8000

malaySiaHenkel (Malaysia) Sdn BhdLot 973, Jalan Kampung Baru HicomPersiaran Tengku Ampuan,Lion Industrial ParkSection 26, 40400 Shah AlamSelangor Darul EhsanTel: +603.5192.6200Fax: +603.5192.6211

SinGaPore 401, Commonwealth Drive #03-01/02, Haw Par Techno Centre, Singapore 149598 Tel: +65.6266.0100

thailand Centralworld, 35th Floor, 999/9 Rama 1 Road, Patumwan, Bangkok, 10330 Thailand Tel: +66.2.209.8000

All marks used above are trademarks and/or registered trademarks of Henkel and/or its affiliates in the U.S., Germany and elsewhere. © Henkel Corporation, 2014. All rights reserved. APH-AE-220 (02/2014)

AcrosstheBoard,AroundtheGlobe.www.henkel.com/electronics

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Automotive Materials for Automotive Electronic Applications