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TC35661 Application Note for HW
©2015 TOSHIBA Corporation 2015-08-27 1
Bluetooth® IC TC35661
Application Note for Hardware Edition
Rev 1.00
The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc.
ARM is a registered trademark of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved.
TC35661 Application Note for HW
2015-08-27 2
Contents 1. About This Document ............................................................................................................................................. 3 2. System Configuration Example .............................................................................................................................. 4 3. Reference Board Appearance and Baseboard Connection..................................................................................... 5
3.1. Reference Board Outline View ........................................................................................................................ 5 3.2. How to Connect with the Baseboard ............................................................................................................... 6
4. Reference Board Circuit.......................................................................................................................................... 7 4.1. Reference Board schematics ............................................................................................................................ 7 4.2. Reference Board Parts List ............................................................................................................................. 8 4.3. Reference Board Layout pattern ................................................................................................................... 10
5. Pattern Layout Guide ........................................................................................................................................... 12 5.1. Introduction ................................................................................................................................................... 12 5.2. Board Layout Notes ....................................................................................................................................... 12
5.2.1. For Set Board .......................................................................................................................................... 12 5.2.2. RF Portion ............................................................................................................................................... 12
5.3. Ball Assignment and GND Boundary ........................................................................................................... 13 5.4. Coplanar Strip Line ....................................................................................................................................... 14 5.5. Reference Board Antenna Characteristics .................................................................................................... 15
5.5.1. Chip Antenna .......................................................................................................................................... 15 5.5.2. Pattern Antenna ..................................................................................................................................... 16
5.6. Reference Board Characteristics ................................................................................................................... 18 6. RFIO Impedance Data .......................................................................................................................................... 24
6.1. TC35661SBG 0.5mm-pitch Package ............................................................................................................. 24 6.1.1. Impedance Data ...................................................................................................................................... 24 6.1.2. DUT (Reference) ..................................................................................................................................... 25
6.2. TC35661IDBG/DBG 0.8mm-pitch Package .................................................................................................. 26 6.2.1. Impedance Data ...................................................................................................................................... 26 6.2.2. DUT (Reference) ..................................................................................................................................... 27
7. RF Parameter Adjustment ................................................................................................................................... 28 7.1. 26 MHz Crystal Oscillator Adjustment ......................................................................................................... 28
7.1.1. How to Change the Crystal Oscillator Adjustment ............................................................................... 28 7.1.2. Crystal Oscillator Parameter ................................................................................................................. 30 RESTRICTIONS ON PRODUCT USE .................................................................................................................... 31
TC35661 Application Note for HW
2015-08-27 3
1. About This Document This document is a design guide for schematics and PCB layouts of TC35661. The schematics are based on a circuit design of our evaluation board and reference board, and they include our
reference design of the RF part with the PCB antenna. This document also shows the frequency adjustment method of crystal oscillator circuit.
TC35661 Application Note for HW
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2. System Configuration Example [Case] Host interface = UART, Reference Clock = OSC Connection, external EEPROM connection, chip antenna Each supported functions depend on ROM version. Please see the supported function sheet. The application circuits shown in this document are provided for reference purposes only. Especially, a thorough
evaluation is required on the phase of mass production design. Toshiba dose not grant the use of any industrial property rights with these examples of application circuits.
TC35661
DVDDA_1
DVDDA_2
DVDDB
LVDD33D
LVSS33_1
LVDD33A
A1
A6
H7
N.M
0Ω H5
H4
AVDD33PA
G5
G2
LVSS33_2
10pF
1000
pF
AGND
0.22
µH
0.22
µH
DVDD33
CDVSS_1
CDVSS_2
CDVSS_3
CDVSS_4
GND
0.1µ
F
10µF
G4
E5
E6
F5
F6
DVDD33USBA8
AGND
LDOUT12A
AVDD12SYN
AVDD12SG
G8
F1
18pF
0.1µ
F
AGND AGND AGND
G1
GND
1µF
AVDD12XE1
0.1µ
F
AGND AGND
1µF
AVSS12ADCF3
AVSS12SYNF2
AVSSSG1_1H1
AVSSSG1_2H3
AVSS12XE2
AGND
CVDD_1A7
GND GND
CVDD_2H6
0.1µ
F
1µF
VPGMC2
AGND
RFIOH21.0nH
AGND
3pF
AGND
2pF
1 4
2 3 5
AGNDAGND
100k
Ω
1.5p
F
5.1n
H
FeedFixing
AGND AGNDAGND
Antenna
RF connector
SAW FilterOUT IN
AGND
GND
XOIN
XOOUT
D1
D2
0Ω
3
2
4
1
15pF
15pF
AGND
AGND
AGNDTRSTXB3
TCKD6
TMSB1
TDIC5
TDOC4
TRCKC3
GPIO6E7
GPIO7F8
GPIO8F7
GPIO9D7
RESETXD5
GPIO0C7
USBDPB7
USBDMB8
GPIO15B5
GPIO14B6
GPIO16A5
X’tal
GPIO17A3
GPIO18B4
GPIO10B2
GPIO11A2
GPIO12C6
GPIO13D8
CLKREQC8
TMODE1C1
TMODE2D3
TRTESTAE3
TRTESTBE4
TRTESTCG3
TRTESTDF4
4
EEPROM
321
SDASCLWPVCC
GNDA2A1A0
5678
10kΩ
10kΩ
GND
AGND
GND
VDD33
GND
0.1μ
F
GPIO1A4
SLEEPCLKE8
UARTTX
UARTRX
RTS
CTS
RESETX
GPIO0
GPIO1
SLEEPCLK
GPIO10
GPIO11
GPIO12
GPIO13
GPIO16
GPIO17
GPIO5G6
GPIO4G7
GPIO3G8
GPIO5
GPIO4
GPIO3
GPIO2H8
GPIO2
10µF
Figure 2-1 Application Circuit Example
TC35661 Application Note for HW
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3. Reference Board Appearance and Baseboard Connection This is about reference board using TC35661 0.8mm-pitch package. 3.1. Reference Board Outline View From Figure 3-1 to Figure 3-4, these outline views are reference board of TC35661 0.8mm-pitch package.
Figure 3-1 TC35661 Reference board (component side, chip antenna)
Figure 3-2 TC35661 Reference board (connector side, chip antenna)
Figure 3-3 TC35661 Reference board (connector side, pattern antenna)
Figure 3-4 TC35661 Reference board (connector side, pattern antenna)
TC35661IDBG
EEPROM
RF connector
Chip antenna
26 MHz Crystal
B to B connector
Pattern antenna
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3.2. How to Connect with the Baseboard To operate the reference board, need to be connected to the baseboard via interface board.
Figure 3-5 TC35661 Reference board, interface board and baseboard
Figure 3-6 TC35661 Interface board (connector side)
B to B connector
Interface board
Reference board
Baseboard
TC35661 Application Note for HW
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4. Reference Board Circuit 4.1. Reference Board schematics
Figure 4-1 TC35661 reference board circuit
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4.2. Reference Board Parts List
Table 4-1 Parts List
No. Part number Name Value Size Supplier
C1 GCM155R11C334K Laminated ceramic capacitor 0.33 μF 1005 Murata Manufacturing
C2 GCM188C71A105K Ceramic capacitor 1 μF 1608 Murata Manufacturing
C3 GCM21BR70J106K Laminated ceramic capacitor 10 μF 2125 Murata Manufacturing
C4 GCM155R11C104K Laminated ceramic capacitor 0.1 μF 1005 Murata Manufacturing
C5 GCM21BR70J106K Laminated ceramic capacitor 10 μF 2125 Murata Manufacturing
C6 GRM1552C1H2R0C Laminated ceramic capacitor 2 pF 1005 Murata Manufacturing
C7 GRM1552C1H100J Laminated ceramic capacitor 10 pF 1005 Murata Manufacturing
C8 GCM155R11C104K Laminated ceramic capacitor 0.1 μF 1005 Murata Manufacturing
C9 GCM155R11C104K Laminated ceramic capacitor 0.1 μF 1005 Murata Manufacturing
C10 GCM155R11C104K Laminated ceramic capacitor 0.1 μF 1005 Murata Manufacturing
C11 LQG15HS1N0S Multilayer chip inductor for RF 1.0 nF 1005 Murata Manufacturing
C12 GRM1552C1H102J Laminated ceramic capacitor 1000 pF 1005 Murata Manufacturing
C13 GCM188C71A105K Ceramic capacitor 1 μF 1608 Murata Manufacturing
C14 GCM188C71A105K Ceramic capacitor 1 μF 1608 Murata Manufacturing
C15 GCM188C71A105K Ceramic capacitor 1 μF 1608 Murata Manufacturing
C16 GRM1552C1H150J Laminated ceramic capacitor 15 pF 1005 Murata Manufacturing
C17 GRM1552C1H120J Laminated ceramic capacitor 15 pF 1005 Murata Manufacturing
C18 GCM155R11C104K Laminated ceramic capacitor 0.1 μF 1005 Murata Manufacturing
C19 GCM155R11C103K Laminated ceramic capacitor 0.01 μF 1005 Murata Manufacturing
C20 GCM155R11C103K Laminated ceramic capacitor 0.01 μF 1005 Murata Manufacturing
C21 GCM188C71A105K Ceramic capacitor 1 μF 1608 Murata Manufacturing
C22 GCM21BR70J106K Laminated ceramic capacitor 10 μF 2125 Murata Manufacturing
C23 GCM155R11C104K Laminated ceramic capacitor 0.1 μF 1005 Murata Manufacturing
C24 GCM188C71A105K Ceramic capacitor 1 μF 1608 Murata Manufacturing
C25 GCM155R11C104K Laminated ceramic capacitor 0.1 μF 1005 Murata Manufacturing
C27 GRM1554C1H1R5C Laminated ceramic capacitor 1.5 pF 1005 Murata Manufacturing
C28 GRM1552C1H180J Laminated ceramic capacitor 18 pF 1005 Murata Manufacturing
CD1 CRS08 Schottky barrier diodes TOSHIBA
CD2 CRS08 Schottky barrier diodes TOSHIBA
CD3 PG1111C Chip LED Green 1608 STANLEY
IC1 TA48LS033F LDO regulator TOSHIBA
IC2 TC35661IDBG Bluetooth LSI TOSHIBA
IC3 S-24CS02AFT-TBH-G EEPROM Seiko Instruments
IC4 BU4228F Reset IC ROHM
J1 MM8130-2600 Connector with switch Murata Manufacturing
J2 48037-002 USB connector type A MOLEX
J3 14 5602 020 000 829 H+ Plug 0.4mm-pitch HIROSE ELECTRIC
L1 MLZ1608DR22DT SMD inductor 0.22 μH 1608 TDK
L2 MLZ1608DR22DT SMD inductor 0.22 μH 1608 TDK
L3 GRM1552C1H3R0C Multilayer chip inductor for RF 3 pH 1005 Murata Manufacturing
L4 MLZ1608DR22DT SMD inductor 0.22 μH 1608 TDK
TC35661 Application Note for HW
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No. Part number Name Value Size Supplier
L5 LQW15AN5N1C Winding chip inductor for RF 5.1 nH 1005 Murata Manufacturing
R1 ERJ2GEJ102X Thick Film Chip Resistors 1 kΩ 1005 Panasonic
R2 ERJ2GEJ152X Thick Film Chip Resistors 1.5 kΩ 1005 Panasonic
R3 ERJ2GE0R00X Thick Film Chip Resistors 0 Ω 1005 Panasonic
R4 ERJ2GE0R00X Thick Film Chip Resistors 0 Ω 1005 Panasonic
R5 ERJ2GE0R00X Thick Film Chip Resistors 0 Ω 1005 Panasonic
R6 ERJ2GEJ220X Thick Film Chip Resistors 22 Ω 1005 Panasonic
R7 ERJ2GEJ220X Thick Film Chip Resistors 22 Ω 1005 Panasonic
R8 ERJ2GEJ103X Thick Film Chip Resistors 10 kΩ 1005 Panasonic
R9 ERJ2GEJ103X Thick Film Chip Resistors 10 kΩ 1005 Panasonic
R11 ERJ2GEJ104X Thick Film Chip Resistors 100 kΩ 1005 Panasonic
R12 ERJ2GE0R00X Thick Film Chip Resistors 0 Ω 1005 Panasonic
R13 ERJ3GEYJ104V Thick Film Chip Resistors 100 kΩ 1608 Panasonic
R14 ERJ2GE0R00X Thick Film Chip Resistors 0 Ω 1005 Panasonic
R15 ERJ2GE0R00X Thick Film Chip Resistors 0 Ω 1005 Panasonic
R16 ERJ2GE0R00X Thick Film Chip Resistors 0 Ω 1005 Panasonic
R17 ERJ2GEJ153X Thick Film Chip Resistors 15k Ω 1005 Panasonic
R18 ERJ2GEJ153X Thick Film Chip Resistors 15k Ω 1005 Panasonic
R19 ERJ2GEJ820X Thick Film Chip Resistors 82 Ω 1005 Panasonic
SW1 MHS121 Slide switch FUJISOKU
SW2 MHS121 Slide switch FUJISOKU
X1 NX3225SA-26.000000MHz Crystal oscillator 26.000000 MHz
3.3 x 2.6 NIHON DEMPA KOGYO
E1 ANT098030CGS2442MB1 Chip antenna TDK
FL1 SAFEA2G44AA0F00 SAW Filter Murata Manufacturing
TC35661 Application Note for HW
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4.3. Reference Board Layout pattern The reference board is 2-layer structure. This is chip antenna version pattern.
Figure 4-2 TC35661 reference board layout pattern (component side)
Figure 4-3 TC35661 reference board layout pattern (L1)
TC35661 Application Note for HW
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Figure 4-4 TC35661 reference board layout pattern (L2)
Figure 4-5 TC35661 reference board layout pattern (component side silk)
TC35661 Application Note for HW
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5. Pattern Layout Guide 5.1. Introduction Inside TC35661, analog and digital circuits are mixed. Among analog circuit, especially RF circuit has very weak signal (for example IC receiver sensitivity: -90dBm) so isolate
from noise from not only external IC but also digital circuit and its power supply. For set board, need isolation digital noise from HOST CPU etc. To prevent noise from other devices and the power supply line, need setting signal line in the inner layer of the board
and/or isolation between power supply and GND. 5.2. Board Layout Notes 5.2.1. For Set Board Please review and fully confirm placement of the IC in the whole board and antenna direction. How to take and GND power line, please refer to the taking of GND and power of our reference board.
It is assumed that when you take a certification BT logo on the set, test with RF cable or antenna. Please consider using the (antenna switch) antenna connector.
5.2.2. RF Portion Please refer to next page for the boundary of the analog and digital sections. Separate VDD/GND of analog from
VDD/GND of digital as far as possible. Do not overlap solid GND of analog with solid GND of digital as far as possible. There is a possibility that noise through
the parasitic capacitance corresponding to the area of overlap, generated from the digital circuit is jumping to the circuit in RF. Design RF line to be 50Ω impedance from RFIO pin to antenna. Please pull out in a straight line as much as possible. Please be placed so as to prevent the signal line and power
approaches. Please refer to Figure 5-2 for example pulling out, coplanar strip line.
It is recommended that between the antenna and the withdrawal of the RF line, using the antenna connector.
TC35661 Application Note for HW
2015-08-27 13
5.3. Ball Assignment and GND Boundary This figure shows the ball assignment and GND boundary. Please refer to this figure to design layout.
Figure 5-1 TC35661 ball assignment and GND boundary
Yellow (D1, D2, D4, E1 to E4, F1 to F4, G1 to G5 and H1 to H5): Regulator and RF circuit Gray (E5, E6, F5 and F6) and pink (A7 and H6): GND of digital block Orange (G6 to G8, H7 and H8): Digital I/O port related DVDDB power supply Purple (A1 to A6, B1 to B6, C1 to C8, D3, D5 to D8, E7, E8, F7 and F8): Other digital I/O Please separate GND by blue line on the board.
Analog Potion Digital Potion
TC35661 Application Note for HW
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5.4. Coplanar Strip Line This figure shows the coplanar strip line example with GND.
Figure 5-2 Coplanar strip line example
信号線 GND線GND線
GND層
スルーホール
IC side Antenna side
Through hole GND line GND line Signal line
Through hole
GND layer
TC35661 Application Note for HW
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5.5. Reference Board Antenna Characteristics
Figure 5-3 Antenna coplanar strip line example
5.5.1. Chip Antenna
Figure 5-4 Antenna characteristics (TX_V)
Figure 5-5 Antenna characteristics (TX_H)
TDK Chip ANT
RX_H/TX_V
2.4 2.44 2.485
TDK Chip ANT
RX_V/TX_V
2.4 2.44 2.485
TDK Chip ANT
RX_H/TX_H
2.4 2.44 2.485
TDK Chip ANT
RX_V/TX_H
2.4 2.44 2.485
TC35661 Application Note for HW
2015-08-27 16
Figure 5-6 Antenna characteristics (TX_H’)
5.5.2. Pattern Antenna
Figure 5-7 Antenna characteristics (TX_V)
TDK Chip ANT
RX_H/TX_H'
2.4 2.44 2.485
TDK Chip ANT
RX_V/TX_H'
2.4 2.44 2.485
Pattern_ANT
RX_H/TX_V
2.4 2.44 2.485
Pattern_ANT
RX_V/TX_V
2.4 2.44 2.485
TC35661 Application Note for HW
2015-08-27 17
Figure 5-8 Antenna characteristics (TX_H)
Figure 5-9 Antenna characteristics (TX_H’)
Pattern ANT
RX_H/TX_H
2.4 2.44 2.485
Pattern ANT
RX_V/TX_H
2.4 2.44 2.485
Pattern AN T
RX_H/TX_H'
2.4 2.44 2.485
Pattern ANT
RX_V/TX_H'
2.4 2.44 2.485
TC35661 Application Note for HW
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5.6. Reference Board Characteristics This list shows EV results of reference board.
Table 5-1 Reference board EV results list
Test Item Sub Item Packet bit ch. Condition Unit
Bluetooth® Spec. w/ SAW
min max R02
TRM/CA/01/C Output Power
DH5 PRBS9
0
peak
[dBm] -6 4
0.5
39 -0.1
78 -0.1
0
average
-0.1
39 -0.6
78 -0.6
TRM/CA/10/C EDR Relative
Transmit Power
P(DPSK)-P(GFSK)
2-DH5 PRBS9
0
min.
[dBc]
-4 1
-0.5
39 -0.5
78 -0.5
0
average -4 1
-0.5
39 -0.5
78 -0.5
3-DH5 PRBS9
0
min.
[dBc]
-4 1
-0.5
39 -0.5
78 -0.6
0
average -4 1
-0.5
39 -0.5
78 -0.5
TRM/CA/05/C 20dB Bandwidth
DH5 PRBS9
0
[kHz] 1000
925.6
39 924.1
78 923.8
TC35661 Application Note for HW
2015-08-27 19
Test Item Sub Item Packet bit ch. Condition Unit
Bluetooth® Spec. w/ SAW
min max R02
TRM/CA/06/C Adjacent Channel Power
DH1 PRBS9 39
-5 MHz
[dBm]
-40
-58.6
-4 MHz -57.2
-3 MHz -54.6
-2 MHz
-20
-51.9
2 MHz -53.1
3 MHz
-40
-56.3
4 MHz -58.8
5 MHz -60.2
TRM/CA/11/C EDR Carrier Frequency
Stability
ωi
2-DH5 PRBS9 39
ave.
[kHz] -75 75
2.7
min. -2.9
max. 8.1
3-DH5 PRBS9 39
ave.
[kHz] -75 75
3.6
min. 0.7
max. 8.1
ωi+ωo
2-DH5 PRBS9 39
ave.
[kHz] -75 75
4.8
min. 4.5
max. 5.1
3-DH5 PRBS9 39
ave.
[kHz] -75 75
4.6
min. 4.4
max. 4.9
ωo m ax
2-DH5 PRBS9 39
ave.
[kHz] -15 15
2.0
min. -4.2
max. 7.7
3-DH5 PRBS9 39
ave.
[kHz] -15 15
0.7
min. -4.4
max. 3.9
TC35661 Application Note for HW
2015-08-27 20
Test Item Sub Item Packet bit ch. Condition Unit
Bluetooth® Spec. w/ SAW
min max R02
TRM/CA/07/C Modulation Characteristics DH5
11110000 39 ∆f1avg (11110000) [kHz] 140 175 161.7
10101010 39
∆f2max _min
(10101010) 115 133.2
∆f2min _ave
(10101010) 137.8
∆f2max _max
(10101010) 172.4
∆f2avg (10101010) 152.4
39 ∆f2avg /∆f1avg - 0.8 0.9
TRM/CA/08/C ICFT DH5 PRBS9 39 ave.
[kHz] -75 75 7.0
min. 3.0 max. 11.6
TRM/CA/09/C Drift
DH1 10101010
39 ave.
[kHz]
-25 25 -5.1 abs.max 25 9.5
DH5 39 ave. -40 40 -5.3
abs.max 40 10.0
Drift Rate DH1 10101010 39 abs.max. [kHz/
50 μs] 20 4.2 DH5 4.9
TC35661 Application Note for HW
2015-08-27 21
Test Item Sub Item Packet bit ch. Condition Unit
Bluetooth® Spec. w/ SAW
min max R02
TRM/CA/11/C EDR Modulation Accuracy
RMS DEVM
2-DH5 PRBS9 39 ave.
20% 4.6%
min. 4.2% max. 5.0%
3-DH5 PRBS9 39 ave.
13% 4.7%
min. 4.2% max. 5.3%
Peak DEVM
2-DH5 PRBS9 39 ave.
35% 12.2%
min. 9.7% max. 15.4%
3-DH5 PRBS9 39 ave.
25% 11.7%
min. 9.6% max. 16.2%
99%DEVM 2-DH5 PRBS9 39 [%] 99 99.99999
3-DH5 99.99999
TRM/CA/12/C EDR Differential Phase Encoding 2-DH1 "PRBS9
100 packet" 39 [%] 99 100
3-DH1 100
TRM/CA/13/C EDR In-band Spurious
Emissions 3-DH5 39
-5 MHz
[dBm] -40 -52.1
-4 MHz -50.7 -3 MHz -46.9 -2 MHz -20 -40.2 -1 MHz
[dB] -26 -40.1 1 MHz -39.8 2 MHz
[dBm]
-20 -41.0 3 MHz
-40 -47.8
4 MHz -51.2 5 MHz -52.5
TC35661 Application Note for HW
2015-08-27 22
Test Item Sub Item Packet bit ch. Condition Unit
Bluetooth® Spec. w/ SAW
min max R02
RCV/CA/01/C Rx Sensitivity Dirty DH5 PRBS9 0
BER = 0.1% dBm -70
-88.9 39 -87.8 78 -88.0
RCV/CA/07/C EDR Rx Sensitivity Dirty
2-DH5 PRBS9 0
BER = 0.007% dBm -70
-90.8 39 -89.9 78 -90.1
3-DH5 PRBS9 0
BER = 0.007% dBm -70
-81.7 39 -80.6 78 -80.7
RCV/CA/08/C EDR BER Floor Performance
2M 8000000bi
ts PRBS9 39 RFin =
-60 dBm [%] 0.0007 0
3M 8000000bi
ts 0
RCV/CA/06/C Max Input Power DH1 PRBS9 39 RFin= -10 dBm [%] 0.1 0
RCV/CA/10/C EDR Max Input Power 2-DH5
PRBS9 39 RFin= -10 dBm [%] 0.1 0.000000
3-DH5 0.000000
RCV/CA/03/C C/I Performance DH5 D wave: PRBS9 U wave: GFSK
PRBS15 39
-3 MHz
[dB]
-40 -44.4 -2 MHz -30 -42.7 -1 MHz 0 -6.3 0 MHz 11 7.5 1 MHz 0 -5.8 2 MHz -20 -38.9 3 MHz -9 -45.1 4 MHz -20 -45.3 5 MHz -40 -46.1
TC35661 Application Note for HW
2015-08-27 23
Test Item Sub Item Packet bit ch. Condition Unit
Bluetooth® Spec. w/ SAW
min max R02
RCV/CA/09/C
EDR C/I Performance 2-DH5
D wave: PRBS9 U wave: GFSK
PRBS15 CO-channe
l: same signal
(pi/4DQPSK)
39
-3 MHz
[dB]
-40 -50.2 -2 MHz -30 -47.0 -1 MHz 0 -12.9 0 MHz 13 8.1 1 MHz 0 -12.7 2 MHz -20 -44.6 3 MHz -7 -50.7 4 MHz -20 -51.0 5 MHz -40 -51.1
EDR C/I Performance 3-DH5
D wave: PRBS9 U wave: GFSK
PRBS15 CO-channe
l: same signal
(pi/4DQPSK)
39
-3 MHz
[dB]
-33 -44.4 -2 MHz -25 -40.8 -1 MHz 5 -6.6 0 MHz 21 15.1 1 MHz 5 -6.0 2 MHz -13 -38.5 3 MHz 0 -44.9 4 MHz -13 -45.2 5 MHz -33 -45.4
RCV/CA/05/C Intermodulation DH1
0 -5 MHz
[dBm] -39
-23.7 +5 MHz -23.8
39 -5 MHz -23.4 +5 MHz -22.0
78 -5 MHz -22.9 +5 MHz -22.4
TC35661 Application Note for HW
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6. RFIO Impedance Data 6.1. TC35661SBG 0.5mm-pitch Package 6.1.1. Impedance Data
Figure 6-1 0.5mm-pitch RFIO impedance (RX)
Figure 6-2 0.5mm-pitch RFIO impedance (TX)
Table 6-1 0.5mm-pitch RFIO impedance list
Frequency RX (S11) RX VSWR TX (S11) TX VSWR
2.402GHz 9.721Ω 20.599Ω 1.364nH 6.068 11.616Ω 17.918Ω1.186nH 4.856
2.441GHz 9.221Ω 23.784Ω 1.550nH 6.677 10.342Ω 21.222Ω 1.383nH 5.406
2.480GHz 8.960Ω 26.766Ω 1.717nH 7.222 10.438Ω 24.396Ω 1.565pF 5.901
TC35661 Application Note for HW
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6.1.2. DUT (Reference) Measured by ungilding the pattern next to RFIO pin and adding semi-rigid cable throw 18pF as follows (Corrected electric length between semi-rigid cable and measure)
Figure 6-3 DUT circuit RF potion
18pF
TC35661 Application Note for HW
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6.2. TC35661IDBG/DBG 0.8mm-pitch Package 6.2.1. Impedance Data
Figure 6-4 0.8mm-pitch RFIO impedance (RX)
Figure 6-5 0.8mm-pitch RFIO impedance (TX)
TC35661 Application Note for HW
2015-08-27 27
Table 6-2 0.5mm-pitch RFIO impedance list
Frequency RX (S11) RX VSWR TX (S11) TX VSWR
2.402GHz 9.0802Ω 25.757Ω 1.7066nH 7.0067 10.477Ω 21.055Ω 1.3951nH 5.6532
2.441GHz 8.9700Ω 28.488Ω 1.8574nH 7.4324 10.010Ω 24.9753Ω 1.6284nH 6.2851
2.480GHz 9.1068Ω 30.832Ω 1.9786nH 7.6292 8.8392Ω 28.021Ω 1.7983pF 7.4762
6.2.2. DUT (Reference) This figure shows DUT for measure S parameter (RF board, IC mounted, pattern cut)
Figure 6-6 DUT for measure S parameter
Measured by removing C28 next to RFIO and adding semi-rigid cable throw 18pF as follows (Corrected electric length between semi-rigid cable and measure)
Figure 6-7 DUT circuit RF potion
18pF
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7. RF Parameter Adjustment 7.1. 26 MHz Crystal Oscillator Adjustment 7.1.1. How to Change the Crystal Oscillator Adjustment To adjust 26 MHz crystal oscillator, please refer this chapter. 1. Operate the HCI Tester 2. Check the current RF parameter using “LOC_DBUS_READ”
Click “Help” -> “LOC_DBUS_READ”
Choose register to be checked.
The following window shows an example of checking “OSC tuning.”
OSC tuning parameter is stored in a register of which Dev addr = 0x5, addr = 0x06
Check the value on main window. The value is indicated in 16 bit Hex data. In the following window, the parameter value is indicated as “value = 0x0100”
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3. Set RF parameter using “Channel3_LOC_DBUS_WRITE”
Click “Help” -> “Channel3_LOC_DBUS_WRITE”
4. Set RF parameter
The following window shows an example to change the parameter from 0x0100 to 0x0180.
5. Check the result of “LOC_DBUS_WRITE” on main window.
In the following window, the result is indicated as “(LOC_DBUS_WRITE)st = 0x00 (LOC OK)”
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The written data can bechecked using “Channel3_LOC_DBUS_READ” comand. (Note) Although “LOC_DBUS_WRITE” can be executed during Chiron is working, ARM 7 might freeze depends on
the command execution timing.
7.1.2. Crystal Oscillator Parameter Frequency of Crystal oscillator l (fine adjustment with internal capacitance array)
Dev addr = 0x05 addr = 0x06 (middle 2 digits) Default value: 10 (as at 26th Oct 2011. Shown as “0x0100” In 4 digits) Max value: 1F (0x01F0) Min value: 00 (0x0000, internal capacitance = 0) Range is around 2 to 4 kHz per 1bit (It depends on board design and external capacitance.) RF frequency example
Figure 7-1 Variable frequency range
-30
-20
-10
0
10
20
30
0 5 10 15 20 25 30
delta
Rai
o Fr
eq. [
kHz]
bit value
Radio Frequency Range with Crystal Triming
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