AN AVNET ELECTRONICS MARKETING PUBLICATION

VOLUME 1// ISSUE 1// MARCH 2013

SOLUTIONS THAT KEEP YOUR WORLd

CONNECTEd

Increase Network Speed

PAGE 06

Find Out the Keys to Selecting a Wireless

Sensor Network ProtocolPAGE 11

Connect with the Next Great Technology

PAGE 14

Information is PowerPAGE 31

What’s New – Training, Products and ResourcesPAGE 34

In 1987, British inventor Clive Sinclair launched the Z88 portable computer weighing in at just under two pounds. That same year, Avnet and TE Connectivity launched a distribution partnership for interconnect products that has grown to span the globe. In the ensuing years, the two companies have experienced tremendous growth, and fueled their share of innovation. Avnet is proud to connect customers to TE Connectivy’s offering of more than half a million high-tech products. Last year, we celebrated our 25th anniversary and look forward to shaping the future of technology together. Here’s to the next 25 years!

I n n o v a t o r s I n E l E c t r o n I c s

Rick Hamada Avnet Chief Executive Officer

Tom LynchTE Connectivity Chief Executive Officer

Robert, Lester and Charles Avnet

Avnet Headquarters Phoenix, Arizona

1987 2013

President’s Message

What does connectivity mean to you? At first blush it might mean you want to make sure your smartphone is synced with your laptop and your tablet, and maybe port it over to download to your car. Dig a little deeper and you’ll find those of us in the electronics industry are tasked with making those connections – and more – happen for the rest of the world.

In the coming pages of this issue of AXIOM, Avnet’s new technology magazine, you’ll hear more about connectivity. We’ll start with the big ideas. First, you’ll hear from our own Ron Moore, who will talk about connectivity trends from an engineer’s perspective. Ron has a unique view of the design chain, as he sees a wide range of customer issues and how our field applications engineers are helping to resolve them with the latest technologies in interconnect, passive, electromechanical components, wireless technology and other solutions for the IO market.

As well, RoweBots Research founder Kim Rowe shares her insight on how to choose a wireless sensor network (WSN) protocol. She reveals factors companies should consider in making their selections as they look to deploy a WSN.

We round out this issue of AXIOM with upcoming training and events so you can find out what seminars are coming to your area or what’s available online. And, of course, we bring you the latest information on new products and technologies from our supplier partners and the resources you have available from Avnet Electronics Marketing.

I hope you enjoy our premiere issue of AXIOM as you look to make connections of your own. Feel free to drop us a line at axiom@avnet.com and tell us what you think about the new publication; we’d love to hear your feedback!

Regards,

Ed Smith, Avnet Electronics Marketing Americas President

contents

Copyright © 2013, Avnet, Inc. All rights reserved. Published by Avnet Electronics Marketing, a group of Avnet, Inc. Produced by Sketchfolio. Avnet, Inc. disclaims any proprietary interest or right in any trademarks, service marks, logos, domain names, company names, brands, product names, or other form of intellectual property other than its own. AVNET and the AV logo are registered trademarks of Avnet, Inc. No part of this publication may be reproduced or transmitted in any form or by any means without written permission.

Printed in the U.S.A.AXIOM-0313

A X I O M

TE CONNECTIVITY

INCrEasE NETwOrk spEEd

6

IN THIs IssUE

14 FeAture StOry

Bluetooth Low Energy… The World’s Next Great Technology

31 Supply ChAIn VelOCIty

Information Is Power: Find out how Avnet can optimize your supply chain

34 trAInIng & eVentS

Get up to speed about the latest technology, products and solutions

37 WhAt’S neW

New product introductions

41 reSOurCeS

Market & Technology Trends

Welcome to the premier issue of AXIOM. Axiom, which comes from the French root axiome, Latin root axioma and the Greek roots axiõm and axios, is defined as information that is thought fitting and worthy. Our goal with this new publication is to bring you, our design community, news and information from some of the best technology companies in the world that is both thought fitting and worthy of your time. Each issue will revolve around a different theme, with this first issue focusing on “Connections”. Connections can take many forms, from wired and cabled or simply connecting you to knowledge about new products that solve your pressing design challenges.

Future issues will cover technological innovations in various Market Segments, Power and Processing, and advances from you, our customers. Since this publication was specifically designed to meet your needs, we are looking forward to receiving your feedback, whether good or bad, at axiom@avnet.com.

Thank you in advance for your support on this journey.

Rondekka Moore, Demand Creation Director & AXIOM Editorial Director, Avnet Electronics Marketing

VOlUmE 1 . IssUE 1 . marCH 2013

Av n e t e l e c t r o n i c s M A r k e t i n g

Questions, Comments, suggestionsPlease forward your questions, comments and suggestions on this issue and for any future topics to axiom@avnet.com.

suBmissionsWe encourage prospective authors to follow AXIOM’s guidelines for Big Idea articles before submission. To obtain a copy of these guidelines, please contact lara.levicki-lavi@avnet.com.

AXIOM in Your in-BoxSign up to receive AXIOM, or our other informative ePubs and eNewsletters, at www.avnetpreferencecenter.com.

DownloaD AXIOMem.avnet.com/axiom

Follow avnet em @avnetdesignwire facebook.com/avnetem

17 prOduCtS & SOlutIOnS

Everything you need to know about new and focus manufacturer products and solutions, highlighting design issues, solutions, innovations and trends. Learn more from:

Maxim te Connectivity Molex

toshiba Analog devices panasonic

renesas Microchip

11keys to selecting a

wIrElEss sENsOr NETwOrk prOTOCOl

IT managers, data system architects and data communication equipment manufacturers are responding by increasingly driving system IO at even higher data rates. More and more servers, SANs, base stations and network switches implement IO at 10Gbps and higher at the physical layer.

While the technical merits of copper and optical physical layers must be considered, an increasing number of these data intensive equipment applications are adopting the SFP+ standard as the default physical layer interconnect.

The SFP+ standard offers several benefits over competing solutions. SFP+ interconnect solutions consume less power versus their copper equivalents. SFP+ cables have longer reaches and SFP+ optical modules have almost no system latency, thus optimizing system performance. Additionally, they have no cross talk sensitivity.

How do the benefits of SFP+ interconnect solutions affect equipment and system design? As an example, low cable and system latency ensures fast response time and reduced CPU idling. This increases data center efficiency and maximizes ROI. Additionally, lower power consumption in SFP+ ports drive system and data center power savings.

Addressing sfp+ Design challenges

While SFP+ connector technologies have many benefits, several design challenges need attention to drive the desired system performance. As port density increases and higher data rates (>10 Gbps) are supported, system EMI emission and thermal performance concerns must be addressed while allowing for several system design trade-offs.

Many variables affect EMI emissions, including leakage from optical transceivers, myriad types of board-level components (integrated chips, power supply module, etc.), and other improperly shielded connectors used in today’s communications equipment. If EMI emissions are not mitigated properly, these disturbances may degrade the effective performance of the circuit or prevent standards compliance. These effects can range from a decrease in performance to a total loss of data transmission.

A X I O M

Smart Phones. Tablets. Social Media. Cloud Computing.

Virtualization. Today’s consumer and enterprise data-intensive

applications are driving the need for constantly increasing data throughput in every aspect of

the computing, storage and data center networks.

07

S F p + e n h A n C e M e n t S e n A b l e n e t W O r k n e e d F O r S p e e d

There are also internal and external variables that affect thermal performance of pluggable IO products and dictate whether or not a cooling solution is required. Unfortunately there is no clear answer to this question and therefore system architects must consider many options and restrictions when designing end products.

The form factor of the product must be taken into account as different configurations have unique airflows. A “pizza box” (whether a 1U or 4U) that is mounted in a standard rack may have front-to-back airflow or side-to-side airflow. A blade style switch, or piece of equipment, may be mounted vertically within an enclosure that is in turn mounted in a standard rack. This type of configuration almost always has bottom-to-top airflow.

The number and density of ports mounted to the PCB must also be well thought out. These ports can be single port cages, 1xN ganged cages, 2xN stacked cages or a combination of all three. This is in addition to other IO connectors at the face of the product. The spacing between these cages must also be taken into account as well as port density, ambient air temperature, airflow and allowable temperature rise and backpressure created by baffling.

Finally, heat dissipation of the optical transceiver itself must be considered. Commercially available optical transceivers are rated up to 70 °C but there are extended temperature range transceivers that can operate up to 85 °C. Newer SFP+ connector modules that are used in short reach and long reach applications are still dissipating 1 watt or less but extended reach and fixed DWDM (dense wavelength division multiplexing) transceivers can range from 1.25 to 1.5 watts per port.

The industry has found that trying to cool these higher wattage transceivers in SFP+ stacked cages is quite challenging. Managing the temperature of the inner lower row of ports that are not exposed to airflow is especially difficult. TE Connectivity has made several enhancements to their standard SFP+ connector portfolio to control EMI emissions while dissipating extra heat in dense, high-speed applications.

emi enhancements

Through extensive research and testing, TE engineers have redesigned two components to improve EMI performance. The first component identified was the gasket retention plate shown in figure 1. This component acts as a backer plate for the conductive elastomeric gasket that interfaces with the inside of the front bezel. This retention plate was redesigned to utilize a right angle design with more attachment points to the cage body. These additional attachment points minimize the chance for EMI emissions to escape between the cage body and gasket retention plate. The redesigned gasket retention plate can be seen attached to the cage body in figure 2.

The second component that was identified for improvement was the latch plate, which is the component that separates the bottom port from the upper port. This component also houses the light pipes that transmit light from LEDs mounted on the PCB to the front face of the cage assembly. Industry standards dictate the design of the latching mechanism, so this was left unchanged. But, within the latch plate a secondary component was added to improve EMI performance and prevent leakage. Since this component is integral to the cage body there is no difference in appearance or functionality between standard SFP+ stacked cages and SFP+ stacked enhanced cage assemblies. See figure 3 for detail view of latch plate.

Figure 1 – Standard Gasket Retention Plate

Figure 3 – Detail view of stacked cage with four lightpipes in latch plate.

Figure 2 – Right Angle Gasket Retention Plate

08

S F p + e n h A n C e M e n t S e n A b l e n e t W O r k n e e d F O r S p e e d

The optimization of the gasket retention plate and the addition of the component to the latch plate yielded a significant improvement in EMI performance in the 10-15 Ghz range. Test results shown in figure 4.

thermal enhancements

The real estate that the latch plate provides was also used to create an airflow channel throughout the cage body in order to allow for the cooling of the lower row of SFP+ ports. This included the addition of square shaped perforations to the outside cage walls and vertical port separators, as well as two thermal vent holes in the front of the latch plate. These perforations were optimized in size and shape in order to maintain the same improved level of EMI performance, and the two thermal vents holes added to the front of each latch plate still allow for the use of two lightpipes per column. See figures 5 and 6 for a side view of cage assembly that includes side wall perforations, and for a detailed view of latch plate that includes the two thermal vent holes.

Standard SFP+ stacked 2x4 cages were tested in order to establish baseline test data which would be compared against thermally enhanced cages. The test setup consisted of three cages mounted to a mock PCB with half-inch spacing between each cage. The PCB was then placed within a wind tunnel that allowed the front face of each cage to protrude through a bezel. Each port was simultaneously populated with a modified SFP+ module that allowed the use of thermocouples for measurement data and allowed testing of various wattages. Thermocouples were also attached to the top, sides and back of cage to record surface temperatures. An

adjustable baffle was added to the exit end of the wind tunnel to induce backpressure. The following parameters were used for the baseline testing and follow up testing with enhanced cages:

• Airflow: 500 LFM • Backpressure: 0.25” H20• Altitude: Sea level

Test data using 1.5 watts per transceiver indicates thermally enhanced cages outperform standard SFP+ cages by a 3% reduction in temperature, in this particular test environment. This testing also verifies that the lower inner row of ports is the most difficult to effectively draw heat away from and will remain a challenge as data rates continue to increase. TE’s thermally enhanced 2xN cages include the same EMI enhancements mentioned above.

conclusion

These SPF+ EMI and thermal enhancements demonstrate TE’s commitment to providing engineered electronic components for data communications applications, while providing innovative solutions the market demands. Avnet’s longstanding relationship with TE enables rapid adoption of these and all of TE’s solutions. More information can be found at www.em.avnet.com/te including links to technical documentation and product information.

contributors

Matthew Schmitt Product Engineer, TE Connectivity

Dave Dedonato Test Engineer, TE Connectivity

Patrick Recce Product Engineer, TE Connectivity

Matt Burns Global IP&E Technical Marketing Specialist, Avnet Electronics Marketing

• Temperature: Room ambient (results adjusted for 55 °C ambient)• Power: 1.5W/transceiver

• Air gap above cage: 50 mm• Air gap below PCB: 9.5 mm• Temperature rise limit: 70 °C

Figure 4 – EMI test data comparing standard SFP+ stacked cages vs. SFP+ stacked enhanced cages.

Figure 5 Figure 6

In today’s fast paced design environment, finding the right pieces to complete your design can be critical to the success of your project. Add to that the increasing complexity of software in designs that can challenge even the most talented development team. For example, simple schedulers need to be replaced with full featured RTOSs, and simple interfaces such as serial ports are being replaced with complex interfaces like CAN, USB and Ethernet. These tasks can cripple a development project if appropriate solutions are not identified, tested and integrated into a system - quickly.

Wouldn’t it be great to have a one-stop shop for these kinds of critical software components? Now one exists with the new Embedded Software Store. Developed jointly by Avnet Electronics Marketing and ARM, the Embedded Software Store provides an embedded marketplace that brings developers and software vendors together, providing solutions for engineers in the embedded software space. By leveraging components and solutions from the Embedded Software Store, engineers can focus on the aspects of the system design that differentiate their products from their competitors, making for quicker time-to-market.

Visit the Embedded Software Store at EmbeddedSoftwareStore.com and find out about the incredible breadth of products available to enable your success!

Avnet Electronics Marketing and ARM have come together to launch the Embedded Software Store. This online information and e-Commerce-based website provides software downloads from a wide range of partners that are active in the ARM Connected Community® and Avnet’s partner ecosystem.

By consolidating a large number of software options that support the ARM architecture within a single domain, the Embedded Software Store will help developers tackle the challenges presented by increased software and SoC design complexity.

• Browse popular categories such as: » Board Support Packages

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OnE-StOp ShOp fOR AccESSing And AcquiRing SOftwARE

in the mind of every engineer, there is a new embedded software solution. Start making yours a reality by visiting www.embeddedsoftwarestore.com today.

CODE TIMETECHNOLOGIES

Power consumption is extremely important since it dramatically affects usability of a device. If wireless sensors require frequent battery replacement or constant recharging, maintenance needs increase, user satisfaction drops and enthusiasm for a device diminishes quickly. Even in a highly optimized design, the transmitter is often the largest power consumer in a wireless sensor device. This is one of the main reasons one type of WSN does not fit all protocols. The minimum power radio suitable for an application with the needed bandwidth and range is often the technology chosen.

In this simplified comparison, it should be clear different technologies fit certain applications. For example, home lighting control is ideally suited to IEEE 802.15.4 radios because both range and data rate are limited. In comparison, a video monitoring function may require a Wi-Fi connection with sufficient bandwidth for transmitting images in real-time.

For many embedded applications designed around microcontrollers (MCUs), network bandwidth and range are just part of the criteria of concern. Power consumption and power management start to factor in as stronger considerations for many applications.

Protocol radio Band toPology nodes range Max data rate

6LoWPAN 802.15.4 2.4 GHz Star or Mesh 64 k 100 m 250 kbps

6LoWPAN UHF Sub-1 GHz Mesh 64 k 800 m 50 kbps

ANT+® UHF 2.4 GHz Channel 64 k 30 m 1 Mbps

Bluetooth® 802.15.1 2.4 GHz Master-slave 7 100 m 3 Mbps

Bluetooth Smart 802.15.1 2.4 GHz Master-slave 7 50 m 260 kbps

Dash7 ISO 18000-7 433.92 MHz Multicast 1000 250 m 200 kbps

NFC ISO 13157 13.56 MHz Point to point 2 4 cm 424 kbps

Weightless UHF TV white space Base station – 10 km 100 kbps

Wi-Fi® 802.11 2.4 or 5 GHz Star 255 100 m 54 kbps

Wi-Fi Direct 802.11 2.4 or 5 GHz Point to point 2 100 m 54 kbps

WiMAX® 802.16 2.5-5.8 GHz Base station 60 20 km 70 Mbps

WirelessHART 802.15.4 2.4 GHz Mesh 8 100 m 250 kbps

ZigBee® 802.15.4 2.4 GHz Mesh 64 k 100 m 250 kbps

Z-Wave® UHF Sub-1 GHz Mesh 232 30 m 40 kbps

Keys to selecting A Wireless sensor netWorK protocolby kim rowe, Founder and CtO, rowebots research

As more sensors surround us, and the diversity of their measurements and technology increases, seamlessly integrating these sensors into wireless networks creates new opportunities for innovation. Choosing a wireless sensor network (WSN) protocol involves sorting through a number of considerations. Exploring those considerations and the best approach for some applications yields insight as to how software for WSNs will evolve.

Some popular protocols for WSNs are shown in the following table. The first set of decisions in deploying a WSN involves the topology, number of nodes, range (implementation dependent) and data rate desired.

11

W I r e l e S S S e n S O r n e t W O r k p r O t O C O l S

Sleep modes are typically used where a wireless link waits for an incoming message, waking the MCU when one is received. Consider the idea of a digital electronic leash, where two devices remain paired even if they go into various sleep modes, and automatically generate an alarm if they are separated by more than a programmed distance. By supporting deep sleep modes, better battery usage is achieved; however, higher level protocols must understand that the link is still active and change the power status of the device, maintaining the wireless connection through the transition.

Diversity of sensors, power management and interoperability are key implications for WSN software. Wireless protocols are at different stages of standardization, and it will be some time before there is complete harmonization of advanced requirements such as support for MCU power modes and interoperability between protocols. As WSNs evolve, new software supporting these factors will make the difference in the seamless integration of devices.

Consider just the sensor technology issues for a moment. Designers of such a player monitoring system have choices  of what data to transmit and how often, which leads directly to choices of wireless protocols. For example, heart and respiration rates change relatively slowly and could be transmitted on an 802.15.4 radio. Combining those measurements with other faster-varying sensor data like accelerometers might mean a Bluetooth Smart link is better, because all data can be transmitted on a single link. Adding a helmet cam would require a Bluetooth or Wi-Fi link for full HD without a heavy electronics package for compression.

One approach to implementation would be a player-area-network, where individual sensors transmit locally to a chest- or back-mounted collection point, which can provide a higher speed wireless connection for aggregated data to the outside world. Very low power sensors are already being integrated directly into smart uniforms and powered by energy harvesting. This approach, with different wireless protocols in use in the same system, implies software for interoperability.

Power management takes the next step, providing the means to actively reduce device power consumption at critical times, thus extending battery life. How power modes become visible to the application suggests how a device needs to be managed. Typical power modes for an MCU-based device would be normal, sleep and deep sleep. An MCU can power down the radio into a sleep or deep sleep mode, but its software must know what reduced power modes mean in terms of higher level protocols and expected system behavior of the device.

RoweBots Research was founded in 1987 by a group of University researchers. From the outset, RoweBots had its roots in real-time multiprocessor software and has broadened into an embedded signal processing systems company. Extensive work has been done on industrial productivity to deliver the value that customers require during software development. The evolution of the business has been built on a broad base of technology and rich business understanding that remains in the company today. Find out how RoweBots Research can match your development environment more closely with your business goals at www.rowebots.com.

Integrated packages for the standards based wireless options are available in the Embedded Software Store in the hardware vendors sections and the RoweBots Research section. These low cost packages are turnkey designs that allow evaluation and demonstration of the wireless protocol software stack and the associated hardware platform in just a few minutes. Check out these package options at EmbeddedSoftwareStore.com.

Another brief example relates to sports. Teams and athletes are interested in better training methods and improving in-game performance, and fans are interested in understanding physiology, getting better results in fantasy leagues or gaining an edge in wagering. Imagine each player on a team is instrumented with sensors, monitoring many different parameters of interest including:

• heart rate• respiration rate• “helmet cam” for player point-of-view display

• temperature• pulse oximetry• 3D linear and rotational acceleration for various body parts

12

W I r e l e S S S e n S O r n e t W O r k p r O t O C O l S

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14

A X I O M

BLE was designed by the Bluetooth Special Interest Group (BT SIG) as a white board design, free of interoperability constraints, to move data quickly and securely using the least amount of power possible. This is achieved primarily using two strategies: first, keep the Bluetooth radio off as much as possible and second, keep the data load small, so when the radio is active it’s on for only a tiny amount of time — think in terms of microseconds. To maximize BLE’s power efficiency the Bluetooth SIG designed a new network without the constraint of compatibility with existing networks. Yes, that’s right, BLE is incompatible with existing networks such as Bluetooth, now referenced as Bluetooth Classic or Bluetooth 2.1. To overcome this obstacle, BLE devices are available as dual mode, BLE plus Bluetooth Classic.

Every so often a technology emerges that has a profound impact on the world. The printing press, computer and internet are some of those technologies. An important note with all of these technologies is that they affect the movement of information. And, now, a new technology has appeared on stage that will again significantly impact the world and change the movement of information.

Bluetooth Low Energy (BLE) is the next technology that is poised to revolutionize our interaction with the world around us. BLE is an ultra-low power wireless network technology capable of forming truly wireless networks. While other wireless network technologies have been introduced, like cellular for example, they are not truly wireless technologies. By their nature, cellular devices must be tethered to accommodate frequent recharging. To be truly wireless, a technology must be capable of operating from a battery not for days or months, but years. BLE accomplishes this goal and does it using a small coin cell. (In fairness, other wireless technologies can operate on a battery, but none of the competing topologies combine the unique feature set found in BLE.)

Bluetooth loW energy the world’s next great technologyby Mr. richard trueman, product Manager, Wireless devices, panasonic

We often think of the information age as beginning with the birth of the internet, or perhaps, for those of us who have been around a bit longer, it may feel that the information age began at the dawn of the computer age. Although in reality, the information age began much earlier with Johannes Gutenburg’s invention of the printing press in 1450 — for it was only after books were no longer written by scribes that information became available to the masses. Prior to the printing press, scribes copied manuscripts by faithfully reproducing each character with pen and ink, restricting books and the distribution of information to the very wealthy. In 1450, innovation and its resulting technology broke through.

15

b l u e t O O t h l O W e n e r g y

Cost engineered host controlled interface modules are well suited for high volume applications. These modules may be ordered with or without an integrated antenna for maximum design flexibility. Available USB, UART and I2C interfaces simplify integration to existing designs. And, optional software stacks from BlueRadios and StoneStreetOne eliminate the need of becoming a Bluetooth expert to develop firmware. And, finally Panasonic’s evaluation kits for all modules speed hardware designs.

Why will BLE have the impact that other wireless network topologies have been unable to achieve? The answer is the coattails. Bluetooth was launched to eliminate the dangling wires between the cell phone and ear bud. As a consequence of this application, Bluetooth is the default Personal Area Network (PAN) technology used by nearly all cell phone manufacturers for the past several years. This gigantic base of installed nodes has caused other products, such as laptop computers, games, medical devices and many more, to adopt Bluetooth. The BT SIG expects the number of Bluetooth nodes to grow to over four billion in the not so distant future. Cell phone manufacturers have already adopted dual mode Bluetooth plus BLE, so BLE is on path to being the ubiquitous PAN standard; the coattails.

Panasonic is a world leading RF module manufacturer that has over 110 different RF module solutions. In addition, Panasonic partners with world class IC manufacturers such as Texas Instruments, Intel and Toshiba as well as cutting edge software partners to offer customers cost engineered, system solutions. Every customer purchasing Panasonic RF modules has the security of Panasonic’s platform guarantee.

To be truly wireless, a technology must be capable of operating from a battery not for days or months, but years.

Panasonic has eight different BLE solutions

to address a wide range of application requirements. Both

single mode, BLE and dual mode, BLE plus

Bluetooth Classic modules are available.

PAN1720 Single Mode, Bluetooth Low Energy

PAN1721 Single Mode, Ultra-Low Power

Bluetooth Low Energy

PAN1326 Dual Mode, Host Controlled Interface

Bluetooth Low Energy plus Bluetooth Classic

Visit panasonic.com/rfmodules for datasheets, reference designs, CAD files and demonstration software. Once your design is complete, Panasonic’s engineering team will review it to make certain that the application will be successful. All Panasonic modules are fully certified to operate worldwide.

To learn more and purchase a Panasonic BLE module visit em.avnet.com/axiom_picble

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proBlem • Designers need to get to market faster with flexible devices that are smaller in size, faster in speed, integrate complex features and so much more.

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design resource Centerdesign ZonesFAesFeatured promotionsMarket & tech trendstraining & events and more

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proBlem • Applications where IO is used for the transfer of data.• Applications that require faster data rates or greater power efficiencies in

their IO interconnect.

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trenD • Saving and sharing media drives the need for faster data transfer rates among all IO connectors.

• Power requirements are saved due to reduced power consumption.

Avnet Electronics Marketingem.avnet.com

Avnet Electronics Marketing brings together everything you need to know about new and focus manufacturer products and solutions. The following pages highlight design:

And, every page includes information on associated parts or links to more information and purchase opportunities.

proBlems What problem

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solutions how does this

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trenDs What current or

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17

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A X I O M

18

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Modular Jacks and Plugsem.avnet.com/axiom_tyemodular

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19

proBlem • Future scalability and reuse in a design—designs are constantly changing based on industry requirements, hence scalability of a design is important to keep up with current system architectures. Board and cable assemblies need to be reused based on the new requirements for smaller or larger systems.

• Laborious, complex and time consuming termination activity must be reduced.

solution • Offered in cable-to-cable or cable-to-board configurations, AMP-LATCH connectors help plan for future lengthening and shortening of cable assemblies at a very low cost.

• Ejection latches ensure secure connection with simple mating and unmating of the plug and receptacle.

• These connectors are one of the most efficient ribbon cable-to-board solutions on the market as they use IDC technology, allowing for mass termination of up to 64 conductors simultaneously. Wire prepping or stripping is eliminated adding efficiency and reducing the cost to assembly.

trenD • Customers need cost-effective products, now. AMP-LATCH connectors are widely available in the market and are one of the lowest cost-per-signal solutions available. With the influx of new companies and solutions, TE makes it easier to build standardized systems by designing plugs and receptacles intermateable with competitive product.

AMP-LATCH Connectorsem.avnet.com/axiom_tyeamplatch

proBlem • PC board space is at a premium and thermal management is a constant concern.

• Applications require robust IO products to run at 10 Gbps speeds.

Associated products:

SFp connectorsQSFp+ connectorsOther pluggable IO productssolution • The SFP+ connectors’ belly-to-belly configuration supports high density design.

• Innovative heat sink designs maximize system thermal management.

• Light pipe options provide easy identification of interface running status.

trenD • The SFP+ family meets the increased demand for higher speeds and greater bandwidth.

• More efficient thermal solutions to meet system thermal requirements.

SFP+ Connectorsem.avnet.com/axiom_tyesfpconnectors

The Blackfin® Embedded Vision Starter Kit, featuring FinBoard™, combines a versatile

hardware platform with the necessary software development tools to enable the building of high

performance, embedded vision systems. Based on the low-cost, dual core Blackfin BF609 processor, the kit is ideal for exploring

advanced video analytics. The Pipeline Vision Processor (PVP) included on the BF609 simplifies and accelerates image processing

algorithms. The CrossCore™ Embedded Studio development tools streamline software development, while the included ICE-100B

In-Circuit Emulator speeds application debug. The Starter Kit includes it all and is a great way to begin exploring the growing

applications of embedded vision technology.

whAt’S in thE kit?

» Avnet FinBoard BF609 baseboard » Analog Devices ICE-100B JTAG debugger » 2 GB microSD card » 5 V power supply » HDMI cable » Micro USB cable » Tripod » 5 White dice » 12-month CrossCore™ Embedded Studio license

(two, 6-month licenses) » Quick Start card » Downloadable documentation and reference

designs » Download Blackfin Embedded Vision Starter Kit

Product Brief.pdf

Blackfin® Embedded Vision Starter Kit The Ultimate IQ Booster for Embedded Vision Systems

$100 Discount

the Blackfin Embedded Vision Starter kit retails for $299. for a limited time, Avnet Electronics Marketing is offering a $100 discount to the first 500 customers who place an order for the kit.

Order your kit today at finboard.org, our new community-based site dedicated to the promotion and support of the Blackfin® Embedded Vision Starter Kit.

M a n u fa c t u r e r P r o d u c t s & s o l u t i o n s

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ADF4351 Integrated Multi-band Silicon VCO Circuitem.avnet.com/axiom_anasynthesizer

proBlem • Supporting the wide range of wireless standards requires a large range of local oscillator frequencies, which typically require multiple voltage controlled oscillators (VCO) together with complex switches and filtering.

solution • The ADF4351 integrated multi-band silicon VCO circuit covers a range of frequencies from 35 to 4400 MHz with no frequency gaps.

• It includes a Fractional-N PLL synthesizer that permits differing channel spacing resolution with no degradation to in-band noise. This is useful for supporting the different radio standards which may have differing channel bandwidths.

• Extra features include phase control of the PLL output, which enables applications like digital beam forming and phased array antennas.

trenD • Small footprint of 5 x 5 mm together with the integrated PLL & VCO reduces board size, time-to-market and iterations.

• Wideband VCO enables software defined radio (SDR), which is increasingly popular.

proBlem • Designers need the ability to tailor driver amplifier performance to the specific needs of the design.

solution • The ADL5324 amplifier incorporates a dynamically adjustable biasing circuit that allows for the customization of OIP3 and P1dB performance from 3.3 to 5 V, without the need for an external bias resistor.

• Its adjustable bias also allows for the driver to be dynamically biased in order to conserve power consumption when the full performance of the driver amplifier is not required, such as when a system is in stand-by mode. This scalability reduces the need to evaluate and inventory multiple driver amplifiers for different output power requirements, from 25 to 29 dBm output power levels.

trenD • Customers need solutions for designs that will experience higher temperatures and much wider frequency trends.

• With a rated operational temperature range of -40 to +105 °C and a wide frequency range of 400 to 4000 MHz, this amplifier addresses that trend.

ADL5324 ½ W SOT-89 RF Driver Amplifier

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maNUfaCTUrEr prOdUCTs & sOlUTIONs

PAN1326/1316 Series Dual-Mode Bluetooth and Bluetooth Low Energyem.avnet.com/axiom_picpan1326

proBlem • Battery life is a critical requirement in low energy applications.

• Short transition times and power efficient hardware are needed to help prevent the loss of battery life.

Associated products:

enW-89820A1kFenW-89820A3kFeVAl_pAn1720eVAl_pAn1720-br

solution • The PAN1720 series is a cost-effective, low-power, true system-on-chip (SoC) complete Bluetooth 4.0 Low Energy solution that includes an embedded processor, antenna and Bluetooth Low Energy stack.

• The module includes an eight-channel, twelve bit analog-to-digital converter, 19 GPIOs plus battery and temperature sensors.

• Available with Bluetooth Low Energy protocol stacks and applications from Texas Instruments and BlueRadios™.

trenD • The PAN1720 is an ideal choice where battery life is a critical application requirement since it uses only 500 nA in sleep mode.

• Short transition times between operating modes – 3uS Wake-Up – and power efficient hardware further reduce current consumption.

proBlem • There is a need for a low cost, ultra-low power wireless networking solution for short range applications.

Associated products:

enW-89823A2JFenW-89823C2JFeVAl_pAn1323

solution • PAN1326/1316 series RF modules features both Bluetooth Low Energy and Bluetooth connectivity.

• Maximum power consumption is less than 15 mA and the average power consumption is about 1 uA. A small coin cell – such as a CR2032 – is capable of powering a device for up to 10 years of operation.

• The PAN1326/1316 Host Controlled Interface (HCI) series also brings Texas Instruments, CC2564 to an easy-to-use module format.

trenD • The Bluetooth Low Energy standard is designed to reduce power consumption, establishing very fast connections (few ms) and transferring small amounts of data. Using these techniques, energy consumption is reduced to a tenth of Classic Bluetooth. Bluetooth Low Energy devices can be put into sleep mode and activated for event activities such as sending files to a gateway, PC or mobile phone.

PAN1720 Series Bluetooth® Low Energy RF Module em.avnet.com/axiom_picpan1720

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Brad® Micro-Change® M12 Harsh Duty Receptaclesem.avnet.com/axiom_mlxbrad

proBlem • EMI noise can degrade signal integrity in harsh duty applications such as manufacturing or non-automotive vehicles.

• Plastic housings are unable to eliminate such shielding issues.

solution • The Brad® Micro-Change® M12 receptacles are designed to withstand harsh commercial and industrial environments.

• They offer a sealed, shielded connection to ensure a reliable connection for control elements in commercial and factory automation equipment.

• Tooled for network connectivity in both Ethernet and Controller-Area Network (CAN bus) protocols, as well as passive applications such as discrete and analog sensor applications.

• And, they are constructed of a heavy-duty die metal housing, providing 360° EMI/RFI shielding.

trenD • Industrial and commercial vehicle applications will continue to require more complex networks with high data-rates in environments that are exposed to vibration, heat and other hazards. These applications will demand Ethernet products that are designed to meet the challenges posed by harsh Ethernet applications such as robustness and integration.

• The Brad Micro-Change M12 harsh duty receptacles are ideal for Class 2 power and network circuit applications including petrochemical, factory-automation and commercial vehicles.

proBlem • Commercial vehicle, marine and non-automotive applications are exposed to harsh chemical and outdoor environments that place extreme demands on interconnect systems.

• Electrical connections need to be protected from dust, water ingress, chemical contamination, wide temperature swings and vibration.

solution • The MX150L™ Industrial sealed connector system is designed for harsh and rugged environments.• Offered in wire-to-wire (in line plug and receptacle), wire-to-panel (sealed panel mount plug), and

wire-to-board (right angle PCB mount header plug) configurations, the system supports both low-level signal as well as power applications up to 40 A.

• An integral matte and interfacial seal design exceeds IEC IP67 “waterproof” requirements. This innovative pre-assembled design eliminates the need to purchase, handle and crimp individual wire seals, therefore lowering labor costs, as the system ships pre-assembled with no need to procure extra or individual components.

trenD • Electrical systems on boats, farm equipment and trucks continue to evolve. The increased intelligence of today’s OEM products requires a versatile, sealed connector that will operate dependably under harsh conditions.

Note: This system is not designed for automotive applications such as USCAR-2, USCAR-25, GMW3191, AK Testing, J2030, Volvo Technology Requirements and Toyota Connector Spec (TCS).

MX150L™ Industrial Sealed Connector Systemem.avnet.com/axiom_mlxmx150l

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maNUfaCTUrEr prOdUCTs & sOlUTIONs

proBlem • Power conversion applications require more flexibility to address energy efficiency targets and aggressive product development schedules.

Associated products:

MCp19111MCp87018MCp87022MCp87030MCp87050MCp87055MCp87090MCp87130

solution • Enter the world’s first digitally enhanced power analog controller – Microchip’s MCP19111.

• Combines a high-speed, high-performance analog PWM controller with a fully-functional, 8-bit MCU. This hybrid, or mixed-mode, implementation provides the performance of an analog controller with the on-the-fly flexibility of a digital interface.

• Feedback loop is wholly in the analog domain, eliminating the need for a high-performance MCU, while still offering cost-effective performance and integration.

• Wide 4.5 to 32 V input voltage range makes the MCP19111 ideal for point-of-load DC/DC converters on 5, 12 and 24 V rails.

• Integrates a peak-current mode analog controller; synchronous buck (i.e. high-side/low-side) MOSFET driver capable of driving up to 50 A power trains; mid-voltage LDO, allowing it to be directly powered from the input voltage; and a fully-functional 8-bit MCU.

trenD • Microchip is on a technology and product development path to support higher voltages and currents, while providing analog power supply designers flexibility approaching that of a fully-digital solution.

digitally-enhanced power Analog product Family

device topologies Integrated driver

driver Strength(Source/Sink - A)

IntegratedpIC® MCu Flash (kb) rAM

(bytes) pins package

MCP19111 Buck Yes 2/4 Yes 8 256 28 5 x 5 mm QFN

power MOSFet product Family

product Id type Config Vds (V) Vgs (V) rds_on @ 4.5 V (mΩ-typ) Qg (nC) package(mm)

MCP87018 N Single 25 +10/-8 1.8 35 5 x 6 DFN

MCP87022 N Single 25 +10/-8 2.2 25 5 x 6 DFN

MCP87030 N Single 25 +10/-8 3 13.3 5 x 6 DFN

MCP87050 N Single 25 +10/-8 5 9 5 x 6 DFN

MCP87055 N Single 25 +10/-8 5.5 6 3.3 x 3.3 DFN

MCP87090 N Single 25 +10/-8 9 4 5 x 6 DFN, 3.3 x 3.3 DFN

MCP87130 N Single 25 +10/-8 13 2.9 5 x 6 DFN, 3.3 x 3.3 DFN

MCP19111 Digitally Enhanced Power Analog Controllerem.avnet.com/axiom_mcccontroller

M a n u fa c t u r e r P r o d u c t s & s o l u t i o n s

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proBlem • To help reduce their design cycles, customers need more complete design solutions instead of just the silicon.• Some traditional evaluation kits still prove useful, but it is often difficult to test ICs in a final system

environment. This is due to hardware interface compatibility issues, unsupplied source code, and the complexity of porting code into the end application.

solution • The Pmod™ form factor and connector standard enable the attachment of a small IC or subsystem to an end user’s system. The modules support SPI, I2C, GPIO, and UART interfaces at low and medium transfer rates for simple plug-in to any FPGA that supports the Pmod standard.

• Maxim Integrated supplies C-language software for the basic operations of the IC and a simple demo program.• Maxim offers many low-cost Pmod evaluation boards. A bundled collection of 15 of the most popular functions,

including ADCs, DACs, and real-time clocks, is available for under $90. This collection includes the FPGA code and software that is compatible with Avnet’s LX9 Spartan®-6 FPGA board and the new Zynq®-based Zedboard.

• New Pmod reference designs are in development and will be released in 2013. Many of these newer Pmods will be based on subsystems rather than single ICs.

All trademarks are the property of their respective owners.

Maxim pmod Family

product Id product type product description

MAXPMBAE1 Analog Essential Collection A bundled collection of 15 of the most popular functions, including ADCs, DACs and real-time clocks

MAX11205PMB1# Precision 16-Bit ADC ADC offers low supply current, low noise, and compact 10-pin package for space-constrained designs

MAX5216PMB1# Precision 16-Bit DAC Industry’s lowest-power 16-bit DAC

DS1086LPMB1# Programmable Oscillator Low-EMI oscillator reduces system cost through innovative architecture

MAX4824PMB1# Octal Relay Driver Octal relay driver reduces access time and power consumption and improves relay switching speed

MAX3232PMB1# RS-232 Transceiver Space-saving RS-232 transceiver works from a single supply voltage

MAX44000PMB1# Proximity Detector Industry’s most advanced proximity/ambient-light sensor offers lowest power consumption to conserve battery life

MAX5487PMB1# Dual Nonvolatile Digital Pot Space-saving, 256-tap nonvolatile digital potentiometer

MAX14840EPMB1# RS-485 Transceiver High-speed (40Mbps) transceiver extends cable lengths

MAX31723PMB1# Temperature Sensor/Switch Industry’s only 3-wire/SPI temperature sensor operates from as low as 1.7V, saving both space and power

MAX7304PMB1# 16-Port I/O Expander Compact I/O expander increases flexibility through I/O expansion and integrated ESD protection

MAX9611PMB1# Programmable Current Limiter Easy to design and flexible current limiter

MAX31855PMB1# Thermocouple to Digital Complete, space- and power-saving solution converts thermocouple signals into a digital temperature reading

DS3231MPMB1# 3PPM Real-Time Clock (RTC) Rugged crystal-less RTC keeps accurate time in challenging environments

MAX14850PMB1# SPI/UART Isolator Robust isolator with capacitive technology has high immunity to magnetic fields

MAX5825PMB1# Octal 12-Bit DAC Space-saving octal DAC with integrated watchdog timer and predefined power-on-reset states improves safety

MAXREFDES4 16-Bit AFE High accuracy 4-20 mA input isolated Analog Front End

MAXREFDES5 16-Bit AFE High accuracy multi-input isolated Analog Front End

MAXREFDES11 16-Bit AFE High accuracy 0 to 10 V input isolated Analog Front End

Peripheral Modules Facilitate Rapid Prototypingem.avnet.com/axiom_mxmpmod

The Power of Two – Renesas & MicriumRenesas and Micrium join forces to present an exciting offer for production users of Renesas’ flagship RX and RL78 MCUs.

RX and RL78 customers can get free: §Micrium’s real-time deterministic multitasking Kernel – μC/OS-II or μC/OS-III (single production license)

§Middleware (TCP/IP, USB, File System and others)

§One year of support and maintenance from Micrium

The new customer project must use a Renesas RX or RL78MCU, and it must be used in a commercial application.

Choose Renesas RX or RL78 MCUs Get Micrium RTOS, Middleware, Support and More for FREE!

FREE Micrium Middleware

FREE Micrium RTOS

FREE Renesas Kits & Boards

© 2013 Renesas Electronics America Inc. (REA). All rights reserved. All trademarks are the property of their respective owners.

* Based on using all available promotion items.

The Power of TwoMicrium Promotion ProductsKernel μC/OS-II μC/OS-III

TCP/IP μC/TCP-IP

TCP/IPExtensions

μC/DHCPcμC/FTPcsμC/TFTPcsμC/HTTPs

μC/POP3cμC/SMTPcμC/TELNETs

USB-Device

μC/USB Device

PHDCHIDMSC

CDC ACM

USB-Host

μC/USB HostHIDMSCCDC

ACMPrinter classes

File System μC/FS – FAT12/16/32CAN μC/CANCANOpen μC/CANopenModbus μC/ModbusData Visualization Yes (μC/Probe) – 1 seat FreeTotal Value ofFree Products $111, 000 USD*

No royalties. No licensing fees. All source code supplied!

Available in the Americas only: North America, South America and Central America. For full rules

and regulations, please visit us at our website.

am.renesas.com/micrium

ofthe

M a n u fa c t u r e r P r o d u c t s & s o l u t i o n s

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USB 3.0 Connectors em.avnet.com/axiom_tyeusb3

proBlem • Applications where space is too limited to accommodate interconnect for separate power and signal connections.

• Applications exposed to harsh environments where mechanical shock, moisture and debris are prevalent.

Associated products:

Industr ial ethernetkOAXXA rF interconnectsICCOn single-pole power connectorssolution • The Circular Power Connector (CPC) family is a versatile, rugged, and

circular-shaped signal and power connector system.• The connectors can be utilized to make complex wiring situations

more manageable.• They are capable of both signal and power in a single interconnect.• They allow for more positions compared to connectors that are rectangular

in shape with the same area.

trenD • Offers power and signal in one connector supporting the trend for more cost effective power and signal interconnect solutions.

• Design engineers prefer easy-to-assemble products with quick connect/disconnect capability and easy mating.

proBlem • Applications where IO is used for the transfer of data.• Applications that require faster data rates or greater power efficiencies in

their IO interconnect.

Associated products:

rJ point f ive connector systemsboard-to-board (0.8 mm Fh connectors)Wire-to-board (AMp Ct & AMp mini Ct connectors)

solution • USB 3.0 connector is designed to meet market trends driving: – Faster data transfer rates – 10 times faster than its predecessor, USB 2.0 – Improved device interaction time – Elimination of device polling – Improved charging and power capabilities

trenD • Saving and sharing media drives the need for faster data transfer rates among all IO connectors.

• Power requirements are saved due to reduced power consumption.

Circular Power Connectors (CPC)em.avnet.com/axiom_tyecpc

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maNUfaCTUrEr prOdUCTs & sOlUTIONs

MULTIGIG RT 2-R Connectorsem.avnet.com/axiom_tyemultigig

proBlem • Designers need to acheive greater speeds in a smaller and lightweight solution.• Increased EMI protection is required.• Easy termination and field reparability required.

Associated products:

Molded bootsterminat ion devices

solution • The CeeLock FAS-T connectors’ noise-cancelling contact arrangement minimizes cross talk.

• Achieves speeds up to 10 Gigabit Ethernet with Cat 6a or Cat 7 wire (1 Gigabit with Cat 5e).

• The small design helps allow for improved performance with less space.• Backshell integrated in plug body provides low profile, low cost, low weight

strain relief and EMI protection.

trenD • Increased high speed protocols and faster data rates.• Field reparability.• Harsh environmental applications require faster speeds.

proBlem • High vibration levels in harsh environments. Associated products:

VItA 61 compliant Mezalok mezzanine connectorsVItA 67 compliant rF modulesVItA 66 compliant opt ics modules

solution • With a new quad redundant contact structure, this ruggedized version of the MULTIGIG RT 2 product helps provide an additional level of reliability under extreme vibration.

• Supports high speed protocols: Serial RapidIO, PCIe, Ethernet, Fiber Channel, and InfiniBand protocols.

• Modular, lightweight connector system.• Robust “pinless” interface resists damage.• Compliant to VITA 46 for Open VPX applications.• VITA 46 compliance enables upgrades in existing VPX applications.

trenD • These connectors are used in harsh environmental applications.• There is strong growth in VPX for rugged embedded computing.

CeeLok FAS-T Connectorsem.avnet.com/axiom_tyeceelok

pluggable high Speed i/O kit

TE Connectivity and the TE connectivity (logo) are trademarks.Other logos, product and company names mentioned herein may be trademarks of their respective owners.

Virtual Sample kitAvnet and TE are offering over 40 of the most popular Pluggable I/O products in a Virtual Sample Kit. Click through the link below to:

» View product details including pricing & availability

» View product data sheet or related specifications

» Request sample(s)

em.avnet.com/axiom_tyevirtualsamplekit

sFP Dust Plug1761394-1

sFP 1x1 cage 1489669-1

sFP+ 1x1 cage2007198-1

sFP+ 1x1 cage + Heat sink2007464-1

XFP 1x1 cage1489951-1

XFP conn 1367500-1

QsFP+ 1x1 cage + Heat sink1888631-1

sFP+ 1x3 cage + Light Pipe + Heat sink

2057042-2sFP/sFP+ conn

1888247-1

QsFP/ XPF EMi Plug

1888810-2

sFP 1x2 cage 1761014-1

sFP+ EMi Plug

1888901-1

sFP+ 1x2 cage + Light Pipe2007262-1

sFP+ 2x1 Assy2007492-5

QsFP+ 1x1 cage QsFP+ Light Pipe1888674-1 1888634-1

zsFP+ connector(Samples available in

April 2013)2170088-2QsFP conn

1761987-9

sFP 2x1 Assy1658391-1

cXP standard Assy2149699-1

cXP Extended Assy2149731-1

cXP Assy + Light Pipe + Heat sink and cXP Dust Plug2149159-5 2149126-3

Mini-sAs HD 1x1 cage Assy

2149027-1

zQsFP+ 1x1 cage + Heat sink and connector

1551892-1 1551920-2

X2 Guide Rails1367710-1

sFP+ cable Assembly and QsFP+ cable Assembly

(Request information)2127934-1 2053638-1

sFP+ 1x4 cage2007093-1

sFP+ 2x2 cage2007417-5

zQsFP+ 1x3 cage2173239-1

X2 conn1367337-1

cFP2057592-2 - CFP GUIDE RAIL2057629-1 - CFP MODULE CONN ASSY2057630-1 - CFP RECEPTACLE CONN ASSY2057631-1 - CFP RECEPTACLE COVER ASSY2057930-1 - CFP BACKER PLATE ASSY2057626-1 - CFP EXTERNAL BRACKET ASSY1963856-1 - HEAT SINK, 100 GIG PLUGGABLE2149151-1 - EMI/DUST COVER, CFP

irtual Sample KitV Pluggable Input/Output Solutions

Belly to Belly

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maNUfaCTUrEr prOdUCTs & sOlUTIONs

proBlem • The transfer of large files, quickly, easily and safely is still a perplexing problem even with today’s advanced technologies. For example, users want to not only swap large files between smartphones, tablets and laptops, but they also want to print photos directly from their camera or smartphone, or stream videos to their large screen TV. It is possible with cables, flash drives and set-up menus, but cables and flash drives can be easily lost or forgotten.

• For Wi-Fi to be effective you need access to a strong connection and configuration issues can affect both Wi-Fi and Bluetooth®. While many different wireless technologies are available on devices, there simply isn’t a technology that is easy to use, secure, consistently reliable and has the ability to quickly transfer large amounts of data. Or is there?

solution • TransferJet™ is a close-proximity wireless data transfer technology with a very high effective data rate, up to 375 Mbits/s, and short range of just a few centimeters. This allows users to swap files between devices by merely “touching” them together.

• This technology can move a 10-Mpixel photo between devices in milliseconds and a 100-Mbyte video file in as little as two seconds.

• This very short range, point-to-point communication, inductive coupling technology and simple pairing all improve the security of the TransferJet wireless transfer technology.

• It avoids interference common with Wi-Fi since it operates on an unlicensed frequency band (4.48 GHz) and has very low transmission power (-70 dBm/MHz) similar to Bluetooth.

• Both the Toshiba TJM35420 LSI and the TJM35420XLG ultra-small module support the TransferJet technology.

trenD • To increase proliferation of the technology, Toshiba has recently announced a microSDIO card, USB and microUSB adaptors that incorporate the TransferJet technology.

• This technology can now be quickly added to after-market products and ease OEM integration.

price and Availability

part number toshiba transferJet products Sample Availability Sample price (1,000 pc)

TJM35420XLG LSI Now $3.00

TJM35420XL Ultra-small module Q213 $5.00

TJM35420UX USB Adaptor Now $29.00

TJM35420MU MicroUSB Adaptor Now $25.00

TJM35420US MicroSDIO Card Now $9.00

Check out the video at www.toshiba.com/taec/components/description/pop_transferjetvideo2.html

TransferJet is a trademark of the TransferJet Consortium, a 45-member organization dedicated to the proliferation of the TransferJet Technology. Toshiba is a member of the TransferJet Consortium. Bluetooth is a registered trademark owned by Bluetooth SIG, Inc.

TransferJet™: Connectivity with a Simple Touch

I n f o r m at I o n I s P o w e r I n s u P P l y C h a I n r I s k m a n a g e m e n t

3106

d E S I G N : S U P P LY C H A I N V E L O C I T Y

In today’s outsource-dominated global electronics industry, much of the value in an OEM brand owner’s operations is highly dependent on businesses outside of the company’s four walls — and increasingly outside their home region. With the volatility, complexity and uncertainty of market demand and the global economy, more comprehensive supply chain risk management is quickly becoming a major competitive differentiator.

Visibility into the supply chain lets you anticipate and

respond quickly to risk factors, both upstream and downstream.

by gerry Fay, Chief global logistics & Operations Officer, Avnet Inc.

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Avnet’s new "Control Tower" service is designed to provide transparency into the multiechelons of the supply chain. Control Tower serves as a collaborative execution based hub for all the supply and demand data Avnet collects from members of the customer’s extended supply chain, such as demand forecasts; channel inventory; SKU level sell-out; work-in-progress (WIP) inventory; shipping data, and purchase orders.

need to have transparency into the operations of all critical supply chain partners, regardless of tier, if they hope to mitigate their supply chain risk meaningfully. This transparency enables companies to proactively shift or reprioritize their supply chains based on changing supply or demand signals in multiple tiers of the supply chain — both up and downstream.

To date, there are few commercial solutions on the market designed to facilitate this level of visibility throughout the supply chain. Gartner Group reports that the most frequently utilized visibility tools for both multitier suppliers are spreadsheets and homegrown collaboration tools.

In an effort to provide a more standard and user-friendly means of monitoring extended supply chains, Avnet recently introduced a new “Control Tower” service. Designed to provide transparency into the multiechelons of the supply chain, Control Tower serves as a collaborative execution based hub for all the supply and demand data Avnet collects from members of the customer’s extended supply chain, such as demand forecasts; channel inventory; SKU level sell-out; work-in-progress (WIP) inventory; shipping data, and purchase orders.

risk has always been inherent in the supply chain. However, when you factor in geopolitical and global economic instability, increased regulatory and environmental compliance, and threat of natural disaster, the likelihood and potential severity of a supply chain disruption are greater than ever before.

This is why Avnet advocates that companies implement supply chain risk management programs that are not only proactive, but also multitiered.

Typically, these efforts just scratch the surface of the problem because they are often limited to tier 1 suppliers. This trend is demonstrated by the results of a 2011 survey by Gartner Group on Multi-tier Supply Chain Visibility, in which two-thirds of respondents reported having upstream visibility processes for tier 1 suppliers, but only one-third had such processes for tier 2 and tier 3 suppliers. Shared data is most often limited to updates on inventory, shipments and order/lead time status.

With the competitive pressure on the supply chain, there is very little room for error. Since supply chains may encompass hundreds of different companies around the globe, each with distinct roles in getting a final product to market, OEMs

I n f o r m at I o n I s P o w e r I n s u P P l y C h a I n r I s k m a n a g e m e n t

33

to focus their risk management emphasis based on their relative performance versus their peer set and whether they are managing their supply chain based on cost versus reliability, responsiveness or agility.

SCC’s Value at Risk metric takes the probability of an event and multiplies it by the expected impact of the event (i.e., if this happens, what does it mean for the organization?). It provides a more methodical and financially based means of evaluating

each risk factor, enabling companies to consider the return on investment (ROI) of any mitigation effort and either reduce the probability of the risk occurring (prevention) or the impact that the

risk might have on the business (recovery).

No matter what size your organization or what market you play in, it is crucial for companies to support and protect their supply chains with a proactive multitier supply chain risk management program. Visibility into multiple echelons of the supply chain enables companies to either anticipate or respond more quickly to supply chain risk factors, avoiding costly disruptions to operations, impacts on product quality and lasting reputational damage.

For more information on how to get started, please contact us at avnet.velocity@avnet.com

In addition, Control Tower customers receive push notifications alerting them to a change in conditions that might have an impact on their supply chain, such as a shortage in supply, an expansion in lead time, concerns over costs related to currency conversion, or a natural disaster affecting the availability of raw materials.

Avnet is able to provide this service because of our unique role in both the downstream design and upstream supply points of high tech supply chains. Now, our customers can leverage our scale and scope to better manage their supply chains and mitigate their risk.

Access to information, however, is just one element of a risk management strategy. A robust process for calculating risk is also essential in moving an organization from simply addressing response capabilities to better assessing where supply chains are most vulnerable. The Supply Chain Council (SCC) offers a number of tools to help companies begin to identify and prioritize their risks, including the Supply-Chain Operations Reference (SCOR) model and the Value at Risk (VAR) metric.

SCOR enables users to gain better insight into their risk relative to industry averages by benchmarking metrics against similar companies in their industry. Using this information, they can determine where

A robust process for calculating risk is also essential in moving an organization from simply addressing response capabilities to better assessing where supply chains are most vulnerable.

Risk has always been inherent in the supply chain. OEMs need to have transparency into the operations of all critical supply chain partners, regardless of tier, if they hope to mitigate their supply chain risk meaningfully.

Douglas Kent explains the importance of prioritizing Supply Chain Risk

Watch Video at: http://goo.gl/ppQrn

This article was reprinted with permission from Avnet Supply Chain Velocity.

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TraININg & EVENTs

embedded Vision Summit• April 25 in San Jose, California.

• Unique opportunity for engineers to learn about the hottest technology in the electronics industry – embedded computer vision, which enables “machines that see and understand.”

• Includes “how-to” presentations, product and technology demonstrations and distinguished speakers.

register: embedded-vision.com/embedded-vision-summit

building a Security Surveillance System: timesys university local edition Workshop

• Learn how to build an embedded Linux-based Qt application and leverage RTOS controlled sensors on the PHYTEC phyCORE-Vybrid Development Kit.

• Using open source Linux, MQX RTOS, Timesys and ARM® tools, and the PHYTEC phyCORE-Vybrid development kit, attendees of this hands-on training session will build a security surveillance system.

register: em.avnet.com/axiom_timesyssecurity

Avnet great lakes: embedded World• April 24 in Plymouth, Michigan.

• This one-of-a-kind, full day event will provide attending customers with a tour of the Embedded World.

• Hear from key lines and talk trends in embedded processing, displays, software and storage.

register: em.avnet.com/axiom_avnetgreatlakes_ew

Avnet Wi-go design Challenge• Avnet invites YOU to design the latest wireless software.

• Using the Avnet Wi-Go System, we are looking for you to design software for the application of your choice.

• One (1) grand prize winner will be chosen to win an 11’’ Apple Macbook Air!

register: em.avnet.com/axiom_wigodesignchallenge

T r a i n i n g & E v E n T s

35

Microsemi SmartFusion2 SoC FpgA SpeedWay design Workshops™

• These workshops feature the new Microsemi SmartFusion2 SoC FPGAs, the only devices that address fundamental requirements for advanced security, high reliability and low power in critical applications.

• Taught by Avnet technical experts, these workshops combine informative presentations with hands-on labs progressing from introductory labs to more complex labs and demos.

• Includes a free SmartFusion2 Starter Kit!

register: em.avnet.com/axiom_mswsmartfusionworkshop

Freescale kinetis-l Online Customer training Modules• Freescale’s exciting new Cortex M0+ based Kinetis-L Series offer a versatile combination of energy efficiency, ease-

of-use and value as well as scalability from existing 8-bit (S08P) and 32-bit Cortex-M4 (Kinetis-K) MCUs.

• Watch these short “On-Demand” training modules that provide prospective users with quick insights into key aspects of what makes these parts so compelling.

register: em.avnet.com/axiom_frskinetistraining

Video-based Xilinx® Zynq™-7000 Ap SoC SpeedWay design Workshops™

• This workshop series features three online courses progressing from introductory, through running a Linux operating system on the Zynq-7000 SoC, and finally to the integration of the high-speed analog signal chain with digital signal processing from RF to baseband for wireless communications.

• Training is recommended equally for engineers who are new to FPGAs as well as those seeking to enhance their expertise with Zynq-7000 SoC development tools.

register: zedboard.org/trainings-and-videos

In addition to the events above, Avnet offers a robust selection of On-Demand Training and Demos, Behind the Wheel™ Dev Tool

Product Overviews and Technical Webcasts.

Check out our offerings at em.avnet.com/axiom_training

Accelerating Your Success!™1 800 332 8638 | www.avnetexpress.com | @avnetdesignwire

Your job is to develop and market innovative products; our job is to reduce your risk along the way.

Even leading edge products need a cost-effective and dependable supply chain to be a success. That’s where Avnet can help. Around the world and around the clock, you can rely on our expertise at every point in the supply chain – from supply chain assessment to solution design to global planning. Avnet’s supply chain solutions save you inventory and infrastructure. That’s money in the bank, and the edge you need to stay ahead of the competition. Simple, really.

What can we do for you? www.avnetexpress.com

Simplified.SUpplY CHAiN SOlUTiONS fROm AVNeT

N e w P r o d u c t I N t r o d u c t I o N s

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wHaT’s NEw

MathWorks dSp design package for Xilinx kitsThe MathWorks Software Package for Xilinx DSP Kits includes MATLAB®, Simulink®, HDL Coder™ and several other MathWorks products that enable engineers to design, test and implement algorithms with high-speed analog data acquisition on Xilinx FPGAs using Model-Based Design. This approach has proven to save time and reduce design errors over traditional workflows involving hand-coding HDL.

em.avnet.com/axiom_npimth

kontron digital Signage evaluation kit dSek-12Fast-track digital signage solutions with this Open Pluggable Standard (OPS)-compliant evaluation kit – complete with media player and key software evaluation licenses. This fully validated solution from Intel, Kontron, Microsoft and their ecosystem partners Flypaper and Scala lets you experience preconfigured digital signage examples and move straight into application development within minutes of opening the box.

em.avnet.com/axiom_npiknt

Intel® platform for large Scale Communications Infrastructure SystemsCheck out the new Intel® Xeon® Processor E5-2600 and E5-2400 Series with Intel® Communications Chipset 89xx Series. This range of Intel® Xeon® processors paired with the Intel® Communications Chipset 89xx Series enable application, control and packet processing workloads with hardware acceleration of cryptographic and compression functions.

em.avnet.com/axiom_npiitl

Idt VersaClock low power Clock generatorThe IDT5P49EE801 is a programmable clock generator intended for low power, battery operated consumer applications. There are four internal PLLs, each individually programmable, allowing for up to eight different output frequencies. The frequencies are generated from a single reference clock, which can come from either a TCXO or fundamental mode crystal.

em.avnet.com/axiom_npiidt

em.avnet.com/axiom_npiefj

emerson network power MVMe2500 VMe64 processor boardThe Emerson MVME2500 single-board computer (SBC) features the latest Freescale QorIQ™ processors — the single-core P2010 and dual-core P2020. The e500 v2 core QorIQ processor uses 45 nm technology, which delivers an industry-leading performance-to-power ratio with single-core or dual-core frequencies up to 1.2 GHz at less than 8 W.

em.avnet.com/axiom_npiana

Analog devices Microwave pll SynthesizerThe ADF41020 frequency synthesizer can be used to implement local oscillators as high as 18 GHz in the up conversion and down conversion sections of wireless receivers and transmitters. It consists of a low noise, digital phase frequency detector, a precision charge pump, a programmable reference divider, and high frequency programmable feedback dividers (A, B, and P).

A X I O M

38

panasonic bluetooth® triple Mode rF ModulesThe PAN1323 series provides easily integrated Bluetooth Version 4.0 and ANT connectivity into new and current designs by removing RF design and certification barriers from the development of the application. Gain unprecedented access using this three mode gateway module that can connect 14 million ANT nodes to over 3 billion Bluetooth nodes.

em.avnet.com/axiom_npipic

OCZ Z-drive r4 pCIe SSdsDesigned and manufactured for a wide range of enterprise environments, including cloud computing and data centers, the Z-Drive R4 features OCZ’s Virtualized Controller Architecture (VCA) 2.0. This architecture provides top performance, flexibility, durability and enhanced reliability, allowing data centers to rely on a PCIe-based SSD as their primary tier one storage solution for the first time.

em.avnet.com/axiom_npiocz

Murata power Solutions 400 W AC-dC ConverterThe new industry-leading MVAC400 power converters feature 400 W of power packaged in a standard 1U open frame format measuring just 76.20 x 127.00 x 35.56 mm (3 x 5 x 1.4 inches). The MVAC400 models accommodate the universal AC input voltage range from 90 to 264 VAC with active power factor correction (PFC) and active inrush protection.

em.avnet.com/axiom_npicdt

Molex ruggedized Interconnect productsMolex offers a variety of interconnect products designed to meet the need for a rugged, environmentally sealed connector system supporting both low-level signal applications as well as power applications. Options are available in wire-to-wire, wire-to-panel and wire-to-board configurations. These products deliver optimal performance especially in wet, high-vibration and wide-operating-temperature conditions.

em.avnet.com/axiom_npimlx2

em.avnet.com/axiom_npimlx

Molex top-Contact FpC ConnectorMolex’s top-contact 0.25 mm FPC connector provides greater PCB space savings and contact reliability — even when subjected to shock or vibration — compared to similar competitive designs. The top-contact 0.25 mm pitch FPC connector expands Molex’s range to provide customers with the industry’s largest offering of 0.25 mm pitch FPC connector choices. Molex is currently the only maker to offer both top-and bottom-contact designs.

Microsemi SmartFusion2 SoC FpgAMicrosemi’s next-generation SmartFusion2 SoC FPGAs are the only devices that address fundamental requirements for advanced security, high reliability and low power in critical industrial, military, aviation, communications and medical applications. SmartFusion2 integrates an inherently reliable flash-based FPGA fabric, a 166 MHz ARM® Cortex™-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM, and industry-required high-performance communication interfaces all on a single chip.

em.avnet.com/axiom_npimsw

wHaT’s NEw

N e w P r o d u c t I N t r o d u c t I o N s

39

texas Instruments precision Amplifier Value lineThe Texas Instruments Precision Amplifier Value Line was conceptualized to enable the designer to address performance needs in price sensitive designs across a wide variety of applications. The line offers three best-in-class performance amplifier families to solve design challenges in low power, low voltage and wide supply designs.

em.avnet.com/axiom_npitis2

te Connectivity Interconnect, passive and electromechanical productsTE releases 100s of new products each year and Avnet Electronics Marketing consistently stocks all of the latest components and design kits to support new designs. New products are clearly marked in the part selector tool, and are available in multiple packages with many offered via the cut reel program.

em.avnet.com/axiom_npitye2

te Connectivity zQSFp+ Interconnect SystemThe zQSFP+ (z-Quad Small Form-factor Pluggable Plus) connector and cage assembly is a high-density, high-speed product solution designed for applications in the telecommunications, data center and networking markets. The interconnect offers four channels of high-speed differential signals with data rates ranging from 25 Gbps up to potentially 40 Gbps.

em.avnet.com/axiom_npitye

StMicroelectronics tSX56 Series Micropower Op AmpsThe TSX56 op amp series delivers new levels of accuracy, energy, efficiency, space savings and rugged performance. It benefits from a new generation of advanced 16 V CMOS op amps that simplify the design of sensors for applications from automotive electronics to smart buildings and industrial controls. The new process, developed in-house, enables tiny die sizes, resulting in available ultra-small surface-mount packages.

em.avnet.com/axiom_npistm2

em.avnet.com/axiom_npitis

texas Instruments tpS92510 Constant Current buck Converter for hbledsThe TPS92510 is a 60 V, 1.5 A peak current-mode step-down converter with an integrated high-side MOSFET. It is specifically designed for driving high-brightness LEDs with a constant current. The tight-tolerance, 200 mV internal reference voltage reduces power dissipation in the current-sense resistor.

em.avnet.com/axiom_npistm

StMicroelectronics l6480 cSpIn Motor driverThe L6480, a member of the STMicroelectronics’ cSPIN family, is an advanced fully integrated motion controller solution suitable for driving two phase high power bipolar stepper motors with microstepping. Precision movement and positioning systems can be smaller, lighter, simpler and more efficient thanks to the L6480’s integration and embedded intelligence to manage the motion.

wHaT’s NEw

Design ZonesAs an engineer, it’s your job to bring innovative products and solutions to market quickly. To help make this happen, Avnet Electronics Marketing has created new Design Zones that bring you instant access to rich product details, selector guides, technical resources and up-to-date industry trends in key market areas such as:

Instant Access to the Materials & Information You Need

discover the endless possibilities of designing with Avnet!

www.em.avnet.com/designzones

A X I O M

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markET & TECHNOlOgY TrENds

real-time Information on pricing and lead times

Product

lead tiMe trend Price trend

coMMentscurrent

trend vs. Previous

Monthtrending

FroM 2/13

to 5/13

Analog 2-16+ weeks Both pricing and lead times are stable overall.

Communications 4-22 weeks Both pricing and lead times are stable overall.

Digital Signal Processors

2-20 weeks Lead times are stable to improving slightly for some products. Overall pricing is stable, however we are seeing increases for some legacy/mature products.

Discrete 4-26 weeks Both pricing and lead times are stable overall.

Logic 4-10 weeks ASPs have stabilized and lead times remain stable at a low level.

Memory 4-12 weeks Both pricing and delivery is stable overall.

Microcontrollers 2-16+ weeks Lead times have moved in slightly at the high end and ASPs have stabilized overall, however we are seeing some price increases for legacy/mature products.

Opto 4-14 weeks Both pricing and lead times have stabilized overall.

Processors 4-22 weeks Both lead times and pricing are stable overall, however we are seeing price increases for some legacy/mature products.

Progammable Logic

4-16 weeks Both pricing and lead times remain stable.

RF 2-26 weeks Both lead times and pricing are stable overall, however we are seeing price increases for some legacy/mature products.

iPe

Commercial Electromechanical

Stock to 19 weeks

Pricing is stable overall. Lead times are beginning to decline back to normal as manufacturing “catches up” from the Lunar New Year.

Miltary Electromechanical

Stock to 24 weeks

Pricing is stable overall, however it should be monitored closely because of the fluctuation of raw material cost for the foreseeable future. Lead times are beginning to decline back to normal as manufacturing “catches up” from the Lunar New Year.

Commercial Interconnect

Stock to 9 weeks

Following the price increases in January, pricing and lead times are now stable. Customers should review their applications and ask the question – Do they really need gold plating when gold flash might suffice?

Millitary Interconnect

Stock to 16 weeks

Lead times are stable and in some cases coming in slightly. Pricing has also been stable and should be for the short term.

Commercial Passive

Stock to 54 weeks /

COE

Lead times continue to vary across the Passive Commodities ranging from stock to 54 weeks. Keep in mind that some products may require contacting the manufacturer for accurate lead times. Pricing is stable.

Military Passive 6-16 weeks Lead times have come in slightly for some products and the overall trend is very stable. Pricing is also stable.

Power Supply Stock to 24 weeks

Pricing is stable overall. Lead times are beginning to decline back to normal as manufacturing “catches up” from the Lunar New Year.

Sign up to receive this innovative enewsletter today: www.avnetpreferencecenter.com

Watch the most recent Market & Technology Trends report highlights: http://youtu.be/r3w9ggX7eIk

Looking for new and innovative ways to get your designs to market faster? With Avnet Electronics Marketing’s Market & Technology Trends, you can track lead times, market updates, pricing and new technology information on HUNDREDS of different products in 15 different commodities.

A X I O M

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a QUICk glaNCE

bIg IdeAS And InduStry trendSPanasonic: Bluetooth Low Energy is the World’s Next Great Technology . . . .  14

em.avnet.com/axiom_picbleRowebots Research: Keys to Selecting a Wireless Network Protocol . . . . . . .   11

rowebots.comTE Connectivity: SFP+ Enhancements Enable Network Need for Speed . . . . . .   6

em.avnet.com/te

MAnuFACturer prOduCtS & SOlutIOnSAnalog Devices Blackfin® Embedded Vision Starter Kit, featuring FinBoard™   20

finboard.orgAnalog Devices ADL5324 ½ RF Driver Amplifier . . . . . . . . . . . . . . . . . . . . .   21

Analog Devices ADF4351 Integrated Mulit-band Silicon VCO Circuit . . . . . .   21em.avnet.com/axiom_anasynthesizer

Analog Devices Delivers Unequaled RF Performance, Selection and Integration   43analog.com/RF

Maxim Peripheral Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   25em.avnet.com/axiom_mxmpmod

Microchip MCP19111 Digitally Enhanced Power Analog Controller . . . . . . . .  24em.avnet.com/axiom_mcccontroller

Molex MX150L™ Industrial Sealed Connector System . . . . . . . . . . . . . . . . . .   23em.avnet.com/axiom_mlxmx150L

Molex Brad® Micro-Change® M12 Harsh Duty Receptacles . . . . . . . . . . . . .   23em.avnet.com/axiom_mlxbrad

Panasonic PAN1720 Series Bluetooth® Low Energy RF Module . . . . . . . . . . .   22em.avnet.com/axiom_picpan1720

Panasonic PAN1326/1316 Series Dual-Mode Bluetooth & Bluetooth Low Energy   22em.avnet.com/axiom_picpan1326

Renesas RX or RL78 Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   26am.renesas.com/micrium

TE Connectivity Modular Jacks and Plugs . . . . . . . . . . . . . . . . . . . . . . . . . .   18em.avnet.com/axiom_tyemodular

TE Connectivity SFP+ Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   19em.avnet.com/axiom_tyesfpconnectors

TE Connectivity AMP-LATCH Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . .   19em.avnet.com/axiom_tyeamplatch

TE Connectivity Circular Power Connectors . . . . . . . . . . . . . . . . . . . . . . . . .   27em.avnet.com/axiom_tyecpc

TE Connectivity USB3.0 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   27em.avnet.com/axiom_tyeusb3

TE Connectivity CeeLok FAS-T Connectors . . . . . . . . . . . . . . . . . . . . . . . . . .   28em.avnet.com/axiom_tyeceelock

TE Connectivity MULTIGIG RT 2-R Connectors . . . . . . . . . . . . . . . . . . . . . . .   28em.avnet.com/axiom_tyemultigig

TE Connectivity Virtual IO Sample Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   29em.avnet.com/axiom_tyevirtualsamplekit

Texas Instruments WEBENCH® Design Center . . . . . . . . . . . . . . . . . . . . . . .   13em.avnet.com/axiom_tiswebench

Toshiba TransferJet™ Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  30toshiba.com/taec/components/Description/pop_transferjetvideo2.html

Weidmuller OMNIMATE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   16Contact Nicole at 804.379.6036

reSOurCeSDesign Zones by Avnet Electronics Marketing . . . . . . . . . . . . . . . . . . . . . . .  40

em.avnet.com/designzonesEmbedded Software Store . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   9, 10

embeddedsoftwarestore.comMarket & Technology Trends . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   41

em.avnet.com/publications

Supply ChAIn VelOCItyInformation is Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   31

ebnonline.com/velocity/ or contact avnet.velocity@avnet.comSimplified Supply Chain Solutions from Avnet . . . . . . . . . . . . . . . . . . . . . . .   36

avnetexpress.com

trAInIng & eVentSAvnet Great Lakes: Embedded World . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  34

em.avnet.com/axiom_avnetgreatlakes_ewAvnet Wi-Go Design Challenge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  34

em.avnet.com/axiom_wigodesignchallengeEmbedded Vision Summit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  34

embedded-vision.com/embedded-vision-summitFreescale Kinetis-L Online Customer Training Modules . . . . . . . . . . . . . . . . .   35

em.avnet.com/axiom_frskinetistrainingMicrosemi SmartFusion2 SoC FPGA SpeedWay Design Workshops™ . . . . . .   35

em.avnet.com/axiom_mswsmartfusionworkshopBuilding a Security Surveillance System: Timesys University Local Edition Workshop . . . . . . . . . . . . . . . . . . . . . . . . .  34

em.avnet.com/axiom_timesyssecurityVideo-based Xilinx® Zynq™-7000 AP SoC SpeedWay Design Workshops™ .   35

zedboard.org/trainings-and-videosOn-demand trainings and demos, technical webcasts and new training announcements . . . . . . . . . . . . . . . . . . . . . . . . .   35

em.avnet.com/axiom_training

WhAt’S neWAnalog Devices ADF41020 Microwave PLL Synthesizer . . . . . . . . . . . . . . . .   37

em.avnet.com/axiom_npianaEmerson Network Power MVME2500 VME64 Processor Board . . . . . . . . . .   37

em.avnet.com/axiom_npiefjIDT VersaClock Low Power Clock Generator . . . . . . . . . . . . . . . . . . . . . . . .   37

em.avnet.com/axiom_npiidtIntel® Platform for Large Scale Communications Infrastructure Systems . . . . .   37

em.avnet.com/axiom_npiitlKontron Digital Signage Evaluation Kit DSEK-12 . . . . . . . . . . . . . . . . . . . . .   37

em.avnet.com/axiom_npikntMathWorks DSP Design Package for Xilinx Kits . . . . . . . . . . . . . . . . . . . . . .   37

em.avnet.com/axiom_npimthMicrosemi SmartFusion2 SoC FPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  38

em.avnet.com/axiom_npimswMolex Top-Contact 0.25 mm FPC Connector . . . . . . . . . . . . . . . . . . . . . . . .  38

em.avnet.com/axiom_npimlxMolex Ruggedized Interconnect Products . . . . . . . . . . . . . . . . . . . . . . . . . .  38

em.avnet.com/axiom_mlx2Murata Power Solutions 400 W AC-DC Converter . . . . . . . . . . . . . . . . . . . .  38

em.avnet.com/axiom_npicdtOCZ Z-Drive R4 PCIe SSDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  38

em.avnet.com/axiom_npioczPanasonic Bluetooth® Triple Mode RF Modules . . . . . . . . . . . . . . . . . . . . . .  38

em.avnet.com/axiom_npipicSTMicroelectronics L6480 cSPIN Motor Driver . . . . . . . . . . . . . . . . . . . . . . .   39

em.avnet.com/axiom_npistmSTMicroelectronics TSX56 Series Micropower Op Amps . . . . . . . . . . . . . . .   39

em.avnet.com/axiom_npistm2TE Connectivity zQSFP+ Interconnect System . . . . . . . . . . . . . . . . . . . . . . . .   39

em.avnet.com/axiom_npityeTE Connectivity Interconnect, Passive and Electromechanical Products . . . . . .   39

em.avnet.com/axiom_npitye2Texas Instruments TPS92510 Constant Current Buck Converter for HBLEDs . .   39

em.avnet.com/axiom_npitisTexas Instruments Precision Amplifier Value Line . . . . . . . . . . . . . . . . . . . . .   39

em.avnet.com/axiom_npitis2

Links and page references to the big ideas and industry trends, products, solutions, trainings and more featured in this issue.

Unequaled RF performance, selection, and integration.ADI delivers.1000+ RF ICs, industry-leading tools, and referencecircuits optimize radio designs.

No one is delivering more ways to meet RF design challenges than Analog Devices. We provide 1000+ high performance ICs for every part of the RF signal chain. From high performance discrete building blocks to integrated subsystems on a chip, ADI offers solutions for every RF challenge. Complete reference circuits, best-in-class online design tools, webinars, evaluation boards, and technical support forums further assure optimum design success. Explore our innovative products and design resources at analog.com/RF.

analog.com/RF

Integrated functionsfor multiple frequencies› ADF435x: Wideband PLL, VCO› ADRF660x: Mixer, PLL, VCO› ADRF670x: Modulator, PLL, VCO› ADRF680x: Demodulator, PLL, VCO › ADRF6510/ADRF6516: Dual VGAs, fi lters› ADRF6850: Demodulator, PLL, VCO, VGA

Design resources› RF Tools: ADIsimPLL™, ADIsimRF™, ADIsimSRD™, ADIsimCLK™

› Circuits From the Lab™: dozens of RF reference circuits› EngineerZone™: online support community

ADC

ADC

DAC

DAC

I/Q MOD

I/QDEMOD

ADCDRIVER

ADCDRIVER

PLL/PRESCALER

AMP

VGAVGADGA

VGADGA

LNA

Rx MIXER

Tx MIXER

Tx/RxDUPLEXER

HPALINEARIZATION

LOG/RMSCONTROL

AMP

AMP

High performance ICs for every part of the RF signal chain

ADI-13083_RF.indd 1 2/27/13 9:21 AM

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