BACK FOR 2016!

www.emc2016.emcss.org

ADVANCE PROGRAM

THE IEEE International Conference onSignal and Power Integrity (SIPI-2016)

BACK FOR 2016!BACK FOR 2016!

http://www.emc2016.emcss.org/

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ADVANCE PROGRAM | WWW.EMC2016.EMCSS.ORG | 3

2016 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY

Top Reasons for attendance1. Learn EMC, Signal Integrity and Power

Integrity techniques

2. Three days of expert technical papers and two full days of practical EMC & SIPI workshops and tutorials

3. Experiments and demonstrations of fundamental and advanced topics

4. Exhibits! New Technologies, Instrumentation and Solutions

5. Social networking, connecting and unique Ottawa culture

The IEEE EMC Society invites you to attend The 2016 IEEE International Symposium on Electromagnetic Compatibility, featuring an embedded Signal Integrity and Power Integrity conference.

The IEEE EMC Symposium provides knowledge and tools that help engineers address electromagnetic environmental effects, electromagnetic compatibility, and signal integrity and power integrity.

Stay abreast of current technologies, testing and engineering methods.

25th – 29th July 2016Ottawa, ONtario Canada

at The Shaw Centre

Please Join Us in BRINGING COMPATIBILITY TO THE CAPITAL

Phot

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edit:

Otta

wa

Tour

ism

EMC 2016 also features: • Embedded SIPI Conference• Special Military EMC Program• Special Session on Aerospace EMC• Keynote Speaker,

Dr. Robert Scully of NASA• Panel Discussions • Ask the Experts



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Welcome 3Chairman’s Letter . . . . . . . . . . . . . . . . . . . . . . 7Symposium Overview. . . . . . . . . . . . . . . . . . . . . 8Schedule at a Glance . . . . . . . . . . . . . . . . . . . . . 12

technical program 14Keynote Presentation . . . . . . . . . . . . . . . . . . . . . 16Workshops and Tutorials . . . . . . . . . . . . . . . . . . . 18Special Sessions . . . . . . . . . . . . . . . . . . . . . . . 38Special Military EMC Program. . . . . . . . . . . . . . . . . 40Technical Sessions . . . . . . . . . . . . . . . . . . . . . . 41Panel Discussions. . . . . . . . . . . . . . . . . . . . . . . 42Ask The Experts . . . . . . . . . . . . . . . . . . . . . . . 43Experiments and Demonstrations . . . . . . . . . . . . . . . 46Youth Technical Program . . . . . . . . . . . . . . . . . . . 47Technical Committees. . . . . . . . . . . . . . . . . . . . . 48Working Groups and Meetings . . . . . . . . . . . . . . . . 51 Industry Hosted Technical Workshops . . . . . . . . . . . . . 52

education 54Professional Development Hours . . . . . . . . . . . . . . . 54Clayton R. Paul Global University . . . . . . . . . . . . . . . 55

social Networking 57Welcome Reception. . . . . . . . . . . . . . . . . . . . . . 58Evening Gala. . . . . . . . . . . . . . . . . . . . . . . . . 58Awards Luncheon. . . . . . . . . . . . . . . . . . . . . . . 59Special Networking Events . . . . . . . . . . . . . . . . . . 60

Exhibit hall 63

Destination and Accommodations 65Host Location . . . . . . . . . . . . . . . . . . . . . . . . 66Getting Around . . . . . . . . . . . . . . . . . . . . . . . . 67Travel Information . . . . . . . . . . . . . . . . . . . . . . 69

Companion Program 70

Registration information 74

Meet the committee 78

TABLE OF CONTENTS

thank you to our 2016 sponsors

GENERAL INFORMATION

Media Sponsors:ENR / Seven Mountains Scientific, Inc.

Espresso EngineeringEvaluation Engineering

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Something that many visitors may not know about the host city for The EMC Symposium is that Ottawa became the Capital of Canada in 1857 by Royal Proclamation of Queen Victoria. At the time, the Capital of Canada had been switching between Toronto, Quebec City, and Kingston but these cities’ proximity to the border with the United States made them vulnerable to, what was then called “Republican’s Contamination” - something British Royalty was sensitive about since 1776. So Victoria handed over 250,000 Pounds Sterling and ordered the seat of her government north on the Rideau Canal to a little lumber town deep in the woods and far from “the frontier”. Today, The Rideau Canal that moved the Capital to Ottawa is a United Nations World Heritage Site. That little lumber town has grown into the seat of political power of a G8 nation and a world-class city in its own right. The pristine beauty is still here and the city, at the convergence of the Ottawa, Gatineau and Rideau Rivers now offers up entertainment, social events, and business opportunities undreamed of by Queen Victoria and the area’s original settlers. This is the setting for your 2016 EMC Symposium. The Committee has worked hard over the past couple of years to bring you the quality program that has been the hallmark of previous symposia, and I believe we have succeeded once again. Our Technical Committee has prepared a program that features almost 200 original research papers, several excellent tutorials, multiple workshops and demonstrations of the latest innovations in EMC science. We have cutting edge research and established practices available to those who are here to learn. A key highlight this year is the return of the joint Symposium combining EMC and Signal and Power Integrity topics that has seen much success over the past several years. And in recognition of the fact that Ottawa is the centre for Canadian military and space exploration, our 2016 Symposium has undertaken to include special military and space exploration EMC topics and events. 2016 is the year of multiple special topics and you will see these highlighted in this program.

Kicking off the Symposium and setting the tone for the topics on space EMC is our keynote speech. This year I am personally honoured and we are privileged to have an outstanding EMC Engineer from NASA, Dr. Robert Scully, deliver the keynote. Bob has worked on the unique and complex problems of EMC on the International Space Station and the Space Shuttle programs. Bob is also a past President of the IEEE EMC Society, a personal friend and a heck of a nice guy. This keynote is not to be missed.

Our social program this year is simply amazing. The Committee has the two most beautiful venues in the city selected for our reception and gala. Tuesday night’s reception is being held in the Grand Hall of the Canadian Museum of History where you will eat, socialize and be entertained

amongst the authentic First Nations artifacts on display. Your Committee has arranged for part of the museum exhibits to remain open for private viewing by attendees and, to carry on the First Nations theme of the evening, a rare performance of The Aboriginal Experience native dance. Wednesday night’s Gala is no less impressive. Attendees will be wined and dined in the Shaw Centre Trillium Ballroom with a million-dollar view of Downtown Ottawa and the Rideau Canal. Both the gala and reception will be catered by local celebrity chefs. Throughout the week, EMC 2016 Attendees have a variety of choices for extra activities including tea time and wine tasting at the historic Mackenzie-King Estate, bike rides on some of the 500 km of bike trails that service the area, a tour of the Canadian Space Agency David Florida Labs, and tours of the Canadian Parliament Building, and National Museums. The week is full of potential. Your time can’t help but be well spent. Your 2016 Committee is available to help you make the most of it.

Kris HatashitaKris Hatashita 2016 EMC Symposium General Chair

A Message from the general chair

Welcome to The 2016 IEEE International Symposium on EMC and to my unique and beautiful home town of Ottawa, Canada..

GENERAL INFORMATION



8 | ADVANCE PROGRAM | WWW.EMC2016.EMCSS.ORG


We hope you will join us For EMC 2016 in Ottawa, Canada!Home to over 1,800 tech companies that employ close to 1,000,000 people, Canada’s Capital city is in a region known internationally for technological enterprise and government research, making it the perfect location to host the 2016 IEEE International Symposium on Electromagnetic Compatibility. Come discuss your ideas, exchange information and collaborate with the EMC and SIPI Communities.

The City of Ottawa is delighted to welcome The Institute of Electrical and Electronics Engineers 2016 International Symposium on Electromagnetic Compatibility. Ottawa is a premier hub of technology in Canada with EMC laboratories serving government and industrial needs. We trust that Symposium attendees will enjoy our Canadian hospitality, while discovering the diversity of cultural, historic and contemporary attractions and activities, which Canada’s capital city has to offer.

Sincerely,

La Ville d’Ottawa est ravie d’accueillir en 2016 le Symposium international sur la compatibilité électromagnétique de l’Institute of Electrical and Electronics Engineers. Ottawa est un des principaux centres de technologie au Canada et possède des laboratoires de compatibilité électromagnétique qui répondent aux besoins des gouvernements et de l’industrie. Nous sommes convaincus que les participants au Symposium goûteront l’hospitalité canadienne tout en découvrant la diversité des attractions et activités de nature culturelle, historique et contemporaine qu’offre la capitale du Canada.

Recevez mes salutations distinguées.

Message from the Mayor

Ottawa, Canada at the Shaw CentrE

25-29, July, 2016

5 Days of technical info 200+ Papers, talks,

and events

1,000+ EMC, SIPI, RF Engineers Numerous Networking

opportunities

GENERAL INFORMATION

Jim Watson, Mayor





Technical TopicsLeading Edge Info on:• EMC Management• Low Frequency EMC• Computational Electromagnetics• High Power Electromagnetics• Electromagnetic Environments• Military EMC Program• Theme Topic I – Signal & Power Integrity

- High-speed channel characterization and modeling- Signal/power integrity co-design and co-simulation- 3D IC and 3D packaging- Measurement techniques- Jitter, equalization, BER

• Theme Topic II – EMC for Emerging Technologies

- Wireless EMC- Radio-Frequency Interference- Smart Grid EMC- Nano-Materials and Silicon Photonics- Unmanned Aircraft Systems EMC

• Theme Topic III – Space EMC- Launch vehicles- On-orbit platforms- Systems and Networks- Design and Mitigation for the Space Environment

Technical Format Guide

Workshops

Tutorials

Technical Sessions

Special Sessions

Experiments & Demonstrations

Panel Discussions

GENERAL INFORMATION



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GENERAL INFORMATION

The IEEE EMC Society Mission:To foster the development and facilitate the exchange of scientific and technological knowledge in the discipline of electromagnetic environmental effects and electromagnetic compatibility, as detailed in the EMCS’s field of interest (FOI), and promote literary, educational and professional aspects thereof, that benefit members, the profession and humanity.

Explore the Daily agenda » Technical Program... Review the many EMC and SIPI sessions available | Page 14

Explore out of session options » Social Networking Events... Connect with others in the community | Page 57 » Exhibits... Check out this year’s features and planned exhibitors | Page 63 » Things To Do... Enjoy the local attractions and embrace the scenery | Page 68

Register » Registration... Don’t miss out on early bird rates or take advantage of group discounts | Page 74 » Accommodations... There are many nearby hotels to accommodate your stay | Page 67

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2

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Planning your Symposium experience:

What you can expect from EMC 2016: • Five full days of technical and social networking events• Attend any of our 21 workshops and/or tutorials• Over 200 technical and abstract reviewed papers focused

on EMC and SIPI• Get down to the specifics during the five special sessions,

including Aerospace EMC • Participate in one or more of our five panel discussions,

including Ask the Experts• Stay informed at the special two-day Military EMC Program • Get a hands-on experience during experiments and

demonstrations• Explore an exhibit hall full of innovative industry products,

technologies, and services • Connect with industry experts and peers during numerous

formal and informal social networking events

get involved and volunteerLearn about the benefits on Page 31





SCHEDULE AT A GLANCE

8:00 AM

9:00 AM

10:00 AM

11:00 AM

12:00 PM

1:00 PM

2:00 PM

3:00 PM

4:00 PM

5:00 PM

6:00 PM

7:00 PM

8:00 PM

ConcurrentSessions

ConcurrentSessions

ConcurrentSessions

Break & Exhibits

Opening Session

Break & Exhibits

Workshops & Tutorials




Break

Break

Break Break & ExhbitisEx

hibits

ConcurrentSessions

ConcurrentSessions

ConcurrentSessions

Break & Exhibits

Concurrent Sessions

Break & Exhibits

Break & Exhbitis

Exhib

its

Monday, 25 July Tuesday, 26 July Wednesday, 27 July

Welcome Reception

Evening Gala

GENERAL INFORMATION






8:00 AM

9:00 AM

10:00 AM

11:00 AM

12:00 PM

1:00 PM

2:00 PM

3:00 PM

4:00 PM

5:00 PM

6:00 PM

7:00 PM

8:00 PM

ConcurrentSessions

Concurrent Sessions

ConcurrentSessions

Break & Exhibits

Concurrent Sessions

Break

Awards Luncheon

Exhib

its





Break

Break

Break

Thursday, 28 july Friday, 29 July

Welcome reception Tuesday, 26 July 6:00 PM - 8:00 PM

Evening Gala Wednesday, 27 July 6:30 PM - 9:30 PM

Awards luncheon Thursday, 28 July 12:30 PM - 2:00 PM

Speakers’ ROOM Monday through Friday 7:00 AM - 5:OO PM

Companion Suite Monday through Friday 7:00 AM - 10:00 AM Registered companions only

We hope you will join us at Symposium this year!

A week of top quality EMC and SIPI information and connections awaits you!

GENERAL INFORMATION





The EMC 2016 Technical Program will provide a wealth of knowledge to EMC and SIPI professionals across a variety of disciplines and industries.

Participate in interactive workshops and tutorials, learn from case studies and new research during technical sessions including papers, posters, and panel discussions, and dive into in-depth during special sessions and special program events.

TECHNICAL PROGRAM


Tuesday, 26 July

Concurrent technical sessions Special sessions

Welcome Reception

MONDAY, 25 July

Full Day Tutorials | 8:00 AM - 5:00 PM

» Fundamentals of EMC Sponsored by IEEE EMCS Education Committee (EdCom)

Half Day Tutorials (AM) | 8:00 AM - 11:30 AM » Development Activities for IEEE P370 Standard -

Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz Sponsored by TC10

» Application of Reverberation Chambers

» Measurement Uncertainty – Challenges and Solutions

» State-of-the-art Research and Education in Electromagnetic Information Security Sponsored by TC5

Half Day Tutorials (PM) | 2:00 PM - 5:00 PM » Automotive EMC – Future Standards

» Updates and New Test Methodologies

» The Role of the IEC Advisory Committee on EMC (ACEC) in Coordinating IEC EMC Activities Sponsored by TC2

» Introduction to EMI Modeling Techniques Sponsored by TC9

» Modeling and Computational Electromagnetics for Nanotechnology and Advanced Materials Sponsored by TC9 and TC11

» Military EMC

Stay tuned for the complete technical program schedule to be announced in May!

Sign up for our newsletter to be notified.



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Friday, 29 July

Half Day Tutorials (AM) | 8:00 AM - 11:30 AM » Testing of Wireless Devices in the Modern World:

Addressing Current and Future Performance Expectations

» Introduction to Medical EMC

» Basic EMC Measurements Sponsored by TC2

» Signal Integrity and Power Integrity Fundamental for Computer and Communication Systems

» EMC Consultant’s Toolkit

Half Day Tutorials (PM) | 2:00 PM - 5:00 PM » Recent Developments and Advanced Measurements

method in EMC for Emerging Wireless Technologies Sponsored by TC12

» Techniques and Measures to Manage Risks with Regard to Electromagnetic Disturbances Sponsored by TC1

» Smart Grid Support and EMC Issues Sponsored by SC1

» Crosstalk – Theory, Modeling, Characterization, and Design Optimization Sponsored by TC9 and TC10

» Calibration of EMC Measurement Instrumentation

TECHNICAL PROGRAM


Wednesday, 27 July


Evening gala

Thursday, 28 July


Awards luncheon

Keynote Speaker, Dr Robert Scully Of NASAElectromagnetic Compatibility in 2016 and Beyond: What Is It and Why Do We Care?

Access to workshops and tutorials included in technical registration.





Electromagnetic Compatibility in 2016 and Beyond: What Is It and Why Do We Care?Electromagnetic compatibility (EMC) has come a long way from the days when radio equipment was installed in military aircraft with exposed antenna leads and the need to control the undesirable effects of such an arrangement was recognized. Topics today are far greater in scope than a handful of individual and rather specialized or unique circumstances. The need for co-existence and interoperability of multiple systems competing for the same spectrum and the growing awareness of both unintentional and intentional electromagnetic interference are driving hardware, software, and system designers and managers to rethink how electromagnetic compatibility plays a central and pivotal role in successful products ranging from cell phones to smart refrigerators to automobiles to commercial and military aerospace platforms. Often times, EMC has been the “bastard child” of engineering, shifting from one department to the next with each reorganization because decision makers don’t fully comprehend how EMC fits into the overall scheme of product development. That’s not altogether the fault of the decision makers; EMC engineers that are very good at what they do generally end up being transparent in the process. Given the opportunity, we look at the design, the system, and determine what needs to be done to ward off EMC problems arising as development proceeds. Product after product ships with no EMC problems identified, and soon management begins asking “What value added are you guys? I don’t see that we have any problems you have to fix!” Working with this sort of management leads to last ditch, high profile visits to the EMC lab to identify why the product failed its radiated emissions measurements and what are the changes that can be implemented that will cost nothing, require zero time for implementation, and add zero mass and volume to the product. Of course, not all managers fall under this description, and a growing number of them are recognizing that EMC is and must be an integral part of the product, from start to finish. This is true across a broadening swath of industry, both commercial and military. This Symposium has several areas of focus that highlight different aspects of the discipline where such recognition is growing.

TECHNICAL PROGRAM

KEYNOTE PRESENTATION

Bob holds a PhD from the University of Texas at Arlington in Electrical Engineering with strong emphasis in electromagnetics, is an IEEE Fellow, a registered Professional Engineer in the state of Texas, a licensed commercial (PG-12-27194) and amateur (KG5KVV) radio operator, holds various EMC certifications from the University of Missouri-Rolla (now Missouri University of Science and Technology) and iNARTE, and is a member of Tau Beta Pi and Eta Kappa Nu.

Within the IEEE EMC Society, Bob is currently serving as the Immediate Past President of the Society. He previously served in all Officer positions for the Technical Activities Committee, Technical Committee 1, Technical Committee 4, was Vice Pres of Technical Services, and most recently was the President of the Society. Bob is also an Associate Editor for the EMC Society Transactions, and is currently serving as the founder and Chair of the Galveston Bay/Houston EMC Chapter.

Bob holds a Federal GS15 rating, and is the Johnson Space Center Electromagnetic Compatibility (EMC) Group Lead Engineer, serving as the technical lead for EMC at the Center. Bob is also the lead for the Community of Practice for EMC within the Agency. Bob supports NASA’s major programs including the International Space Station, the Multi-Purpose Crew Vehicle, and the Commercial Crew Development Program, providing expertise

and guidance in development of tailored electromagnetic compatibility specifications, including control plans, interference control testing methodologies, ESD control, and lightning protection and test. Bob’s combination of technical expertise and EMC community leadership has been instrumental in establishing technical coordination between flight hardware contractors, the NASA technical community, NASA Program Offices, Commercial Spacecraft Industry Partners and various external agencies and organizations.

Prior to working for NASA, Bob was the lead military EMC engineer for his last 3 years at Bell Helicopter. Bob worked for Bell Helicopter for 12 years, starting on the assembly line. He eventually worked his way up through several different departments at Bell, including Quality, Technical Customer Support, Field Service Engineering, and finally design engineering.

Bob has also worked in various other positions, including switching power supply design, flight-line support of a small fleet of commercial and business jets, and weapons research and development for the US Army supporting operations on the instrumented range at Fort Hunter Liggett.

About Dr Robert Scully



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ELECTROMAGNETIC COMPATIBILITY,SIGNAL AND POWER INTEGRITY

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Fundamentals of EMC Sponsored by IEEE EMCS Education Committee (EdCom) Chair: Mark Steffka, General Motors Powertrain, Milford, Michigan, USA

This tutorial is an overview of many of the major topics that need to be considered when designing an electronic product or system to meet EMI/EMC requirements.

The tutorial will present the foundational ideas from physics and mathematics, and demonstrate the engineering approaches to enable attendees to successfully design, evaluate, diagnose, and/or solve EMI/EMC problems. The main objective of this tutorial is to provide a learning opportunity for those that are new to EMC/EMI as well as provide a review of the basics to those who already have experience in this area. Topics included in the Tutorial are emissions (both radiated and conducted), printed circuit boards (PCB), grounding, shielding, cables, filters and testing fundamentals.

Planned Speakers and Topics

WORKSHOPS AND TUTORIALS

Introduction Mark Steffka, General Motors Powertrain, Milford, Michigan, USA

Welcome and Presentation

Radiated Emissions Lee Hill, Silent Solutions, Amherst, New Hampshire, USA

Conducted Emissions Mark Steffka, General Motors Powertrain, Milford, Michigan, USA

PCB Design for EMI/EMC Bruce Archambeault, Missouri University of Science and Technology, Rolla, Missouri, USA and IBM, Research Triangle Park, North Carolina, USA

Grounding Todd H. Hubing, LearnEMC, Stoughton, Wisconsin, USA

Shielding Robert Scully, NASA, Houston, Texas, USA

Radiated and Conducted Immunity Tom Jerse, The Citadel, Charleston, South Carolina, USA

Filters for EMI/EMC Arturo Mediano, Professor, University of Zaragoza, Zaragoza, Spain

Test and Measurement for EMCBogdan Adamczyk, Grand Valley State University, Grand Rapids, Michigan, USA

Full-day Tutorial

MO-AM-1 and MO-PM-1

TECHNICAL PROGRAM





Military EMCChair: L. Gregory Hiltz, Quality Engineering Test Establishment, National Defence, Ottawa, Ontario, Canada

Achieving electromagnetic compatibility with military equipment, systems, and platforms requires significant effort and expense. EMC must be considered at all lifecycle stages and involves design and testing at various stages of production, assembly and integration. Various national military EMC standards have been developed for electromagnetic environmental effects (E3) testing and analysis to reduce the risk of equipment and systems failing to meet their operational performance requirements due to detrimental E3. The tutorial will focus on new updates to MIL-STD-461G and NATO military standards, and specialized military topics including E3 requirements for airworthiness, frequency spectrum management, and military system design requirements in view of new high power microwave threats.


Full-day Tutorial

MO-AM-2 and MO-PM-2


TECHNICAL PROGRAM

MIL-STD-461G UpdatesKen Javor, EMC Compliance, Huntsville, Alabama, USA

MIL-STD-461G CS117 Indirect Lightning and CS118 Personal Bourne ESD TestsFred Heather, US Navy, Patuxent River, Maryland, USA

NATO Electromagnetic Environmental Effects (E3) Activities and Technical Publications AJM (Edwin) van Bladel, Royal Netherlands Air Force (RNAF), Woensdrecht, Netherlands

NATO Land Platform and System Electromagnetic Environmental Effects (E3) Verification and TestingL. Gregory Hiltz, Quality Engineering Test Establishment, National Defence Ottawa, Ontario, Canada

Military System Design Requirements in View of Ultimate High Power Microwave ThreatAndrew S. Podgorski, ASR Technologies Inc., Ottawa, Ontario, Canada

Overview of International and National Radio Spectrum Management Regulatory FrameworksMajor Christian René, DND Frequency Spectrum Management, National Defence, Ottawa, Ontario, Canada

Electromagnetic Environmental Effects (E3) Airworthiness RequirementsDoug Munn, National Defence, Ottawa, Ontario, Canada

In-Flight Use of RF Transmitting Portable Electronic DevicesLorne Calles, National Defense, Ottawa, Ontario, Canada





Development Activities for IEEE P370 Standard - Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz Sponsored by TC10

Co-chairs: Samuel Connor, IBM Corporation, Research Triangle Park, North Carolina, USAXiaoning Ye, Intel, Hillsboro, Oregon, USA

The objective of this workshop is to provide an overview of IEEE P370’s purpose and scope for attendees who were not previously aware of its existence and then to review current work activities of the standard project’s three task groups (Test-fixture Design Criteria, De-embedding Verification, and S-Parameter Integrity and Validation). Each task group will highlight one or more of their current technical studies which are being conducted to identify the best practices as candidates for standardization. These technical studies include simulations, measurements, data analysis, and algorithm evaluation, and the latest results will be presented and discussed in an open format. The workshop will conclude with a summary of key findings and a discussion of next steps for each task group.

We intend to present an overview of the standard’s purpose and scope and then review the current work activities (simulations, measurements, algorithm evaluation) of the three task groups and solicit input from all attendees on the results and next steps.


Half-day Workshop

MO-AM-3

TECHNICAL PROGRAM


Overview of P370 Purpose, Scope, and Task Group OrganizationXiaoning Ye, Intel, Hillsboro, Oregon, USA, Samuel Connor, IBM Corporation, Research Triangle Park, North Carolina, USA, Brice Achkir, Cisco Systems, Inc., San Jose, California, USA

Discussion of Task Group 1 Activities – Test-fixture Design Criteria Jim Nadolny, Samtec, Inc., New Albany. Indiana, USA, Steven Barnes, Cuming-Lehman Chambers, Inc., Chambersburg, Pennsylvania, USA

Discussion of Task Group 2 Activities – De-embedding VerificationAlistair Duffy, De Montfort University, The Gateway, Leicester, United Kingdom, Kai Xiao, Intel Corporation, Hillsboro, Oregon, USA, Eric Bogatin, Teledyne LeCroy, Boulder, Colorado, USA

Discussion of Task Group 3 Activities – S-Parameter Integrity and Validation Jun Fan, Missouri University of Science and Technology, Rolla, Missouri, USA, Mikhel Tsiklauri, Missouri University of Science and Technology, Rolla, Missouri, USA

Summarize Key Developments and Discuss and Prioritize Next Steps for each Task Group





Application of Reverberation ChambersChair: Vignesh Rajamani, Oklahoma State University, Stillwater, Oklahoma, USA

This tutorial will provide an introduction to recent applications of reverberation chambers. It is intended to provide EMC engineers who are interested in applying reverberation chambers to various measurement issues and the extension of reverberation chambers to solve a variety of EMC problems.

This half-day tutorial provides a brief overview of Reverb Chamber (RC) theory, followed by recent applications of RCs. The tutorial material will be updated to reflect recent research results and implications. The format will be a conference presentation style (lecture) followed by questions moderated by the chairman. It is designed for both academics and people from industry who will be involved in radiated emission or immunity testing of commercial or military systems using reverberation chambers and will be valuable to personnel evaluating the use of reverberation chambers as a complement to or replacement for other types of radiated test facilities and for personnel who are trying to use statistical methods to characterize the electromagnetic environments.


Half-day Tutorial MO-AM-4

Introduction and Overview of Reverb TheoryVignesh Rajamani and Chuck Bunting, Oklahoma State University (OSU), Stillwater, Oklahoma, USA

Examination of LTE Signals Propagating Through Reverberation ChambersJ. Coder and J. Ladbury, National Institute of Science and Technology (NIST), Boulder, Colorado, USA

The Challenges of Introducing Stirring into Reverb EMC Tests: A Case Study “Stirring the Pot”J. Ladbury and J. Coder, National Institute of Science and Technology (NIST), Boulder, Colorado, USA

Electromagnetic Probability-of-Effect Assessment Tool for High-Power HERO/EMV testingJustin Rison, Carl Hager and Greg Tait, Naval Surface Warfare Center, Dahlgren, Virginia, USA

Aerospace Applications of Reverberation Chamber Techniques for the Performance Assessment of Components and SystemsDennis Lewis, Boeing, Seattle, Washington, USA

DO160G Chamber calibration and test findingsGarth D’Abreu, ETS Lindgren, Cedar Park, Texas, USA

TECHNICAL PROGRAM






Measurement Uncertainty – Challenges and SolutionsCo-chairs: Doug Kramer, ETS-Lindgren, Cedar Park, Texas, USACarlo Carobbi, University of Florence, Florence, Italy

In the near future, the evaluation of Measurement Uncertainty (MU) won’t be the same as we have known since the first edition of the Guide to Uncertainty in Measurement (GUM) was published in 1993. Some important changes are indeed expected in the second edition of the GUM, tentatively scheduled for publication in mid-2016. Such changes are mainly required to make the GUM consistent with its supplements and address the very fundamental idea of probability. The scope of the presentation by Prof. Carobbi, in particular, will show how the new concepts will practically affect the evaluation of MU.

There has been an increasing need for accredited calibration test services in the commercial EMC, military and aerospace test communities. Part of the accreditation process, based on ISO 17025, is the determination of measurement uncertainty – a requirement that is often misunderstood or misinterpreted. This tutorial will provide an overview and discussion of measurement uncertainty to further the knowledge of this subject in the international EMC testing community.

One of the goals of the tutorial is to address head-on, the fact that the majority of people new to measurement uncertainty are intimidated and overwhelmed. Tips and tools will be provided to make those associated with measurement uncertainty educated and comfortable moving forward in this area.

This tutorial brings together a number of different viewpoints on measurement uncertainty in order to provide a well-rounded discussion of the topic.


The New, Second Edition of the Guide to Measurement Uncertainty (GUM 2016) – How the Evaluation of MU Will Evolve in the FutureCarlo F. M. Carobbi, University of Florence, Florence, Italy

Measurement Model Based Uncertainty Analysis for Antenna CalibrationsZhong Chen, ETS-Lindgren, Cedar Park, Texas, USA

Everyday, Practical Tools for Measurement Uncertainty Evaluation in a Lab EnvironmentDennis Lewis, The Boeing Company, Seattle, Washington, USA

An Introduction to the Microwave Uncertainty Framework at NISTKate Remley, The National Institute of Standards and Technology (NIST), Boulder, Colorado, USA

Half-day Workshop

MO-AM-5

TECHNICAL PROGRAM






State-of-the-art research and education in electromagnetic information security Sponsored by TC5

Chair: Yuichi Hayashi, Tohoku Gakuin University, Sendai, JapanCo-chair: William A. Radasky, Metatech Corporation, Goleta, California, USA

As information security becomes more important every day, safeguarding security at the physical level is as important as at the higher levels. In recent years, instrumentation has become cheaper and more precise, computation has become faster, and storage capacity has increased. With these changes, the threat has increased of advanced attacks that were previously too difficult to carry out, not just in the military and diplomatic fields but also for general-use commercial manufactured goods. This tutorial session focuses on the problem of reduced security concerning electromagnetic waves (electromagnetic information security), which has made attack detection particularly difficult at the physical level. As well as introducing the mechanisms of these information leaks and countermeasures, this session presents the latest research trends and education.


IntroductionYuichi Hayashi, Tohoku Gakuin University, Sendai, Japan

Overview of EM Information Leakage from Cryptographic ModulesJosep Balasch, KU Leuven, Leuven, Belgium

Proactive and Reactive Countermeasures against Active and Passive EM AttacksNoriyuki Miura, Kobe University, Kobe, Japan

Estimation Method of EM Information Leakage in Cryptographic-Module-Equipped PCBKengo Iokibe, Okayama University, Okayama, Japan

EM Information Leakage Threats in Public SpacesYuichi Hayashi, Tohoku Gakuin University, Sendai, Japan

Education for Practical Hardware SecurityNaofumi Homma, Tohoku University, Sendai, Japan

Half-day Tutorial MO-AM-6

TECHNICAL PROGRAM






Automotive EMC – Future Standards Updates and New Test MethodologiesCo-chairs: Garth D’Abreu, ETS-Lindgren, Cedar Park, Texas, USARobert Kado, Fiat Chrysler Automobiles, Auburn Hills, Michigan, USA

The rapid development of advanced automotive features and the trend toward autonomy is driving the need for more sophisticated automotive EMC design and test scenarios. Vehicle platforms continue to become increasingly more complex with propulsion, entertainment and safety related systems all having to function reliably without impacting safety or the legacy communications infrastructure. At the same time, the traditional 12 V automotive system has been changing in recent years with the introduction and increasing implementation of electric and hybrid vehicles. This has led to the development of higher voltage and current busses on vehicle platforms, while the increasing use of electric motors and inverter drives have led to changes in the design and implementation of these new systems to meet the EMC requirements for regulation and interoperability.

In this tutorial, experts from industry and academia will share their latest research in automotive EMC to address these emerging automotive trends. The workshop begins with an overview of global automotive EMC standards, including SAE standards in the US as well as ISO and CISPR standards in European and Asian countries. Automotive EMC test system planning for the future, addressing both component level and full-vehicle level radiated emission and radiated immunity will be addressed.


Half-day Tutorial MO-PM-3

An Overview of Automotive EMC Standards and Emerging RequirementsCraig Fanning, Elite Electronic Engineering, Downers Grove, Illinois, USA

EMC Test Chamber Design for Vehicle and Electronic Sub-Assemblies (ESA) TestingGarth D’Abreu, ETS-Lindgren, Cedar Park, Texas, USA

Grounding in Automotive PCBs and SystemsTodd Hubing, Clemson University and LearnEMC, Stoughton, Wisconsin, USA

EMI Characterization of DC Power Devices and MotorsFlavio Canavero, Dipartimento di Elettronica, Politecnico di Torino, Torino, Italy

Update on Next Stage Certification Environment Sponsored by the USDOT for the 5.9 GHz DSRC TechnologyDmitri Khijniak, 7layers, Irvine, California, USA

TECHNICAL PROGRAM






The Role of the IEC Advisory Committee on EMC (ACEC) in Coordinating IEC EMC Activities Sponsored by TC2

Chair: Donald Heirman, Don HEIRMAN Consultants, Lincroft, New Jersey, USA

This tutorial is intended to inform researchers in the field of EMC of the coordination of EMC standards and activities in the International Electrotechnical Commission (IEC) by the IEC Advisory Committee on EMC known as ACEC. The members of this committee include technical committees of the IEC that produce horizontal EMC basic standards for testing and measurement instrumentation, and also product committees that apply the basic standards along with specific test levels, performance criteria, and emission limits. On occasion there may be conflicts that require some compromise between different standards committees that have EMC aspects in their work. ACEC reviews the situation and recommends potential solutions or supports these compromises if suitable to the IEC Standardization Management Board (SMB) which ACEC reports to as the SMB manages the technical activity of all IEC technical committees. This tutorial will review the major activities of ACEC and its members and will also describe an update of some of the hot topics in standardization today.



What is ACEC? William Radasky, Metatech, Goleta, California, USA

Recent Trends in CISPR and its SubcommitteesDonald Heirman, Don HEIRMAN Consultants, Lincroft, New Jersey, USA

Recent Trends in TC77 (EMC) and its SubcommitteesWilliam Radasky, Metatech, Goleta, California, USA

Emission Control in the 2 kHz to 150 kHz Frequency BandWilliam Radasky, Metatech, Goleta, California, USA

E-mobilityWilliam Radasky, Metatech, Goleta, California, USA

Medical Electronics EMCDonald Heirman, Don HEIRMAN Consultants, Lincroft, New Jersey, USA

Human Exposure Measurement Standards ActivityDonald Heirman, Don HEIRMAN Consultants, Lincroft, New Jersey, USA

TECHNICAL PROGRAM






Introduction to EMI Modeling Techniques Sponsored by TC9

Co-chairs: Bruce Archambeault, Missouri University of Science and Technology, Rolla, Missouri, USA and IBM, Research Triangle Park, North Carolina, USA Chuck Bunting, Oklahoma State University, Stillwater, Oklahoma, USA

This tutorial will provide an introduction to all of the commonly used numerical EMC modeling techniques. It is intended to provide EMC engineers who are interested in learning the basics of these modeling techniques a fundamental understanding of all the different techniques, without the need for detailed math. Practicing modelers will also benefit from learning the fundamentals of modeling techniques they are currently not using. Each technique will be presented along with their strengths and weakness, so engineers can decide which techniques are appropriate for their types of problems.

Planned topics and speakers

Introduction to the Transmission-Line Modeling Method (TLM)David Johns, CST of America, Boston, Massachusetts, USA

Introduction to the Finite Difference Time-Domain (FDTD) TechniqueBruce Archambeault, Missouri University of Science and Technology, Rolla, Missouri, USA and IBM, Research Triangle Park, North Carolina, USA

Introduction to the Finite Element MethodChuck Bunting, Oklahoma State University, Stillwater, Oklahoma, USA

Integral Equation Methods (MOM) in Numerical ModelingJim West, Oklahoma State University, Stillwater, Oklahoma, USA

Principles of Finite Integration Technique (FIT) and Appliance to EMITracey Vincent, CST of America, Boston, Massachusetts, USA


TECHNICAL PROGRAM






Modeling and computational electromagnetics for nanotechnology and advanced materials Sponsored by TC9 and TC11

Co-chairs: Alessio Tamburrano, Sapienza University of Rome, Rome, Italy

The Tutorial is intended to introduce EMC engineers and researchers to the EM simulation methods and techniques aimed at predicting the performance of nanointerconnects, nanocomposites, multifunctional nanostructured shields and other advanced materials that hold relevant interest in the EMC fields. The Tutorial will provide to participants the chance to gain a better understanding of nanotechnology and its implications in EMC issues. The Tutorial will contribute to the development of a debate on the state-of-art modeling and computational methods for a rational approach to the design of nanomaterials and nanodevices, opening future research directions.

Nanotechnology is the engineering of functional systems at the molecular and atomic scale and represents a technological revolution that is shaking scientific academia, industries and almost all areas of society. Nanotechnology has the potential to develop many novel materials and devices for a vast range of applications. Over the last ten years, several studies have been focused on carbon nanotubes, graphene nanoribbons, nanostructured multifunctional materials and single/ multiphase composites filled with nanoparticles.

The outstanding performance and capabilities of these novel materials have demonstrated a great impact in different EMC applications: signal integrity of electrical nano-interconnects and nano-vias for high speed electronics, multifunctional electromagnetic shields, lightweight and high-performance radar absorbing materials, just to mention some examples.

Together with experimental characterizations, analytic models and electromagnetic simulations are essential for the fabrication of desirable materials as well as for the functional performance understanding and control of novel devices and multi-scale structures on a broad range of frequencies. In particular, new models and adapted version of computational electromagnetics that take into account the effects occurring at nano-length scale are needed to relate the physical and chemical properties of nanostructures to the performance of complex materials and integrated systems.

Planned Topics• Modeling of quantum effects in electromagnetic devices• Multiphysics modeling of nanostructures and nano-devices• Modeling of nanocomposites• Simulation methods for nanotubes and graphene based interconnects• Computation of EM properties of novel frequency selective surfaces, shielding and radar

absorbing materials


TECHNICAL PROGRAM




http://en.wikipedia.org/wiki/List_of_nanotechnology_applications



Testing of Wireless Devices in the Modern World: Addressing Current and Future Performance ExpectationsCo-chairs: Jari Vikstedt, ETS-Lindgren, Cedar Park, Texas, USAJanet O’Neil, ETS-Lindgren, ETS-Lindgren, Cedar Park, Texas, USA

The proliferation of wireless technologies into every corner of our lives, starting with traditional cellular and wireless LAN technologies and leading to the impending evolution of connected cars and the “Internet of Things,” all require the use of one common asset - bandwidth. While the traditional approach to added bandwidth is simply to use more RF spectrum, the availability of spectrum, especially at frequencies compatible with most of today’s applications, is severely limited. While regulatory agencies such as the FCC continue to repurpose and open up spectrum for wireless communication, it’s still not enough to address our insatiable hunger for bandwidth. Other technologies continue to evolve to make better utilization of the available bandwidth, including MIMO, beam forming, spectrum sharing and reuse, etc. However, each of these schemes presents a set of complexities that affect the ability of devices to operate and coexist within the same spectrum space. The added complexity of these “smart” wireless systems carries over into the complexity of trying to test radios using these technologies. Wireless systems that adapt to their environment are not likely to perform the same way in a traditional laboratory test as they would in the real world. Thus, the laboratory test methodologies must advance to keep up with these innovations to be able to determine the expected over-the-air performance of these devices without requiring an unlimited number of test cases.

This tutorial will provide an overview and primer on testing modern wireless devices to verify performance and address the latest test challenges. Planned instructors include experts active in the RTCA DO-307, CTIA and ANSI ASC C63® standards committees on wireless devices as well as a member of IEEE EMC Society Special Committee 6 on Unmanned Aircraft Systems EMC.


Half-day TutorialFRI-AM-1

EMC Test Challenges of Unmanned Aerial Systems - Why Drones Matter to an EMC Test Engineer and Antenna DesignerVignesh Rajamani, Oklahoma State University, Stillwater, Oklahoma, USA

Shared Spectrum: Implementation, Testing, and Verification ChallengesWilliam Young, Communications Technology Laboratory, Boulder, Colorado, USA

OTA Testing Challenges of 60 GHz WiGig DevicesJari Vikstedt, ETS-Lindgren, Cedar Park, Texas, USA

An Anechoic Chamber Based Advanced VDT+OTA Test Solution to Reproduce a High-speed Train Radio Environment in a Test LabZheng Liu, China Academy of Telecommunications Research (CATR), Beijing, China

TECHNICAL PROGRAM




http://www.emcs.org/committees/sc06/index.html



Introduction to Medical EMC Chair: Darryl Ray, Darryl Ray EMC Consulting, Carlsbad, California, USA

EMC compliance of medical devices is regulated differently from that of other types of equipment, for reasons of patient and operator safety. The medical device industry must work to a complex set of standards, regulations, and requirements. For example, medical devices are required to have very low leakage current, which precludes some of the usual EMI mitigation design techniques. Also, the immunity requirements are very stringent. Testing requirements are in many cases unique.

The applicable IEC and EN standards now have requirements to manage safety risks that could foreseeably be caused by errors, malfunctions, and faults that could occur as a result of EM disturbances. Medical devices are required to comply with risk management requirements that are not widely understood. Such requirements could soon become the norm for safety-related and safety-critical equipment of all types.

The wireless presentation discusses some important trends in medical wireless technologies as well as key strategies that product developers can use to successfully address the EMC regulatory requirements for wireless medical devices. A review of IEC 60601-1-2:2014 will be presented. This edition is a recent revision, and it will have a significant impact on the medical device industry.


Half-day Tutorial FRI-AM-2

Basics of Medical EMCDarryl Ray, Darryl Ray EMC Consulting, Carlsbad, California, USA

IEC 60601-1-2:2014Harald Buchwald, CSA Group, Strasskirchen, Germany

Risk ManagementKeith Armstrong, Cherry Clough Consultants Ltd, Brocton, Stafford, United Kingdom

IEC/TR 60601-4-2:2016Darryl Ray, Darryl Ray EMC Consulting, Carlsbad, California, USA

Wireless Medical Device TestingGreg Kiemel, Northwest EMC, Hillsboro, Oregon, USA

Regulatory Approval Issues - A View from the FDAJeff Silberberg, Food and Drug Administration, Silverspring, Maryland, USA

TECHNICAL PROGRAM






Basic EMC Measurements Sponsored by TC2

Chair: Don Heirman, Don HEIRMAN Consultants, Lincroft, New Jersey, USA

This workshop will be an introduction to basic EMC measurements with a primary focus on emission testing but also including selected immunity test techniques. The latest activity in national and international standards through 2015 and into 2016 related to EMC measurements and application will be presented including activity above 1 GHz and measurement uncertainty. Where possible, attendees will be asked questions as to what they learned.


Emission Measurements for Tabletop Equipment Steve Koster, Washington Laboratories, Gaithersburg, Maryland, USA

Emission Measurements for Floor-Standing EquipmentH. R. (Bob) Hofmann, Hofmann EMC Engineering, Naperville, Illinois, USA

IEC Transient-Immunity Testing OverviewThomas E. Braxton, Shure Incorporated, Niles, Illinois, USA

Immunity to Continuous RF DisturbancesJohn Maas, IBM Corporation, Rochester, Minnesota, USA

Basic Measurement Sites, Methods, and Associated ErrorsDon Heirman, Don HEIRMAN Consultants, Lincroft, New Jersey, USA

Selecting a Quality EMC LabDaniel D. Hoolihan, Hoolihan EMC Consulting, Lindstrom, Minnesota, USA

Uncertainty Considerations in Stating Pass/FailDon Heirman, Don HEIRMAN Consultants, Lincroft, New Jersey, USA

Half-day Workshop

FRI-AM-3

TECHNICAL PROGRAM






Signal Integrity and Power Integrity Fundamental for Computer and Communication SystemsCo-chairs: Chunfei Ye, Intel Corporation, Dupont, Washington, USAJiangqi He, Intel Corporation, Chandler, Arizona, USA

Signal integrity (SI) and power integrity (PI) becomes increasingly important as critical factors for the design of today’s computing and communication systems. This tutorial will introduce concepts and design challenges in SI and PI, test and measurement approaches addressing SI and PI issues, and possible enablers that may improve SI and PI performance.

Planned Topics• Signal Integrity Fundamentals for High-speed Signaling• Challenges in High-Speed Interconnect Characterization• Power Integrity and VR

Half-day Tutorial FRI-AM-4

TECHNICAL PROGRAM

Call for Volunteers

We are seeking volunteers to oversee registration and assist with various conference activities to help the Symposium run smoothly and with great success. We welcome new and past volunteers to help with the following positions:• Registration desk• Change signs• Host Poster Papers• Monitor Exhibit Hall Demonstrations• Monitor Technical Papers, Workshops, and Tutorials• Oversee the Speaker Ready Room• Stuff Tote Bags

Participating as a volunteer has some great perks! Registered attendees contributing as a volunteer will receive: • Connect with other peers and industry professionals • Food and beverages during your hours of service• Free Symposium shirt

Local residents, who are not registered for the Symposium, will also receive these cool benefits:• Free one-day registration for every day you volunteer• See what’s happening in the EMC and SI fields• Free parking pass for the day

To Volunteer, Please Contact:

Co-Chairs, VolunteersW. [email protected]

Bob [email protected]






EMC Consultant’s ToolkitChair: Jerry Meyerhoff, JDM Labs LLC, Buffalo Grove, Illinois, USA

As more engineering and design firms outsource and reduce staff, more qualified EMC engineers are finding themselves “homeless.” As well, there are hundreds of companies that do not have the resources to hire a full-time EMC engineer. The purpose of this workshop is to provide an introduction to the technical, business and marketing skills to interested EMC engineers so that they can successfully locate, market and provide effective services to these companies at a fair profit and with job satisfaction.

Topics to be addressed include: Practical tools and skills in the following areas – Marketing and self-promotion, acquiring low-cost equipment, developing a troubleshooting kit using new and low-cost DIY tools & probes, how to use social media marketing such as LinkedIn, to bring in business, networking practices, advertising, setting up your office, pricing your services, tracking your time, best business practices, how to present yourself professionally, tax & legal obligations and other issues (such as how to review contracts and non-disclosure agreements).


Marketing YourselfJerry Meyerhoff, JDM Labs LLC, Buffalo Grove, Illinois, USA

Networking, Branding & Providing Customer Value Kenneth Wyatt, Wyatt Technical Services LLC, Woodland Park, Colorado, USA

Presenting Yourself Professionally Patrick André, André Consulting Inc., Bothell, Washington, USA

Acquiring Test Equipment & Developing a Low-Cost EMC Troubleshooting Kit Patrick André, André Consulting Inc., Bothell, Washington, USA, Kenneth Wyatt, Wyatt Technical Services LLC, Woodland Park, Colorado, USA

Consulting For Geeks Daryl Gerke, Kimmel Gerke Associates, LTP., Mesa, Arizona, USA

Panel Discussion: Audience Q&A

Half-day Workshop

FRI-AM-5

TECHNICAL PROGRAM






Recent Developments and advanced measurements method in EMC for Emerging Wireless Technologies Sponsored by TC12

Co-chairs: Yihong Qi, DBJ Technologies, Zhuhai, China Harry Skinner, Intel, Hillsboro, Oregon, USA Jun Fan, Missouri University of Science and Technology, Rolla, Missouri, USA

With the continuous development of wireless technologies and their tight integration with various electronic/computer/communication devices, EMC issues, at both the system and the intra-system levels, become increasingly important. This tutorial, sponsored by TC12 EMC for Emerging Wireless Technologies, will provide an overview of the issues and challenges, as well as the recent developments in modeling, measurements, test practices, and standards. Planned topics include interference from digital to wireless, noise mitigation (EMC design) through system planning, wireless performance testing methodologies, anechoic and reverberation chambers in wireless testing, etc.


Current and Future Coexistence Challenges for Wireless DevicesHarry Skinner, Intel, Hillsboro, Oregon, USA

OTA for Certification, R&D and Mass ProductionLie Liu, General Test Systems, Shenzhen, China

Self-interference CancellationEduardo Alban, Intel, Hillsboro, Oregon, USA

Radiated Two Stage Method for MIMO Throughput Test Penhui Shen, General Test Systems, Shenzhen, China

4G LTE MIMO Test MethodsYa Jin, Keysight, Beijing, China,

Interference Measurement on Wireless NetworkGao Feng, China Mobile, Beijing, China

Half-day Tutorial FRI-PM-1

TECHNICAL PROGRAM






Techniques and Measures to Manage Risks with Regard to Electromagnetic Disturbances Sponsored by TC1

Chair: Keith Armstrong, Cherry Clough Consultants Ltd, Brocton, Stafford, United Kingdom

Half-day TutorialFRI-PM-2

Planned Speakers and Topics Risk-managing Electromagnetic Disturbances is Increasingly Important Davy Pissoort, KU Leuven, Oostende, Belgium

General Overview of Approaches: a) ‘Big grey box’; b) New MethodKeith Armstrong, Cherry Clough Consultants Ltd, Brocton, Stafford, United Kingdom

Developments in Related IEC and IEEE Standards, and IET Codes of Good PracticeKeith Armstrong, Cherry Clough Consultants Ltd, Brocton, Stafford, United Kingdom

Special Challenges for Medical EMC Standard IEC 60601-1-2Keith Armstrong, Cherry Clough Consultants Ltd, Brocton, Stafford, United Kingdom

Discussions of the Detailed Design Techniques and Measures for Increasing Resilience Against the Effects of EMI, Using the New Practical MethodKeith Armstrong, Cherry Clough Consultants Ltd, Brocton, Stafford, United Kingdom

Overall Discussions, Q & ADavy Pissoort, KU Leuven, Oostende, Belgium

Technical Summary and ConclusionsKeith Armstrong, Cherry Clough Consultants Ltd, Brocton, Stafford, United Kingdom

Where safety risks may be increased by the effects of EMI on electronic equipment, EMC must be risk-managed for the full lifetime of the equipment/system/installation concerned, and so must take into account all reasonably foreseeable aging, wear, corrosion, faults, use and misuse.

Overall risks of death from new projects are only acceptable at levels below 0.1% (1000ppm) per person per year, with most of the acceptable levels set at or below 0.0001% (1ppm) per person per year. However, there are many possible contributors to this overall safety risk, and the proportion of the overall risk allocated to EMI causes is typically 1/10th of this, i.e. between a risk of death of 100ppm and 0.1ppm per person per year.

A consequence of the above is that no affordable time/cost of EMC immunity testing, at any test levels, can possibly provide the necessary design confidence required for compliance with the relevant safety risk management standards. Where the future EM environment is unknown (as it usually is), the traditional approach (e.g. as used by the military) is to use very rugged high-specification EM mitigation, designed to meet or exceed all possible environmental issues (shock, vibration, humidity, salt spray, temperature, EM disturbances, etc.).

However, this ‘big grey box’ approach can be too large, heavy or costly for many modern safety critical systems, especially (for example) in road/air transportation, portable medical devices, mobile life-support equipment, etc. This workshop also describes a new approach, first published in August 2013, which (unlike the ‘big grey box’ approach) adds little to size, weight and cost. These two approaches can also be used to help manage non-safety risks associated with the use of electronics, including financial risks, mission-critical risks, high-reliability, etc.

TECHNICAL PROGRAM






Smart Grid Support and EMC Issues Sponsored by SC1

Chair: Don Heirman, Don HEIRMAN Consultants, Lincroft, New Jersey, USA

Smart Grid continues to be a hot topic worldwide with no end in sight. This tutorial will review the latest Smart Grid (SG) EMC activities of key organizations and an example of an SG EMC working group on the topic. The focus will be on the EMC implications including what are being accepted and what are not. It will discuss what EMC compatibility level is desirable for all grid-connected devices, especially those that are part of the communication channel passing power usage data and use in both directions. The communications challenge is in the frequency range 2 kHz to 150 kHz. The tutorial will also give a specific example of the immunity needed for SG devices used in power station and substation environments. Finally, the tutorial will place in perspective the EMC status and the work still needed to be done to make it an integral part of the Smart Grid.


Immunity for Power Station and Substation EnvironmentsWilliam Radasky, Metatech, Goleta, California USA

US Smart Grid Interoperability Panel (SGIP 2.0) and its Testing and Certification CommitteeDonald Heirman, Don HEIRMAN Consultants, Lincroft, New Jersey USA

Application of Selected EMC Standards by the SGIP Electromagnetic Interoperability Issues Working Group (EMI)Donald Heirman, Don HEIRMAN Consultants, Lincroft, New Jersey USA

EMC Between Communication Circuits and Power Systems in the Frequency Range 2-150 kHzDavid Thomas, University of Nottingham, United Kingdom


TECHNICAL PROGRAM






Crosstalk – Theory, Modeling, Characterization, and Design Optimization Sponsored by TC9 and TC10

Co-chairs: Xiaoning Ye and Kai Xiao, Intel Corporation, Hillsboro, Oregon, USA

Crosstalk is a major concern in the computer system designs that support various interfaces and speeds. As the serial I/O data rate is approaching 40 Gbps and beyond, and the single-ended memory busses (DDR, GDDR) are also getting faster, it has become critical to meet the signal integrity requirements and strike a balance between low-cost design (form factors, routing density, etc.) and performance. This tutorial will cover fundamentals of crosstalk, modeling, simulation, characterization of crosstalk, and design techniques for crosstalk reduction and mitigation.


Fundamentals of CrosstalkXiaoning Ye, Intel, Hillsboro, Oregon, USA

Crosstalk in Transmission Lines on a Printed Circuit BoardKai Xiao, Intel Corporation, Hillsboro, Oregon, USA

Crosstalk in Vertical Path of High-speed LinksKai Xiao, Intel Corporation, Hillsboro, Oregon, USA

Crosstalk Management Techniques in PCB Transmission LinesXiaoning Ye, Intel, Hillsboro, Oregon, USA

Inter-layer Crosstalk in Dual-stripline Design and Management TechniquesKai Xiao, Intel Corporation, Hillsboro, Oregon, USA

Half-day TutorialFRI-PM-4

TECHNICAL PROGRAM






Calibration of EMC Measurement InstrumentationCo-chairs: Doug Kramer, ETS-Lindgren, Cedar Park, Texas, USAJanet O’Neil, ETS-Lindgren, Cedar Park, Texas, USA

This tutorial will present detailed information about the state of the art in calibration of EMC measurement equipment required by many current international standards. Specific requirements and nuances that can challenge even the most experienced EMC practitioner will be discussed, and methods for practical implementation for real-world application will be shared with attendees. Speakers include experts who are actively involved in using, writing and maintaining the standards in which the requirements are established.

This tutorial will take a novel approach to equipment calibration by delving into the implementation of specific characteristics and requirements, as opposed to a general treatment of calibration.

Calibration issues related to a variety of measurement equipment and associated standards will be covered in this tutorial, including: LISNs according to ISO; field probes according to IEEE 1309; test sites used for antenna calibration and reference test sites, per revision being developed for CISPR 16-1-5 and future CISPR 16-1-6; and calibration of the uniform field per IEC 61000-4-3. Attendees can expect to improve their understanding of both the background of the latest requirements for calibration of EMC measurement equipment and practical aspects of performing or specifying the required calibrations.


Traceability of Antenna Measurement and Introduction to Methods in CISPR 16-1-6 for Frequencies Below 1 GHz David Knight, NPL, Middlesex, England, United Kingdom

Calibration of Field Probes for EMC Measurements (IEEE 1309)Zhong Chen, ETS-Lindgren, Cedar Park, Texas, USA

Impact of the Cables and Connectors on LISN CalibrationDennis Lewis, Boeing, Seattle, Washington, USA

Calibration of the Uniform Field for 61000-4-3 for Field Uniformity Above 1 GHz Vic Hudson, ETS-Lindgren, Cedar Park, Texas, USA

EMI Compliance Receiver CalibrationMark Terrien, Keysight Technologies, Santa Rosa, California, USA


TECHNICAL PROGRAM






Aerospace ELectromagnetic Compatibility Session Chair: Robert Scully, NASA Johnson Space Center, Houston, Texas, USA

This Special Session presents papers specific to the practice of EMC within the aerospace industry. Included are papers concerning the physics of surface electrical charging, the control of radiated emissions for highly sensitive radio-navigation receivers, and the related areas concerning the protection of sensitive electronics in the presence of electrically charged and complex radio frequency environments. The particular EMC problems that may be encountered in the development and operation of a large-scale ground-based radar/communications installation are also covered. Many of the topics that appear in this Special Session address topics not normally encountered by EMC engineers working outside of the aerospace industry. However, these topics often exhibit applications and/or problems with their solutions that are of broad interest to engineers practicing the wider EMC discipline, both within and external to the aerospace industry. The primary audience comprises EMC engineers currently working in, or who wish to work in, the EMC discipline within the aerospace industry. The secondary audience comprises EMC engineers who have interest in receiver protection, radiated emissions control, radar and communication systems EMC, and protection from single event upset.

3D IC integration: SIPI Modeling and MeasurementSession Chair: Antonio Orlandi, University of L’Aquila, L’Aquila, Italy

The three-dimensional (3D) integration of integrated circuits (IC) and chips requires two challenging actions: 1) the multi physical (thermal, electrical, mechanical) modeling of their performances in order to predict their behavior before any production stage, and 2) the capability of measuring these performances. Both actions involve specific skills and competencies. The aim of this Special Session is to gather these competencies from academia and industry leaders and offer them to the audience in a compact and effective way. Specifically sponsored by the Technical Committee TC10 “Signal Integrity”, this session will provide speakers who are well known technical leaders in this field with solid and long-lasting reputations. In the field of SIPI, for 3D ICs, simulation and measurements are not independent. As an example, consider the problem of fixture de-embedding; this is a mix of measurement and simulation techniques. The primary audience will be engineers and scientists from industry and academia involved in SIPI for 3D ICs. Also, EMC engineers involved in the design of very high bit rate systems will find interest in the content of the papers presented in this session. The secondary audience will be graduate students that steer their research interest toward this area of chip design and development.

SPECIAL SESSIONS

TECHNICAL PROGRAM





Techniques & Measures to Manage Risks With Regard to Electromagnetic DisturbancesSession Chair: Davy Pissoort, KU Leuven, Oostende, Belgium Due to the increased use of electronics in safety-related applications, EMI becomes a functional safety issue for which proper risk management becomes a necessity. In the coming years, the importance of EMI Risk Management will rapidly grow in many sectors such as automotive, industrial automation, medical, mechatronics, railways, avionics, robotic and consumer electronics. The papers in this Special Session discuss some of the relevant issues associated with achieving what the IEEE calls “Managing Risks with Regard to Electromagnetic Disturbances.” EMC and Functional Safety (FS) have evolved completely separately over the years and share few or no concepts or terminology. Safety engineers generally are seldom aware of the effects caused by EMI. EMC engineers are typically unfamiliar with the techniques used within FS to cost-effectively minimize safety risks. Recent literature has shown that classical EMI shielding, grounding, filtering and testing alone can never lead to a feasible and economically affordable approach to guarantee safety due to the many possible variations of EMI that can occur during the lifetime of an electronic system. A totally new methodology imposes itself where the classical EMI mitigation techniques are complemented with a dedicated EMI failure analysis, as well as appropriate hardening techniques and measures which are typical for FS. This approach results in a system that is inherently resilient to EMI. This Special Session will be of value to designers and manufacturers of electronic products, equipment and/or systems, owners and users of such products, and specialized risk assessors.

On-Chip and On-Board ESD ProtectionSession Chair: Harald Gossner, Intel, Neubiberg, Germany This Special Session was prepared by the Electrostatic Discharge (ESD) Association, a sister society to the IEEE EMC Society, in conjunction with the EMC Society’s Technical Committee TC5 on ESD effects. The session covers on-chip ESD protection concepts and presents an overview of on-chip ESD concepts implemented in advanced technology nodes down to 14nm CMOS. Constraints of design are discussed, and typical failure mechanisms are shown. Additionally, technical papers addressing on-chip as well as on-board ESD protection and their interaction will be presented. An insight to the most recent on-chip ESD concepts will be presented; these concepts are typically not accessible to EMC designers. An understanding of these ESD concepts facilitates the co-design for EMC and ESD protection measures on board with the on-chip protection circuit. This session will be of particular interest to system ESD and EMC engineers and researchers in the field of system ESD.

SPECIAL SESSIONS

TECHNICAL PROGRAM





Military EMC ProgramAs part of the Symposium, the IEEE EMCS and SAE G46 EMC Subcommittee are jointly sponsoring a Military EMC Program open to all registered attendees at no additional charge.

SPECIAL PROGRAM

“Kar the EMI Beater” was

susceptible to the wiles of the lovely

Navya, the first feelings growing over

a shared pot of tea and the tangle of

partial differential equations. Then,

in the lab, they knew they needed to

be together when they both reached

for the same ferrite, their hands

gently touching.

But how could they grow their love?

After all, He was from Emissions!

She, Immunity! But they LISN’d to

the their hearts’ call, and love surged

under the broad Kansas sky.

At last, theirs became a story about a

bond between two Young

Professionals, full of promise and

hope.

To enjoy this and other titles by the

IEEE EMC Society, join today!

TECHNICAL PROGRAM

This two-day program will consist of a full day of tutorials focused on updates to MIL-STD-461G and NATO Allied Environmental Conditions and Tests Publications (AECTP) standards.

On the second day, the G46 EMC Subcommittee will host their meeting which includes: committee activity reports from the IEC, ANSI C63, IEEE Standards Development Committee (SDCom), AISAA S121 and SAE-4.

Activity highlights will be presented on the continuing development of MIL-STD-461 and

MIL-STD-464 standards, and on NATO and space EMC topics.

A surprise keynote speaker will provide insight into aspects of EMC that will appeal to a wide audience.

The G46 EMC Subcommittee meeting will be followed by a panel discussion where attendees can ask questions of subject matter experts (SMEs) on any military EMC issue of interest. In addition to the Military EMC Program, other technical and special sessions, tutorials and workshops will also present topics of interest throughout the Symposium.



http://emcs.org



Technical PapersTechnical Papers will be provided Tuesday through Thursday in parallel sessions

The papers represent the latest in technology as presented by industry, government, and academia. All papers have been peer reviewed and accepted by the EMC Society’s Technical Committees. The Technical Papers will be given in three formats: oral presentation of paper sessions, poster session papers, and abstract reviewed papers.

The Technical Papers and Special Sessions presentations will be organized according to technical topic areas associated with the IEEE EMC Society Technical Committees. The Technical Paper Sessions schedule will be developed in mid-May. Please check www.emc2016.emcss.org for updates.

Oral Presentation of Papers SessionsThe Oral Papers Sessions presentations are oral briefings on a digital projector in a theatre-style room setup. The Session Chair will moderate the meeting between speaker presentations and questions and answers with the attendees and speakers.

Presentation of Poster Session PapersFor the Poster Paper Sessions, the authors will be available for one hour to present and discuss their papers. Afterward, the posters will be moved to another location for further review by those who may be interested. To provide prominence to the poster session papers, no technical paper oral presentations will be scheduled during that one-hour session.

Abstract Reviewed PapersAbstract Reviewed Papers provide unique opportunities to EMC/SIPI engineers and researchers to exchange experiences and ideas. This 2016 special program has over 30 accepted papers and will help us build a professional community that benefits not only the development of the technologies but also the members’ professional careers. We also hope that this special program will lead us to reduce ever increasing gaps between rapidly changing modern electronic industry, computational analyses and traditional IEEE conferences. Abstract Reviewed Papers are treated the same as regular papers in the conference proceedings, however, due to the differences in the reviewing processes, Abstract Reviewed Papers are not published in the IEEE Xplore. Abstract Reviewed Papers will have separate best paper awards.

TECHNICAL SESSIONS

TECHNICAL PROGRAM






Wireless EMC and Wireless OTA Measurement Organizer: Jun Fan, Missouri University of Science and Technology, Rolla, Missouri, USA Wireless technologies are commonly integrated into various electronic designs. EMC issues including receiver desensitization, ESD, modulation/intermodulation, and measurement methodologies for wireless OTA (over-the-air) performance are important to EMC and testing engineers. This panel will cover a few of the hot topics including MIMO testing, product-level EMC debugging for wireless devices, noise coupling mechanisms and characterization, noise source modeling and interference estimation, wireless coexistence, etc.

Tentative panelists include: • David Pommerenke (Missouri S&T), • Kenji Araki (Sony), • HakByeong Park (Samsung), • Harry Skinner (Intel), • Yihong Qi (DBJ Technologies), • Bill Young (NIST)

Which Simulation tool is best for which application?Organizer: Bruce Archambeault, Missouri University of Science and Technology, Rolla, Missouri, USA and IBM, Research Triangle Park, North Carolina, USA There are many different simulation tools. Some very impressive color pictures can be created. But each simulation technique has certain problems where it excels and certain problems where it is not the best tool for the job. This panel will discuss the various simulation techniques and their strengths and weaknesses. Specific examples from the audience will be used to discuss which techniques might be more appropriate than other techniques.

Tentative panelists include: • Prof Chuck Bunting (Oklahoma State Univ), • David Johns (CST), • Jim West (Oklahoma State University), • Tracey Vincent (CST)

PANEL DISCUSSIONS

TECHNICAL PROGRAM





Aerospace Systems EMC Organizer: Robert Scully, NASA, Houston, Texas, USA A 5-person panel of experts knowledgeable in the discipline of Electromagnetic Compatibility as it pertains to aerospace systems, including terrestrial fixed and rotary wing aircraft, as well as space vehicles, both manned and unmanned. Panel membership would be drawn primarily from membership in Special Committee 7 of the IEEE EMC Society, augmented by others as necessary to complete the panel. Panel members may include Jim Lukash (LM), Dave Brumbaugh (Boeing retired), Bob Scully (NASA JSC), John Norgard (NASA JSC), John McCloskey (NASA GSFC), Ray Perez (NASA JPL), Pablo Narvaez (NASA JPL), and others. The event would open with a brief introduction/presentation by the panel Chair to establish the purpose of the panel, introduce potential topics for discussion, and to introduce the panel members and their bona fides. Following the introduction, as described, the panel would then be open to the floor for questions and discussions as brought forward by the attendees in the audience. Electromagnetic compatibility (EMC) is a necessary characteristic of any successful aerospace platform. It is also a complex engineering discipline area combining applied physics, engineering, and materials & processes. All other discipline areas are affected to some degree by the need for EMC on all aerospace platforms, and the lack of EMC has been the bane and in some cases, the ultimate cause of failure of many projects over time. Unfortunately, EMC is an area that is poorly understood by many other disciplines, and certainly by management focused on cost and schedule performance looking for recovery of dollars and days lost to other engineering area overruns. Successful EMC design effectively eliminates problems before they arise, rendering the art and science of EMC practically invisible to others who are apt to ask what value added does EMC bring to the table?

It is expected that practitioners of EMC supporting aerospace discipline areas such as avionics and power generation and distribution will be in attendance. Concerns such as crosstalk effects, “black-box” certification, lightning immunity, triboelectrification and p-static, corona, power quality, and so forth are all part and parcel of the avionics and power generation and distribution discipline areas. Bringing in EMC aerospace experts thus offers a new and unique opportunity for conference attendees to engage and interact with these experts to ask questions and hold discussions about specific problems the attendees may have encountered in the past, are struggling with now, or may be confronted with in the future.

PANEL DISCUSSIONS

TECHNICAL PROGRAM

Ask the ExpertsTwo Ask the Experts Panel discussions are planned for EMC 2016! One session on EMC and another focused on Signal/Power Integrity. Both panels are staffed by well known experts in their field and will be available to respond to any questions from attendees.

EMC PanelistsLee Hill, Silent Solutions Prof. Jim Drewniak, Missouri University of Science & Technology Mark Steffka, General Motors Dr. Bruce Archambeault, Missouri University of Science & Technology Prof. Farhad Rachidi, Swiss Federal Institute of Technology (EPFL) Ryan From, Boeing

SIPI PanelistsDr. Dale Becker, IBM Prof. Ram Achar, Carleton University Prof. Jun Fan, Missouri University of Science & Technology Dr. Xiaoning Ye, Intel Dr. Brice Achkir, Cisco Prof. Joungho Kim, KAIST





Military EMC Organizer: Gregory Hiltz, Quality Engineering Test Establishment, Ottawa, Canada Achieving electromagnetic compatibility with military equipment, systems, and platforms is a continuing challenge. Communication, radar, electronic warfare and other systems must operate in an increasingly congested and contested spectrum. Military EMC standards for design, test, and verification continue to evolve to ensure the operational effectiveness of military forces are not degraded by electromagnetic environmental effects.

This panel discussion will focus on current topics of interest related to military EMC standards, EMC challenges with military hardware, emerging military technologies and electromagnetic threats, etc. A panel of subject matter experts will briefly outline their areas of expertise and provide comment on aspects of military EMC. Questions and comments from attendees will be welcome.

PANEL DISCUSSIONS





ITE EMC Regulatory Intelligence to market products in B R I C countriesOrganizer: Elizabeth Perrier, ORBIS Compliance LLC, Morgan Hill, California, USA

Brazil, Russia, India and China are the selected group of developing countries recognized as the most promising emerging markets by their demographic and economic potential as they are expected to rank among the world’s largest and most influential economies by 2027 overtaking G7 economies. Together they comprise more than 2.8 billion people or 40% of the world’s population, covering a quarter of the world and representing 25% of global GDP.

The focus of this Panel of Experts is to share with the audience, product compliance requirements for Electronics and ITE products in BRIC countries, as well as presenting recently published regulations affecting approvals. Tina Ding from the CSA Group, Elizabeth Perrier from ORBIS and Mark Maynard from SIEMIC will engage attendees in a lively discussion afterward to address their experiences and challenges in these countries.

BrazilIntroduction on product compliance requirements to access Brazil, includes:• Description of Anatel, InMetro, Anvisa

Regulatory bodies• Anatel Brazil Standards and US / EU equivalent

(EMC, RF, Safety, SAR, PSTN, Batteries and Cell phones )

• New regulation updates Anatel Res. 506, Res. 662, Res. 442, IPv6

• InMetro Regulatory updates• IoT and M2M Regulatory Initiatives • Best Practices for successful approval

RussiaIntroduction on product compliance requirements to access Russia, includes: • Electrical & Electronics products under Low

Voltage Technical Regulation and EMC Technical Regulation

• Radio / Telecommunication products type approval

• Medical Equipment registration• Other Technical Regulations in EEU countries

IndiaIntroduction on product compliance requirements to access India, includes:• Electronics and ITE products under BIS

registration• Battery BIS approval• Radio/Telecommunication product WPC

approval

ChinaChina Compulsory Certification (CCC)• For EMC & Product Safety compliance• Ministry of Industry & Information Technology

(MIIT)• Telecom Administrative Bureau (TAB)• Network Access License (NAL) • State Radio Regulations Committee (SRRC)

PANEL DISCUSSIONS





Computer Modeling & Simulations DemonstrationsIn this highly popular Symposium event, fundamental EMC and SIPI modeling approaches and simulation methods are illustrated through a series of interactive computer demonstrations. Various computational electromagnetic (CEM) modeling techniques will be demonstrated, illustrating their application to simple canonical type problems to show how specific EMC and SI/Power Integrity problems can be solved. These include the application of the Moment Method (MoM), Uniform Theory of Diffraction (UTD), Ray Tracing Method (RTM), Finite Difference Time-Domain (FDTD), Finite Element Method (FEM), Transmission Line (TL) theory, and other useful methods. Many new demonstrations are added each year, and an interactive participation during the demonstrations is encouraged.

The demonstrations will be conducted using general-purpose codes; no codes or tools used in this session may be demonstrated for commercial or promotional purposes. The computer modeling and simulation demonstrations should continue to focus on various technical areas of interest to the EMC and SIPI practitioner.

Hardware Experiments & DemonstrationsEMC and SIPI hardware experiments and demonstrations continue to be a very popular Symposium event, and the 2016 IEEE International Symposium on Electromagnetic Compatibility will be no exception. The event’s purpose is to demonstrate important EMC and SIPI concepts through interactive experiments and demonstrations focusing on, for example, EM coupling phenomena and effects, EMC and SIPI measurements and troubleshooting methods. Presentations may be based upon those documented in the ESAC’s EMC Experiments Manual, originally compiled by Clayton Paul and Henry Ott. Past experiments have demonstrated the effects of PC board radiation coupling; component-cable crosstalk; grounding and shielding strategies; spectral analysis techniques using test hardware; effective EMC and SIPI test methods and practices; use of EMC instrumentation to measure interference at the device or component level and the role of EMC standards as part of overall measurement practices. Presentations typically show how fairly simple test hardware can be used to measure a range of electromagnetic effects. Experiments new to the Symposium venue are encouraged each year and oft-times popular demonstrations from previous years are reprised. Hands-on participation for attendees during experiments and demonstrations is also encouraged.

Hardware experiments and demonstrations should focus on innovative concepts and methods that are of interest to practicing EMC engineers. EMC hardware experiments and demonstrations shall not be for commercial or promotional purposes and are intended to be technical in nature.

EXPERIMENTS & DEMONSTRATIONS

TECHNICAL PROGRAM





YOUTH TECHNICAL PROGRAM

TECHNICAL PROGRAM

Youth Technical ProgramWednesday, 25 July10:00 AM - 12:00 PM

This year's Youth Technical Program (YTP) is going to be magical.

Each Youth will be given the coolest ESD Wand that will make objects fly and do many other shocking things. The official name of the topic is ElectroStatic Discharge (also known as ESD) - it's all about how electrical shocks, even those created by rubbing your feet on the carpet, can be a major source of electromagnetic interference (EMI) problems. The Youth Technical Program will consist of one 2 hour workshop where a leading expert will explain the principles of ESD and how we try to control them using Electromagnetic Compatibility (EMC) technologies. The talk will include demonstrations and hands-on experiences using the ESD Wands. The workshop will be held on Wednesday from 10:00 AM to Noon.

In addition to Wednesday's workshop, on Thursday morning, from 10am to Noon, the Youth Technical Program and all Companions (adults and youths) are invited to join a guided tour of the exhibition hall where the experts will show us their newest and coolest EMC devices.

The Youth Technical Program is free; however, we encourage all interested participants to register for the YTP so that an adequate number of ESD Wands can be purchased. The Youth Program is recommended for ages 8 to 19. Younger children are welcome if accompanied by adults or teenage or older siblings. The 2016 Symposium is able to offer the Youth Technical Program free of charge due to the continued support of InField Scientific Inc., Pointe-Claire, Quebec, Canada. Dr. Amy Pinchuk, President of InField, was an original founder of this Program with its inception at the EMC Symposium in 2001. Also, to avoid confusion, it should be noted that the Youth Technical Program registration does not include access to the Companion Suite or social events.

SPONSOR OF THE EMC 2016 YOUTH TECHNICAL PROGRAM





This committee is concerned with the development and dissemination of Best Practices and Methodologies for the successful leadership, supervision and guidance of EMC related activities. These Best Practices and Methodologies shall be structured so as to provide assistance to all managers, and engineers. Appropriate and convenient tools shall serve as a foundation for these Best Practices and Methodologies.

This committee is concerned with the measurement and instrumentation requirements in EMC standards and procedures and how they are interpreted. Also concerned with the adequacy of measurement procedures and measurement instrumentation specifications for radiated and conducted emission and susceptibility tests and the rationale for performance limits for these tests.

This committee is to encourage research in the following areas: electromagnetic environment (EME), development of standards for EME measurement and characterization, natural and man-made sources of electromagnetic environment that comprise this environment, effects of noise (unwanted portions of EME) on systems performance, effects of international civil and military standards intended to control man-made intentional and unintentional emissions of electromagnetic energy.

This committee is concerned with design, analysis, and modeling techniques useful in suppressing interference or eliminating it at its source. Bonding, grounding, shielding, and filtering are within the jurisdiction of this committee. These activities span efforts at the system, subsystem, and unit levels

This committee is concerned with the effects and protection methods for electronic equipment and systems for all types of high power electromagnetic environments. These environments include electromagnetic pulse (EMP), intentional EMI environments (i.e., narrowband and wideband), lightning electromagnetic currents and fields, electrostatic discharge and geomagnetic storms. In addition this committee deals with the commercial data security issue through electromagnetic information leakage activities. Interactions with subsystems, systems and platforms are included.

This committee is concerned with the analysis, design, and measurement techniques for intentional RF transmitting and receiving equipment to prevent interference and promote efficient spectrum use through technology and operational based approaches,such as software design, dynamic spectral allocation, waveform control, as well as frequency coordination and management procedures.

TECHNICAL COMMITTEES

TECHNICAL PROGRAM

TC 1 EMC Management

TC 2 EMC Measurements

TC 3 Electromagnetic

Environment

TC 4 Electromagnetic

Interference

TC 5 High Power

Electromagnetics

TC 6 Spectrum

Engineering






TECHNICAL PROGRAM

TC 7 Low Frequency EMC

TC 9 Computational

Electromagnetics

TC 10 Signal/Power

Integrity

TC 11 Nanotechnology

TC 12 EMC for Emerging

Wireless Technologies Charter

This committee is concerned with low-frequency EMC including Power Quality in electric power systems. The committee is focusing on the application of fundamental EMC concepts also to low-frequency conducted disturbances. EMC in power systems is expected to be increasingly important. This is due to increased use of electronics in renewables, electric vehicles, energy efficient technologies and Smart Grid applications.

This committee is concerned with broad aspects of Applied Computational Electromagnetic techniques which can be used to model electromagnetic interaction phenomena in circuits, devices, and systems. The primary focus is with the identification of the modeling methods that can be applied to interference (EMC) phenomena, their validation and delineating the practical limits of their applicability. Included are low and high-frequency spectral-domain techniques and time-domain methods.

This committee is concerned with the design, analysis, simulation, modeling and measurement techniques useful in maintaining the quality of electrical signals. These activities encompass all aspects of signal integrity from the integrated circuit level to the system level.

The newest technical topic area for the EMC Society, the topics include carbon nanotubes, composite materials, and other measurements, design, and analysis applications.

This committee is concerned with the EMC design, analysis, modeling, measurement, and testing aspects of emerging wireless products. The committee encourages research including but not limited to the following areas:

Innovative Wireless Component Design for System Integration: Wireless component design with integrated EMC functions and/or meeting certain EMC specifications.

Radio-Frequency Interference and De-sense: Characterization and mitigation of interference from digital circuits to wireless antennas.

Measurement & Testing of Wireless Systems: Development of methods and standards for wireless performance and compliance testing. Wireless Coexistence: Interference control/mitigation among various wireless radios, as well as related testing methods and standard development

Wireless Product or Subsystem EMC: Wireless-specific EMC design





This special committee is concerned with coordination of the EMC Society activity on providing EMC principles for those organizations and associated documentation and specifications that address the efficient use of the AC power grid including the control of power entering and in some cases exiting a house or building.

This committee is concerned with power electronics converters EMI/EMC issues. These are mainly, converters that use switching frequency schemes to control the output parameters, such as voltage and current. These converters, including inverters, can be found as an interface between the raw power and the electrical grid to provide the end-user with the desired operating power. Applications can range from grid-connected PV systems, wind farms, automotive, aerospace, and communication systems.

This committee is concerned with design, testing, modeling/simulation required for system level EMC for unmanned aircraft systems that will be engaged in all weather autonomous single and cooperative flight. Special emphasis is on spectrum management on intra and inter-system interactions (platform integration), mission specific data security and bandwidth requirements, and robust performance in the presence of high-intensity radiated fields (HIRF). Engagement in the development of standards will be a key role of this special committee.

This committee is concerned with EMI/EMC issues in aircraft, spacecraft & space launch vehicles, robotic and crewed. The space environment provides unique challenges in the design, development, test and operation of space systems to avoid EMI and achieve EMC. Aeronautics & space EMC covers a wide range of topics on the part, board, box, system, multi-system, planetary and interplanetary levels. The harshness of the atmospheric, launch and space environments necessitates a broader view of EMC issues than traditional terrestrial projects, often leading to creative methods and solutions that can benefit our society’s efforts elsewhere on Earth.

SC 1 Smart Grid

SC 5 Power Electronics EMC

SC 6 Unmanned Aircraft

Systems EMC

SC 7 Aeronautics and

Space EMC






Working Groups, Committees, and Board MeetingsThe EMC Society has many working groups and committees that are tackling the wide range of aspects of the society’s mission. The working groups primarily come out of the EMC Society Standards activities of developing new EMC Standards and revising existing standards. Standing and special committees are formed to address a broad range of needs, ranging from interfacing with other industry organizations to dealing with the administration of the society. All of these meetings are open to everyone (unless listed otherwise). Join them for breakfast, breaks, lunch or dinner; learn what other EMC members are working on, and influence how the society operates.

Collateral MeetingsWith so many people attending this pinnacle event from across the globe, it is a perfect opportunity for groups other than the EMC Society to hold meetings in parallel to the Symposium. Check out the schedule to find out about the numerous collateral meetings, and who can participate. The EMC Society is neither responsible for nor endorses any of these collateral meetings and discourages any meetings from conflicting with the technical and networking programs of the Symposium.

Would you Like to request a meeting? Complete the easy request form here:http://www.emc2016.emcss.org/meeting-request-form

WORKING GROUPS AND MEETINGS

© Jerry Ramie



http://www.emc2016.emcss.org/meeting-request-form

Visit iNARTE in Ottawa!iNARTE invites you to join us at the annual EMC Society Symposium, July 25-29, in Ottawa, Ontario. We’ll be exhibiting at the event and would love to meet with you to discuss how iNARTE certification can help you in

your career. We’ll also be hosting a reception on Thursday evening. Please join us for a cup of cheer and a chat.We’ll also be hosting a training session on Monday, July 25, to help you prepare and take the iNARTE EMC

Engineer and Technician exams, which will be held on Friday, July 29.


Preparing for the iNARTE ExaminationMonday, July 25This workshop is for anyone who is interested in taking the EMC Engineer or Technician exam. Exams will be held during the EMC Society Symposium on Friday. The workshop will cover:

• Introduction to INARTE certification. • Scope of the exam • Exam strategies• Sample questions and answers and a

simulated exam (short)• Question and answer session

You will have an opportunity to ask questions regarding application and examination for these programs, as well as an opportunity to take a practice test.

iNARTE EMC Certification ExaminationsFriday, July 29The iNARTE EMC Engineer and Technician Certification Examinations will be held at the Symposium from 8:00 a.m. to 5:00 p.m. on Friday, July 29.

Three Ways to Register for the Exam:1. Call 414 272 39372. Visit www.inarte.org. Select the EMC

Engineer or Technician Exam. Enter OTTAWA 2016 as the exam location.

3. Register on-site during the symposium.

More Information About iNARTE Certifications

The iNARTE EMC certification is an international program that recognizes engineers and technicians practicing in the EMC fields to include bonding, shielding, grounding, EMI prediction, EMI analysis, conducted and radiated interference, lightning protection and more. iNARTE certifies qualified engineers and technicians in the fields of Telecommunications, Electromagnetic Compatibility (EMC), Product Safety (PS), Electrostatic Discharge Control (ESD), and Wireless Systems Installation.

iNARTE, a product of Exemplar Global Inc.600 N Plankinton Ave., Milwaukee, WI 53203Phone (888) 722-2440www.inarte.org

INDUSTRY HOSTED TECHNICAL WORKSHOP


http://www.inarte.org

Emission Measurements (2014 Edition of ANSI C63.4), and Time Domain (TD) Applications (draft ANSI C63.25)This combined workshop is presented in two parts over a two day period. Topics covered include: (1) review of the 2014 edition of ANSI C63.4 and (2) application of Time Domain (TD) measurements for test site validation and antenna calibration. These workshops are designed to increase your understanding of the new C63.4 standard and the draft TD approach. For the C63.4 workshop, there will be an analysis of the test site validation including using the CISPR SVSWR method above 1 GHz, requirements for hybrid antenna use, test setup requirements and many other changes. Application of time domain methods to validating test sites will also be presented along with a demonstration on its use. As time permits, attendees will get a chance to apply what they learned via problem solving and/or participating in the real-time time domain demonstration.

In the C63.4 workshop, you will learn:· RF emission measurement

procedures· National and international

regulatory implications· Test facility and instrumentation

requirements· Equipment test arrangements

and configurations

In the Time Domain (C63.25 draft) workshop, you will learn:· Application for site validation· Application for antenna

calibration

Support material provided:· A complete lecture flash drive· FCC handouts and references

Who Should Attend:Those responsible for determining compliance with FCC Rules and Regulations (and CISPR 22), including:· Product managers and

developers· EMC engineers and test

technicians· Regulatory compliance

managers· Those using and calibrating

antennas in making radiated emission compliance measurements

· Calibration technicians· Calibration and measurement

accreditation bodies· Lab quality assessors· Test instrumentation and

chamber manufacturers

Expert Instructors:Workshops feature leading industry experts and ANSI C63® members, including Don Heirman, Workshop Director, (Don HEIRMAN Consultants), Jason Nixon (Innovation, Science and Economic Development Canada; formerly Industry Canada) and Zhong Chen (ETS-Lindgren)

Location: (Prior to the IEEE EMC Symposium in Ottawa, Canada)

Flextronics1280 Teron RoadOttawa, Ontario K2K 2C1, CANADA

Dates:Friday and Saturday, July 22-23, 2016

Fee Includes:Complete lecture flash drive, continental breakfast, lunch, breaks, completion certificate and transportation to/from the IEEE EMC symposium host hotel (Westin) and Flextronics. Fee does NOT include copies of the draft or published standards. Fee does NOT include hotel accommodations. For hotel information, and to reserve your hotel room, see http://www.emc2016.emcss.org/

Visit www.c63.org for more information

Registration Form Contact: Janet O’Neil | Telephone: 425-868-2558 Email: [email protected]

Ms./Mr._______________________________________ ______Company____________________________________________Address_____________________________________________City________________________State_____Zip____________Daytime Phone___________________Fax______________Email________________________________________________

C63.4 Emissions workshop only – All Day July 22By June 10*: $800 USD__________C63® & S/C Members (by June 10) $725 USD__________

Time Domain workshop only – Morning Only July 23By June 10*: $400 USD __________C63® & S/C Members (by June 10) $325 USD _________

Both workshops – All Day July 22 and Morning of July 23 By June 10*: $1,000 USD _________C63® & S/C Members (by June 10) $850 USD__________

*Add $150 if after June 10 or at the door $150 USD $_________ Total USD $_________

Payment Options:ON LINE: To pay on line, send an email to [email protected] along with a scan of this completed registration form. An invoice will be returned to you via email which you can use to pay on line with your credit card.

CHECK: Make check payable to U.S. EMC Standards Corporation in U.S. dollars drawn on a U.S. bank. Mail to:

Dan Hoolihan P.O. Box 367

Lindstrom, MN 55045

Please do not mail after July 5.

Visit www.c63.org/workshops.htm for more information on ANSI ASC C63®, these workshops, and speaker biographies.

NOTE: You are not registered until you receive confirmation.On site or “at the door” registrations can only be accepted with prior telephone or email confirmation only.

The organizing committee reserves the right to substitute speakers, modify the program (or lecture notes), restrict attendance or to cancel the workshop(s). In the event the workshop(s) is/are canceled, registration fees will be refunded. No refunds will be made to individuals who cancel after June 10. Substitutions are allowed. Workshops without a minimum of six attendees signed up by 27 June 2016 will be cancelled and registration fees returned. It is suggested that you book refundable travel arrangements as appropriate if workshop(s) is/(are) cancelled.


INDUSTRY HOSTED TECHNICAL WORKSHOP

Agenda:ANSI C63.4: All day Friday, July 22 8:30 am Registration Class: 9:00 am to 5:00 pm

Time Domain C63.25: Morning, Saturday, July 23 8:30 am: Registration Class: 9:00 am to 1:00 pm


http://www.c63.org

mailto:[email protected]

http://www.c63.org/workshops.htm




Each year, licensed Professional Engineers (PEs) are expected to show continuing education. This is often done by earning Professional Development Hour (PDH) credits and submitting evidence to the individual State Board or Certifying Body to support the claim. Some districts have strict requirements for their licensed PEs on what constitutes an eligible PDH, and the IEEE EMC Society has instituted a tracking system at the annual Symposium to fulfill these requirements.

The IEEE EMC Society is offering PDH credits to EMC and SIPI Symposium registered technical attendees. Credit hours may be earned by participating in any combination of paper sessions, workshops & tutorials, Global University, and technical meetings. The total hours attended will be calculated along with the total number of PDH credits earned, and a PDH Certificate will be issued by the IEEE showing the total earned PDH credits.

To obtain PDH credits, an attendee must:• Sign up for PDHs on the Symposium registration form or at the Registration Desk• Pay $20 fee (free for EMC Society members; but must be a member at the time of registration.)• Provide P.E. credentials or similar• Sign in and out of each session outside each meeting room• Complete an evaluation form for each session that credit is claimed• Submit all evaluation forms to [email protected] no later than the Friday following the

Symposium closing.

EDUCATION

PROFESSIONAL DEVELOPMENT HOURS

EducationProfessional development

Hours and Formal learning experiences

© EMC Society Europe






We are pleased to be able to offer The Clayton R. Paul Global University once again at the 2016 IEEE International Symposium on Electromagnetic Compatibility featuring an embedded SIPI conference.

This year’s Global University is will include approximately 8 hours of instruction on EMC and 4 hours on SIPI related topics. The GU will be run all day on Monday and one half day on Thursday. Students are encouraged to participate in all of the other activities when they are not in class. Classes are taught by an international panel of educators, who have been selected for this program based on their reputation for excellence in areas of practical importance to EMC and SI PI engineers and their demonstrated ability to communicate effectively with students who are new to the field. The targeted audience for the GU is engineers who have been in the profession approximately 5 years, although past classes have included many veterans wanting to improve their understanding. The overall objective of this sequence of lectures and activities is to provide a comprehensive exposure to the core concepts and skills that are necessary to be successful in the profession.

EDUCATION

CLAYTON R. PAUL GLOBAL UNIVERSITY

Other InformationA certificate of completion will be provided to students who have signed in and signed out each day thereby confirming 100% attendance at all lectures. CEUs will be assigned to this course.

PrerequisitesEngineering or Technology Degree with Electrical Theory

Who is it forEngineers, technicians and professionals who want to gain insight into EMC and SI technology.

Registration FeeAttendance at the Clayton R. Paul Global University requires a registration fee in addition to the full Symposium registration fee. Fee information can be found on the main registration page. Note that on-site registration may not be possible and if available will be limited to openings due to cancellations.

ABOUT GLOBAL UNIVERSITYGlobal EMC University was first offered at the 2007 IEEE EMC Symposium in Honolulu to provide advanced education on a variety of topics that are an important part of EMC and Signal/Power Integrity engineering. The overwhelming response to this program caused the EMC Society to add it to the technical program every year since 2007. It has continued to receive high praise from those who attend. The Global University is named in honor of Clayton R. Paul, who dedicated his career to EMC education and was instrumental in setting up the initial Global University.





EM Coupling MechanismsProfessor Bogdan Adamczyk, Grand Valley State University, Michigan, USA

Review of the 4 basic coupling EMC coupling mechanisms with examples including crosstalk in cables and circuit board structures.

Signal Spectra Professor Flavio Canavero, Politecnico di Torino, Italy

Time-domain and frequency-domain representations of signals. Time-domain and frequency-domain measurements.

Conducted Emissions and Filtering Mark Steffka, University of Michigan-Dearborn and General Motors, Dearborn, Michigan, USA

Conducted emissions testing and source modeling. Basic filters.

Radiated Emissions Lee Hill, Worcester Polytechnic Institute, USA and Silent Solutions, Amherst, New Hampshire, USA

Radiated emissions testing and source modeling. Basic antennas theory.

Transmission Lines Professor Francesca Maradei, University of Rome, La Sapienza, Italy

Basic transmission line theory with an emphasis on time-domain transmission lines.

Shielding Prof. Emeritus Andy Marvin, University of York, United Kingdom

Basic shielding theory, shielding materials and shielding effectiveness measurements.

Non-ideal Behavior of Components Professor Arturo Mediano, University of Zaragoza, Spain

High frequency parasitics and non-linear behavior of resistors, capacitors, inductors, ferrites and other common circuit components.

Power Integrity Professor Tzong-Lin Wu, National Taiwan University

Basic principles of power distribution and decoupling at the printed circuit board and system level.

Signal Integrity Professor Jun Fan, Missouri Univ. of Science and Technology, Rolla, Missouri, USA

Introduction to key concepts in the field of signal integrity including noise margins, jitter, eye diagrams, and signal integrity models and measurements.

PCB and System Design Professor Frank Leferink, University of Twente, Netherlands

Basics of printed circuit board and systems design for EMC applying the concepts introduced in the previous lectures.

EM Modeling for EMC and SI Professor Emeritus Todd Hubing, Clemson University, USA

Overview of modeling methods and tools available to engineers to aid in the EMC and signal integrity design of their products, with examples of effective and ineffective modeling approaches.

CLAYTON R. PAUL GLOBAL UNIVERSITY

2016 Course curriculum:





Meet and network with like-minded individuals

Social Networking

© Shaw Centre

Network with your peers and other top industry professionals throughout the week during numerous planned events!

Welcome ReceptionUnite with colleagues from across the globe at the Canadian Museum of History and delight in the local cuisine and entertainment.

Evening GalaEnjoy the spectacular panoramic view of the Shaw Centre’s Trillium Ballroom during this sit-down dinner with special planned entertainment.

Awards LuncheonCome celebrate the achievements of your colleagues during our annual awards luncheon ceremony.

See registration information for inclusion details.

Special Networking Opportunities » Chapter Chair Training Session and Dinner

Learn best practices, discuss concerns and opportunities with other Chapter Chairs.

» Founders and Past Presidents’ Luncheon Exchange ideas experiences with other leading members of the society.

» Senior Member Events Learn about membership or join the workshop for application or resume assistance.

» Young Professionals Social Network during social hour followed by a haunted walk, or join the luncheon with special guest: Johanna Hill

» Team EMC Bike Ride Go for a morning bike ride around Ottawa.





Evening Gala Wednesday, 27 July 6:30 PM - 9:30 PM

The Gala will take place in the Trillium Ballroom at The Shaw Centre. This ballroom has a beautiful panoramic view of downtown Ottawa. Here, you will enjoy some incredible entertainment and an exquisite sit-down meal as you watch the sun set over the city. One ticket to this event is included in all 5-Day technical registrations EXCEPT student registrations. Extra tickets to the Gala may be purchased as an add-on to your registration.

Welcome Reception Tuesday, 26 July 6:00 PM - 8:00 PM

The Welcome Reception will take place in The Grand Hall at the Canadian Museum of History. This museum is located in Gatineau, Quebec, directly across the Ottawa River from Parliament Hill in Ottawa, Ontario. Enjoy a night full of delectable food and spectacular entertainment as you reunite with old friends and colleagues. There will be transportation to and from the museum. Pick up and drop off will be at The Westin Hotel. One ticket to this event is included in all 5-Day technical registrations and the Companion Program registration. All others may purchase a ticket to the Welcome Reception as an add-on to your registration.

© Canadian Museum of History

© Shaw Centre

© Shaw Centre

Inside the Trillium Ballroom at the Shaw Centre

© Canadian Museum of History

A view of the Musuem’s Grand Hall

Network with peers, colleagues, and professionals in a relaxed environment

SOCIAL NETWORKING





Awards LuncheonThursday, 28 July 12:30 PM - 2:00 PM

The Award Luncheon will take place on Thursday in The Ballroom at the Westin Hotel. It’s a wonderful opportunity to recognize achievements and network with families and EMC professionals from academia, industry, government, military, and retired sectors. The event will start off with a catered sit-down meal. Afterward, the EMC Society will take time to recognize members and non-members for their contribution to the Society and for professional excellence. One ticket to this event is included in all 5-Day technical registrations. All others may purchase a ticket to the Awards Luncheon as an add-on to their registration.

Chapter Chair Training Session and Dinner Monday, 25 July6:00 PM - 9:00 PM

The Chapter Chair Training Session provides a forum for providing focused training to the Chapter Chairs, provides the Chapter Chairs with the opportunity to discuss their chapter issues and get group feedback, gives the Chapter Chairs the opportunity to meet other Chapter Chairs from around the world and for the Chapter Coordinator to disseminate important information from IEEE headquarters and the EMC Society Board of Directors. A Social Session will precede the Dinner, to give the Chapter Chairs the opportunity to socialize with the other Chapter Chairs and their Angels. The Dinner will be served at the end of the Social Session. Besides a great meal, each Chapter Chair or their representatives will have the opportunity to share what their chapter has been doing for the past year. After the Dinner, an interactive brainstorming session will conclude the meeting. This session is intended to exchange information and new ideas for effective chapter management, as well as to discuss best practices and suggestions for future development and growth of the EMC chapters. This is a free event open to Chapter Chairs or their representatives. Please check with your Chapter Chair, as you can be that representative for your chapter if your Chapter Chair cannot attend this event.

List of Anticipated Awards:

• Best EMC 2016 Symposium Paper• Best SIPI 2016 Symposium Paper• Best Visual Poster Paper• Best EMC 2016 Student Paper• Best SIPI 2016 Student Paper• Special Service• Richard R. Stoddart Award for

Outstanding Performance• Lawrence G. Cumming Award for

Outstanding Service• President’s Memorial Award• Technical Achievement Award• Honorary Life Member Award• Certificate of Acknowledgement• Certificate of Recognition• Hall of Fame• Sustained Service• Symposium Chair Award

SOCIAL NETWORKING





Founders and Past Presidents LuncheonWednesday, 27 July 11:30 AM - 1:30 PM

The Founders and Past Presidents Luncheon is open to the Founders of the EMC Society, Past-Presidents of the EMC Society, and current members of the Board of Directors. The luncheon is a chance for the old and the new to mix, exchanging experiences of the past, challenges of the future and learning about the EMC profession. A sit down lunch is provided. Founders and Past-Presidents should inform the Chair of the History Committee of their interest in attending so there will be seating and food available for all ([email protected]).

SOCIAL NETWORKING

IEEE will give a presentation to explain the benefits of being a Senior Member.

To be eligible for this special IEEE program you must:• Be an engineer, scientist, educator, technical

executive, or an originator in an IEEE-designated field.

• Have experience reflecting professional maturity.• Have been in professional practice for at least ten

years.• Show significant performance over a period of at

least five of your years in professional practice.• The goal of this presentation is to explain the

value of IEEE Senior Membership.

Need help filling out your applications to be a Senior Member of IEEE? Come to our workshop to prepare your application with our IEEE specialists. We will be completing the forms onsite at EMC 2016. The three required references will be provided on location by the local IEEE Section. You must bring your resume.

Senior Member PresentationTuesday, 26 July 11:00 AM - 12:00 PM

Senior Member WorkshopWednesday, 27 July 9:30 AM - 5:00 PM






networking social Monday, 25 July 6:00 PM - 7:00 PM

The EMC Society would like to invite all Young Professionals (YP), those with a Bachelors received within 15 years, and Undergraduates to our Networking hour at d’Arcy McGees, Enjoy appetizers, drinks and prizes. This event is free to all YP and undergraduates.

HAunted WalkMonday, 25 July 7:00 PM, Arrive Early A Haunted walk will start promptly at 7pm, meet at d’Arcy McGees for 6:50 PM where you will learn favourite regional ghost stories while covering a wide variety of subjects and very well-known sites in the capital. The cost to participate is $11, please bring your student ID.

SOCIAL NETWORKING

IEEE EMC Young Professionals

You are automatically enrolled in IEEE Young Professionals (YP) if you have received your bachelor within the last 15 years. IEEE YP is a transition place for young professionals and new graduates. The IEEE Young Professionals mission is to inspire, energize, empower, and engage young professionals to envision and realize their dreams.

Luncheon with Guest Speaker: Joanna Hill Wednesday, 27 July 12:00 PM - 1:30 PM

Join us at this exciting luncheon where you will meet other young professionals and learn how to take charge of your destiny!

“We can achieve more together.” Joanna Hill will provide you tools to change the path of your career. According to Joanna, “Less than 25% of your professional success will be due to your technical abilities, 75% will be due to your ability to communicate.” Guests must register in advance, a $5.00 admission is required. See registration for details.

Joanna HillEMC Specialist and Consultant





Team EMC Bike RideThursday, 28 July, 2016 7:00 AM Interested in exploring some of Ottawa on bike with your fellow EMCS members? The 5th annual Team EMC bike ride is scheduled for Thursday, July 28th.

Please join us for a leisurely morning ride to get some exercise and to experience part of the area in a refreshing way. This year we will try to host two levels of escorted riding: leisure and performance.

A Team EMC jersey will be included for 1st-time participants on a first come first serve basis, while quantities last. If you received a jersey on one of our past rides, please don’t forget to bring it with you. Bike rentals are readily available in the local area around the Convention Center. It is the responsibility of the rider to arrange the rental. Cycling helmets are required.

The tentative bike route will be from the convention center along the river on the Trans Canada Trail and/or Rideau Canal Eastern Pathway. The distance will be determined the day of the ride, however, each rider can set their own comfortable distance.

If you need to rent a bike, please plan on renting the bike the night before the ride since the bike shop doesn’t open until 9:00 AM. You will need to provide the type of bike you want and size (or your height if you don’t know). If you want to use your bike shoes and need clipless pedals you can bring your own. You are also welcome to bring your own bike.

RentABike provides a variety of bike rentals and is located at 2 Rideau Street (Rideau Street at Colonel By Drive) East Arch, Plaza Bridge, just a short walk from the convention center (http://www.rentabike.ca/rentabike/en/files/contact.php).

This is an open ride, so no need to sign up, simply show up ready to ride. For additional information, please contact John LaSalle ([email protected]) or Ray Adams ([email protected] or (310) 387-7201).

SOCIAL NETWORKING

© Ottawa Tourism



http://www.rentabike.ca/rentabike/en/files/contact.php

http://www.rentabike.ca/rentabike/en/files/contact.php

mailto:john.lasalle%40ieee.org?subject=2016%20Team%20EMC%20Bike%20Ride

mailto:r.k.adams%40ieee.org?subject=



Explore the Exhibit Hall and learn about new technologies, instrumentation, and solutions that service the industry.

Visit the EXHIBIT HALLTuesday, 26 July 10:00AM - 5:00PM Wednesday, 27 July 9:00AM - 5:00PM Thursday, 28 July 9:00AM - 12:00PM

EXHIBITS

What’s happening in the Exhibit Hall?• Explore and learn from over a hundred

top suppliers • Enjoy daily refreshment/beverage breaks• Attend Ask the Experts and get your

questions answered • Enjoy Experiments and Demonstrations • Visit exhibitor booths to participate in

raffles and daily prizes

Exhibit Participation andSponsorship Opportunities Interested in Exhibiting? We welcome the opportunity to have your organization join us as an industry partner and exhibit at this year’s Symposium.

To learn more about exhibiting and sponsorship opportunities, or to reserve your space today, visit:

http://www.emc2016.emcss.org/exhibitor-and-sponsor-info



http://www.emc2016.emcss.org/exhibitor-and-sponsor-info



Participating ExhibitorsStart planning your exhibit hall visit and discover more information about top suppliers prior to the Symposium.

A.H. Systems, Inc.

A2LA

AE Techron, Inc.

Advanced Test Equipment Rentals

Altair Engineering, Inc.

Ametek CTS

Amphenol Canada

ANDRO Computational Solutions

Anechoic Systems L.L.C.

AR RF Microwave Instrumentation

ARC Technologies, Inc.

Com-Power Corporation

Comtest Engineering, Inc.

Communications & Power Ind CPI

CST of America

Cuming-Lehman Chambers, Inc.

D.L.S. Electronic Systems Inc.

Dayton T. Brown, Inc.

Detectus

Dexmet Corporation

Electro Magnetic Applications

Electronics Test Centre

Elite Electronic Engineering Inc.

EMCoS Ltd.

EMI Solutions Pvt Ltd

Empower RF Systems

ESD Guns

Espresso Engineering

ETS-Lindgren

Evaluation Engineering

Fair-Rite Products Corp

Fischer Custom Communications, Inc.

Gauss Instruments GmbH

HAEFELY HIPOTRONICS

HV Technologies, Inc.

IEEE EMC Society

In Compliance Magazine

ITEM Media

KEMET Electronics

Keysight Technologies

Kitagawa Industries America, Inc.

Langer EMV-Technik GmbH

Liberty Labs Canada, Inc.

Michigan Scientific Corporation

Microwave Vision Group

mk-messtechnik GmbH

NEC TOKIN America

Nemko

Nexio Technologies

Northwest EMC, Inc.

NTS

NVLAP

Ophir RF Inc

Panashield, LLC A Braden Shielding Systems Company

Pearson Electronics Inc.

Raymond EMC Enclosures Ltd

Reliant EMC LLC

Retlif Testing Laboratories

RF Exposure Lab

Rigol Technologies

Rohde & Schwarz

Schlegel Electronic Materials Inc.

Schmid & Partner Engineering AG

SGS

Siepel

Spira Manufacturing

TDK-Lambda Americas-High Power Division

Teledyne LeCroy

Thermo Fisher Scientific

TMD Technologies

Toyo Corporation

Transient Specialists, Inc.

TUV Rheinland

V Technical Textiles / Shieldex USA

Vectawave

EXHIBITS

Visit the Exhibit Hall Maphttp://www.emc2016.emcss.org/exhibit-hall



http://www.ahsystems.com/

http://www.a2la.org/

http://aetechron.com/

http://www.atecorp.com/

http://www.altair.com/

http://www.ametek-cts.com/

http://www.amphenolcanada.com/

http://www.androcs.com/

http://www.anechoicsystems.com/

http://www.arworld.us/

http://www.arc-tech.com/

http://www.com-power.com/

http://www.comtestengineering.com/

http://www.cpii.com/

http://www.cst.com/

http://www.cuminglehman.com/

http://www.dlsemc.com/

http://www.dtb.com/

http://www.detectus.com/

http://www.dexmet.com/

http://www.ema3d.com/

http://www.etc-mpb.com/

http://www.elitetest.com/

http://www.emcos.com/

http://4EMI.com

http://www.empowerrf.com/

http://www.esdguns.com/

http://www.espressoengineering.com/

http://www.ets-lindgren.com/

http://www.evaluationengineering.com/

http://www.fair-rite.com/

http://www.fischercc.com/

http://www.gauss-instruments.com/

http://www.haefely-hipotronics.com/

http://www.hvtechnologies.com/

http://www.emcs.org/

http://incompliancemag.com

http://www.item-media.net/

http://www.kemet.com/

http://www.keysight.com/

http://www.kgs-ind.com/

http://www.langer-emv.com/

http://www.libertycalibrationcorps.com/

http://www.michsci.com/

http://www.mvg-world.com/

http://www.mk-messtechnik.com/

http://www.nec-tokin.com/english/

http://www.nemko.com/

http://nexiogroup.com/

http://www.nwemc.com/

http://www.nts.com/

http://www.nist.gov/nvlap/

http://www.ophirrf.com/

http://www.panashield.com/

http://www.panashield.com/

http://www.pearsonelectronics.com/

http://www.raymondemc.com/

http://www.reliantemc.com/

http://www.retlif.com/

http://www.rfexposurelab.com/

http://www.rigolna.com/

http://www.rohde-schwarz.com/

http://www.schlegelemi.com/

http://www.speag.com/

http://www.sgs.com/ee

http://www.siepel.com/

http://www.spira-emi.com/

http://www.us.tdk-lambda.com/hp

http://www.us.tdk-lambda.com/hp

http://teledynelecroy.com/

http://www.thermoscientific.com/

http://www.tmd.co.uk/

http://www.toyo.co.jp/english/

http://www.transientspecialists.com/

http://www.tuv.com/us

http://vtechtextiles.com/

http://www.vectawave.co.uk/

http://www.emc2016.emcss.org/exhibit-hall



Ottawa, Canada’s Capital, is a cosmopolitan city that can be experienced in a variety of ways in every season.

From vast, luscious green spaces that are hubs for physical activity in the warmer weather months, to more than 600 kilometres (373 miles) of scenic bike paths, to the tranquil Rideau Canal waterway that turns into the world’s largest skating rink when frozen in the winter. How you choose to experience Ottawa is really up to you!

If history and culture are what you’re after, the city does not disappoint. As Canada’s Capital, Ottawa is home to several national museums that allow visitors to see some of the best art in the world, to learn about Canada’s military history, Aboriginal community and even learn about the young nation’s contributions to the world of flight. Ottawa is also a pedestrian-friendly city, in which some of the country’s best cultural attractions are within a short 20-minute walk from many downtown area hotels.

If outdoor adventure is what you’re after, we have that too! In the summer, the Ottawa region is one of the world’s premier whitewater rafting destinations. It is also home to the highest bungee jumping tower in North America, which stands at a knee-rattling 61 metres (200 feet). In the winter, you’ll find several ski hills within a 40-minute drive of Ottawa’s downtown core, as well as the expansive Gatineau Park, which offers an extensive network of snowshoeing and cross-country ski trails in the winter and scenic hiking trails in the summer.

After all of your adventures you’ll be hungry, and Ottawa’s culinary scene is not to be missed. Head out to enjoy a meal at one of its many award-winning restaurants.

enjoy the scenery and historic attractions here in the tech capital of

the north - ottawa, canada

destination & accommodations

DESTINATION AND ACCOMMODATIONS

Visit the Exhibit Hall Maphttp://www.emc2016.emcss.org/exhibit-hall

© Shaw Centre



http://www.emc2016.emcss.org/exhibit-hall



Destination Ottawa, ontario canada

Nestled at the junction of three rolling rivers and bordering the provinces of Québec and Ontario, Ottawa is one of the world’s most beautiful capital cities. Located at a four-hour drive north-east of Toronto and two hours west of Montreal, Ottawa is easy to get to by car or by train at any time of year. The Ottawa Macdonald-Cartier International Airport is also located just 20 minutes from downtown Ottawa, offering more than 130 non-stop flights daily to more than 50 destinations in Canada, the United States, and European centres out of its state-of-the-art terminal. With so many transportation options available, getting here is easy!

Conference Location The Shaw Centre

The Symposium will be hosted in the spectacular new Shaw Centre (formerly Ottawa Convention Centre). The facility staged its grand opening 13 April 2011, welcoming the world to a stunning new landmark and exceptional new meeting place in the heart of the Capital. Overlooking the Rideau Canal – a UNESCO World Heritage Site – Parliament Hill and downtown Ottawa, the Centre features a sweeping glass façade encasing four floors of state-of-the-art meeting space, including the Canada Hall, which can accommodate up to 6,000 delegates. The 200,000 square foot Centre takes Ottawa to a whole new level in the meetings and conventions industry, enabling the Capital to host large, city-wide events and multiple simultaneous functions. Delegates can step outside and be just steps away from recreational paths and the ByWard Market shopping and restaurant district—not to mention 6,000 downtown hotel rooms, all within easy walking distance. The facility is directly linked to the 180-store Rideau Centre, the 495-room Westin Ottawa, and offers ample indoor parking. The Shaw Centre sets new standards for environmental design and sustainable practices, serving delegates and guests with advanced technology.


© Shaw Centre

© Ottawa Tourism






EMC 2016 Map

At the Shaw Centre in Ottawa with recommended hotels

Untitled layer

Shaw Centre

The Westin Ottawa

Les Suites Hotel Ottawa

Novotel Ottawa

1 The Shaw Centre

2 The Westin Ottawa

3 Les Suites Hotel

4 novotel Ottawa

AirportMacdonald-Cartier International Airport, located just south of downtown Ottawa, Ontario. The airport’s internal design focuses on creating a calm and easy travel experience for passengers, and is open 24 hours for a full range of passenger services.

Macdonald-Cartier International Airport1000 Airport Parkway Private, Ottawa, ON K1V 9B4, Canada www.yow.ca/en

TransportationBoat Aqua-Taxi: 819-329-2413 Casino du Lac-Leamy docking facilities: 819-772-2100

TaxiBlue Line Taxi: 613-238-1111 Capital Taxi: 613-744-3333 DJ’s Taxi: 613-829-9900

Bus There are two city bus systems in Canada’s Capital Region. OC Transpo (613-741-4390) operates in the Ontario side of the Ottawa River and the Société de Transport de l’Outaouais (819-770-3242) operates on the Québec side. You can transfer between these systems along Rideau and Wellington Streets in Ottawa and around the Place d’accueil on Maisonneuve Boulevard in Gatineau.

1

2

3

4

To book your reservations and receive the group rate, visit: http://www.emc2016.emcss.org/hotel

55 Colonel By Drive, Ottawa, ON K1N 9J2 www.shaw-centre.com

11 Colonel By Drive, Ottawa, ON K1N 9H4www.thewestinottawa.com

130 Besserer St, Ottawa, ON K1N 9M9www.les-suites.com

33 Nicholas St, Ottawa, ON K1N 9M7www.novotelottawa.com



http://www.yow.ca/en

http://www.emc2016.emcss.org/hotel

http://www.shaw-centre.com/

www.thewestinottawa.com

https://www.les-suites.com/

www.novotelottawa.com



Things To Do“Ottawa is blessed with an abundance of attractions that will enliven your visit no matter the time of year. Bask in the city’s wealth of historic landmarks — from the iconic Parliament Buildings to the Rideau Canal — all located within its downtown core; marvel at the architectural wonders that house national museums and galleries, before taking in their world-class exhibitions; and, soak in Ottawa’s natural beauty, the perfect backdrop for your next outdoor adventure. And round out those experiences with activities that will excite your kids during the day, food that will comfort or surprise (depending on your mood), and nightlife that sparkles.” - Ottawa Tourism Bureau

Flash Your Badge Program Attendees of the 2016 EMC Symposium will be automatically enrolled in the Ottawa Tourism Flash Your Badge program. Your Symposium badge is a passport to receiving special deals and discounts at local restaurants and attractions in Ottawa.

Learn more about the available deals here:

http://ottawatourism3.ca/fyb/en.html


Top Attractions

» Parliament hill and Buildings

» Canadian Musuem of History

» Canadian Aviation and Space Museum

» Rideau Canal

» National War Musuem and Memorial

» Royal Canadian Mint

Aside from planned food services during breaks you can find a variety of food options just next door at the Rideau Centre.



http://ottawatourism3.ca/fyb/en.html



VISA InformationCitizens of certain countries and territories need a visa to visit or transit through Canada. Others need an eTA. It is recommend that you apply for an eTA now.

NEW! Starting 15 March 2016, visa-exempt foreign nationals who fly to or transit through Canada will need an Electronic Travel Authorization (eTA). Exceptions include U.S. citizens and foreign nationals with a valid visa. See the Canadian Government website for full information to properly prepare for your trip. http://www.cic.gc.ca/english/visit/visas-all.asp

VISA Invitation Letter The IEEE EMC Society is happy to provide a Visa Invitation Letter upon request. Registrants must be in a paid conference registration category (guests must be registered with a paid full conference registrant). The registration must be paid in full with a valid credit card or check before a letter will be issued. Fulfillment may be delayed while validity of payment is confirmed. Letters are emailed or faxed at no charge. A $75 USD fee will apply to send the original letter via FedEx International. Please allow a minimum of 4 to 6 weeks for your government to process your visa. Visit our web site at www.emc2016.emcss.org for more details.


ClothingThe technical attendees at the Symposium are encouraged to wear at a minimum business casual (long pants, knee length skirts, long or short sleeved shirts/blouses). Presenters, session chairs and other participants involved in the Symposium program are recommended to come in business formal wear: business suit and tie or business dress. The recommended clothing for the reception is business casual. The recommended clothing for the Gala is casual.

Electrical PowerOutlets and voltage (110 volts) are the same as in the United States. For those from other countries, adapters are required for electrical appliances. The frequency of electrical current in Canada is 60 Hz.

CurrencyIt is recommend that visitors exchange currency prior to arrival however many banks and currency exchange stations will provide this service. In addition, some hotels and merchants may accept foreign currency.

Sales TaxFor up-to-date tax information, visit the Canada Revenue Agency website at www.cra.gc.ca/visitors.

TippingA 15% tip, pre-tax bill, is recommend for good service.

Tips for Traveling to Ottawa

© Ottawa Tourism



http://www.cic.gc.ca/english/visit/visas-all.asp




Dear guests, spouses, friends and family considering attendance to the 2016 IEEE International Symposium on Electromagnetic Compatibility in Ottawa, Canada.

The Companion Club is your chance to meet new people and catch up with old friends. You may register for the Companion Club as a part of the technical attendee’s registration, or separately.

Paid Companion Club members are welcome to visit the Companion Suite where a delicious breakfast will be served each morning. There will be packets of information about nearby museums and local attractions with plenty of options for local transportation. Come join us for breakfast while you visit with old friends and meet new ones. There will also be daily raffles!

We will have specially arranged Tours for you to get out and experience the Ottawa area. If you register for the Companion Club, you may sign up for any of these tours right in your own registration. Otherwise, a tour may be purchased through the technical attendee’s registration.

Join your technical attendee at any of our Social Events for more fun and to meet more people. We have special prices for companions under the age 18. Tickets to the Welcome Reception, a great networking time for all, are included in all Companion Club registrations. The Evening Gala is also a fun event, and companions are invited to register for this event separately in their Companion Club or technical attendee’s registration.

enjoy the program of scheduled tours and activities while your

companion is in session

For companions

© Shaw Centre

COMPANION PROGRAM





High Tea at the Elegant Fairmont Chateau LaurierHigh tea in Zoes lounge at the Fairmont Chateau Laurier. Escape into a world of elegance and timeless décor. Sip tea while enjoying freshly baked scones, homemade strawberry jam and Devonshire Cream prepared tableside. As well as Dainty Finger Sandwiches and tea cake and fruit tartlet

Discover the Capital with Changing the Guard Ceremony Your professional tour guide brings the nation’s capital to life during a tour of Canada’s Capital Region. Hear all about the history of Ottawa from the early explorers to the fur traders to the lumber industry and the vibrant cosmopolitan city that it is today. Sit back and relax while you enjoy hearing about the creation of the Rideau Canal, a UNESCO World Heritage Site.

During the tour you will stop at the Canadian Parliament Buildings and enjoy the pageantry of the Changing the Guard Ceremony held every day on the lawn in front of the Centre Block. Continue your tour as you board your motor coach and enjoy the sites of the Capital including the Supreme Court of Canada, the Bank of Canada and the Canadian War Museum. Cross the Ottawa River into the Province of Quebec to get off the bus and enjoy the architecturally impressive Canadian Museum of History and its unique views of the Ottawa River and the Parliament Buildings.

From there the tour will pass the National Gallery of Canada on the way to Rideau Hall, the official residence of the Governor General of Canada and 24 Sussex Drive, the official residence of the Prime Minister of Canada. You will also pass by the Royal Canadian Mint and many Embassies and High Commissions.

Includes:• 54 passenger luxury

motor coach • Professional Tour guide

• Gratuity to driver and guide

• Bottled water and snacks

Includes:• Afternoon tea

(including gratuity)• JPdL Tour Leader

© Fairmont Chateau Laurier

© Ottawa Tourism

Monday, 25 July

1:45 PM - 3:45 PM

Tuesday, 26 July

8:30 AM - 12:30 PM

COMPANION PROGRAM





Gatineau Park with Wine Tasting and Lunch Enjoy a picturesque drive through Gatineau Park, the Capital’s conservation park, with many unique and diversified ecosystems and heritage features. It covers 36,131 hectares (361 square kilometers) of land. Stops will be made at Pink Lake, the Champlain Lookout and Mackenzie King Estate.

Pink Lake is Gatineau Park’s most unique lake because it is “meromictic” meaning that, unlike a normal lake, its upper and lower water levels never mix. Of rare beauty, the site offers the opportunity to relax while learning about its ecology. Despite its name, the lake is green. It is named after the Pink family, which settled the land in 1826.

The next stop is the Champlain Lookout atop the Eardley Escarpment, 335 meters above sea level. The view is unique because it shows two of Canada’s major geological formations side by side: the Canadian Shield and the St. Lawrence Lowlands. A series of interpretive panels describes the geological events that have shaped this landscape. For more than four decades, King spent most of his summers at the Estate. He gradually expanded and beautified the grounds until he owned 231 hectares (2.31 km) of land. The Mackenzie King Estate has many heritage and natural features to explore. It is an expression of King’s love of nature, architecture and romanticism.

The Mackenzie King Estate was created by William Lyon Mackenzie King, Canada’s 10th and longest serving prime minister. During a career that spanned some fifty years — almost half of that as prime minister — King guided Canada from semi-colonial status to complete autonomy.

Wine Tasting in the Garden at Les Fougères followed by lunch in the Restaurant Restaurant Les Fougères is situated just 14 minutes from downtown Ottawa/Gatineau, in the magnificent Gatineau Hills Relax and enjoy a wine and cheese tasting in the garden of Les Fougères, located in a rustic country setting in the heart of the Gatineau Hills. Followed by a typical three-course French lunch. Before boarding your motor coach for the return to Ottawa, you will have time to browse the gift shop that sells foods inspired by the restaurant and offers decorative items as well as other gifts and gourmet products.

Includes:• 54 passenger Motor coach• Professional Tour Guide• Wine and Cheese Tasting

(including gratuity) • Three-course plated lunch

(including gratuity) • Gratuities for driver and guide• Bottled water and snacks on board

motor coach

Wednesday, 27 July

9:00 AM - 3:00 PM

COMPANION PROGRAM

© Ottawa Tourism





Ottawa River Cruise and National Gallery of Canada Meet your Tour Leader and board your motor coach for a short drive to enjoy a triple-decker riverboat cruise on the Ottawa River. It is from this vantage point where guests will experience the natural beauty of the region that captured the imagination of the first European explorer Samuel de Champlain including the magnificent Rideau Falls. After your cruise, your motor coach will drive you to the National Gallery of Canada. Once there you will enjoy a guided tour of the Permanent Collection at the National Gallery of Canada the country’s showcase of the visual arts and a spectacular architectural landmark. The Gallery houses the largest collection of Canadian art anywhere in the world along with works by internationally renowned artists. Created in 1880, the Gallery is one of Canada’s oldest national cultural museums. Its current building was opened in 1988.

After the tour you can spend time exploring the gallery and to browse the Gift shop before boarding your motor coach to return to the Shaw Centre.

Companion Exhibit Hall Tour A tour of the Exhibition Hall is offered free of charge to companions and families. This

is a guided tour of selected exhibit booths and provides an overview of EMC technologies and products. The purpose of the tour is to present an overview of the Symposium to participants who do not have a technical background in EMC. The Exhibition Hall tour will begin at the main entrance of the exhibit hall.

Includes:• 54 passenger luxury motor coach • Ottawa River Cruise • Guided tour of the permanent exhibit at

the National Gallery of Canada • JPdL Tour Leader • Bottled water and snacks on motor coach • Gratuity to driver Youth Technical Program

For the younger crowd, our ever popular Youth Technical Program is back once again to amaze all companions and guests aged 8 to 19.

This program will again be free of charge, but please register early to be assured a project kit. Registration for each young person can be made either through your own Companion Club registration or the technical attendee’s registration.

Refer to Page 45 for more complete information.

Thursday, 28 July

12:45 PM - 4:30 PM

Thursday, 28 July

10:00 AM - 11:45 AM

COMPANION PROGRAM

© Ottawa Tourism





GEneral Information

Author RegistrationSymposium registration is required by at least one author, or the speaker, before the final paper submission deadline, 1 May 2016. Failing to meet this requirement will result in the paper not being published or presented – no exceptions. Visit our web site at www.emc2016.emcss.org for more details.

Exhibitor Registration All exhibitor staff and booth workers must register using the link and code sent to the Exhibitor/ Sponsor contact.

Exhibit Hall Only RegistrationFor the customers and clients of our exhibitors. Exhibitors and their reps must register through EXHIBITOR registration. Companions may be listed within your own technical registration. See Companion Registration for more details.

Companion RegistrationOur Companions are family and friends of all ages who accompany a registered, technical attendee or exhibitor. We offer two types of badges:

• Companion Club (includes gift, breakfasts, Welcome Reception ticket, and access to the Exhibit Hall). Individual registrations are required. A fee applies.

• Basic Badge (for Exhibit Hall entrance and Youth Technical Program registration). Sign up your companion within your own registration. No charge.

REGISTRATION INFORMATION

Attendee Registration Information

Certificate of Participation New this year, a personalized Certificate of Participation will be available free of charge to all registered Symposium attendees and participants. These Certificates may be used to officially document attendance at the Symposium. Please check in at the Registration Desk to request your certificate and to verify your name and affiliation. If you have any questions, please email:

[email protected].





Registration Savings and discounts

Advance Registration You must be paid in full by midnight EDT, 27 June, to receive the Advanced rates.

IEEE Members Your membership must be in good standing and paid in full for 2016. Have your member number and current member grade ready when registering.

IEEE Life Member IEEE Life Membership is automatically bestowed upon an active IEEE member based on age and years of membership.

EMC-S Retired or Unemployed You must be an EMC Society member; this rate is not available on site. Have your last place of employment and the date of retirement or unemployment ready when registering.

EMC-S Honored MemberYou must be an EMC Society Honored Award recipient who was presented with this award in a prior year. No discount code is necessary to register.

IEEE & EMC-S Membership IncentivesNon IEEE members: 5-day registration fee includes a FREE first year (for 2017) membership in the IEEE and EMC Society. Visit the EMC-S membership booth in the Exhibit Hall to sign up. IEEE members who are not EMC-S members: 5-day registration fee includes a FREE first year (for 2017) membership in the EMC Society. Visit the EMC-S membership booth in the Exhibit Hall to sign up.

StudentsYou must be enrolled in a full time course of study at a college or university to register in any of the student categories. Have your college ID number, and advisor’s name and email ready when registering.

Company Group Rate Sign up to request a discount code now! Send an email to: [email protected]. Each company must register 10 or more employees with a 5-day attendee registration (not including Exhibitor or Booth Staff) by 27 June. There is no need for all to be from the same central office or company branch. Void if not registered and paid by 27 June. After 27 June, regular rates will apply.

Financial Assistance for AuthorsThe IEEE EMC Society provides funding to selected economically disadvantaged engineers from both developing and developed countries to attend the annual IEEE International Symposium on EMC.

Financial support is limited to basic Symposium registration, excluding optional activities and services, and may also include travel and/or lodging expenses. The Financial Assistance Program for Economically Disadvantaged Engineers (FAP/EDE) committee shall determine the level of support to be provided. This committee has been formed by the IEEE EMC Society Board of Directors.

The applicant must present a technical paper in which he or she is the principal author or participate in a workshop, tutorial or demonstration that provides a substantial contribution to the conference. If there are multiple authors or presenters, only one can apply for financial assistance.

For further information and requirements, go to http://www.emcs.org/about/fap.html


Register Online http://www.emc2016.emcss.org/attendees



http://www.emc2016.emcss.org/attendees




REGISTRATION CATEGORIES WHAT IS INCLUDED

You must be paid in full by 27 June to receive the Advanced rates.

All prices are in USD.

Advanced On or Before

27 June

Regular

After27 June

Tech

nica

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sion

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Exhi

bits

Reco

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Tote

Bag

^

Wel

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Gal

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IEEE Member, 5-DayIEEE Member $640 $750 X X X X X X X

IEEE Life Member $320 $380 X X X X X X X

IEEE Student $100 $160 X X X X X X

EMC-S Honored Member Free Free X X X X X X X

EMC-S Retired/Unemployed $320 $360 X X X X X X X

Non-IEEE Member, 5-DayNon-Member $900 $1070 X X X X X X X

Non-Member Student $160 $210 X X X X X X

Company Group RateMinimum of 10 employees $575 each N/A X X X X X X X

1-Day Registration IEEE Member $210 $260 X X X X

IEEE Student $ 55 $ 75 X X X X

Non-Member $315 $370 X X X X

Non-Member Student $ 60 $ 85 X X X X

Companion RegistrationCompanion Club (18 +) $ 90 $120 X X X X

Jr. Companion Club (8-17) (PG) $ 40 $ 60 PG X PG PG

Companion Club children under 8 (PG) Free Free PG PG PG

Registration for Exhibit Hall, Socials, Tours, or Youth Technical Program

Free Free X

Exhibit Hall Only (technical) Free Free X

Notes: * Symposium Record includes the Proceedings and all Workshop/Tutorial (W/T) slide presentations.^ Tote Bag and contents will differ according to registration category.PG = Parental Guidance. Must be accompanied by a registered adult.

Your registration gives you access to all paper sessions, Workshops/Tutorials, and the Exhibit Hall.

Register Online at http://www.emc2016.emcss.org/attendees






Register Online at http://www.emc2016.emcss.org/attendees


ADDITIONAL OPTIONS (All prices are in U.S. Dollars)

You must be paid in full by midnight EDT, 27 June, to receive the Advanced rates. Adv. Reg.

CLAYTON R PAUL GLOBAL UNIVERSITY (5-Day Symposium registration is required in addition to the G.U. fee)

EMC/SI UNIVERSITYStandard price $275 $375Special price for EMC-S members $200 $250

YOUNG PROFESSIONALS ACTIVITIES (B.S. degree within past 15 years)

Monday Networking at d'Arcy McGees; 6:00 – 7:00 pm Free Free Monday Special: Haunted Walk! Meet at McGees at 6:50 pm $ 11 $ 11 Wednesday Luncheon Meeting, with Joanna Hill, at 12:00 noon $ 5 $ 5

PROFESSIONAL DEVELOPMENT HOURS (PDH) (must have P.E. License or equivalent)

PDH candidate, regular $ 20 $ 20 PDH candidate, EMC-S member (must be a member at time of registration) $ 0 $ 0

SYMPOSIUM RECORD (USB Thumb Drive included with all 1 and 5 Day registrations)

Additional copies of the Proceedings and Workshop/Tutorial (W/T) slide presentations are available if ordered by 27 June. A limited supply will be available after 27 June, but not guaranteed. Pick up on site only.

CD RoM: includes Proceedings plus W/T Notes $ 10 $ 20

Printed: Proceedings and W/T NotesSymposium Proceedings $125 $175W/T printed notes $100 $150Combined Proceedings & W/T Notes $200 $275

VISA INVITATION LETTER (Must have a technical registration and be paid in full. Allow a minimum of 4 to 6 weeks for your government to process your visa.)

Visa letter via email or fax; no charge. Free N/A Visa letter via FedEx International; fee applies. $75 N/A

SOCIAL EVENTS – additional tickets

Tuesday Welcome Reception Adult, Ages 18+ $ 65 $ 75Junior, Ages 8–17 (PG) $ 25 $ 35

Wednesday Evening Gala Adult, Ages 18+ $ 80 $ 90Junior, Ages 8–17 (PG) $ 35 $ 45

Thursday Awards Luncheon Adult, Ages 18+ $ 45 $ 50Junior, Ages 8–17 (PG) $ 20 $ 25

COMPANION TOURS MO: High Tea at the Elegant Fairmont Chateau Laurier; 1:45 pm - 3:45 pm $ 66 $ 66

TU: Discover the Capital with Changing of the Guard Ceremony; 8:30 am - 12:30 pm $ 54 $ 54

WE: Gatineau Park with Wine Tasting and Lunch; 9:00 am - 3:00 pm $159 $159

TH: Ottawa River Cruise and National Gallery of Canada; 12:45 pm - 4:30 pm $ 93 $ 93

YOUTH TECHNICAL PROGRAM

Open to Jr. companions and guests aged 8-19. Younger children are welcome if accompanied by an adult or older, responsible sibling. Register early to be guaranteed a project kit. Free Free






GENERAL CHAIR ... Kris Hatashita

GENERAL VICE CO-CHAIRS ... Qiubo Ye Wahab Almuhtadi

FINANCIAL CHAIR ... Kin Sze

VICE FINANCIAL CHAIR ... Raed Abdullah

SECRETARY ... Mark Kuisma

TECHNICAL PROGRAM CHAIR ... Amy Pinchuk

REGISTRATION CHAIR... Bronwyn Brench

ARRANGEMENTS CHAIR ... Rhonda Rodriguez

EXHIBITS CHAIR ... Peter Patterson Bob Moon

PUBLICATIONS CHAIR ... John Rohrbaugh

MARKETING CO-CHAIRS ... Mike Violette Ashleigh O’Connor

SOCIAL MEDIA COORDINATOR ... Matthias Tröscher

COMPANION & SOCIAL EVENTS CHAIR ... Holly Hatashita

IEEE EMC YOUNG PROFESSIONALS REPRESENTATIVE ... Caroline Chan

VOLUNTEER COORDINATOR, CO CHAIRS ... W Lunscher Robert Davis

Symposium Committee

EMC 2016 Symposium

MEET THE COMMITTEE





TECHNICAL PROGRAM CHAIR ... Amy Pinchuk

TECHNICAL PAPERS CO-CHAIRS ... Chuck Bunting Syed Bokhari

WORKSHOPS/TUTORIALS CHAIR ... John Maas

EXPERIMENTS AND DEMONSTRATIONS CO-CHAIRS ... Bob Scully Sam Connor

SPECIAL SESSIONS CO-CHAIRS ... Colin Brench Mark Maynard

GLOBAL UNIVERSITY CO-CHAIRS ... Colin Brench Mark Steffka

MILITARY EMC PROGRAM CHAIR ... Greg Hiltz

YOUTH TECHNICAL PROGRAM CHAIR ... Amy Pinchuk

SIPI GENERAL CO-CHAIRS ... Ram Achar Dale Becker

SIPI TECHNICAL PROGRAM CO-CHAIRS ... Xiaoning Ye Joungho Kim

SPECIAL TECHNICAL ADVISOR ... Bruce Archambeault

Technical Committee

EMC 2016 Symposium

MEET THE COMMITTEE

CONTINUITY CommitteeEMC Society

TECHNICAL PROGRAM ... Bruce Archambeault

REGISTRATION ... Bronwyn Brench

VOLUNTEERS ... Robert Davis

ARRANGEMENTS/EXHIBITS ... Rhonda Rodriguez

FINANCIAL ... John LaSalle

GENERAL ... Janet O’Neil



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EMC SOCIETY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

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FISHER CUSTOM COMMUNICATIONS . . . . . . . . . . . . . . . . . . 83

HAEFELY HIPOTRONICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

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IN COMPLIANCE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

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SPIRA MANUFACTURING . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Advertiser index

EMC 2016 Symposium

© Kris Hatashita



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