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Tom Watzka Satwant SinghLattice Semiconductor Lattice Semiconductor
Mobile Influenced Markets –Evolution of Camera and Display Uses
©2017MIPIAlliance,Inc.
• ThePCindustrycreateddemandinadjacentmarketssuchastestequipment,POSterminals,andindustrialcontrols
• DesignersleveragedtheiraccesstostandardizedAPIsandhardware
• Inasimilarway,themobileindustryisexperiencingdemandforhighquality,lowcostcomponentsinmobileinfluencedmarkets
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LatticeSemiconductor
LatticeMIPID-PHY℠Applications
©2017MIPIAlliance,Inc.
TraditionalDisplayApplications
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LatticeSemiconductor
RearDisplay
FrontDisplay
SplitAP
AP
• Traditionaldisplayapplicationswillincludeone(maybetwo)staticdisplays
©2017MIPIAlliance,Inc.
Industrial
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LatticeSemiconductor
Appliances
Automotive
SOC Bridge
AP Bridge LVDSDSI
LVDS
BRIDGING
Manyconsumer,automotive,andindustrialapplicationsuseolderLVDSinterfaces
©2017MIPIAlliance,Inc.
AR/VR(Displays)
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LatticeSemiconductor
SplitAP
LeftEyeRightEye
HDMIBridge
Input
Monitor
Minimumframerateof75Hzisneededtoavoidmotionsickness.
Mergingisthefavoredmethodtominimizeeye-to-eyelatency.
©2017MIPIAlliance,Inc.
MuxvsMerge
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LatticeSemiconductor
MergeLine1 Line2Camera1
Output
Line1
Line1 Line2Camera1
Line2
Input Output=2XInputBandwidth,0Latency
MuxFrame1Camera1
Output Frame1
Frame1Camera2
Frame2
Frame2
Frame3
Frame3
Frame4
Frame4
Frame2 Frame3 Frame4
Input Output=1XInputBandwidth,1FrameLatency
Frame1 Frame2 Frame3
…
• Videodatacanbe“multiplexed”throughasingleMIPID-PHYportbymux-ing framebyframe,ormergingtosuperframes.
©2017MIPIAlliance,Inc.
TraditionalCameraApplications
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LatticeSemiconductor
RearCamera
FrontCamera
Mux AP
• Traditionalcameraapplicationsstaticallyswitchfromonecameratotheother
©2017MIPIAlliance,Inc. 8
LatticeSemiconductor
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RequiresEnvironmentAwareness• IMU– InertialMeasurementUnitPerformingSensorFusionforAccelerometer,
Gyrometer &Magnetometer• Cameras
– DistanceMeasurement– EnvironmentalUnderstanding
AR/VR(Cameras)
©2017MIPIAlliance,Inc.
AR/VRTracking
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LatticeSemiconductor
Outside-InSystem
• Twoapproachestopositionaltracking:– Outside-Inrequiresexternalhardware– Inside-outisselfcontained
Inside-OutSystem(suchasMicrosoftHololens)
©2017MIPIAlliance,Inc.
AR/VRPermutationsforInside-Out
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LatticeSemiconductor
2XBandwidth,0Latency
~3XBandwidth,0Latency
:
Input
~5XBandwidth,0Latency
TOF TOF
TOFTOF
Output• Inside-out
implementationsaregrowinginthenumberofcamerasandsensors
©2017MIPIAlliance,Inc.
Drones
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LatticeSemiconductor
• RequiresamethingsasAR/VR• Plusmorecameras
360Cameras
Automotive
• Justmorecameras
Merge Transport GPU
• RequiresamethingsasAR/VR• Plustransport
Merge AP
Merge AP
©2017MIPIAlliance,Inc. 12
LatticeSemiconductor
EverythingElseSOC Bridge
AP Bridge LVDSDSI
LVDS
LVDS
DSI
AP Bridge DualLVDS
DSI LVDSLVDS
SOC BridgeCMOSRGB/24
DSI
APBridge CSI-2CMOSRGB/24
SOCBridgeCSI-2
CMOSRGB/24
APRe-Time CSI-2CSI-2
©2017MIPIAlliance,Inc.
• FPGAshavegeneralpurposeIOsinadditiontospecializedIOssuchasMIPID-PHY
• FPGAsprovideanarrayofflexibleprogrammablelogiccellsthatcansupporthighspeeddataflowincludingsplittingandmergingfunctions
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LatticeSemiconductor
CrossLink
Prog
rammab
leI/O
MIPID
-PHY
ProgrammableFPGAFabric
WhyFPGAs?Flexibility
©2017MIPIAlliance,Inc.
WhyFPGAs?TimeToMarket
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LatticeSemiconductor
ASICs=18monthdev cycle
Consumer=6– 12
monthdevcycle
Design RTL
Simulate
Pass
Synthesize
Debug
Pass
Features
Time
DaystoWeeks
DevCycle
• ProductdevelopmentcycleismuchfasterthanASICcycles• FPGAsenableinnovation
©2017MIPIAlliance,Inc.
Summary• MIPIcomponentshavebecomeubiquitous
– Cameras,Displays,APs,Accelerometers,Gyrometers,Magnetometers…
• Mobileinfluencedmarketsareleveragingthesecomponentsinallsortsofwaysandcombinations
• FPGAshavebeeninstrumentalinenablingthesenew(andunforeseen)marketsinwaysthatsimplebridgescannot,intermsoftimeandfunctionality
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LatticeSemiconductor